Claims
- 1. A hermetic waveguide seal comprising:
a waveguide; a glass solder for encasing at least a portion of the waveguide; a first glass sleeve for encasing at least a first portion of the glass solder; a second glass sleeve for encasing at least a second portion of the glass solder; and an outer sleeve for encasing at least a portion of the first glass sleeve and the second glass sleeve.
- 2. The hermetic waveguide seal as defined in claim 1 wherein the waveguide is a fiber or a fiber array.
- 3. The hermetic waveguide seal as defined in claim 1 further comprising a gap between the first glass sleeve and the second glass sleeve, said gap being filled with the glass solder for forming a compressive seal.
- 4. The hermetic waveguide seal as defined in claim 1 wherein the first glass sleeve and the second glass sleeve abut.
- 5. The hermetic waveguide seal as defined in claim 1 wherein the encased portion of the waveguide is window-stripped.
- 6. The hermetic waveguide seal as defined in claim 1 wherein the encased portion of the waveguide is end-stripped.
- 7. The hermetic waveguide seal as defined in claim 6 wherein the end-stripped encased portion of the waveguide is polished.
- 8. The hermetic waveguide seal as defined in claim 1 wherein the outer sleeve is made from metal, metallic alloy, ceramic, or glass.
- 9. A method of hermetically sealing at least a portion of a waveguide comprising the steps of:
providing a length of waveguide; providing a first glass sleeve having a first bore therethrough; providing a second glass sleeve having a second bore therethrough; providing a glass solder pre-form having a third bore therethrough, said glass solder pre-from being disposed between the first glass sleeve and the second glass sleeve such that the first bore, the second bore, and the third bore are substantially aligned; providing an outer sleeve for encasing the glass solder pre-form and at least a portion of the first glass sleeve and the second glass sleeve; inserting said length of waveguide through the substantially aligned first, second, and third bore; providing a pre-load to the first glass sleeve, the second glass sleeve, and the glass solder pre-form; and heating at least a portion of said outer sleeve for extruding the glass solder pre-form between the waveguide and said first and second glass sleeve.
- 10. The method as defined in claim 9 further comprising the step of providing a pretension to the waveguide prior to performing the step of heating at least a portion of the outer sleeve for reducing a de-centering of the waveguide in the substantially aligned first, second, and third bore.
- 11. The method as defined in claim 9 wherein the waveguide is an optical fiber or fiber array.
- 12. A hermetic waveguide ferrule made by the method as defined in claim 9.
- 13. A hermetic waveguide feedthrough made by the method as defined in claim 9.
- 14. A hermetic waveguide ferrule comprising:
an optical waveguide; a glass solder for encasing at least a portion of the optical waveguide; a first glass sleeve for encasing at least a first portion of the glass solder; and an outer sleeve for encasing at least a portion of the first glass sleeve.
- 15. The hermetic waveguide ferrule as defined in claim 14 further comprising a second glass sleeve for encasing at least a second portion of the glass solder, said outer sleeve further encasing at least a portion of the second glass sleeve.
- 16. The hermetic waveguide ferrule as defined in claim 15 further comprising a gap between the first glass sleeve and the second glass sleeve, said gap being filled with the glass solder.
- 17. The hermetic waveguide ferrule as defined in claim 16 wherein the encased portion of the waveguide is end-stripped.
- 18. The hermetic fiber-optic ferrule as defined in claim 17 wherein the end-stripped encased portion of the waveguide is polished.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority of U.S. patent application Ser. No. 09/993,612 filed on Nov. 27, 2001 entitled “Hermetic Fiber Ferrule and Feedthrough” and U.S. Provisional Patent Application No. 60/369,342 filed on Apr. 03, 2002, entitled “Hermetic Fiber Ribbon Feedthrough Using Glass Solder Process” which are incorporated herein by reference for all purposes.
Provisional Applications (1)
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Number |
Date |
Country |
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60369342 |
Apr 2002 |
US |