This is a continuation of application Ser. No. 08/332,229, filed Oct. 31, 1994.
Number | Name | Date | Kind |
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4420386 | White | Dec 1983 | |
5043139 | Carnall, Jr. et al. | Aug 1991 |
Number | Date | Country |
---|---|---|
60-107757 | Jan 1985 | JPX |
60-258961 | Dec 1985 | JPX |
61-174766 | Aug 1986 | JPX |
1-110767 | Apr 1989 | JPX |
1-110767 | Apr 1989 | JPX |
0425776A1 | Aug 1990 | JPX |
WO9013913 | Nov 1990 | WOX |
Entry |
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Darrow, D., et al., "A Comparative Analysis of Thin Film Metallization Methodologies for High Density Multilayer Hybrids," 1992 Proceedings Int'l Conf. on Multichip Modules, Apr. 1-3, 1992, Denver, Colorado, Int'l Society for Hybrid Microelectronics (ISHM) and Int'l Electronics Packaging Society (IEPS). |
Darrow, D., "High-Aspect Ratio Hole Coverage Using the Enhanced Ion-Plating Vacuum Deposition Process," Fall Meeting of Int'l Printed Circuits Society (IPC), Oct. 1994. |
Number | Date | Country | |
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Parent | 332229 | Oct 1994 |