Patent Application
20150035624
1. Field of the Invention
The present invention relates to a high frequency filter including a plurality of insulator layers and transmission lines.
2. Description of the Related Art
As one of conventional high frequency filters, for example, a multilayer balanced filter described in Japanese Unexamined Patent Application Publication No. 2011-124880 is known. The multilayer balanced filter described in Japanese Unexamined Patent Application Publication No. 2011-124880 is described below.
As illustrated in
The coils 531 and 541 are formed on the dielectric layer 553. The coil 542 is formed on the dielectric layer 552. The coil 543 is formed on the dielectric layer 551. The coil 531 electromagnetically couples to the coil 542 with the dielectric layer 552 in between by arranging the coil 531 and the coil 542 to oppose each other in a stacking direction of the multilayer structure 502. Further, one end portion of the coil 542 is connected to the coil 541 through a via-hole conductor. The other end portion of the coil 542 is connected to the coil 543 through a via-hole conductor.
The capacitor electrode 521 is formed on the dielectric layer 554. The capacitor electrodes 522 and 523 are formed on the dielectric layer 556. Further, the ground electrode 520 is formed on the dielectric layer 555.
A capacitor C100 is formed by arranging the ground electrode 520 and the capacitor electrode 521 so as to oppose each other across the dielectric layer 554. Further, the capacitor C100 is connected in parallel to the coil 531. As illustrated in
Further, a capacitor C200 is formed by arranging the ground electrode 520 and the capacitor electrode 522 so as to oppose each other across the dielectric layer 555. Further, the capacitor C200 is connected to the coil 541. As illustrated in
Further, a capacitor C300 is formed by arranging the ground electrode 520 and the capacitor electrode 523 so as to oppose each other across the dielectric layer 555. Further, the capacitor C300 is connected to the coil 543. As illustrated in
In the multilayer balanced filter 500 configured as described above, an unbalanced signal inputted from an input terminal 561 to the coil 531 is converted to a balanced signal in between the coil 531 and the coil 542, as illustrated in
In the multilayer balanced filter 500, the coil 531 and the coil 542 are electromagnetically coupled by arranging them to oppose each other in the stacking direction with the dielectric layer 552 in between (broadside coupling). Accordingly, in the multilayer balanced filter 500, the area of insulator layers may be reduced compared to a multilayer balanced filter in which two coils are arranged on the same layer to produce electromagnetic coupling (edge coupling).
However, in the multilayer balanced filter 500, the coil 531 and the coil 542 face each other in the stacking direction. Thus, compared to the multilayer balanced filter in which two coils are arranged on the same layer to produce electromagnetic coupling, the multilayer balanced filter 500 stacks more insulator layers. In other words, it is difficult to reduce a profile height of the multilayer balanced filter 500.
Preferred embodiments of the present invention provide a high frequency filter that is configured to have a lower profile height while preventing an increase in a mounting area.
A high frequency filter according to a first preferred embodiment of the present invention includes a multilayer structure including a plurality of insulator layers stacked on each other; a first transmission line configured to transmit an input signal; a second transmission line configured to produce electromagnetic coupling with the first transmission line on a same insulator layer and transmit an output signal; and a conductor layer configured to define capacitors with the first transmission line and the second transmission line with the insulator layer in between, wherein a dielectric constant of a first insulator layer that comes in contact with the first transmission line and the second transmission line is higher than a dielectric constant of the insulator layer other than the first insulator layer.
High frequency filters according to various aspects of preferred embodiments of the present invention achieve a lower profile height while preventing an increase in a mounting area.
The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.
High frequency filters according to preferred embodiments of the present invention are described below.
A high frequency filter according to the first preferred embodiment of the present invention is now described below with reference to the drawings.
The high frequency filter 10 includes a multilayer structure 12, outer electrodes 14a to 14f, transmission lines 18 and 19, a ground conductor 24, and a floating conductor 26, as illustrated in
The insulator layers 28a to 28e are stacked in this order from the positive direction side to the negative direction side in the z-axis direction, as illustrated in
The transmission line 18 and the transmission line 19 are provided on the top surface of the insulator layer 28c, as illustrated in
The transmission line 18 includes a coupling line portion 18a and extraction portions 18b and 18c, as illustrated in
An end portion of the extraction portion 18b at the positive direction side in the x-axis direction is connected to an end portion of the coupling line portion 18a at the positive direction side in the y-axis direction, as illustrated in
The transmission line 19 includes a coupling line portion 19a and extraction portions 19b and 19c, as illustrated in
An end portion of the extraction portion 19b at the negative direction side in the x-axis direction is connected to an end portion of the coupling line portion 19a at the positive direction side in the y-axis direction, as illustrated in
Further, the coupling line portion 18a is parallel or substantially parallel to the coupling line portion 19a, as illustrated in
Here, the extraction portion 19b is provided with an adjuster portion 20b that occupies a portion of the extraction portion 19b. Further, the extraction portion 19c is provided with an adjuster portion 20c that occupies a portion of the extraction portion 19c. The adjuster portion 20b and the adjuster portion 20c face each other in the y-axis direction. As illustrated in
The ground conductor 24 (conductor layer) faces the transmission line 18 and the transmission line 19 with the insulator layer 28c in between, as illustrated in
The extraction portions 24b and 24c are provided on the top surface of the insulator layer 28d, as illustrated in
The floating conductor 26 is provided on the top surface of the insulator layer 28d and faces the adjuster portion 20b and the adjuster portion 20c with the insulator layer 28c in between, as illustrated in
The adjuster portions 20b and 20c, the floating conductor 26, and the insulator layer 28c define an impedance adjuster portion configured to adjust the impedance of the transmission line 19. Specifically, in the high frequency filter 10, the impedance adjuster portion preferably includes the following first structure and second structure. The first structure is a structure in which the floating conductor 26 faces portions of the transmission line 19 (namely, the adjuster portions 20b and 20c). The second structure is a structure in which the distance between the portions (adjuster portions 20b and 20c) of the extraction portions 19b and 19c differs from the distances between portions other than the adjuster portions 20b and 20c of the extraction portions 19b and 19c.
The transmission lines 18 and 19, the ground conductor 24, and the floating conductor 26 are formed preferably by a method such as sputtering, evaporation, printing, photolithography, or the like, and are composed of a material such as Ag—Pd, Ag, Pd, Cu, or the like.
The outer electrode 14a and the outer electrode 14b are provided on the side surface S3 of the multilayer structure 12, as illustrated in
The outer electrode 14a is configured so as to extend in the z-axis direction on the side surface S3, as illustrated in
The outer electrode 14b is configured so as to extend in the z-axis direction on the side surface S3, as illustrated in
The outer electrode 14c and the outer electrode 14d are provided on the side surface S4 of the multilayer structure 12, as illustrated in
The outer electrode 14c is configured so as to extend in the z-axis direction on the side surface S4, as illustrated in
The outer electrode 14d is configured so as to extend in the z-axis direction on the side surface S4, as illustrated in
The outer electrode 14e is configured so as to cover substantially the whole of the side surface S5, as illustrated in
The outer electrode 14f is configured so as to cover substantially the whole of the side surface S6, as illustrated in
The high frequency filter 10 having structures illustrated in
Further, the extraction portion 18b, the coupling line portion 18a, and the extraction portion 18c are connected in series in this order between the outer electrodes 14a and 14b. Accordingly, the striplines 30b, 30a, and 30c are connected in series in this order between the outer electrodes 14a and 14b.
The transmission line 19 of the high frequency filter corresponds to a resonator 32 illustrated in
Further, the extraction portion 19b, the coupling line portion 19a, and the extraction portion 19c are connected in series in this order between the outer electrodes 14c and 14d. Accordingly, the striplines 32b, 32a, and 32c are connected in series in this order between the outer electrodes 14c and 14d.
A capacitor C1 is provided between the adjuster portion 20b of the extraction portion 19b and the floating conductor 26 by arranging the adjuster portion 20b and the floating conductor 26 to oppose each other with the insulator layer 28c in between, as illustrated in
The high frequency filter 10 configured as described above may be used as a signal converter configured to perform reciprocal conversion between a balanced transmission line signal and an unbalanced transmission line signal.
The outer electrode 14a connected to the transmission line 18 is used as a signal input terminal. Further, the outer electrode 14b is connected to a ground electrode. Further, the outer electrodes 14c and 14d of the transmission line 19 are used as output terminals.
An unbalanced signal is inputted to the transmission line 18 from the outer electrode 14a. Subsequently, a balanced signal is generated at the transmission line 19 by having electromagnetic coupling between the transmission line 18 and the transmission line 19. The balanced signal is extracted from the outer electrodes 14c and 14d connected to the transmission line 19. Alternatively, a balanced signal may be inputted to the transmission line 19 from the outer electrodes 14c and 14d, and an unbalanced signal may be extracted from the outer electrode 14a connected to the transmission line 18.
Further, a high frequency signal inputted to the transmission line 18 passes through the striplines 30a to 30c. At this time, the striplines 30a to 30c define and function as a band filter and remove unwanted frequency components of the unbalanced signal inputted. Further, when extracting the balanced signal from the transmission line 19, the striplines 32a to 32c remove unwanted frequency components from the balanced signal.
Note that the degree of coupling formed between the transmission line 18 and the transmission line 19 may be varied by adjusting the distance between the transmission line 18 and the transmission line 19 or the distances to the ground conductor 24. This enables to adjust the pass band width of the high frequency filter 10.
The high frequency filter 10 configured as described above prevents an increase in the size of a mounting area. Specifically, the wavelength of a high frequency signal propagating over a transmission line on an insulator layer having a relatively-high dielectric constant is shorter than the wavelength of a high frequency signal propagating over a transmission line on an insulator layer having a relatively-low dielectric constant because of a wavelength shortening effect. Thus, in the high frequency filter 10, the dielectric constant of the insulator layer 28c on which the transmission lines 18 and 19 are provided is made larger than those of the insulator layers 28a, 28b, 28d, and 28e (namely, insulator layers other than the insulator layer 28c). In this way, the transmission lines 18 and 19 of the high frequency filter 10 is shorter than transmission lines of a high frequency filter where the transmission line 18 and the transmission line 19 are provided on the insulator layer having a relatively-low dielectric constant (insulator layer other than the insulator layer 28c). In other words, according to the high frequency filter 10, increases in the size of the mounting area are prevented.
Further, according to the high frequency filter 10, the profile of component is lowered. In the multilayer balanced filter 500, as illustrated in
According to the high frequency filter 10, the profile of component is further lowered. Specifically, a certain size of area is required on a dielectric layer to obtain a certain capacity in order to have a matching circuit for impedance adjustment (hereinafter, a matching circuit indicates a matching circuit for impedance adjustment). Thus, in general, a matching circuit is provided on an insulator layer that is different from the insulator layer on which electromagnetically coupled transmission lines are provided to reduce the size of mounting area in a high frequency filter.
On the other hand, in the high frequency filter 10, a higher dielectric constant material is preferably used for the insulator layer 28c. This allows the matching circuit to achieve the certain capacity even with an area less than the certain size of area by providing the matching circuit on the insulator layer 28c. Thus, the area of the matching circuit of the high frequency filter 10, namely, the impedance adjuster portion (preferably defined by the adjuster portions 20b and 20c, the insulator layer 28c, and the floating conductor 26) is less than the area of a matching circuit of a typical high frequency filter. In this way, in the high frequency filter 10, the impedance adjuster portion preferably is provided on the top surface of the insulator layer 28c on which the transmission lines 18 and 19 are located, as illustrated in
Further, according to the high frequency filter 10, a stray capacitance produced between the ground conductor 24 and a board on which the high frequency filter 10 is mounted is significantly reduced or prevented. Specifically, in the high frequency filter 10, a higher dielectric constant material is preferably used only for the insulator layer 28c. If the same higher dielectric constant material used for the insulator layer 28c were used for the insulator layers 28d and 28e, a stray capacitance would be generated between the ground conductor 24 and the board on which the high frequency filter 10 is mounted. However, in the high frequency filter 10, a higher dielectric constant material is preferably used only in the insulator layer 28c. Thus, the generation of stray capacitance between the ground conductor 24 and the board is significantly reduced or prevented.
Further, according to the high frequency filter 10, the impedance adjustment is easily performed. Specifically, the y-axis direction distance between the adjuster portion 20b and the adjuster portion 20c is shorter than the y-axis direction distance between any portion other than the adjuster portion 20b in the extraction portion 19b and any portion other than the adjuster portion 20c in the extraction portion 19c. In this way, a minute capacitor C3 is provided between the adjuster portion 20b and the adjuster portion 20c. Further, the size of the capacitor C3 preferably is varied by adjusting the distance between the adjuster portion 20b and the adjuster portion 20c. Thus, according to the high frequency filter 10, the adjustment of impedance in a matching circuit is easily performed by adjusting the distance between the adjuster portion 20b and the adjuster portion 20c. Note that the capacitor C3 is not illustrated in the equivalent circuit diagram of
According to the high frequency filter 10, the impedance adjustment is more easily performed. Specifically, the high frequency filter 10 is provided with the floating conductor 26 that is electrically discontinued with the ground conductor 24. Further, the capacitance generated between the floating conductor 26 and the transmission line 19 varies by adjusting an overlapping area of the floating conductor 26 and the transmission line 19 when viewed from the positive direction side in the z-axis direction. This makes it possible to perform the impedance adjustment easily in the high frequency filter 10.
A high frequency filter 10-1 according to a first modification example of a preferred embodiment of the present invention is described below with reference to drawings.
Differences between the high frequency filter 10 and the high frequency filter 10-1 lie in the shape of the ground conductor 24 and the presence or absence of the floating conductor 26. The remaining features are preferably identical or substantially identical in the high frequency filter 10 and the high frequency filter 10-1, and thus the descriptions thereof are omitted. Here, a ground conductor in the high frequency filter 10-1 is referred to as a ground conductor 24-1, and a main portion is referred to as a main portion 24a-1. Further, in
As illustrated in
Further, in the high frequency filter 10-1, a capacitor C1-1 is provided between the adjuster portion 20b and the ground conductor 24-1 by arranging the adjuster portion 20b and the ground conductor 24-1 to oppose each other with the insulator layer 28c in between, as illustrated in
In the high frequency filter 10-1 configured as described above, the adjuster portions 20b and 20c face the ground conductor 24-1. This allows center points of the capacitors C1-1 and C2-1 to be connected to ground. As a result, a balancing property may be stabilized when the high frequency filter 10 is used as an unbalanced-to-balanced signal converter.
A high frequency filter 10-2 according to a second modification example of a preferred embodiment of the present invention is described below with reference to drawings.
Differences between the high frequency filter 10 and the high frequency filter 10-2 lie in the shape of the ground conductor 24 and the presence or absence of the floating conductor 26. The remaining features are preferably identical or substantially identical in the high frequency filter 10 and the high frequency filter 10-2, and thus the descriptions thereof are omitted. Here, a ground conductor in the high frequency filter 10-2 is referred to as a ground conductor 24-2, and a main portion is referred to as a main portion 24a-2. Further, in
As illustrated in
Extraction portions 24b-2 and 24c-2 of the ground conductor 24-2 preferably include wiring parallel or substantially parallel to the y-axis direction, as illustrated in
Further, in the high frequency filter 10-2, a capacitor C1-2 is provided between the adjuster portion 20b and the main portion 24a-2-2 of the ground conductor 24-2 by arranging the adjuster portion 20b and the main portion 24a-2-2 to oppose each other with the insulator layer 28c in between, as illustrated in
The high frequency filter 10-2 configured as described above is provided with the two main portions 24a-2-1 and 24a-2-2. Further, the transmission line 18 faces the main portion 24a-2-1, and the transmission line 19 faces the main portion 24a-2-2. Thus, the main portion 24a-2-1 to which the transmission line 18 faces is not connected to the main portion 24a-2-2 to which the transmission line 19 faces. This weakens the electromagnetic coupling between the transmission line 18 and the transmission line 19. In other words, dividing the ground conductor 24-2 into two portions enables to weaken the electromagnetic coupling without changing the distance between the transmission line 18 and the transmission line 19. This enables to provide a wider margin to adjust the degree of coupling between the transmission lines.
A high frequency filter 10-3 according to a third modification example of a preferred embodiment of the present invention is described below with reference to drawings.
A difference between the high frequency filter 10 and the high frequency filter 10-3 lies in the shapes of the adjuster portions 20b and 20c. The remaining features preferably are identical or substantially identical in the high frequency filter 10 and the high frequency filter 10-3, and thus the descriptions thereof are omitted. Note that a transmission line in the high frequency filter 10-3 is referred to as a transmission line 19-3, and that adjustment portions are referred to as adjuster portions 20b-3 and 20c-3. Further, in
As illustrated in
In the high frequency filter 10-3 configured as described above, capacitors C1-3 and C2-3 (see
A high frequency filter 10-4 according to a fourth modification example of a preferred embodiment of the present invention is described below. A difference between the high frequency filter 10 and the high frequency filter 10-4 lies in the dielectric constant of a portion of the insulator layer 28c. Note that, in the high frequency filter 10-4, an insulator layer corresponding to the insulator layer 28c in the high frequency filter 10 is referred to as an insulator layer 28c-4. The remaining features preferably are identical or substantially identical in the high frequency filter 10 and the high frequency filter 10-4, and thus the descriptions thereof are omitted. Further, as for the drawings of the high frequency filter 10-4 according to the fourth modification example,
The dielectric constant of the insulator layer 28c-4 of the high frequency filter 10-4 according to the fourth modification example is higher than those of the insulator layers 28a, 28b, 28d, and 28e (namely, insulator layers other than the insulator layer 28c-4). Further, in the insulator layer 28c-4, the dielectric constant of a portion located between the adjuster portions 20b and 20c and the floating conductor 26 is higher than the dielectric constants of other portions of the insulator layer 28c-4. In this way, the impedance adjuster portion is configured in such a way that, in the insulator layer 28c-4, the dielectric constant of a contact portion that comes in contact with portions (adjuster portions 20b, 20c) of the transmission line 19 is higher than the dielectric constants of portions other than the contact portion.
In the high frequency filter 10-4 configured as described above, the capacitors C1 and C2 provided between the adjuster portions 20b and 20c and the floating conductor 26 may be adjusted by varying the dielectric constant of the portion of the insulator layer 28c-4. Further, in the high frequency filter 10-4, the minute capacitor C3 provided between the adjuster portion 20b and the adjuster portion 20c may be adjusted by varying the dielectric constant of the portion of the insulator layer 28c. Thus, according to the high frequency filter 10-4, the adjustment of impedance in the matching circuit may be easily performed by adjusting the dielectric constant of the portion of the insulator layer 28c.
The high frequency filter according to the present invention is not limited to the high frequency filters 10, 10-1, 10-2, 10-3, or 10-4 according to the foregoing preferred embodiments or foregoing modification examples, and may be modified within the spirit and scope of the present invention.
Further, the elements of the high frequency filters 10, 10-1, 10-2, 10-3, and 10-4 may be combined, for example.
Note that, in the high frequency filter 10, the distance between the adjuster portions 20b and 20c may be made wider than the distances between portions other than the adjuster portions 20b and 20c of the extraction portions 19b and 19c, for example.
As described above, various preferred embodiments of the present invention and modifications and combinations thereof are useful for high frequency filters, and in particular, superior in achieving lower component profiles while preventing increases in a size of a mounting area.
While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012-104621 | May 2012 | JP | national |
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2013/057759 | Mar 2013 | US |
| Child | 14515625 | US |
