High density component mounting back panel for electronic equipment

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Information

Patent Grant
D275279

References
Source

Patent Number
D275,279
Date Filed
Friday, August 15, 1980
44 years ago
Date Issued
Tuesday, August 28, 1984
40 years ago

Inventors
Original Assignees
- Redcom Laboratories, Inc.
Examiners
- Lucas; Susan J.
Agents
- LuKacher; Martin

US Classifications
- D13 - Equipment for production, distribution, or transformation of energy
Field of Search
- US
- D13 24
- D13 41
- D13 12
- D13 99
- D13 40
- 339 17 C
- 339 17 M
- 339 18 R
- 339 18 B
- 174 685
- 361 415
- 361 412
- 361 403
- 361 399
- Term of Grant
  14Years

Information

Abstract

Description

Claims

The ornamental design for high density component mounting back panel for electronic equipment as shown and described.

US Referenced Citations (3)

Number	Name	Date	Kind
3300686	Johnson et al.	Jan 1967
3838317	Coyne	Sep 1974
4160880	Brey	Jul 1979