1. Field of the Invention
The present invention relates to a high bay light, and more particularly to a high bay light that uses a light emitting diode (LED) as a light source and provides improved heat dissipation.
2. Description of the Prior Arts
High bay lights are typically used for lighting in industrial buildings, warehouses and other large spaces that have high ceilings. More recently, the high bay lights use LEDs as light sources because LEDs are compact and energy efficient and have become increasingly popular.
LED performance depends on the temperature of the operating environment. Driving an LED in high ambient temperatures may cause overheating and device failure. Thus, providing a heat sink for dissipating heat from the LED is required to maintain long life of the LED.
A finned heat sink is presently the most widely used type of heat sink. The finned heat sink can absorb heat from the LED and then dissipate the heat into the surrounding air. However, the finned heat sink which transfers the heat only by heat conduction is slow and inefficient so that the heat dissipation can not be improved.
To overcome the shortcomings, the present invention provides a high bay light to mitigate or obviate the aforementioned problems.
The main object of the present invention is to provide a high bay light to improve heat dissipation.
To achieve the foregoing objective, the high bay light in accordance with the present invention comprises a lamp holder, a light module, a plurality of cooling modules and a lamp cover. The lamp holder includes a frame. The frame has a top surface, a periphery, an aperture, and a plurality of connecting pieces. The connecting pieces extend radially from the periphery of the frame. The light module is mounted on the lamp holder and includes a printed circuit board (PCB) and at least one light emitting diode (LED). The PCB is secured to the top surface of the frame and has a top surface and a bottom surface. The at least one LED is mounted to the bottom surface of the PCB and is disposed within the aperture of the frame. The cooling modules are mounted on the PCB and each cooling module includes a heat pipe and a cooling component. The heat pipe has an evaporator portion and a condenser portion. The evaporator portion is secured to the top surface of the PCB. The condenser portion is connected to the cooling component. The lamp cover covers the cooling modules and includes an interior, an open bottom, a top hole and a bottom rim. The open bottom and the top hole communicate with the interior. The connecting pieces of the frame are secured to the bottom rim of the lamp cover so as to form a plurality of bottom holes between adjacent connecting pieces. Therefore, the heat from the LED is efficiently dissipated because the heat can be quickly transferred to the cooling components via the heat pipes. In addition, air can flow through the bottom holes into the interior of the lamp cover and flow out from the top hole of the lamp cover so as to enhance air convection, thereby providing improved heat dissipation.
Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
With reference to
The lamp holder 10 includes an annular frame 11 and a lens plate 12. The frame 11 has a top surface, a bottom surface, a center, a periphery, an aperture 111 and a plurality of connecting pieces 112. The aperture 111 is formed through the center of the frame 11. The connecting pieces 112 extend radially from the periphery of the frame 11 and each connecting piece 112 is bent to form a horizontal portion 1121 and an upward portion 1122. The lens plate 12 is secured to the bottom surface of the frame 11 and covers the aperture 111.
The light module 20 is mounted on the lamp holder 10 and includes a disk-shaped printed circuit board (PCB) 21 and at least one light emitting diode (LED) 22. The PCB 21 is secured to the top surface of the frame 11 and has a top surface, a bottom surface, a center and a periphery. The at least one LED 22 is mounted to the bottom surface of the PCB 21 and is disposed within the aperture 111 of the frame 11.
The cooling modules 30 are mounted on the PCB 21 and are arranged radially. With reference to
The lamp cover 40 covers the cooling modules 30 and includes a closed top, an open bottom, an interior 41, a top hole 42, a plurality of bores 43 and a bottom rim. The interior 41 receives the cooling modules 30. The top hole 42 is formed through a center of the closed top of the lamp cover 40. The bores 43 are respectively formed through the closed top of the lamp cover 40 around the top hole 42. The open bottom, the top hole 42 and the bores 43 communicate with the interior 41. The bottom rim has an inner surface to which the upward portions 1122 of the connecting pieces 112 of the frame 11 are secured so as to form a plurality of curved bottom holes 44 between adjacent connecting pieces 112. The lamp cover 40 may be truncated cone-shaped as shown or in other shapes, for example, the lamp cover 40′ may be cylinder-shaped as shown in
The hanging assembly 50 is mounted on the lamp cover 40 and includes a top cover 51, a plurality of hanging rods 52, a plurality of bolts 53 and a power supply 54. The top cover 51 is disposed above the lamp cover 40 to form a space 55 therebetween as shown in
When the high bay light is in use, the evaporator portions 311 of the heat pipes 31 absorb the heat from the LED 22 and transfer the heat to the working fluid inside the heat pipes 31. The working fluid evaporates into vapor and flows to the condenser portions 312. The condenser portions 312 transfer the heat to the cooling components 32 and the cooling components 32 then dissipate the heat. The vapor condenses into droplets when transferring the heat to the cooling component 32 and the condensed water flows back to the evaporator portion 311 due to capillary force exerted by the wick. Therefore, the heat from the LED 22 is efficiently dissipated because the heat can be quickly transferred to the cooling components 32 via the heat pipes 31. In addition, air can flow through the bottom holes 44 into the interior 41 of the lamp cover 40 and flow out from the top hole 42 and the space 55 so as to enhance air convection, thereby providing improved heat dissipation.
With reference to
With reference
Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and features of the invention, the disclosure is illustrative only. Changes may be made in the details, especially in matters of shape, size and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.