HIGH CREEP RECOVERY, LOW MODULUS POLYMER SYSTEMS AND METHODS OF MAKING THEM

Information

  • Patent Application
  • 20220380645
  • Publication Number
    20220380645
  • Date Filed
    July 27, 2022
    3 years ago
  • Date Published
    December 01, 2022
    3 years ago
Abstract
Disclosed herein are methods of making an adhesive composition, the methods comprising providing a polyurethane acrylate and combining with a vinyl ether and co-curing the combination to form an adhesive composition, wherein after curing the adhesive composition has a modulus at −20° C. of less than about 10.0 mPa and a creep recovery of greater than about 50%. Also disclosed are the resulting adhesive compositions.
Description
BACKGROUND

Electronic devices that display images, such as smart phones, digital cameras, notebook computers, navigation units, and televisions, include display panels for displaying images. Thin and lightweight flat display panels are widely used for image display. Many types of flat display panels exist, including liquid crystal display (LCD) panels, organic light-emitting diode (OLED) display panels, plasma display panels (PDPs), electrophoretic display (EPD) panels, and the like.


Flexible electronic displays or foldable displays, which can be folded for portability and unfolded to increase the viewing area, are being developed. Flexible electronic displays, where the display can be bent freely without cracking or breaking, is a rapidly emerging technology area for making electronic devices using, for example, flexible plastic substrates.


With the emergence of these flexible electronic displays, there is an increasing demand for adhesives, and particularly for optically clear adhesives (OCA), to serve as an assembly layer or gap filling layer between an outer cover lens or sheet (based on glass, PET, PC, PMMA, polyimide, PEN, cyclic olefin copolymer, etc.) and an underlying display module of electronic display assemblies. The presence of the OCA improves the performance of the display by increasing brightness and contrast, while also providing structural support to the assembly. In a flexible assembly, the OCA will also serve as the assembly layer, which in addition to the typical OCA functions, may also absorb most of the folding induced stress to prevent damage to the fragile components of the display panel and protect the electronic components from breaking under the stress of folding. The OCA layer may also be used to position and retain the neutral bending axis at or at least near the fragile components of the display, such as for example the barrier layers, the driving electrodes, or the thin film transistors of an organic light emitting display (OLED).


Typical OCAs are visco-elastic in nature and are meant to provide durability under a range of environmental exposure conditions and high frequency loading. In such cases, a high level of adhesion and some balance of visco-elastic property is maintained to achieve good pressure-sensitive behavior and incorporate damping properties in the OCA. However, these properties are not fully sufficient to enable foldable or durable displays.


A foldable display for OLED devices requires highly bendable optical adhesives to bond plastic substrates together. A normal folding test requires an adhesive to pass 100,000 cycles of radius 1 mm (180 degree bending) folding through a temperature range of −20° C. to 85° C. There are no commercial products that meet this test. A foldable adhesive should have a high recovery speed and a low residual strain for good foldability.


Two important properties in an OCA used in a foldable display device are modulus and creep recovery rate. When a device is folded, the folding generates shear stress between the adhesive and the substrates at the ends of the device while and compression in the bent area in the middle of the device. When the device returns to a flat state, stresses in these areas are released.


Especially for adhesives used in foldable displays, it is highly desirable to have a polymer system that exhibits a very low modulus (especially at a low temperatures) and a high creep recovery rate. These two physical properties typically oppose each other. Polymer structures that exhibit high creep recovery typically have a high modulus, while those that exhibit a low modulus have low creep recovery. For example, known high creep recovery polymers require a highly crosslinked network with high elasticity, which generally has a relatively high modulus, especially at low temperatures.


Accordingly, there remains a need for a polymer that exhibits a combination of low modulus and high creep recovery rate.


SUMMARY

Disclosed herein is a new co-cured polyacrylate/vinyl ether adhesive polymer that exhibits very low modulus at −20° C. (less than 10.0 mPa) and exhibits excellent creep recovery (greater than 50%). The adhesive polymer composition achieves a combination of low modulus and high creep recovery, in particular a creep recovery from >70% to >90% and a modulus at −20° C. from <1.0 mPa to <0.3 mPa.


Also disclosed herein is a method of making an adhesive composition comprising co-curing a polyurethane acrylate and a vinyl ether to form the adhesive composition, wherein after curing the adhesive composition has a modulus at −20° C. of less than about 10.0 mPa and a creep recovery of greater than about 50%.







DETAILED DESCRIPTION

Disclosed herein is a new co-cured polyacrylate/vinyl ether adhesive polymer composition that exhibits very low modulus at −20° C. (less than 10.0 mPa) and exhibits excellent creep recovery (greater than 50%). The polymer composition produced by this method achieves a combination of low modulus and high creep recovery, in particular a creep recovery from >70% to >90% and a modulus at −20° C. from <1.0 mPa to <0.3 mPa.


Also disclosed herein is a method of making an adhesive composition comprising co-curing a polyurethane acrylate and a vinyl ether resin to form the adhesive composition, wherein after curing the adhesive composition has a modulus at −20° C. of less than about 10.0 mPa and a creep recovery of greater than about 50%. The polymer composition achieves a combination of low modulus and high creep recovery, in particular a creep recovery from >70% to >90% and a modulus at −20° C. from <1.0 mPa to <0.3 mPa.


The polyurethane acrylate utilized herein may be made by the reacting a highly branched diol with a diisocyanate to obtain a polyurethane and reacting the polyurethane with an acrylate to form the polyurethane acrylate, as described in more detail below.


The resulting polyurethane acrylate/vinyl ether adhesive composition exhibits very low modulus at −20° C. and exhibits excellent creep recovery. Particularly, the creep recovery can be greater than about 70%, for example greater than about 90% while the modulus at −20° C. can be less than about 4.0 mPa, for example less than about 1.0 mPa, and even less than about 0.3 mPa.


In addition to the polyurethane acrylate and the vinyl ether, the adhesive composition may also include other ingredients.


Suitable polyurethane acrylates for use in the present invention include the following:
















Polymer
Tg (° C.)









Poly(2-ethylhexyl acrylate)
−53



Poly(2,2,3,3-tetrafluoropropyl acrylate)
−24



Poly(4-cyanobutyl acrylate)
−38



Poly(butyl acrylate)
−53



Poly(dodecyl acrylate)
−19



Poly(ethyl acrylate)
−23



Poly(hexyl acrylate)
−59



Poly(isobutyl acrylate)
−34



Poly(isopropyl acrylate)
 −2



Poly(nonyl acrylate)
−74



Poly(propyl acrylate)
−42



Poly(sec-butyl acrylate)
−21



Poly(tetrahydro furfuryl acrylate)
−14
























Polymer
Tg (° C.)









Poly(decyl methacrylate)
−63



Poly(dodecyl methacrylate)
−55



Poly(hexyl methacrylate)
 −5



Poly(isodecyl methacrylate)
−41



Poly(octyl methacrylate)
−45










Vinyl ethers useful in the present invention include the following:




embedded image
















Polymer
Tg (° C.)









Poly(butyl vinyl ether)
−54



Poly(ethyl vinyl ether)
−41



Poly(hexyl vinyl ether)
−76



Poly(isobutyl vinyl ether)
−19



Poly(isopropyl vinyl ether)
 −3



Poly(methyl vinyl ether)
−28



Poly(octyl vinyl ether)
−80



Poly(propyl vinyl ether)
−49










The adhesive polymer formed by co-curing a polyurethane acrylate and vinyl ether surprisingly possesses extremely high creep recovery combined with a very low modulus. Applicant has found that introducing a vinyl ether monomer into an acrylate polymer system can significantly reduce the modulus and Tg of the resulting polymer while also yielding a very high creep recovery at very low modulus. This combination of physical properties of very low modulus at low temperature with very high creep recovery has not previously been exhibited in polymer adhesive systems and is an unexpected beneficial result.


In one embodiment, the method of making an adhesive composition comprises combining a polyurethane acrylate and a vinyl ether to form a mixture and co-curing the mixture to form the adhesive composition, wherein after curing the adhesive composition has a modulus of less than about 10.0 mPa at −20° C. and a creep recovery of greater than about 50%.


In another embodiment, the polyurethane acrylate used in the method is created by providing a highly branched diol; reacting the highly branched diol with a diisocyanate to obtain a polyurethane; and reacting the polyurethane with an acrylic group to form a polyurethane acrylate. The diol may have a molecular weight of greater than about 1000 g/mol.


In another embodiment, the co-curing is done by light curing or heat curing.


In another embodiment, the diisocyanate is an aliphatic diisocyanate.


In another embodiment, the polyurethane acrylate is combined with vinyl ether in a molar ratio of vinyl ether to polyurethane acrylate of equal to or less than about 1.


In another embodiment, the polyurethane acrylate has a molecular weight of over about 25000 g/mol.


In another embodiment, the adhesive composition has a modulus of less than about 1.0 mPa at −20° C. and a creep recovery of greater than about 70%.


In another embodiment, the adhesive composition has a modulus or less than about 0.3 mPa at −20° C. and a creep recovery of greater than about 90%.


In another embodiment, the polyurethane acrylate has a glass transition temperature of less than 10° C.


In another embodiment, the polyurethane acrylic polymer has a glass transition temperature of less than −30° C.


In another embodiment, the polyurethane acrylic polymer is combined with a photoinitiator or a thermal initiator before the co-curing step.


In another embodiment, the vinyl ether may be selected from poly(butyl vinyl ether), poly(ethyl vinyl ether), poly(hexyl vinyl ether), poly(isobutyl vinyl ether), poly(isopropyl vinyl ether), poly(methyl vinyl ether), poly(octyl vinyl ether), poly(propyl vinyl ether), and combinations thereof.


In another embodiment, the polyurethane acrylate may be selected from poly(2-ethylhexyl acrylate), poly(2,2,3,3,-tetrafluoropropyl acrylate), poly(4-cyanobutyl acrylate), poly(butyl acrylate), poly(dodecyl acrylate), poly(ethyl acrylate), poly(hexyl acrylate), poly(isobutyl acrylate), poly (isopropyl acrylate), poly (nonyl acrylate), poly(propyl acrylate), poly(sec-butyl acrylate), poly (tetrahydrofurfural acrylate), poly decyl methacrylate), poly(dodecyl methacrylate), poly(hexyl methacrylate), poly(isodecyl methacrylate), poly(octyl methacrylate), and combinations thereof.


The disclosure also provides an adhesive composition comprising: a co-cured mixture of polyurethane acrylate and vinyl ether, wherein the adhesive composition has a modulus of less than about 10.0 mPa at −20° C. and a creep recovery of greater than about 50%.


In one embodiment, the adhesive composition has a modulus of less than about 1.0 mPa at −20° C. and a creep recovery of greater than about 70%.


In one embodiment, the adhesive composition has a modulus of less than about 0.3 mPa at −20° C. and a creep recovery of greater than about 90%.


In another embodiment, the molar ratio of the vinyl ether to the acrylic monomer is less than about 1.


In another embodiment, there is no solvent present in the composition.


In another embodiment, the composition further comprises a thermal initiator or a photoinitiator.


In another embodiment, the diol used to prepare the polyurethane acrylate used in the invention has a highly branched polymer backbone as exemplified below:




embedded image


Synthesis of Polyurethane Acrylates



embedded image


(NBJ408535) A 3000 g/mol dihydroxylated polyfarnesene (CVX50452, 40 g, 0.0133 mol) was added to a 100 mL reactor equipped with an overhead stirrer that was heated to 80 C. Isodecyl acrylate (18.8 g, 0.0887 mol) was added, followed by dibutyltin dilaurate (0.03 g, 0.0001 mol) and irganox 1010 (0.03 g). Subsequently IPDI (3.46 g, 0.0156 mol) was added in two portions (95% in first shot). The reaction was monitored by infrared spectroscopy, and the persistence of the isocyanate peak (ca. 2200 cm-1) was confirmed before addition of hydroxyl quenching agent. 4-hydroxybutyl acrylate (0.11 g, 0.0008 mol) was added after the isocyanate concentration stabilized as observed by infrared spectroscopy. After an hour butanol (0.06 g, 0.0008 mol) was added to finish quenching the reaction. Infrared spectroscopy was used to confirm the complete conversion of isocyanate. The results of the synthesis were as follows: Mn=19.9 kg/mol, Mw=39.9 kg/mol, Ð=2.


(NBJ408536) A 3000 g/mol dihydroxylated polyfarnesene (CVX50452, 100 g) was added to a 1.5 L reactor equipped with an overhead stirrer that was heated to 80 C. Heptane (133 g) was added, followed by dibutyltin dilaurate (0.07 g). Subsequently IPDI (8.165) was added in two portions (93% in first shot). The reaction was monitored by infrared spectroscopy, and the persistence of the isocyanate peak (ca. 2200 cm-1) was confirmed before addition of hydroxyl quenching agent. 4-hydroxybutyl acrylate (0.2 g) and butanol (0.11 g) were added together, after the isocyanate concentration stabilized as observed by infrared spectroscopy. Infrared spectroscopy was used to confirm the complete conversion of isocyanate. The results of the synthesis were as follows: Mn=75.2 kg/mol, Mw=164.0 kg/mol, Ð=2.18.


(NBJ408537) A 3000 g/mol dihydroxylated polyfarnesene (CVX50452, 152 g) was added to a 1.5 L reactor equipped with an overhead stirrer that was heated to 80 C. Isodecyl acrylate (65 g) was added, followed by dibutyltin dilaurate (0.106 g) and Irganox 1010 (0.106 g). Subsequently IPDI (12.90948 g) was added in two portions (92% in first shot). The reaction was monitored by infrared spectroscopy, and the persistence of the isocyanate peak (ca. 2200 cm-1) was confirmed before addition of hydroxyl quenching agent. 4-hydroxybutyl acrylate (0.617 g) and butanol (0.317 g) were added together, after the isocyanate concentration stabilized as observed by infrared spectroscopy. This combination was targeted to get a statistical 25:50:25 ratio of di:mono:non-functional polymer chains. Infrared spectroscopy was used to confirm the complete conversion of isocyanate. The results of the synthesis were as follows: Mn=40.9 kg/mol, Mw=156.7 kg/mol, Ð=3.82.


(NBJ408541) A 3000 g/mol dihydroxylated polyol (Priplast 3196—Croda, 155.5 g) was added to a 1.5 L reactor equipped with an overhead stirrer that was heated to 80 C. 2-ethylhexyl acrylate (66.6 g) was added, followed by dibutyltin dilaurate (0.108 g) and Irganox 1010 (0.108 g). Subsequently IPDI (12.844 g) was added in two portions (92% in first shot). The reaction was monitored by infrared spectroscopy, and the persistence of the isocyanate peak (ca. 2200 cm-1) was confirmed before addition of hydroxyl quenching agent. 4-hydroxybutyl acrylate (1.98 g) and butanol (2.04 g) were added together, after the isocyanate concentration stabilized as observed by infrared spectroscopy. This combination was targeted to get a statistical 10:45:45 ratio of di-:mono-:non-functional polymer chains. Infrared spectroscopy was used to confirm the complete conversion of isocyanate. The results of the synthesis were as follows: Mn=8.1 kg/mol, Mw=85 kg/mol, Ð=10.4.


(NBJ408544) A 3000 g/mol dihydroxylated polyol (Priplast 3196—Croda, 305.88 g) was added to a 1.5 L reactor equipped with an overhead stirrer that was heated to 80 C. 2-ethylhexyl acrylate (131.1 g) was added, followed by dibutyltin dilaurate (0.214 g) and Irganox 1010 (0.214 g). Subsequently IPDI (25.69 g) was added in two portions (92% in first shot). The reaction was monitored by infrared spectroscopy, and the persistence of the isocyanate peak (ca. 2200 cm-1) was confirmed before addition of hydroxyl quenching agent. 4-hydroxybutyl acrylate (1.05 g) and butanol (1.08 g) were added together, after the isocyanate concentration stabilized as observed by infrared spectroscopy. This combination was targeted to get a statistical 10:45:45 ratio of di-:mono-:non-functional polymer chains. Infrared spectroscopy was used to confirm the complete conversion of isocyanate. The results of the synthesis were as follows: Mn=30.3 kg/mol, Mw=580 kg/mol, Ð=19.1.


(NBJ408546) A 3000 g/mol dihydroxylated polyol (Priplast 3196—Croda, 217.76 g) was added to a 1.5 L reactor equipped with an overhead stirrer that was heated to 80 C. 2-ethylhexyl acrylate (93.3 g) was added, followed by dibutyltin dilaurate (0.152 g) and Irganox 1010 (0.152 g). Subsequently IPDI (18.29 g) was added in two portions (92% in first shot). The reaction was monitored by infrared spectroscopy, and the persistence of the isocyanate peak (ca. 2200 cm-1) was confirmed before addition of hydroxyl quenching agent. 4-hydroxybutyl acrylate (2.72 g) was added, after the isocyanate concentration stabilized as observed by infrared spectroscopy. This combination was targeted to get a statistical 100:0:0 ratio of di-:mono-:non-functional polymer chains. Infrared spectroscopy was used to confirm the complete conversion of isocyanate. The results of the synthesis were as follows: Mn=22.8 kg/mol, Mw=111.2 kg/mol, Ð=4.87.


(NBJ408550) A 3000 g/mol dihydroxylated polyol (Priplast 3196—Croda, 176.1 g) was added to a 1.5 L reactor equipped with an overhead stirrer that was heated to 80 C. 2-ethylhexyl acrylate (75.47 g) was added, followed by dibutyltin dilaurate (0.123 g) and Irganox 1010 (0.123 g). Subsequently IPDI (14.794 g) was added in two portions (92% in first shot). The reaction was monitored by infrared spectroscopy, and the persistence of the isocyanate peak (ca. 2200 cm-1) was confirmed before addition of hydroxyl quenching agent. 1,4-butanediol vinyl ether (2.72 g) and butanol (0.557) were added together, after the isocyanate concentration stabilized as observed by infrared spectroscopy. This combination was targeted to get a statistical 25:50:25 ratio of di-:mono-:non-functional polymer chains. Infrared spectroscopy was used to confirm the complete conversion of isocyanate. The results of the synthesis were as follows: Mn=25.5 kg/mol, Mw=131.3 kg/mol, Ð=5.14.


(NBJ408553) A 5000 g/mol polyfarnesene mono-ol (CVX50457, 105 g) was added to a 1.5 L reactor equipped with an overhead stirrer that was heated to 80 C. Dibutyltin dilaurate (0.073 g) and Irganox 1010 (0.073 g) were added. Subsequently AOI (3.33 g) was added in one portion. The reaction was monitored by infrared spectroscopy, and the disappearance of the isocyanate peak (ca. 2200 cm-1) was confirmed to yield fully monofunctional material.


Another set of polymers was designed and synthesized by the similar methodology.




embedded image


By adjusting the feed ratio of end-cap group, a statistical mono-functional polymer can be made, as described below. In the above depiction, GI-2000IPDIn=7-10O-butyl4-HBA-OGI-2000n4-HBA-OPPGO-butylmGI-2000n4-HBA-OPriplastO-butylmIPDIIPDIIPDIIPDIIPDIIPDIIPDI.


MJ408666G GI2000 blended with PPG with 0.33 HBA end functionality.


MJ408657D GI2000 blended with PPG with 0.50 HBA end functionality.


MJ408650E GI2000 blended with PPG2000 with 0.50 HBA end functionality.


MJ408619F GI2000 blended with PPG with 0.33 end functionality.


MJ408690F GI2000 with 0.5 4-hydroxy butyl vinyl ether end functionality.


MJ408642D GI2000 with 0.5 HBA end functionality.


These resins were synthesized by the procedure described above, using the appropriate starting materials.


The following abbreviations are used herein: 4-HBA—4-hydroxybenzoic acid; IDA—iminodiacetic acid; IPDI—isophorone diisocyanate; IBA—isobornyl acrylate; AOI; 2-BCA; VE—vinyl ester; 2-EHA—2-ethylhexyl acrylate; 2-EH VA; 2-EHVE—2-ethylhexyl vinyl ether; 4-HBVE—4-hydroxybutyl vinyl ether. Irganox 1010 is the trade name for pentaerythritol tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate).


Synthesis of 2-decyl-1-tetradecanol acrylate



embedded image


This acrylate was synthesized by reacting 2-decyl-1-tetradecanol 100.0 g (0.281 mol) with acryloyl chloride 33.38 g (0.369 mol) in toluene, using triethylamine as catalyst. The product is a colorless low viscosity liquid.


Synthesis of High MW Polymers



text missing or illegible when filed


The synthesis of ultrahigh MW polyacrylate was done by a known synthetic procedure of SET-LRP, described as follow:


To a 250 ml four neck round bottom flask, with mechanical stirrer, condenser, additional funnel and rubber septum, was added acetonitrile (13 g), t-butyl acrylate (12.80 g, 100 mmol), copper mesh (0.43 g) (treated with 0.1 N hydrochloric acid aqueous solution for, risen with acetone), copper (II) bromide (0.013 g, 0.05 mmol, or using CuBr2 stock solution in CH3CN), the mixture was purged with nitrogen for 30 min, then raised to temperature ˜45° C., to the above solution was injected initiator tert-Butyl α-bromoisobutyrate (1.115 g, 5 mmol) and ligand Me6TREN (0.12 g, 0.50 mmol, or using stock solution in CH3CN) via air tight syringes, the reaction was monitored with 1H NMR until the conversion of t-butyl acrylate >85% (˜2 hrs.) and GPC.


Following the above process but using the appropriate starting materials, the following were prepared.




embedded image


Synthesis of tert-polymer of methacrylate acrylate n-butyl acrylate and t-butyl acrylate (NBJ408529).


The synthesis procedure was described with the feed ratio of:


















MW
grams
Moles
Mole Ratio
wt %




















methyl acrylate
86.09
0.00
0.0000
0.0
0.00%


tert-butyl acrylate
128.17
0.00
0.0000
0.0
0.00%


n-butyl acrylate
128.17
615.22
4.8000
8000.0
57.35%


Dimethyl sulfoxide
78.13
336.1


31.33%


Ethyl Acetate
88.11
121.2


11.30%


Copper (II) Bromide
223.37
0.001
0.0000
0.010
0.00%


diethymeso-2,5-
360.40
0.22
0.0006
1.00
0.02%


dibromoadipate







Me-6TREN
230.50
0.014
0.00006
0.100
0.00%









The GPC scan with the reaction time was listed as follow:














Rx IR Scan
Rx Time
GPC Mn

















97
0
0.000


401
2.53
88.739


762
5.53
105.821


1052
21.7
193.614


1082
27.1
217.315


1196
46.64
402.576









Synthesis of tert-polymer of 2-ethylhexyl acrylate n-butyl acrylate and 4-hydroxybutyl acrylate (NBJ408530).


The synthesis procedure was described with the feed ratio of:


















MW
grams
Moles
Mole Ratio
Wt %




















2-ethylhexyl acrylate
184.00
220.80
1.2000
2000.0
18.70%


4-hydroxybutyl acrylate
144.00
138.24
0.9600
1600.0
11.71%


n-butyl acrylate
128.17
338.37
2.6400
4400.0
28.65%


Dimethyl sulfoxide
78.13
355.2


30.08%


Ethyl Acetate
88.11
128.1


10.85%


Copper (II) Bromide
223.37
0.001
0.0000
0.010
0.00%


diethymeso-2,5-
360.40
0.22
0.0006
1.00
0.02%


dibromoadipate







Me-6TREN
230.50
0.014
0.00006
0.100
0.00%









GPC scan of MW vs. reaction time:














Rx IR Scan
Rx Time
GPC Mn

















97
0
0.000


401
2.53
88.739


762
5.53
105.821


1052
21.7
193.614


1082
27.1
217.315


1196
46.64
402.576









Synthesis of tert-polymer of 2-ethylhexyl acrylate n-butyl acrylate and 4-hydroxybutyl acrylate (NBJ408534).


The synthesis procedure was described with the feed ratio of:


















MW
grams
Moles
Mole Ratio
Wt %




















2-ethylhexyl acrylate
184.00
750.72
4.0800
6800.0
54.07%


4-hydroxybutyl acrylate
128.17
30.76
0.2400
400.0
2.22%


n-butyl acrylate
128.17
61.52
0.4800
800.0
4.43%


Dimethyl sulfoxide
78.13
400.7


28.86%


Ethyl Acetate
88.11
144.5


10.41%


Copper (II) Bromide
223.37
0.001
0.0000
0.010
0.00%


diethymeso-2,5-
360.40
0.22
0.0006
1.00
0.02%


dibromoadipate







Me-6TREN
230.50
0.014
0.00006
0.100
0.00%









GPC scan vs reaction time














Rx IR Scan
Rx Time
GPC Mn

















97
0
0.000


401
2.53
88.739


762
5.53
105.821


1052
21.7
193.614


1082
27.1
217.315


1196
46.64
402.576









Formulation Testing
Modulus

The Optically Clear Adhesive (OCA) formulations having the compositions described below were tested on an Anton Paar MCR 302 rheometer for both modulus and creep recovery. To establish good contact with the rheometer plates, the initially liquid test sample was photo-cured to form a 600-um film through the bottom quartz plate at 100 mW/cm2 of UVA for 90 seconds. The modulus measurement was generally conducted with a 8-mm aluminium parallel plate and a liquid nitrogen cooling unit from −25 to 25° C. at 0.1% strain, 1 Hz oscillation frequency, and zero normal force. A heating rate of 3° C./min of heating rate was originally used, then switched to 5° C./min.


The moduli of the formulations at −20 and 25° C., along with the Tg values are listed in Table 1 through 6. For consistent reporting and fast data analysis, an auto-analysis macro was set up using the Anton Paar RheoPlus software to determine the moduli in megapascal (MPa) at the temperatures of interest, as well as the Tg values. In this study, the temperature corresponding to the maximum of the tan(δ) peak was taken to be the Tg. If a tan(δ) peak was not fully captured in the temperature range studied, the Tg is considered lower than −25° C., and reported as “<−25” ° C. in the tables below.


Creep Recovery

After the temperature sweep described above, the creep recovery test was performed on select formulations by straining the cured sample to 200% in 0.2 sec, allowing it to relax for 20 min at constant strain of 200%, and then monitoring the strain recovery after instantly removing all the accumulated shear stress. The strain at 2400 s of the test run was recorded, and the recovery calculated using the following equation:






Recovery
=



200
-


Strain

@
2400


s


200

*
100





The 70D formulation described below shows a remarkably higher creep recovery of 98%. At the same time, the formulation has a modulus of 0.18 MPa at −20° C., and a modulus of 0.02 MPa at 25° C.












Formulation


70D










Ingredient
Weight (g)







SB407914
4.054



IDA
0.506



Dodecyl VE
2.006



4-HBA
0.457



819 mix
0.045




7.068










Temperature Sweep Results









TABLE 1







Run #1-10













G′ @ −20° C.
G′ @ 25° C.
Tg



Formulations
(MPa)
(MPa)
(° C.)
















62B
21.08
0.07
−11



62C
4.35
0.04
−15



62D
15.80
0.06
−11



63B
1.74
0.04
−18



63C
1.09
0.03
−18



63D
1.49
0.05
−20



64A
2.07
0.03
−18



64B
3.58
0.04
−16



65C
3.12
0.10
−20



65E
82.83
0.10
 −6

















TABLE 2







Run #11-20













G′ @ −20° C.
G′ @ 25° C.
Tg



Formulations
(MPa)
(MPa)
(° C.)
















66A
43.84
0.08
−10



66B
29.98
0.05
−10



66D
1.46
0.05
−22



66E
1.23
0.04
−22



67A
1.02
0.05
−24



67B
0.64
0.03
−23



67C
4.20
0.11
−21



67D
4.82
0.09
−19



68B
66.9
0.11
 −5



69A
0.89
0.04
<−25 

















TABLE 3







Run #21-30













G′ @ −20° C.
G′ @ 25° C.
Tg



Formulations
(MPa)
(MPa)
(° C.)







69B
1.06
0.04
−23



69C
2.51
0.02
−14



69D
3.38
0.08
−20



69E
4.86
0.10
−20



70A
6.64
0.12
−19



70B
0.42
0.02
<−25 



70C
0.53
0.02
<−25 



70D
0.18
0.02
<−25 



71A
0.19
0.02
<−25 



71B
0.31
0.03
<−25 

















TABLE 4







Run #31-40













G′ @ −20° C.
G′ @ 25° C.
Tg



Formulations
(MPa)
(MPa)
(° C.)
















71E
0.01
0.004
<−25 



71E (dried)
1.58
0.08
<−25 



71F
0.97
0.04
<−25 



72A
0.59
0.02
<−25 



72B
6.27
0.09
−18



72C
7.13
0.08
−18



73E
0.73
0.09
<−25 



74B
0.54
0.06
<−25 



74C
0.67
0.05
<−25 



74D
0.56
0.07
<−25 

















TABLE 5







Run #41-50













G′ @ −20° C.
G′ @ 25° C.
Tg



Formulations
(MPa)
(MPa)
(° C.)







75A
1.35
0.09
−16



75C
0.67
0.04
<−25 



75D
0.53
0.03
<−25 



75E
1.28
0.06
<−25 



75F
7.90
0.11
−17



76A
3.84
0.08
−19



76B
4.56
0.08
−19



76C
4.82
0.07
−17



76D
1.16
0.07
<−25 



76F
0.72
0.06
<−25 

















TABLE 6







Run #51-60













G′ @ −20° C.
G′ @ 25° C.
Tg



Formulations
(MPa)
(MPa)
(° C.)
















77A
0.95
0.06
<−25 



77B
4.29
0.08
−18



77C
1.93
0.03
<−25 



77D
0.33
0.06
<−25 



77E
0.26
0.04
<−25 



78A
0.39
0.09
<−25 



78B
0.44
0.05
<−25 



79F
0.46
0.09
<−25 



80B
0.10
0.0008
<−25 



80C
0.13
0.003
<−25 










Applicant has surprisingly found that introducing a vinyl ether monomer into an acrylate system can significantly reduce the modulus and Tg of the resulting polymer, while simultaneously achieving a high creep recovery rate at very low modulus. This combination of physical properties of very low modulus at low temperature with very high creep recovery rate has never before been observed and is an unexpected result.


The formulations tested above have the following compositions:





















62B

62C

62D

63B






58C
6.492
58C
5.853
58C
5.139
53A
8.119


58A
0.662
58A
0.607
62A
1.045
58A
0.828


MBF
0.359
184/819/MBF
0.101
58A
0.626
mix
0.107


Sum
7.513

6.561
184/819/
0.467

9.049






MBF
7.277





52C

63A

63C

63D





7929-19HNV
33.619
7929-19HNV
50.058
63A
8.545
63A
6.781


7929-50K
6.983
7929-50K
10.4
62A
0.739
62A
0.678


10AH-15X
7.918
10AH-15X
11.696
mix
0.105
mix
0.051


IDA
10.149
IDA
15.008
58A
0.975

7.51


4-HBA
3.379
4-HBA
5.112

10.364




I80A
4.073

92.274







66.121





64A

64B

65C

65D





52A
8.162
PEM-X264
7.188
SB407914
4.036
SB407914
9.778


59E
0.906
59E
1.267
IDA
2.542
59E
9.36


mix
0.083
2-BCA
0.489
4-HBA
0.456

19.138



9.151
mix
0.071
mix
0.08







9.015

7.114





65E

66A

66B

66D





65D
5.392
65D
6.749
65D
5.277
PEM-X264
6.464


IDA
0.494
IDA
1.706
IDA
1.96
mix
0.056


4-HBA
0.643
4-HBA
0.459
4-HBA
0.494

6.52


mix
0.067
mix
0.104
mix
0.233





6.596

9.018

7.964





66E

67A

67B

67C





PEM-X264
5.452
PEM-X264
3.979
PEM-X264
6.049
MJ408642D
7.151


4-HBA
0.229
JY220-083
0.828
PIB DA
0.393
mix
0.05


mix
0.056
mix
0.027
2-BCA
0.063

7.201



5.737

4.834
mix
0.027









6.532




























67D

68B

68D

69A






MJ408642D
6.378
SB407914
3.441
7929-19HNV
15.948
PEM-X264
6.036


4-HBA
0.303
59E
3.297
7929-50K
6.611
2-BCA
0.065


2-BCA
0.1
CR551
0.624
4-HBA
1.142
Mix
0.024


mix
0.051
4-HBA
0.802

23.701

6.125



6.832
mix
0.084









8.248





69B

69C

69D

69E





PEM-X264
5.305
68D
6.66
MJ408642
7.455
MJ408642
9.855


2-BCA
0.148
2-BCA
0.116
2-BCA
0.07
2-BCA
0.301


Mix
0.026
Mix
0.023
mix
0.029
mix
0.042



5.479

6.799

7.554

10.198





70A

70B

70C





MJ408642
6.931
NBJ408535
6.605
NBJ408535
6.004




2-BCA
0.376
2-BCA
0.193
DMAA
0.12




mix
0.035
mix
0.027
mix
0.037





7.342





70D

71A

71B





SB407914
4.054
70E
7.132
70E
5.072




IDA
0.506
mix
0.026
2-BCA
0.022




Dodecyl VE
2.006


mix
0.106




4-HBA
0.457








mix
0.045









7.068





71E

71F

71G





NBJ408536
6.554
NBJ408537
7.717
52A
5




2-BCA
0.13
2-BCA
0.217
59E
0.515




mix
0.028
mix
0.063
NBJ408534
61.058








0.073





72A

72B

72C





SB407914
3.417
MJ408646D
7.121
MJ408645E
7.766




59E
3.365
2-BCA
0.212
2-BCA
0.249




CM1007
2.14
mix
0.053
mix
0.053




4-HBA
2.153








IDA
0.763








mix
0.122


























72D

73B

73E






NBJ408649
6.948
MJ408646D
6.726
MJ408646D
3.705


2-BCA
0.19
Dodecyl VE
0.495
NBJ408537
3.091


mix
0.056
2-BCA
0.195
2-BCA
0.22




mix
0.056
mix
0.05





73D

72E

73F





MJ408646D
3.705
MJ408650E
6.901
MJ408650E
6.075


NBJ408537
2.184
2-BCA
0.241
2-BCA
0.223


PIB DA
1.094
mix
0.061
mix
0.052


2-BCA
0.215


dodecyl VE
0.683


mix
0.05





74A

74B

74C





MJ408650E
6.043
MJ408650E
6.133
MJ408646D
6.101


2-BCA
0.223
2-BCA
0.222
2-BCA
0.228


mix
0.039
15D
0.053
15D
0.045


2-EHA
0.633
2-EH VA
0.702
dodecyl VE
0.682






Polycaprolactone
0.729






DMA





74D

75A

75B





MJ408650E
6.425
MJ408650E
5.872
MJ408646D
53.181


2-BCA
0.291
2-BCA
0.231
2-BCA
1.435


CM1007
0.737
CD9075
0.697
15D
0.404


15D
0.052
15D
0.051





76D

76F

77A





MJ408661F
5.801
MJ408661F
8.207
SB407914
5.985


2-EHVE
0.585
2-EHVE
1.259
Dodecyl VE
0.62


BCA
0.202
BCA
0.334
BCA
0.193


15D
0.059
15D
0.086
15D
0.068







6.866





77B

77C





MJ408646D
5.88
MJ408646D
4.454




4-HB VE
0.684
Octyldecyl VE
0.451




BCA
0.212
BCA
0.153




15D
0.069
15D
0.052









Although Applicant has provided descriptions and examples of various embodiments of the invention, the scope thereof is not to be limited to the specific embodiments but is defined only in the appended claims. Those of skill in the art would understand that various modifications to the embodiments of this disclosure may be made without departing from the spirit and scope of the present disclosure.

Claims
  • 1. A method of making an adhesive composition comprising: combining a polyurethane acrylate and a vinyl ether to form a mixture and co-curing the mixture to form the adhesive composition, wherein after curing the adhesive composition has a modulus of less than about 10.0 mPa at −20° C. and a creep recovery of greater than about 50%.
  • 2. The method of claim 1, wherein the polyurethane acrylate is created by: providing a highly branched diol; reacting the highly branched diol with a diisocyanate to obtain a polyurethane; and reacting the polyurethane with an acrylate to form a polyurethane acrylate.
  • 3. The method of claim 2 wherein the highly branched diol is a polyfarnesene or a dimer acid polyester.
  • 4. The method of claim 2, wherein the diol has a molecular weight of greater than about 1000 g/mol.
  • 5. The method of claim 1, wherein the co-curing is done by light curing or heat curing.
  • 6. The method of claim 1, wherein the diisocyanate is an aliphatic diisocyanate.
  • 7. The method of claim 1, wherein the polyurethane acrylate is combined with vinyl ether in a molar ratio of vinyl ether to polyurethane acrylate of less than about 1.
  • 8. The method of claim 1, wherein the polyurethane acrylate has a molecular weight of over about 25000 g/mol.
  • 9. The method of claim 1, wherein the adhesive composition has a modulus of less than about 1.0 mPa at −20° C. and a creep recovery of greater than about 70%.
  • 10. The method of claim 1, wherein the adhesive composition has a modulus of less than about 0.3 mPa at −20° C. and a creep recovery of greater than about 90%.
  • 11. The method of claim 1, wherein the polyurethane acrylate has a glass transition temperature of less than 10° C.
  • 12. The method of claim 1, wherein the polyurethane acrylate has a glass transition temperature of less than −30° C.
  • 13. The method of claim 1, further comprising combining the polyurethane acrylate with a photoinitiator or a thermal initiator before the co-curing step.
  • 14. The method of claim 1, wherein the vinyl ether is a member selected from poly(butyl vinyl ether), poly(ethyl vinyl ether), poly(hexyl vinyl ether), poly(isobutyl vinyl ether), poly(isopropyl vinyl ether), poly(methyl vinyl ether), poly(octyl vinyl ether), poly(propyl vinyl ether), and combinations thereof.
  • 15. The method of claim 1, wherein the polyurethane acrylate is selected from poly(2-ethylhexyl acrylate), poly(2,2,3,3,-tetrafluoropropyl acrylate), poly(4-cyanobutyl acrylate), poly(butyl acrylate), poly(dodecyl acrylate), poly(ethyl acrylate), poly(hexyl acrylate), poly(isobutyl acrylate), poly (isopropyl acrylate), poly (nonyl acrylate), poly(propyl acrylate), poly(sec-butyl acrylate), poly (tetrahydrofurfural acrylate), poly decyl methacrylate), poly(dodecyl methacrylate), poly(hexyl methacrylate), poly(isodecyl methacrylate), poly(octyl methacrylate), and combinations thereof.
  • 16. An adhesive composition comprising a co-cured mixture of polyurethane acrylate and vinyl ether, wherein the adhesive composition has a modulus of less than about 10.0 mPa at −20° C. and a creep recovery of greater than about 50%.
  • 17. The adhesive composition of claim 16, wherein the adhesive composition has a modulus of less than about 1.0 mPa at −20° C. and a creep recovery of greater than about 70%.
  • 18. The adhesive composition of claim 16, wherein the adhesive composition has a modulus at −20° C. of less than about 0.3 mPa and a creep recovery of greater than about 90%.
  • 19. The adhesive composition of claim 16, wherein the molar ratio of the vinyl ether to the acrylic monomer is equal to or less than about 1.
  • 20. The adhesive composition of claim 16, wherein there is no solvent present in the composition.
  • 21. The adhesive composition of claim 16, wherein the composition further comprises a thermal initiator or a photoinitiator.
  • 22. The adhesive composition of claim 16, wherein the vinyl ether is a member selected from poly(butyl vinyl ether), poly(ethyl vinyl ether), poly(hexyl vinyl ether), poly(isobutyl vinyl ether), poly(isopropyl vinyl ether), poly(methyl vinyl ether), poly(octyl vinyl ether), poly(propyl vinyl ether), and combinations thereof.
  • 23. The adhesive composition of claim 16, wherein the polyurethane acrylate is selected from poly(2-ethylhexyl acrylate), poly(2,2,3,3,-tetrafluoropropyl acrylate), poly(4-cyanobutyl acrylate), poly(butyl acrylate), poly(dodecyl acrylate), poly(ethyl acrylate), poly(hexyl acrylate), poly(isobutyl acrylate), poly (isopropyl acrylate), poly (nonyl acrylate), poly(propyl acrylate), poly(sec-butyl acrylate), poly (tetrahydrofurfural acrylate), poly decyl methacrylate), poly(dodecyl methacrylate), poly(hexyl methacrylate), poly(isodecyl methacrylate), poly(octyl methacrylate), and combinations thereof.
Provisional Applications (1)
Number Date Country
62966221 Jan 2020 US
Continuations (1)
Number Date Country
Parent PCT/US2021/015085 Jan 2021 US
Child 17874870 US