High-density emitter package

Information

  • Patent Grant
  • D658139
  • Patent Number
    D658,139
  • Date Filed
    Monday, January 31, 2011
    14 years ago
  • Date Issued
    Tuesday, April 24, 2012
    12 years ago
Abstract
Description


FIG. 1 is a top perspective view showing an embodiment of our design for a high-density emitter package.



FIG. 2 is a top view of the embodiment of our design shown in FIG. 1.



FIG. 3 is a side view of the embodiment of our design shown in FIG. 1.



FIG. 4 is another side view of the embodiment of our design as shown in FIG. 1.



FIG. 5 is a bottom perspective view of the embodiment of our design shown in FIG. 1.



FIG. 6 is another side view of the embodiment of our design as shown in FIG. 1.



FIG. 7 is another side view of the embodiment of our design as shown in FIG. 1.



FIG. 8 is a bottom view of the embodiment of our design as shown in FIG. 1.



FIG. 9 is a top perspective view showing an alternate environment thereof;



FIG. 10 is a top view thereof;



FIG. 11 is a side view thereof;



FIG. 12 is another side view thereof;



FIG. 13 is a bottom perspective view thereof;



FIG. 14 is another side view thereof;



FIG. 15 is another side view thereof; and,



FIG. 16 is a bottom view thereof.


The broken lines in the drawing views is for the purpose of illustrating environmental structure and forms no part of the claimed design.


Claims
  • We claim the ornamental design for a high-density emitter package, as shown and described.
US Referenced Citations (12)
Number Name Date Kind
7213940 Van De Ven et al. May 2007 B1
D615504 Keller et al. May 2010 S
D631020 Chuang et al. Jan 2011 S
D650343 Andrews et al. Dec 2011 S
20090108281 Keller et al. Apr 2009 A1
20090283787 Donofrio et al. Nov 2009 A1
20100140633 Emerson Jun 2010 A1
20100140634 van de Ven et al. Jun 2010 A1
20100252851 Emerson et al. Oct 2010 A1
20110062482 Solomensky et al. Mar 2011 A1
20110127912 Lee et al. Jun 2011 A1
20110248289 Hsieh et al. Oct 2011 A1