This application is a continuation-in-part of U.S. patent application Ser. No. 09/393,845 filed on Sep. 9, 1999 now U.S. Pat. No. 6,130,688 to Agarwal et al.
Number | Name | Date | Kind |
---|---|---|---|
3823408 | Gordon, III | Jul 1974 | |
3979195 | Strickland | Sep 1976 | |
4007464 | Bassous et al. | Feb 1977 | |
4246076 | Gardner | Jan 1981 | |
4329698 | Smith | May 1982 | |
4368476 | Uehara et al. | Jan 1983 | |
4389654 | Bar-on et al. | Jun 1983 | |
4497890 | Helbert | Feb 1985 | |
4500895 | Buck et al. | Feb 1985 | |
4535343 | Wright et al. | Aug 1985 | |
4587534 | Saito et al. | May 1986 | |
4616408 | Lloyd | Oct 1986 | |
4623906 | Chandrashekhar et al. | Nov 1986 | |
4643948 | Diaz et al. | Feb 1987 | |
4661409 | Kieser et al. | Apr 1987 | |
4663640 | Ikeda | May 1987 | |
4675083 | Bearss et al. | Jun 1987 | |
4698256 | Giglia et al. | Oct 1987 | |
4740263 | Imai et al. | Apr 1988 | |
4749291 | Kobayashi et al. | Jun 1988 | |
4771295 | Baker et al. | Sep 1988 | |
4890126 | Hotomi | Dec 1989 | |
4937172 | Gervay | Jun 1990 | |
4944850 | Dion | Jul 1990 | |
5017205 | Shioura et al. | May 1991 | |
5073785 | Jansen et al. | Dec 1991 | |
5122812 | Hess et al. | Jun 1992 | |
5185034 | Webb et al. | Feb 1993 | |
5208606 | Klein et al. | May 1993 | |
5229785 | Leban | Jul 1993 | |
5278584 | Keefe et al. | Jan 1994 | |
5305015 | Schantz et al. | Apr 1994 | |
5312517 | Ouki | May 1994 | |
5387440 | Takemoto | Feb 1995 | |
5417897 | Asakawa et al. | May 1995 | |
5426458 | Wenzel et al. | Jun 1995 | |
5443687 | Koyama et al. | Aug 1995 | |
5451993 | Takahashi | Sep 1995 | |
5493320 | Sandbach, Jr. et al. | Feb 1996 | |
5508230 | Anderson et al. | Apr 1996 | |
5594479 | Inoue et al. | Jan 1997 | |
5598193 | Halko et al. | Jan 1997 | |
5653901 | Yoshimura | Aug 1997 | |
5786830 | Su et al. | Jul 1998 | |
5859654 | Radke et al. | Jan 1999 | |
5975686 | Hauck et al. | Nov 1999 | |
6062679 | Meyer et al. | May 2000 |
Number | Date | Country |
---|---|---|
0419190A2 | Mar 1991 | EP |
59-176054 | May 1984 | JP |
61-58744 | Mar 1986 | JP |
62-68763 | Mar 1987 | JP |
02-223451 | Sep 1990 | JP |
02-281959 | Nov 1990 | JP |
Entry |
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Pending U.S. Patent application Ser. No. 08/869,446 filed Jun. 5, 1997 of Olsen et al. |
Pending U.S. Patent application Ser. No. 08/921,678 filed Aug. 28, 1997 of Meyer et al. |
Pending U.S. Patent application Ser, No. 08/953,111 filed Oct. 16, 1997 of Etheridge, III et al. |
Hewlett-Packard Journal, vol. 39, No. 4 (Aug. 1988). |
Elliott, D.J., Integrated Circuit Fabrication Technology, McGraw-Hill Book Company, New York, 1982, pp. 1-23, and 339-362. |
Article by Advanced Refractory Technologies, Inc., “Dylyn® : A Novel Coating with Unique Properties”, White Paper 96 -010. |
Number | Date | Country | |
---|---|---|---|
Parent | 09/393845 | Sep 1999 | US |
Child | 09/618992 | US |