Patent Application
20140305619
The present invention relates to a lightweight, high efficiency liquid containing thermal transfer plate and to methods and apparatus used to control a temperature of a liquid via a thermal transfer plate. More specifically, the present invention provides a thermal transfer plate with one or more skived fin thermal transfer surfaces contained within a low weight, easily formed body.
Efficient and low cost temperature control is an ongoing endeavor in multiple industries, including the semiconductor manufacture industry. Removal of large quantities of heat over a small area is critical to operation of many electronic devices such as computer microprocessors, isolated gate bipolar transistors (IGBTs), metal oxide field effect transistors (MOSFETs), thermoelectric devices and diode laser bars.
Since these devices generate a large amount of heat over a very small area, they require liquid cooling to prevent overheating. Traditionally, liquid thermal transfer plates were used in cooling applications. Traditional thermal transfer plates typically include a metal block with internal cooling channels through which a temperature controlled coolant. However, liquid thermal transfer plates tend to be expensive due to the use of meta. Metals such as aluminum and copper are preferred due to their relatively high rates of thermal transfer. Consequently, liquid thermal transfer plates tend to be heavy and expensive.
Accordingly, the present invention provides includes a novel way to take advantage of metallic thermal transfer properties without requiring the entire thermal transfer plate be fabricated from metal. Improved methods and apparatus for temperature control are described and suggested herein. A liquid thermal transfer plate including one or more skived-fin thermal transfer plates including multiple skived fins are sealed within a plastic body. Sealing devices may include, for example, one or more o-rings or gaskets. The plastic body includes fluid channels to route fluid through the liquid thermal transfer plate in a pathway that places the liquid in contact with the skived fins.
An assembly of the parts may be fastened together via clamping screws or other mechanical fasteners. In some preferred embodiments, a plastic body is fabricated from a plastic with a thermal expansion coefficient closely matching a thermal expansion coefficient of the metal used in the skived-fin thermal transfer plates, such as Ultem®, to minimize stresses on the seals during operation.
Other embodiments include a skived fin thermal transfer plates of a same or similar material as the thermal transfer plate body. For example, a metallic thermal transfer plate may be matched with a metallic thermal transfer plate body.
Other examples may include a plastic with a high thermal transfer capability, such as for example a plastic including a thermal conductor. A thermal conductor may include, for example, a ceramic component, such as boron nitride or a compound. Today's smaller hotter and faster electronic assemblies may require a larger amount of heat dissipation in a faster response time. Plastics may also offer a low dielectric loss for applications where such concerns are present. A plastic thermal transfer plate body may offer a relatively good electrical insulation and high thermal conductivity. A thermal conductor may be crystalline or poly crystalline.
As presented herein, various embodiments of the present invention will be described, followed by some specific examples of various components that can be utilized to implement the embodiments. The following drawings facilitate the description of some embodiments:
The present invention provides an improved thermal transfer plate assembly for maintaining a temperature of a thermal load. According to the present invention, a skived fin thermal transfer plate is included in a thermal transfer plate assembly.
As used herein, “thermal transfer plate” or “Thermal Transfer Plate’ shall mean a temperature plate including a fluid passageway for receiving a fluid and transferring thermal energy between the thermal transfer plate and the fluid.
As used herein “skived fin” or Skived Fin” shall mean a heat sink with a base and multiple fins formed via a skiving process
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The Skived Fin Plate 101-101A is formed from a contiguous material and may be fashioned, for example via traditional skiving practices, or via a 3 dimensional printing process. Preferably the one or more Skived Plates 101-101A are formed from a material with a high thermal coefficient, such as copper or other metallic material or metallic compound. As new materials are developed it is within the scope of this invention to include a skived fin plate fashioned from a non-metallic material with favorable thermal conductivity characteristics. Generally a material with a high thermal coefficient is preferred.
According to the present invention, one or more skived fin thermal transfer plates 101-101A are housed in a casing of lighter weight material for optimal dissipation and transfer of the heat from the base to the Skived Fins 105 and an overall light weight and less expensive thermal transfer unit. Additionally, a skiving process used to form the fins 105 may increases the roughness of the heat-sink's fins. Unlike the underside of a heat-sink which typically benefits from a smooth surface for maximum surface area contact with the heat-source that it cools, the skived fins benefit from roughness due to an increased surface area of the fins 105. A non-smooth fin 105 surface area provides increased area for thermal energy transfer.
A Body 102 is used to fix the skived fin plate in a position to come into contact with a fluid entered into a fluid transport area 103. Preferred embodiments include a Body 102 fashioned from a plastic or other non-metallic material due to the light weight characteristics and inexpensive manufacturing. However, other materials may also be used to form the Body 102. Non-metallic materials that may be used to form the thermal transfer plate body may include for example, a plastic with a high thermal transfer capability, including, for example, a plastic with a thermal conductor. A thermal conductor may include, for example, a ceramic component, such as boron nitride or a compound such as a thermally conductive ceramic or metallic nanoparticle component.
A Body 102 will hold the one or more Skived Fin Plates 101-101A in contact with a fluid for which thermal energy control is desired. For example a fluid may be cooled or heated in order to maintain a desired temperature of the fluid.
The Body 102 may be fashioned from a thermoplastic via injection molding processes, or via a 3D printing process. The Body 102 includes a fluid transport area 103 defined by multiple Thermal transfer plate Body Sides 110-113. The fluid transport area 103 may additionally include one or more fluid Flow Channels 103a. Fluid Flow Channels 103a guide the path of fluid flowing within the Body 102.
The Skived Fin Plates 101-101A are housed within the Body 102 and fluid entered in to the Body 102 will come into contact with the Skived Fin Plate 101-101A. In some embodiments, fluid within the Body 102 will follow a route defined by fluid Flow Channels 103a and be guided into contact with the Skived Fins 105 on the Skived Fin Plates 101-101A. A thermal transfer will take place between the Skived Fin Plates 101-101A, including the Skived Fins 105, and fluid within the Body 102.
Fluid exits the Body 102 via a Fluid Outlet 107. The Fluid Inlet 106 and the Fluid Outlet 107 may generally include a tubing nozzle or other fixture for providing fluid communication between a thermal unit, such as a thermoelectric cooling unit and the Body 102.
As illustrated, the Thermal transfer plate Body 112 may include an upper sealed surface 113 and a lower sealed surface 114 and a respective skived fin thermal transfer plate 101-101A seals against each of the upper sealed surface 113 and the lower sealed surface 114. The seal 104 may include a gasket 104, such as an O-Ring gasket, a sealer, or other known sealing mechanism. The illustrated Thermal transfer plate Body 112 includes a lower thermal transfer plate 101 and an upper thermal transfer plate 101A. The seal 104 prevents liquid from inside the thermal transfer plate body 112 from leaking to an external environment.
Also as illustrated, a Fluid Inlet 106 and the Fluid Outlet 108 are both included on a same side 111 of the Body 102. However, other embodiments may include a straight through flow with a fluid inlet 106 in a generally linear path with a fluid outlet 107. Still other embodiments include a Fluid Inlet 106 on a different side 110-113 than the Fluid Outlet 107.
Skived Fin plates 101-101A may be fastened to the Body 102 via a Seal 104. The Seal 104 may include, for example, an O-Ring seal. Other types of Seal 104 may include a gasket, a cement or other sealant artifact.
In some embodiments, a Mechanical Fastening Point 108 may also be included in one or both of the Skived Fin Plate 101-101A and the Body 102. The Mechanical Fastening Point 108 will accommodate a fastening mechanism that secures the Skived Fin Plate 101-101A in a fixed position relative to the Body 102. The Seal 104 contains a liquid with the Body 102 and the Skived Fin Plate 101-101A. A Fastening Mechanism may include, by way of non-limiting example, a bolt, a screw, a rivet, a quick disconnect device, or other known mechanical fastening means.
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A body 502 may also include an upper level 503 and a lower level 504. Fluid may enter a channel in contact with a thermal transfer plate 501A and be circulated through a via 505 or other pass through to a lower level 504. On the lower level the fluid may be placed in contact with one or more additional thermal transfer plates 501. Another via 506 may be used to circulate the fluid back to an upper level 503 and out a fluid egress, such as the outlet 508.
In another aspect, in order to improve sealing of an upper thermal transfer plate 501A to the body 502 and a lower thermal transfer plate 501, one or more fastener accesses 503A may be included in one or more thermal transfer plates 501-501A in a position interior to an edge 512 in the body 502. In some embodiments additional fastener access features may be included in the body. The access features may included a via or a threaded area for receiving a bolt of other fastener. Embodiments may also include an access hole 509 allowing access to an opposing thermal transfer plate 501 and fastener features 513 in the opposing thermal transfer plate 501. Fastener features 514 may also be included exterior to the body edge 512.
In another aspect alignment pins or other mechanical alignment features 510 may be used to assist in assembly and maintenance of a proper seal.
The Skived Fin Plate 501-501A may be formed from a contiguous material and may be fashioned, for example via traditional skiving practices, or via a three dimensional printing process. Preferably the one or more Skived Plates 501-501A are formed from a material with a high thermal coefficient, such as copper or other metallic material or metallic compound. As new materials are developed it is within the scope of this invention to include a skived fin plate fashioned from a non-metallic material with favorable thermal conductivity characteristics. Generally a material with a high thermal coefficient is preferred.
According to the present invention, one or more skived fin thermal transfer plates 501-501A are housed in a casing of lighter weight material for optimal dissipation and transfer of the heat from the base to the Skived Fins 505 and an overall light weight and less expensive thermal transfer unit. Additionally, a skiving process used to form the fins 505 may increases the roughness of the heat-sink's fins. Unlike the underside of a heat-sink which typically benefits from a smooth surface for maximum surface area contact with the heat-source that it cools, the skived fins benefit from roughness due to an increased surface area of the fins 505. A non-smooth fin 505 surface area provides increased area for thermal energy transfer.
A Body 502 is used to fix the skived fin plate in a position to come into contact with a fluid entered into a fluid transport area 517. Preferred embodiments include a Body 502 fashioned from a plastic or other non-metallic material due to the light weight characteristics and inexpensive manufacturing. However, other materials may also be used to form the Body 502. Non-metallic materials that may be used to form the thermal transfer plate body may include for example, a plastic with a high thermal transfer capability, including, for example, a plastic with a thermal conductor. A thermal conductor may include, for example, a ceramic component, such as boron nitride or a compound such as a thermally conductive ceramic or metallic nanoparticle component.
A Body 502 will hold the one or more Skived Fin Plates 501-501A in contact with a fluid for which thermal energy control is desired. For example a fluid may be cooled or heated in order to maintain a desired temperature of the fluid.
The Body 502 may be fashioned from a thermoplastic via injection molding processes, or via a 3D printing process. The Body 502 includes a fluid transport area defined by multiple Thermal transfer plate Body 502 sides. The fluid transport area may additionally include one or more fluid Flow Channels 517. Fluid Flow Channels 517 guide the path of fluid flowing within the Body 502.
The Skived Fin Plates 501-501A are housed within the Body 502 and fluid entered in to the Body 502 will come into contact with the Skived Fin Plate 501-501A. In some embodiments, fluid within the Body 502 will follow a route defined by fluid Flow Channels 517 and be guided into contact with the Skived Fins 505 on the Skived Fin Plates 501-501A. A thermal transfer will take place between the Skived Fin Plates 501-501A, including the Skived Fins 505, and fluid within the Body 502.
Fluid exits the Body 502 via a Fluid Outlet 508. The Fluid Inlet 507 and the Fluid Outlet 508 may generally include a tubing nozzle or other fixture for providing fluid communication between a thermal unit, such as a thermoelectric cooling unit and the Body 502.
As illustrated, the Thermal transfer plate Body 502 may include an upper sealed surface 516 and a lower sealed surface 515 and a respective skived fin thermal transfer plate 501-501A seals against each of the upper sealed surface 516 and the lower sealed surface 515. The seal 512 may include a gasket 512, such as an O-Ring gasket, a sealer, or other known sealing mechanism. The illustrated Thermal transfer plate Body 502 includes a lower thermal transfer plate 501 and an upper thermal transfer plate 501A. The seal 512 prevents liquid from inside the thermal transfer plate Body 502 from leaking to an external environment.
Also as illustrated, a Fluid Inlet 507 and the Fluid Outlet 508 are both included on a same side 511 of the Body 502. However, other embodiments may include a straight through flow with a fluid inlet 507 in a generally linear path with a Fluid Outlet 508. Still other embodiments include a Fluid Inlet 507 on a different side 511 of the Body 502 than the Fluid Outlet 508.
Skived Fin Plates 501-501A may be fastened to the Body 502 via a Seal 512. The Seal 512 may include, for example, an O-Ring seal. Other types of Seal 512 may include a gasket, a cement or other sealant artifact.
In some embodiments, a Mechanical Fastening Point 508 may also be included in one or both of the Skived Fin Plate 501-501A and the Body 502. The Mechanical Fastening Point 503A will accommodate a fastening mechanism that secures the Skived Fin Plate 501-501A in a fixed position relative to the Body 502. The Seal 512 contains a liquid with the Body 502 and the Skived Fin Plate 501-501A. A Fastening Mechanism may include, by way of non-limiting example, a bolt, a screw, a rivet, a quick disconnect device, or other known mechanical fastening means.
A number of embodiments of the present invention have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. For example, various methods or equipment may be used to implement the process steps described herein or to create a device according to the inventive concepts provided above and further described in the claims. In addition, various data communication mechanisms and thermal transfer mechanisms may be utilized for various aspects of the present invention. Accordingly, other embodiments are within the scope of the following claims.
The present application claims priority to U.S. Provisional Patent No. 61/810,933, entitled “High Efficiency Cold Plate” filed Apr. 11, 2013 the contents of which are relied upon and incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 61810933 | Apr 2013 | US |
