Number | Name | Date | Kind |
---|---|---|---|
3479655 | Quinn | Nov 1969 | |
3482152 | Iersel | Dec 1969 | |
4025907 | Karp et al. | May 1977 | |
4126900 | Koomen et al. | Nov 1978 |
Entry |
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IBM Tech. Dis. Bul., vol. 14, No. 10, Mar. 1972, "Stacked High Density Multichip Module", by Jarvella, pp. 2896-2897. |