1. Technical Field
Embodiments generally relate to input/output (IO) interfaces and interconnects. More particularly, embodiments relate to a high bandwidth connector configuration for IO interfaces and interconnects.
2. Discussion
Computing systems may include one or more USB (Universal Serial Bus, e.g., USB Specification 3.0, Rev. 1.0, Nov. 12, 2008, USB Implementers Forum) ports to support IO communication with peripheral components such as flash drives, keyboards, mice, cameras, and so forth. Future platforms and peripheral components, however, may demand higher bandwidths than offered by current solutions.
The various advantages of the embodiments of the present invention will become apparent to one skilled in the art by reading the following specification and appended claims, and by referencing the following drawings, in which:
Embodiments may include an input/output (IO) connector having a housing with surfaces defining a paddle card region. The IO connector may also have a set of compressible contacts extending vertically through the housing into the paddle region.
Embodiments may also include a system having a motherboard and an IO connector mounted to the motherboard. The IO connector can include a housing having surfaces defining a to paddle card region, and a set of compressible contacts extending vertically from the motherboard through the housing and into the paddle card region.
Additionally, embodiments can include a method of fabricating an IO connector. The method may involve providing a housing that includes surfaces defining a paddle card region, and extending a set of compressible contacts vertically through the housing into the paddle card. region.
Other embodiments may include an IO interconnect hair a cable portion and at least one end portion coupled to the cable portion. The at least one end portion may include a paddle card having a circuit board with a set of contacts disposed on a bottom surface of the paddle card, and an asymmetric metal shell having a configuration that encloses at least as portion of the paddle card and exposes the set of contacts.
Turning now to
Generally, the IO connector 10 may include a housing 16 having surfaces defining a paddle card region 18, and a set of compressible contacts extending vertically from the circuit board 12 through the housing 16 and into the paddle card region 18. In the illustrated example, the compressible contacts are spring loaded (e.g., “pogo”) pins 20 that make contact with a corresponding set of contacts on a bottom side of the paddle card 14 if the paddle card 14 is inserted into the paddle card region 18. The spring loaded pins 20 of the IO connector 10, which may be mounted to the circuit board 12 via surface mount technology (SMT), through-hole technology, etc., enable the physical and electrical distance between the paddle card 14 and the circuit board 12 to be very small. The reduced distance between the paddle card 14 and the circuit board 12 may in turn minimize the electrical parasitic inductance and capacitance associated with the IO connector 10, and improve channel performance with regard to data rate (e.g., bandwidth) and power efficiency. For example, each spring loaded pin 20 may have an inductance that does not exceed a predetermined threshold (e.g., on the order of 0.5 nH or less), whereas conventional IO connector configurations may have contacts with inductances of 3 nH or more.
The spring loaded pins 20 may also be arranged in a plurality of rows (e.g., extending into to the page), wherein each row is substantially parallel to a connection edge 22 of the housing 16. Such an architecture may enable a substantial increase in signaling density (e.g., by extending rows of contacts deeper into the connector) without concern over parasitic inductance and capacitance drawbacks.
Turning now to
The paddle card 40 may also include an asymmetric metal shell 48 that extends a majority of the longitudinal distance of the paddle card 40 on the top side of the paddle card 40, and exposes the set of contacts 46 on the bottom side of the paddle card 40. Thus, exposing the set of contacts 46 can further reduce the connection distance associated with the end portion 38 and may significantly enhance performance.
In addition, the illustrated paddle card 40 includes a plastic frame 52 having a tapered tip 50, wherein the plastic frame 52 may provide structural rigidity to the circuit board 44 and bias the circuit board 44 toward the compressible contacts of the IO connector (not shown). Moreover, the tapered tip 50 can further mechanically bias the circuit board 44 (e.g., flexing it downward) during insertion of the paddle card 40 into the IO connector. As in the case of the compressible contacts, the illustrated set of contacts 46 may be arranged in a plurality of rows that are substantially parallel to a connection edge 54 of the paddle card 40 in order to facilitate greater signaling density. The circuit board 44 may be a multi-layer circuit board containing one or more traces that route signals from the contacts 46 to the cable portion of the IO interconnect. The paddle card 40 may he retractable within the overmold 42 to provide enhanced protection to the contacts 46 (e.g., against dust, scratches, damage, etc.).
Turning now to
In the illustrated example, the motherboard 78 includes one or more processors 82 coupled to system memory 84, which could include, for example, double data rate (PDR) synchronous is dynamic random access memory (SDRAM, e.g., DDR3 SDRAM JEDEC Standard JESD79-3C, April 2008) modules. One or more of the modules of the system memory 84 may be incorporated into a single inline memory module (SIMM), dual inline memory module (DIMM), small outline DIMM (SODIMM), and so forth. In particular, the processor 82 may have an integrated memory controller (IMC) 86 to facilitate the storage and retrieval of data, and one or more processor cores (not shown) to execute one or more drivers associated with a host OS (operating system) and/or application software, wherein each core may be fully functional with instruction fetch units, instruction decoders, level one (L1) cache, execution units, and so forth. The processor 82 could alternatively communicate with an off-chip variation of the IMC 86, also known as a Northbridge, via a front side bus. The illustrated processor 82 communicates with a platform controller hub (PCH) 88, also known as a Southbridge, via a hub bus. The IMC 86/Processor 82 and the PCH 88 are sometimes referred to as a chipset.
The illustrated motherboard 78 also includes a network controller 90 that may enable off-platform communication via a wide variety of wired and/or wireless techniques. The PCH 88 may also communicate with mass storage 92 (e.g., hard disk drive/HDD, optical disk, etc.) in order to further facilitate the storage and retrieval of data.
The motherboard 78 may also include an IO connector 94 configured similarly to, for example, the IO connector 10 (
Turning now to
Embodiments of the present invention are applicable for use with all types of semiconductor integrated circuit (“IC”) chips. Examples of these IC chips include but are not limited to processors, controllers, chipset components, programmable logic arrays (PLAs), memory chips, network chips, systems on chip (SoCs), SSD/NAND controller ASICs, and the like. In addition, in sonic of the drawings, signal conductor lines are represented with lines. Some may be different, to indicate more constituent signal paths, have a number label, to indicate a number of constituent signal paths, and/or have arrows at one or more ends, to indicate primary information flow direction. This, however, should not be construed in a limiting manner. Rather, such added detail may be used in connection with one or more exemplary embodiments to facilitate easier understanding of a circuit. Any represented signal lines, whether or not having additional information, may actually comprise one or more signals that may travel in multiple directions and may be implemented with any suitable type of signal scheme, e.g., digital or analog lines implemented with differential pairs, optical fiber lines, and/or single-ended lines.
Example sizes/models/values/ranges may have been given, although embodiments of the present invention are not limited to the same. As manufacturing techniques (e.g., photolithography) mature over time, it is expected that devices of smaller size could be manufactured. In addition, well known power/ground connections to IC chips and other components may or may not be shown within the figures, for simplicity of illustration and discussion, and so as not to obscure certain aspects of the embodiments of the invention. Further, arrangements may be shown in block diagram form in order to avoid obscuring embodiments of the invention, and also in view of the fact that specifics with respect to implementation of such block diagram arrangements are highly dependent upon the platform within which the embodiment is to be implemented, i.e., such specifics should be well within purview of one skilled in the art. Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the invention, it should be apparent to one skilled in the art that embodiments of the invention can be practiced without, or with variation of, these specific details. The description is thus to be regarded as illustrative instead of limiting.
The term “coupled” may be used herein to refer to any type of relationship, direct or indirect, between the components in question, and may apply to electrical, mechanical, fluid, optical, electromagnetic, electromechanical or other connections. In addition, the terms “first”, “second”, etc. might be used herein only to facilitate discussion, and carry no particular temporal or chronological significance unless otherwise indicated.
Those skilled in the art will appreciate from the foregoing description that the broad techniques of the embodiments of the present invention can be implemented in a variety of forms. Therefore, while the embodiments of this invention have been described in connection with particular examples thereof, the true scope of the embodiments of the invention should not be so limited since other modifications will become apparent to the skilled practitioner upon a study of the drawings, specification, and following claims.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US11/67163 | 12/23/2011 | WO | 00 | 7/11/2014 |