High frequency midboard connector

Description

FIELD

Disclosed embodiments are related to near midboard connectors with high frequency performance, as well as related methods of use of such midboard connectors.

BACKGROUND

Electrical connectors are used in many electronic systems. It is generally easier and more cost effective to manufacture a system as separate electronic subassemblies, such as printed circuit boards (PCBs), which may be joined together with electrical connectors. Having separable connectors enables components of the electronic system manufactured by different manufacturers to be readily assembled. Separable connectors also enable components to be readily replaced after the system is assembled, either to replace defective components or to upgrade the system with higher performance components.

A known arrangement for joining several printed circuit boards is to have one printed circuit board serve as a backplane. Other printed circuit boards, called “daughterboards,” “daughtercards,” or “midboards” may be connected through the backplane. A backplane is a printed circuit board onto which many connectors may be mounted. Conducting traces in the backplane may be electrically connected to signal conductors in the connectors so that signals may be routed between the connectors. Daughtercards may also have connectors mounted thereon. The connectors mounted on a daughtercard may be plugged into the connectors mounted on the backplane. In this way, signals may be routed among the daughtercards through the backplane. The daughtercards may plug into the backplane at a right angle. The connectors used for these applications may therefore include a right angle bend and are often called “right angle connectors.”

Connectors may also be used in other configurations for interconnecting printed circuit boards. Sometimes, one or more smaller printed circuit boards may be connected to another larger printed circuit board. In such a configuration, the larger printed circuit board may be called a “motherboard” and the printed circuit boards connected to it may be called daughterboards. Also, boards of the same size or similar sizes may sometimes be aligned in parallel. Connectors used in these applications are often called “stacking connectors” or “mezzanine connectors.”

Connectors may also be used to enable signals to be routed to or from an electronic device. A connector, called an “I/O connector,” may be mounted to a printed circuit board, usually at an edge of the printed circuit board. That connector may be configured to receive a plug at one end of a cable, such that the cable is connected to the printed circuit board through the I/O connector. The other end of the cable may be connected to another electronic device.

Cables have also been used to make connections within the same electronic device. The cables may be used to route signals from an I/O connector to a processor assembly that is located at the interior of printed circuit board, away from the edge at which the I/O connector is mounted. In other configurations, both ends of a cable may be connected to the same printed circuit board. The cables can be used to carry signals between components mounted to the printed circuit board near where each end of the cable connects to the printed circuit board.

Routing signals through a cable, rather than through a printed circuit board, may be advantageous because the cables provide signal paths with high signal integrity, particularly for high frequency signals, such as those above 40 Gbps using an NRZ protocol or greater than 50 Gbps using a PAM4 protocol. Known cables have one or more signal conductors, which are surrounded by a dielectric material, which in turn is surrounded by a conductive layer. A protective jacket, often made of plastic, may surround these components. Additionally the jacket or other portions of the cable may include fibers or other structures for mechanical support.

One type of cable, referred to as a “twinax cable,” is constructed to support transmission of a differential signal and has a balanced pair of signal wires embedded in a dielectric and encircled by a conductive layer. The conductive layer is usually formed using foil, such as aluminized Mylar. The twinax cable can also have a drain wire. Unlike a signal wire, which is generally surrounded by a dielectric, the drain wire may be uncoated so that it contacts the conductive layer at multiple points over the length of the cable. At an end of the cable, where the cable is to be terminated to a connector or other terminating structure, the protective jacket, dielectric and the foil may be removed, leaving portions of the signal wires and the drain wire exposed at the end of the cable. These wires may be attached to a terminating structure, such as a connector. The signal wires may be attached to conductive elements serving as mating contacts in the connector structure. The foil may be attached to a ground conductor in the terminating structure, either directly or through the drain wire, if present. In this way, any ground return path may be continued from the cable to the terminating structure.

High speed, high bandwidth cables and connectors have been used to route signals to or from processors and other electrical components that process a large number of high speed, high bandwidth signals. These cables and connectors reduce the attenuation of the signals passing to or from these components relative to what might occur were the same signals routed through a printed circuit board.

SUMMARY

In some embodiments, a method of constructing a connector includes stamping a terminal assembly. The terminal assembly includes a base extending in a first plane, a plurality of connected terminals having a first portion parallel to the first plane, and a second portion disposed at an angle relative to the first plane, a first wing including first projection receptacle, and a second wing including a second projection receptacle. The method also includes overmolding portions of the plurality of connected terminals with a dielectric material, and severing each of the plurality of connected terminals from one another.

In some embodiments, a method of constructing a connector includes stamping a terminal assembly, where the terminal assembly includes a cable clamp plate and a plurality of terminals extending from the cable clamp plate. The method also includes overmolding portions of the plurality of terminals with a dielectric material, and, for a portion of the plurality of terminals, severing a connection between the terminal and each of the other of the plurality of electrically connected terminals.

In some embodiments, an electrical connector includes a base, a plurality of terminals, where each of the plurality of terminals includes a first portion aligned with the base and a second portion transverse to the base, and where the terminals are integrally formed on the same piece of metal. The electrical connector also includes a dielectric material attached to the plurality of terminals and the base such that the terminals are physically supported relative to the base by dielectric material.

In some embodiments an electronic assembly includes a substrate having at least one electronic component mounted thereto, and a first connector including a first connector housing having a bottom face disposed in a first plane, a plurality of first terminals disposed in the first connector housing and extending in a first direction angled relative to the first plane at an angle between approximately 20 and 55 degrees. The electronic assembly also includes a second connector mounted to the substrate, the second connector including a base including a portion disposed in a second plane and facing the substrate, a first wing extending from the base, a second wing extending from the base, and a plurality of second terminals. Each of the plurality of terminals includes a first portion extending in the second plane and a second portion angled relative to the second plane at an angle between 10 and 40 degrees. The first connector is mated to the second connector such that the plurality of first terminals press against respective ones of the plurality of second terminals. The plurality of first terminals and/or the plurality of second terminals are elastically deformed so as to bias the first connector housing away from the base of the second connector.

In some embodiments, an electrical connector includes a base, and a first wing and an opposing second wing extending perpendicularly from the base so as to define an opening between the first and second wings, where the base and the first wing and the second wing include integral portions of a sheet of metal. The electrical connector also includes a plurality of terminals, where each of the plurality of terminals includes a first portion aligned with the base and a second portion transverse to the first portion extending into the opening. The electrical connector also includes dielectric material attached to the plurality of terminals and the base such that the plurality of terminals are physically supported relative to the base by dielectric material.

It should be appreciated that the foregoing concepts, and additional concepts discussed below, may be arranged in any suitable combination, as the present disclosure is not limited in this respect. Further, other advantages and novel features of the present disclosure will become apparent from the following detailed description of various non-limiting embodiments when considered in conjunction with the accompanying figures.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures may be represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:

FIG. 1 is a perspective view of a portion of an exemplary embodiment of an electronic system with cables routing signals between I/O connectors and a midboard location;

FIG. 2 is a perspective view of an exemplary embodiment of a board connector;

FIG. 3 is a perspective view of an exemplary embodiment of a cable connector;

FIG. 4 is a perspective view of the board connector of FIG. 2 receiving the cable connector of FIG. 3;

FIG. 5 is an exploded perspective view of an exemplary embodiment of a cable connector, without an overmold;

FIG. 6A is an assembled perspective view of the cable connector of FIG. 5;

FIG. 6B is a cross section of the cable connector of FIG. 6A taken along line 6B-6B;

FIG. 7 is a perspective view of the cable connector with an overmold in place;

FIG. 8A is a cross-sectional view of an exemplary embodiment of a cable connector mating with a board connector in a first position;

FIG. 8B is a cross-sectional view of the cable connector and board connector in a second position;

FIG. 9 is a side view of an exemplary embodiment of a mated board connector and cable connector; and

FIG. 10 is a side view of an exemplary embodiment of a terminal of a board connector mating with a terminal of a cable connector.

DETAILED DESCRIPTION

The inventors have recognized and appreciated designs for cabled interconnections that enable efficient manufacture of small, high performance electronic devices, such as servers and switches. These cabled interconnections support a high density of high-speed signal connections to processors and other components in the midboard region of the electronic device. A board connector may be mounted near these components and a cable connector may be mated to it. The other end of cables terminated at the cabled connector may be connected to an I/O connector or at another location remote from the midboard such that the cables may carry high-speed signals, with high signal integrity, over long distances.

Additionally, the inventors have recognized and appreciated designs for cable connectors and mating board connectors that are simple to manufacture with low tolerances and reduced tolerance stack. Furthermore, the inventors have recognized and appreciated designs for cable connectors and mating board connectors that shorten terminal stubs which can cause stub resonance and reduce cable frequency bandwidth. These connectors may nonetheless provide wipe of the mating terminals, which can remove oxide and other contaminates from the terminals, increasing the reliability of the interconnections in operation. The board and cable connectors may have mating terminals that deflect when the board and cable connector are pressed together, in a mating direction. The deflection may generate a backwards force, in a direction opposite the mating direction. Backward motion of the cable connector relative to the board connector is restrained by engagement features on the cable connector and/or board connector such that the relative position of the terminals, and resulting stub length, is set by the engagement features.

The board connector may support a surface mount interface to a substrate (e.g., a PCB or semiconductor chip substrate) carrying a processor or other components processing a large number of high speed signals. The connector may incorporate features that provide a large number of terminals in a relatively small volume. In some embodiments, the connector may support mounting on the top and bottom of a daughtercard or other substrate separated by a short distance from a motherboard, providing a high density of interconnections.

The cable connector may terminate multiple cables with a terminal for each conductor in each cable designed as a signal conductor and one or more terminals coupled to a grounding structure within the cable. For drainless twinax cable, for example, the connector may have, for each cable, two signal terminals electrically coupled to the cable conductors and a ground terminal coupled to a shield around the cable conductors. The terminals may be positioned such that the ground terminals are between adjacent pairs of signal terminals.

According to exemplary embodiments described herein, any suitably sized cable conductors may be employed and coupled to a suitably sized terminal. In some embodiments, cable conductors may have a diameter less than or equal to 24 AWG. In other embodiments, cable conductors may have a diameter less than or equal to 30 AWG.

A cable connector may be simply constructed through the use of modular terminal assemblies. Each terminal assembly may contain a plurality of terminals and an overmolded dielectric portion which physically supports the terminals. Terminals coupled to the shield of the cable may be electrically connected to one another. For example, in some embodiments, a ground conductor may be attached, such as by welding or soldering, to a ground portion of the terminals. The terminal assemblies may be aligned in one or more rows, creating an array of terminals. The terminal assemblies may be tightly spaced without walls of a connector housing separating them, as each terminal subassembly may include a cable connector plate, which aids in making ground connections to the cable shield and provides mechanical support for the terminal subassembly. The cable connector plate may engage a connector housing, holding the terminal assembly securely in the housing, without additional support structures, further increasing the density of the array of terminals.

In some embodiments, a board connector may include a terminal assembly. The terminal assembly may be formed by stamping a single piece of metal. All of the components of the connector formed in that stamping operation may be positioned relative to each other with high precision achievable in a stamping operation. The terminal assembly may include a base extending in a first plane, and a plurality of connected terminals having a first portion parallel to the first plane and a second portion disposed at an angle relative to the first plane. The second portion of the terminals may be arranged as a contact tip which extends at an angle (e.g., between 15 and 45 degrees, or between 20 and 30 degrees). The first portion of the terminals may be configured as a solder tail, arranged to be soldered to a contact on a substrate (e.g., PCB).

In some embodiments, the terminal assembly may also include a first wing and a second wing extending perpendicular to the first plane and defining an opening in the board connector into which the cable connector may be inserted. Each of the first wing and second wing may include engagement features, such as at least one projection receptacle configured to receive a corresponding projection of a cable connector. According to some embodiments, the second portions of the terminals may be configured to bias a cable connector away from the opening, and the projection receptacles maybe configured to retain the cable connector in the opening against the biasing force of the second portions. As the terminals, wings, and projection receptacles may be formed by the same stamping die, the distance between the projection receptacles and second portions may have a very low tolerance, such that the length of stubs of the plurality of terminals may be predicted with greater accuracy. Accordingly, the connectors may be designed with the length of the stubs may be reduced, and the bandwidth of the connector correspondingly increased due to a reduced effect of stub resonance.

According to exemplary embodiments described herein, a board connector may be manufactured with a terminal assembly stamped from a single piece of metal, such that tolerances maybe lowered as a result of reducing tolerance stack and the accuracy of bending and puncturing sheet metal (e.g., within ±1 degree of angular tolerance on bends and ±0.25 mm on relative spacing). Accordingly, a method of manufacture of a board connector may begin with stamping a terminal assembly with a die, where the terminal assembly includes a base, a plurality of terminals, a first wing, and a second wing. Next, a dielectric may be overmolded over at least a portion of plurality of terminals and the base, such that the dielectric physically supports the plurality of terminals and holds them in position relative to the base. Once overmolded, at least a portion of the plurality of terminals may be electrically and physically severed from one another. In severing the terminals, a portion of metal interconnecting the terminals (e.g., tie bars) may be removed, so that each of the separated terminals is physically supported and electrically isolated by the dielectric. The resulting board connector may be relatively simple and inexpensive to produce and may retain a low tolerance in positioning of the terminals with respect to the wings, which may include features to position the cable connector with respect to the base, thereby improving bandwidth of the connector.

In some embodiments, a cable connector may include a terminal assembly. The terminal assembly may include a cable clamp plate and a plurality of terminals integral with and extending from the cable clamp plate. The plurality of terminals and a portion of the cable clamp plate may be overmolded with a dielectric material, so that the plurality of terminals are physically supported relative to the cable clamp plate by the dielectric. The terminal assembly may form a row of terminals, effectively disposed in a single plane. The cable connector may include a connector housing having an opening configured to accommodate one or more terminal assemblies. The cable clamp plate may include at least two retaining tabs disposed on opposite side edges of the cable clamp plate which may be received and retained in corresponding tab receptacles of the connector housing.

In some embodiments, the connector housing may have a bottom face disposed in a first plane, and each terminal assembly disposed in the connector housing may be inclined relative to the first plane (e.g., between 30 and 45 degrees). Such an angle may be appropriate to engage inclined terminals of a board connector, such that the terminals of the board connector bias the cable connector away from the board connector. In some embodiments, the connector housing may include at least one projection on each side of the connector housing configured to engage corresponding projection receptacles disposed on a board connector. The projections may be arranged with lead-ins, such that the projections are not secured in the projection receptacles when the cable connector is moved toward the board connector, but are secured in the projection receptacles when the cable connector is moved away from the board connector. In some embodiments, the connector housing may include at least one guide configured to be received in a guide channel of a board connector. According to some embodiments, the guide may be parallel with the terminals and inclined relative to a bottom face of the connector housing, such that the connector housing moves at an incline relative to a board connector base when the guide is engaged with a guide channel.

In some embodiments, a cable clamp plate of a terminal assembly may include one or more strain relief portions where one or more cables may be physically secured to the terminal assembly. In some cases, signal fidelity through a high-bandwidth cable is susceptible to change based on the geometry of the conductors inside of the cable. A crushed cable, for example, may affect the signal fidelity of transmissions through a connector. Accordingly, the strain relief portions of the cable clamp plate may provide regions where the cable clamp plate can deform at a threshold clamping force to mitigate damage to a cable. In some embodiments, an I-shaped slot may be provided on the cable clamp plate for each attached cable. A metal plate (e.g., shield plate) may be used to apply pressure to a plurality of cables and clamp the cable against the cable clamp plate. In some embodiments, up to 100 lbs of force may be used to compress the cable(s) against the cable clamp plate. In other embodiments, a different clamping force may be applied, such as up to 75 lbs or up to 125 lbs, for example.

In some embodiments, a cable connector may include a ground conductor, which may act as a shorting bar interconnecting a ground terminal portion of a plurality of terminals. In some cases, resonance within the operating frequency range of a cable connector may be avoided by reducing the length of segments of ground terminals between connections to a common ground to which other terminals are connected. Accordingly, the ground conductor may shorten the length of segments of ground terminals between connections to a common reference by shorting them together near a contact point, thereby reducing the effects of resonance. In some embodiments, a ground conductor may be laser welded to a ground portion of the plurality of connectors. In some embodiments, the ground conductor may be spaced within 2 mm, such as 1.94 mm or less, from the proximal ends of the beams in the ground terminals, where the beams are connected to a common ground structure. Such an arrangement may be no more than a quarter wavelength of resonances which may interfere with signal fidelity. The ground conductor may nonetheless be sufficiently flexible that the ground terminals may move independently to mate with corresponding terminals in a mating connector.

In some embodiments, a cable connector may be manufactured by stamping structures from a sheet of metal in a manner similar to that of a board connector. In some embodiments, signal terminals and ground structures for a terminal assembly may be stamped with a die from a single piece of metal. Those structures may include a cable clamp plate along with a plurality of terminals extending from the cable clamp plate. The cable clamp plate may include at least two tabs disposed on opposing side edges of the cable clamp plate, as well as strain relief regions defined by an I-shaped slot. A dielectric may be overmolded over the plurality of terminals and the cable clamp portion, such that the plurality of terminals are physically supported by the dielectric. At least a portion of the terminals may then be physically and electrically severed from the cable clamp portion (e.g., by removing tie bars). A ground conductor may be welded or soldered to a ground portion of the plurality of terminals. Cable conductors of one or more cables may be welded or soldered to solder tails of each of the plurality of terminals. The cables may be clamped to the cable clamp portion with a metal shield with an appropriate clamp force. The shield may be attached to the clamp plate, such as by welding or brazing, for example. The terminal assembly including dielectric and ground conductor may be inserted into a connector housing, where the at least two tabs are received in corresponding tab receptacles so that the terminal assembly is secured in the connector housing. The terminal assembly may be disposed in a plane at an inclined relative to a bottom face of the connector housing (e.g., between 20 and 55 degrees, or between 30 and 45 degrees).

In some embodiments, methods of connecting a cable connector and a board connector include aligning a guide of the cable connector and a guide channel of the board connector. The guide may be inserted into the guide channel, so that the cable connector may move in a first direction toward the board connector, or a second direction away from the board connector. The cable connector may be moved in the first direction, and in some embodiments one or more projections of the cable connector may engage a first wing and second wing of the board connector with a lead-in, such that the projections are not caught by the wings and do not inhibit movement in the first direction. The cable connector may be moved further in the first direction until a plurality of cable terminals engage a plurality of board terminals, where the board terminals are disposed at an angle relative to the base of the board connector. The board terminals and/or cable terminals may deflect under force applied to the cable connector, and may also wipe against one another. Once the cable connector has been inserted into the board connector, the cable connector may be released, or the force applied reduced, such that biasing force generated by the plurality of deflected terminals moves the cable connector in the second direction away from the board connector. At a predetermined position, the one or more projections may be received in one or more corresponding projection receptacles formed in the first wing and second wing so that further movement in the second direction is prevented.

Turning to the figures, specific non-limiting embodiments are described in further detail. It should be understood that the various systems, components, features, and methods described relative to these embodiments may be used either individually and/or in any desired combination as the disclosure is not limited to only the specific embodiments described herein.

FIG. 1 is a perspective view, respectively of an illustrative electronic system 1 in which a cabled connection is made between a connector mounted at the edge 4 of a printed circuit board 2, which here is a motherboard, and a midboard connector 12A mated to a printed circuit board, which here is a daughterboard 6 mounted in a midboard region above printed circuit board 2. In the illustrated example, the midboard connector 12A is used to provide a low loss path for routing electrical signals between one or more components, such as component 8, mounted to printed circuit daughterboard 6 and a location off the printed circuit board. Component 8, for example, may be a processor or other integrated circuit chip. However, any suitable component or components on daughterboard 6 may receive or generate the signals that pass through the midboard connector 12A.

In the illustrated example, the midboard connector 12A couples signals to and from component 8 through an I/O connector 20 mounted in panel 4 of an enclosure. The I/O connector may mate with a transceiver terminating an active optical cable assembly that routes signal to or from another device. Panel 4 is shown to be orthogonal to circuit board 2 and daughterboard 6. Such a configuration may occur in many types of electronic equipment, as high speed signals frequently pass through a panel of an enclosure containing a printed circuit board and must be coupled to high speed components, such as processors or ASICS, that are further from the panel than high speed signals can propagate through the printed circuit board with acceptable attenuation. However, a midboard connector may be used to couple signals between a location in the interior of a printed circuit board and one or more other locations, either internal or external to the enclosure.

In the example of FIG. 1, connector 12A mounted at the edge of daughterboard 6 is configured to support connections to an I/O connector 20. As can be seen, cabled connections, for at least some of the signals passing through I/O connectors in panel 4, connect to other locations with the system. For example, there is a second connector 12B, making connections to daughterboard 6.

Cables 14A and 14B may electrically connect midboard connector assemblies 12A and 12B to locations remote from component 8 or otherwise remote from the location at which midboard connector assemblies 12A or 12B are attached to daughterboard 6. In the illustrated embodiment of FIGS. 1-2, first ends 16 of the cables 14A and 14B are connected to the midboard connector 12A or 12B, Second ends 18 of the cables are connected to an I/O connector 20. Connector 20, however, may have any suitable function and/or configuration, as the present disclosure is not so limited. In some embodiments, higher frequency signals, such as signals above 10 GHz, 25 GHz, 56 GHz or 112 GHz may be connected through cables 14, which may otherwise be susceptible to signal losses at distances greater than or approximately equal to six inches.

Cables 14B may have first ends 16 attached to midboard connector 12B and second ends 18 attached to another location, which may be a connector like connector 20 or other suitable configuration. Cables 14A and 14B may have a length that enables midboard connector 12A to be spaced from second ends 18 at connector 20 by a first distance. In some embodiments, the first distance may be longer than a second distance over which signals at the frequencies passed through cables 14A could propagate along traces within PCB 2 and daughterboard 6 with acceptable losses. In some embodiments, the first distance may be at least 6 inches, in the range of 1 to 20 inches, or any value within the range, such as between 6 and 20 inches. However, the upper limit of the range may depend on the size of PCB 2.

Taking midboard connector 12A as representative, the midboard connector may be mated to printed circuit board, such as daughter card 6, near components, such as component 8, which receive or generate signals that pass through cables 14A. As a specific example, midboard connector 12A may be mounted within six inches of component 8, and in some embodiments, within four inches of component 8 or within two inches of component 8. Midboard connector 12A may be mounted at any suitable location at the midboard, which may be regarded as the interior regions of daughterboard 6, set back equal distances from the edges of daughterboard 6 so as to occupy less than 100% of the area of the daughterboard 6. Such an arrangement may provide a low loss path through cables 14. In the electronic device illustrated in FIG. 1, the distance between connector 12A and processor 8 may be of the order of 1 inch or less.

In some embodiments, midboard connector 12A may be configured for mating to a daughterboard 6 or other PCB in a manner that allows for ease of routing of signals coupled through the connector. For example, an array of signal pads to which terminals of midboard connector 12A are mated may be spaced from the edge of daughterboard 6 or another PCB such that traces may be routed out of that portion of the footprint in all directions, such as towards component 8.

According to the embodiment of FIG. 1, connector 12A includes cables 14A aligned in multiple rows at first ends 16. In the depicted embodiment, cables are arranged in an array at first ends 16 attached to midboard connector 12A. Such a configuration, or another suitable configuration selected for midboard connector 12A, may result in relatively short breakout regions that maintain signal integrity in connecting to an adjacent component in comparison to routing patterns that might be required were those same signals routed out of an array with more rows and fewer columns.

As shown in FIG. 1 the connector 12A may fit within a space that might otherwise be unusable within electronic device 1. In this example, a heatsink 10 is attached to the top of processor or component 8. Heatsink 10 may extend beyond the periphery of processor 8. As heatsink 10 is mounted above daughterboard 6, there is a space between portions of heatsink 10 and daughterboard 6. However, this space has a height H, which may be relatively small, such as 5 mm or less, and a conventional connector may be unable to fit within this space or may not have sufficient clearance for mating. However, at least a portion of the connector 12A and other connectors of exemplary embodiments described herein may fit within this space adjacent to processor 8. For example, a thickness of a connector housing may be between 3.5 mm and 4.5 mm. Such a configuration uses less space on printed circuit daughterboard 6 than if a connector were mounted to printed circuit daughterboard 6 outside the perimeter of heatsink 10. Such a configuration enables more electronic components to be mounted to printed circuit to which the midboard connector is connected, increasing the functionality of electronic device 1. Alternatively, the printed circuit board, such as daughterboard 6, may be made smaller, thereby reducing its cost. Moreover, the integrity with which signals pass from connector 12A to processor 8 may be increased relative to an electronic device in which a conventional connector is used to terminate cables 14A, because the length of the signal path through printed circuit daughterboard 6 is reduced.

While the embodiment of FIG. 1 depicts a connector connecting to a daughter card at a midboard location, it should be noted that connector assemblies of exemplary embodiments described herein may be used to make connections to other substrates and/or other locations within an electronic device.

As discussed herein, midboard connector assemblies may be used to make connections to processors or other electronic components. Those components may be mounted to a printed circuit board or other substrate to which the midboard connector might be attached. Those components may be implemented as integrated circuits, with for example one or more processors in an integrated circuit package, including commercially available integrated circuits known in the art by names such as CPU chips, GPU chips, microprocessor, microcontroller, or co-processor. Alternatively, a processor may be implemented in custom circuitry, such as an ASIC, or semicustom circuitry resulting from configuring a programmable logic device. As yet a further alternative, a processor may be a portion of a larger circuit or semiconductor device, whether commercially available, semi-custom or custom. As a specific example, some commercially available microprocessors have multiple cores in one package such that one or a subset of those cores may constitute a processor. Though, a processor may be implemented using circuitry in any suitable format.

In the illustrated embodiment, the processor is illustrated as a packaged component separately attached to daughtercard 6, such as through a surface mount soldering operation. In such a scenario, daughtercard 6 serves as a substrate to which midboard connector 12A is mated. In some embodiments, the connector may be mated to other substrates. For example semiconductor devices, such as processors, are frequently made on a substrate, such as semiconductor wafer. Alternatively, one or more semiconductor chips may be attached, such as in a flip chip bonding process, to a wiring board, which may be a multi-layer ceramic, resin or composite structure. The wiring board may serve as a substrate. The substrate for manufacture of the semiconductor device may be the same substrate to which the midboard connector is mated.

Electronic systems as illustrated in FIG. 1 may be constructed with connectors such as 12A and 12B implemented with a board connector, such as might be mounted to daughtercard 6, and a cable connector that mates with the board connector.

FIG. 2 is a perspective view of an exemplary embodiment of a board connector 100. As shown in FIG. 2, the board connector is formed primarily from a unitary piece of material (e.g. metal), and may be formed from a process including stamping and overmolding. The board connector includes a terminal assembly including a base 101 and two wings 102. The base is disposed in a first plane, while the two wings 102 extend from the base. In the illustrated embodiment, the wings extend orthogonally from the base. According to the embodiment of FIG. 2, the board connector includes features that engage and position a cable connector. In this example, those features include a plurality of projection receptacles 104, with two projection receptacles disposed on each wing 102 near the corners regions of the wings. Each wing 102 also includes a guide channel 106 which is inclined relative to the base 101 and has an open end opposite the base. The guide channel may be angled relative to the base. The angle may be between 15 and 60 degrees, or between as 30 and 55 degrees in some embodiments. FIG. 2, for example, illustrates the guide channel angled at approximately 45 degrees relative to the base.

As shown in FIG. 2, the wings also each include two lead-in tabs 108 associated with the projection receptacles. The function of the lead-in tabs and projection receptacles 104 will be discussed further with reference to FIG. 4. According to some embodiments, as shown in FIG. 2, the board connector may include an alignment projection 118 configured to assist in aligning the board connector terminals with contact pads on a PCB or other substrate. The alignment projection 118 may be received in a corresponding hole in the PCB or other substrate to orient and align the board connector. Projection 118 may be used, for example, to position the board connector on a PCB prior to reflow soldering the terminals of the board connector to pads of the PCB.

According to the embodiment of FIG. 2, the board connector 100 includes a plurality of terminals 112 associated with the base 101. The plurality of terminals may be integrally formed with the base during a manufacturing process where the terminals are stamped from sheet metal. In the example of FIG. 2, the terminals are formed in four rows. Each row may align with a terminal subassembly of a mating cable connector.

Each terminal includes a first portion 114 and a second portion 116. The first portion is disposed in the plane of the base 101, and may be configured as a solder tail for soldering to a contact pad on an associated substrate (e.g., PCB). For example, the solder tails may each be configured to be soldered to a PCB with a solder reflow process. The second portion 116 is disposed at an angle relative to the plane of the base 101. The second portion extends upwards away from the base to form a contact tip for corresponding terminals of a cable connector. The second portions also function as cantilevered beams configured to undergo elastic bending and provide a biasing spring force urging a corresponding cable connector away from the board connector when a cable connector is mated to the board connector 100. In some embodiments, the second portion may be angled relative to the plane of the lower face of the base at an angle between 15 and 45 degrees, for example. According to the embodiment of FIG. 2, the second portion is angled between 20 and 30 degrees.

According to the embodiment of FIG. 2, the board connector 100 includes a dielectric 110 overmolded on the plurality of terminals 112 and the base 101. The dielectric is configured to physically support each of the terminals relative to the base 101. Accordingly, the integrally formed plurality of terminals may be physically and electrically severed from one another. In some embodiments, tie bars between the terminals may be removed. Once the plurality of terminals are electrically severed, the dielectric 110 may provide the sole physical support for the terminals, and may maintain their position relative to the base 101. Accordingly, in some embodiments of a manufacturing process, a terminal assembly may be stamped, a dielectric may be overmolded over the plurality of terminals and a portion of the base, and at least a portion of the terminals may be electrically severed from one another (e.g., by removing tie bars).

According to the embodiment of FIG. 2, each terminal assembly includes 76 terminals. Of course, in other embodiments, any number of terminals may be employed, as the present disclosure is not so limited.

FIG. 3 is a perspective view of an exemplary embodiment of a cable connector 200. As shown in FIG. 3, the cable connector includes a connector housing 202. The connector housing includes a plurality of projections 204. In particular, the connector housing has two projections 204 shown in FIG. 3, and two corresponding projections on an opposing side of the connector housing. The projections 204 are configured to engage projection receptacles formed in a board connector. In particular, the projections are configured to engage the projection receptacles to resist movement of the cable connector away from a board connector. Each of the projections 204 includes a lead-in 206 which is configured to allow the projections to move past corresponding projection receptacles when the cable connector is moved toward the board connector, as will be discussed further with reference to FIG. 4.

As shown in FIG. 3, the connector housing also includes guides 208 disposed on opposite sides of the connector housing. The guides are angled relative to a bottom face 218 of the connector housing which may sit parallel to a PCB or other substrate when the cable connector is engaged with a board connector. According to the embodiment of FIG. 3, the guides 208 are angled at an angle relative to the bottom face. The guides may be angled at an angle that matches that of guide channel 106. The angle, for example, may be between 15 and 60 degrees, such as at an angle between 30 and 50 degrees. The guides 208 may be received in corresponding guide channels of a board connector to restrict the relative movement of the cable connector to a single axis (i.e., eliminating or reducing rotational axes). The connector housing 202 may be formed of a dielectric material (e.g., plastic), but the present disclosure is not so limited in this regard, and any appropriate material may be employed.

According to the embodiment of FIG. 3, the connector housing 202 is configured to receive a plurality of terminal assemblies 212. The terminal assemblies are received in slots arranged in rows, so that a plurality of terminals 214 extend past the bottom face 218 at an angle relative to the bottom face. According to the embodiment, of FIG. 3, the terminal assemblies are angled at an angle relative to the bottom face. The terminal assemblies may be angled at an angle that matches that of guides 208. The angle, for example, may be between 15 and 60 degrees, such as at an angle between 30 and 50 degrees. The terminal assemblies 212 are configured to be retained in the connector housing with retaining tabs that engage corresponding tab receptacles 210 formed in the connector housing. As shown in FIG. 3 and as will be discussed further with reference to FIGS. 5-6A, each terminal assembly 212 includes a ground conductor 216 configured to short a ground portion of the terminals to reduce resonance modes of the ground portion of the plurality of terminals. According to the embodiment of FIG. 3, each terminal assembly includes 19 terminals, and the connector housing accommodates four terminal assemblies for a total of 76 terminals. Of course, in other embodiments, any number of terminals and terminal assemblies may be employed, as the present disclosure is not so limited.

FIG. 4 is a perspective view of the board connector 100 of FIG. 2 receiving the cable connector 200 of FIG. 3 during a mating sequence. As shown in FIG. 4, the guides 208 of the cable connector housing 202 are received in the guide channels 106 of the first and second wings 102. Accordingly, the movement of the cable connector 200 is limited to movement along a single axis, where movement in the first direction moves the cable connector close to the board connector and movement in a second direction moves the cable connector further away from the board connector. The axis of movement of the cable connector is parallel to the guides 208 and the guide channels 106, and in the embodiment shown in FIG. 4 is between 30 and 45 degrees relative to the base 101 of the board connector.

As shown in FIG. 4, the lead-ins 206 of each of the projections 204 of the cable connector 200 are aligned with the lead-in tabs 108 of the board connector 100. The lead-ins 206 and lead-in tabs 108 have complementarily angled surfaces so that engagement between the lead-ins and lead-in tabs does not inhibit movement of the cable connector. In particular, when the lead-ins 206 engage the lead-in tabs 108, the first and second wings 102 may be elastically deformed outward away from the cable connector, so that the wings 102 accommodate the width of the cable connector.

As the cable connector continues to move closer to the board connector, the lead-ins 206 may also engage the projection receptacles 104 to deform the wings 102 outward and to avoid capturing the projections 204 in the projection receptacles when the cable connector is moved in the first direction. Accordingly, the cable connector 200 may be freely moved in the first direction until the plurality of cable terminals contact the plurality of board terminal 112.

Upon insertion of cable connector 200 into board connector 100, the terminals of the cable connector engage the second portions 116 of the board connector terminals. As the second portions 116 are disposed at an angle relative to the base 101, the second portions may elastically deform and generate biasing force urging the cable connector in the second direction away from the board connector. Accordingly reducing or removing the insertion force from the cable connector allows the cable connector to move in the second direction under urging from the second portions until the projections 204 are captured in the projection receptacles, thereby inhibiting further movement in the second direction. This process accomplishes a terminal wipe for effective electrical conduction, and also provides for a known stub length of the terminals with a low tolerance.

FIG. 5 is an exploded perspective view of an exemplary embodiment of a cable connector terminal assembly 212. As shown in FIG. 5, the terminal assembly includes a plurality of terminals 214 extending from a cable clamp plate 300. The plurality of terminals and cable clamp plate may be stamped from the same piece of metal, such that the plurality of terminals and cable clamp plate were at one point integral. As shown in FIG. 5, the terminal assembly also includes a dielectric 306 overmolded over the plurality of terminals 214 and a portion of the cable clamp plate. The dielectric may be plastic material and may physically support the plurality of terminals. Accordingly, at least a portion of the plurality of terminals may be physically separated from the cable clamp plate (e.g., tie bars are removed) to electrically isolate the terminals. The dielectric may maintain the relative position of the terminals 214. In the embodiment of FIG. 5, the cable clamp plate 300 also includes retaining tabs 304 configured to be received in corresponding tab receptacles of a cable connector housing. Such an arrangement allows the terminal assembly to be reliably and accurately secured in a cable connector housing.

The cable clamp plate is configured to secure a plurality of cables 310 to the terminal assembly. The cables 310 may be configured as drainless twinax cables. The drainless twinax cable includes two cable conductors 318, each of which may be electrically and physically coupled to one or more of the terminals 214. Each of the cable conductors are surrounded by dielectric insulation 316 which electrically isolates the cable conductors from one another. A shield 314 which may be connected to ground surrounds the cable conductors and dielectric insulation 316. The shield may be formed of a metal foil and may fully surround the circumference of the cable conductors. The shield may be coupled to one or more ground contact tips through a compliant conductive member. Surrounding the shield is an insulating jacket 312. Of course, while a drainless twinax cable is shown in FIG. 5, other cable configurations may be employed, including those having more or less than 2 cable conductors (e.g., 1 cable conductor), one or more drain wires, and/or shields in other configurations, as the present disclosure is not so limited. For example, as shown in FIG. 5, the cable clamp plate also accommodates single conductor cables 320, which each include single conductors 322 surrounded by a single layer of dielectric insulation 324.

The conductors of the cables may be attached, such as by soldering or welding, to tails of the terminals in the terminal assembly. The shields of the cables may be electrically connected to the ground structures of the terminal assembly via clamping.

According to the embodiment of FIG. 5, the cable clamp plate 300 includes multiple strain relief portions 302. The strain relief portions of FIG. 5 are defined by an I-shaped slot or opening formed in the cable clamp plate that allows the cable clamp plate to deform under clamping pressure securing the cables to the cable clamp plate. Such an arrangement may reduce or eliminate the likelihood of the cable conductors 318 being crushed or otherwise altered by clamping force. In the embodiment of FIG. 5, a metal shield plate 308 is used to clamp the cables 310 to the cable clamp plate. The metal shield plate may be secured around the cables by welding (e.g., laser welding), overmolding, or another appropriate process, once an appropriate clamping force (e.g., 100 lbs) is applied to the metal plate.

As shown in FIG. 5, the terminal assembly includes a ground conductor 216 configured to electrically interconnect the terminals 214 that serve as ground terminals. The ground conductor may be laser welded or soldered to the ground portion of the plurality of terminals 214 near the end of the terminals. That is the ground conductor may be no more than 1.97 mm from an end of the terminals. Such an arrangement may reduce the quarter wavelength of standing resonance modes, thereby allowing the connector to support higher frequencies without resonance mode interference.

FIG. 6A is an assembled perspective view of the cable connector terminal assembly 212 of FIG. 5. As shown in FIG. 6A, the metal shield plate 308 has been secured around the twinax cables 310 and the single conductor cables 320. The metal plate may be welded or otherwise secured to the cable clamp plate 300 to provide suitable clamping force to secure the cables 310, 320. The ground conductor 216 is also electrically connected to some of the plurality of terminals 214, thereby shorting the ground terminals together. According to the embodiment of FIG. 6A, the terminal assembly is disposed primarily in a plane, and multiple terminal assemblies according to FIG. 6A may be secured in rows in a cable connector housing with retaining tabs 304.

FIG. 6B is a cross section of the cable connector terminal assembly 212 of FIG. 6A taken along line 6B-6B, showing the arrangement of one of the twinax cables 310 and the metal shield 308 clamping the cable. As shown in FIG. 6B, the cable includes two signal conductors 318 surrounded by dielectric insulation 316. Surrounding both of the dielectric insulation layers is a shield 314 configured to reduce the effects of electromagnetic interference. The shield 314 may be electrically connected to the ground terminals. Surrounding the shield 314 is a dielectric insulating jacket 312 which protects the cable 310. The metal shield plate 308 applies pressure to the insulating jacket 312 to secure the cable to the terminal assembly. The signal conductors 318 may be welded, soldered, or otherwise electrically connected to corresponding terminals.

FIG. 7 is a perspective view of the cable connector terminal assembly 212, showing one embodiment of an attached metal shield plate 308 securing cables 310, 320. As shown in FIG. 7, a portion of the metal shield plate 308 and the cable clamp plate are overmolded with a dielectric material 326. The dielectric material may partially surround the cables, holding the cables so as to reduce strain on the connections between the cables and the terminal subassembly. Overmolding may reduce the clamping force required to produce a robust terminal assembly. The dielectric may be a plastic, and may secure the metal shield plate with appropriate clamping force for securing the cables 310, 320.

FIGS. 8A-8B are cross-sectional views of an exemplary embodiment of a cable connector mating with a board connector in a first position and second position, respectively. FIGS. 8A-8B show a process for wiping terminals of a cable connector and board connector and allowing the terminals to bias the cable connector away from the board connector. As shown in FIG. 8A, the cable connector includes multiple terminal assemblies 212 disposed in rows 700 formed in a cable connector housing 202. The terminal assemblies are secured by retaining tabs 304 received in corresponding receptacles formed in the cable connector housing 202. The terminal assemblies each include a plurality of cable terminals 214. A signal portion of the cable terminals are electrically connected with a cable conductor 318 of a cable. A ground portion of the cable terminals are shorted together with a ground conductor 216 and may also be electrically connected to one or more cable shields. The terminal assemblies 212 are all angled relative to as base of the board connector and/or underlying substrate by an angle between 30 and 45 degrees. As shown in FIG. 8A, the board connector includes a plurality of board terminals, each having a first portion 114 functioning as a solder tail and a second portion 116 angled relative to the base of the board connector. The angled second portions 116 are angled relative to the base of the board connector by an angle between 20 and 30 degrees, less than the angle of the terminal assemblies 212.

As shown in FIG. 8A, the cable connector may be moved toward the board connector in a first direction as shown by the dashed arrows. The first direction may corresponding to a direction in which a guide of the cable connector extends. In the embodiment of FIG. 8A, the first direction is also parallel to a plane of the terminal assemblies 212. As the cable connector is moved in the first direction, the cable terminals 214 engage the second portions 116 with a curved tip. As force is applied to the cable connector to move the cable connector in the first direction, the cable terminals 214 and second portions may be elastically deformed. Accordingly, as shown in FIG. 8B, the deflection of the cable terminals 214 and/or second portions 116 generates a biasing spring force urging the cable connector in a second direction opposite the first direction. As a result and as shown by the dashed arrows of FIG. 8B, reducing or eliminating the insertion force applied to the cable connector to move the cable connector in the first direction causes the cable connector to move in the second direction. The movement of the cable connector in the first and second directions causes the cable terminals 214 to wipe the second portions 116, thereby ensuring a good electrical connection between the board terminals and cable terminals.

FIG. 9 is a side view of an exemplary embodiment of a mated board connector and cable connector. As shown in FIG. 9, the cable connector is received between wings 102 of the board connector. Guides 208 of the cable connector are disposed in corresponding guide channels 106 disposed in the wings 102. Likewise, projections 204 of the cable connector are disposed in projection receptacles 104 formed in the wings 102 of the board connector. The projections inhibit movement of the cable connector away from the board connector. In some embodiments, the cable connector may be released by applying force the lead-in tabs 108 to deflect the wings 102 outward relative to the cable connector until the projections 204 can clear the projection receptacles 104. Of course, other release arrangements may be employed, as the present disclosure is not so limited.

FIG. 10 is a side view of an exemplary embodiment of a terminal 112 of a board connector mating with a terminal 214 of a cable connector. As shown in FIG. 10, the board terminal 112 includes a first portion 114 and a second portion 116. The first portion may be disposed in a plane parallel to an underlying substrate (e.g., PCB), and may be configured to be soldered to a corresponding contact pad. The second portion 116 is angled relative to the first portion and is configured to physically and electrically engage the cable terminal 214. As shown in FIG. 10, the cable terminal includes a curved tip 215 to facilitate engagement and wipe of the terminals. As discussed previously, the second portion 116 and cable terminal 214 are both arranged as cantilevered beams configured to generate a biasing force when engaged to bias the cable connector away from the board connector.

This arrangement allows projections of the cable connector to be received in stamped projection receptacles of the board connector with a very low or tight tolerance relative to the board terminals. Accordingly, this biasing force yields an engagement between the second portion 116 and the curve tip 215 with a stub length A that has a correspondingly tight tolerance. In particular, the length A may be known to within 0.25 mm. Accordingly, the cable terminals 214 and board terminals 112 may be manufactured to reduce the stub length A to approximately 0.25 mm. Such an arrangement ensures proper mating between the terminals, even if the relative position deviates by the maximum tolerance. Nonetheless, the resulting stub is short, which limits the effects of stub resonance and signal reflections that could otherwise limit bandwidth of the board connector.

Further, as part of the mating sequence the terminals of the cable connector may wipe along the terminals of the board connector by a wipe length W that exceeds the stub length A. In this example, the wipe length W equals the stub length A plus the distance that the cable connector is pushed back by the spring force generated when the terminals are deflected.

According to exemplary embodiments described herein, terminals of a board connector and/or cable connector may have an average center to center spacing of less than 1.5 mm. Of course, other spacing arrangements are contemplated, including center to center spacing between 1 mm and 3 mm, as the present disclosure is not so limited.

According to exemplary embodiments described herein, up to 100 N of force may be used to eject a cable connector from a board connector. In other embodiments, a different ejection force may be applied, such as up to 75 N or up to 125 N, for example. In some embodiments, an ejection force greater than or equal to 25 N and less than or equal to 75 N may be employed.

While the present teachings have been described in conjunction with various embodiments and examples, it is not intended that the present teachings be limited to such embodiments or examples. On the contrary, the present teachings encompass various alternatives, modifications, and equivalents, as will be appreciated by those of skill in the art. For example, connector assemblies of exemplary embodiments described herein may be employed in silicon to silicon application for data transmission rates greater than or equal to 28 Gbps and 56 Gbps. Additionally, connector assemblies may be employed where signal losses from trace signal transmissions are too great, such as in cases where signal frequencies exceed 10 GHz, 25 GHz, 56 GHz or 112 GHz.

As another example, a midboard connection system was described in which a cable connector is biased into a position set by retention features on the cable connector and a mating receptacle connector. Techniques as described herein may be used in connectors with other configurations, such as mezzanine connectors or vertical configuration.

As another example, mating cable and board connectors that are biased apart as a result of spring force generated in the terminals of each connector when the connectors are pushed together for mating. Alternatively or additionally, spring members may be incorporated into either or both of the mating connectors to generate or increase the amount of spring force biasing the connectors apart.

As yet another example, a board connector was described as connecting to a PCB through surface mount soldering. A board connector may alternatively or additionally have terminals with contact tails shaped for pressure mounting to a PCB, such as by bending the tails to have tips extending below a base of the connector, such that the contact tails are deflected as the base is pressed against a surface of a PCB.

In some embodiments, a method of constructing a connector includes stamping a terminal assembly, where the terminal assembly includes a cable clamp plate, and a plurality of terminals extending from the cable clamp plate. The method further includes overmolding portions of the plurality of terminals with a dielectric material, and, for a portion of the plurality of terminals, severing a connection between the terminal and each of the other of the plurality of electrically connected terminals. In some embodiments, the plurality of terminals are electrically connected through the cable clamp plate, and severing the connection, for each of the first portion of the plurality of terminals, includes physically severing terminals of the first portion from the cable clamp plate. In some embodiments, the method further includes securing a plurality of cables to the cable clamp plate. In some embodiments, securing the plurality of cables includes compressing the plurality of cables against the cable clamp plate with a metal shield. In some embodiments, securing the plurality of cables further includes welding the metal shield to the cable clamp plate. In some embodiments, securing the plurality of cables further includes overmolding the metal shield, cable clamp plate and a portion of the plurality of cables. In some embodiments, the method further includes deforming one or more strain relief portions of the cable clamp plate. In some embodiments, the strain relief includes an I-shaped opening in the cable clamp plate. In some embodiments, the plurality of terminals include beams extending from the dielectric material, and the method further includes welding an elongated conductor to the beams of a second portion of the plurality of terminals. In some embodiments, the first portion of the plurality of terminals is disjointed from the second portion of the plurality of terminals. In some embodiments, the method further includes inserting the terminal assembly, overmolded dielectric, and secured cables into a connector housing. In some embodiments, the connector housing is formed of a dielectric material. In some embodiments, connector housing has a bottom face disposed in a first plane, and where the terminal assembly is inclined relative to the first plane. In some embodiments, the terminal assembly is inclined at an angle between approximately 30 and 45 degrees relative to the first plane. In some embodiments, the method further includes securing the terminal assembly in the connector housing by inserting a tab of the cable clamp plate into a tab receptacle of the connector housing. In some embodiments, the terminal assembly includes 19 terminals. In some embodiments, the connector housing includes at least two guides disposed on opposite sides of the first connector housing. In some embodiments, the at least two guides extend in a direction parallel to the plurality of first terminals. In some embodiments, the connector housing includes at least two projections configured to engage a connector receptacle. In some embodiments, each of the at least two projections includes a lead-in configured to engage a connector receptacle first when the connector housing is moved into the connector receptacle. In some embodiments, the method further includes laser welding a ground conductor to a ground portion of the plurality of terminals.

In some embodiments, a method of making an electrical connection includes moving a first connector in a first direction relative to a second connector, bringing the plurality of first connector terminals into contact with a plurality of terminals of the second connector, pressing the plurality of first connector terminals against the plurality of second connector terminals so as to bias the first connector in a second direction opposite the first direction, allowing the first connector to move in the second direction, and restraining motion in the second direction of the first connector relative to the second connector by engaging features of the first connector to features of the second connector. In some embodiments, restraining motion in the second direction includes engaging a projection receptacle of the second connector with at least one projection of the first connector when the first connector moves in the third direction. In some embodiments, the second connector is coupled to a circuit board defining a first plane, and the first direction and second direction are inclined relative to the first plane. In some embodiments, the first direction is inclined at an angle between approximately 10 and 20 degrees relative to the first plane. In some embodiments, the plurality of terminals of the second connector are inclined at an angle between approximately 30 and 45 degrees relative to the first plane. In some embodiments, bringing the plurality of terminals of the first connector into contact with a plurality of terminals of the second connector includes wiping the first connector terminals and second connector terminals as the first connector moves in the first direction. In some embodiments, biasing the first connector in the second direction includes elastically bending the plurality of terminals of the first connector. In some embodiments, biasing the first connector in the second direction includes elastically bending the plurality of terminals of the second connector. In some embodiments, the first connector in the third direction includes elastically bending both the plurality of terminals of the first connector and the plurality of terminals of the second connector. In some embodiments, moving the first connector in a first direction relative to a second connector includes moving the first connector into the second connector. In some embodiments, engaging features of the first connector to features of the second connector includes engaging a projection of the first connector in a projection receptacle of the second connector and moving the first connector into the second connector includes elastically deforming a first wing and a second wing with the at least one projection. In some embodiments, the at least one projection includes a lead-in configured to engage the first wing and second wing when the first connector is moved into the second connector. In some embodiments, the lead-in of the at least one projection engages at least one tab of the first wing and/or second wing when the first connector is moved into the second connector.

In some embodiments, an electronic assembly includes a substrate having at least one electronic component mounted thereto, and a first connector including a first connector housing having a bottom face disposed in a first plane, a plurality of first terminals disposed in the first connector housing and extending in a first direction angled relative to the first plane at an angle between 20 and 55 degrees. The electronic assembly also includes a second connector mounted to the substrate, the second connector including a base including a portion disposed in a second plane and facing the substrate, a first wing extending from the base, a second wing extending from the base, and a plurality of second terminals, where each of the plurality of terminals includes a first portion extending in the second plane and a second portion angled relative to the second plane at an angle between 10 and 40 degrees. In some embodiments, the first connector is mated to the second connector such that the plurality of first terminals press against respective ones of the plurality of second terminals, and the plurality of first terminals and/or the plurality of second terminals are elastically deformed so as to bias the first connector housing away from the base of the second connector. In some embodiments, the plurality of first terminals disposed in the first connector housing and extending in a first direction angled relative to the first plane at an angle between approximately 30 and 45 degrees, and the plurality of second terminals, where each of the plurality of terminals includes a first portion extending in the second plane and a second portion angled relative to the second plane at an angle between 20 and 30 degrees. In some embodiments, the first wing and the second wing each includes a projection receptacle, and the first connector housing includes a first projection extending into the projection receptacle of the first wing and a second projection extending into the projection receptacle of the second wing. In some embodiments, the projection receptacles of the first and second wings are circular, and the first and second projections are cylindrical. In some embodiments, the first and second projections each include an inclined face configured to deflect the first wing and second wing, respectively, so as to allow the first connector housing to move towards the base while the at least two projections are engaged with the first wing and second wing. In some embodiments, the first and second projections each includes surfaces perpendicular to a side of the housing configured to engage the projection receptacle of the first wing and the second wing, respectively, when the first connector housing is moved away from the base. In some embodiments, the first wing and second wing each includes a tab oriented in a parallel plane relative to the inclined faces of the first connector housing. In some embodiments, the first wing and second wing each has two projections receptacles, and the first connector housing has four projections. In some embodiments, the first connector housing includes two guides disposed on opposite sides of the first connector housing, the first wing and second wing each include a slot; and the two guides are each disposed of a slot of a respective one of the first and second wings. In some embodiments, the two guides extend in a direction parallel to the plurality of first terminals.

In some embodiments, an electrical connector includes a cable clamp plate, a plurality of terminals aligned with the cable clamp plate, dielectric material attached to the plurality of terminals and the cable clamp plate such that the plurality of terminals are physically supported relative to the cable clamp plate by dielectric material, and a plurality of cables disposed on the cable clamp plate. In some embodiments, the electrical connector further includes a metal shield enclosing the plurality of cables between the metal shield and the cable clamp plate. In some embodiments, the electrical connector further includes a dielectric connecting and at least partially surrounding the metal shield and cable clamp plate. In some embodiments, the electrical connector further includes a ground conductor laser welded to a ground portion of the plurality of terminals. In some embodiments, the plurality of terminals are physically severed from the cable clamp plate. In some embodiments, the electrical connector further includes a connector housing at least partially enclosing the cable clamp plate, plurality of terminals, and dielectric material. In some embodiments, the connector housing includes a tab receptacle, the cable clamp plate includes at least one tab engaged with the tab receptacle to retain the cable clamp plate in the connector housing. In some embodiments, the connector housing includes at least one projection, where the at least one projection includes an inclined face. In some embodiments, the projection in cylindrical. In some embodiments, the housing includes a bottom face disposed in a first plane, and where the plurality of terminals and cable clamp plate substantially extend in a second plane inclined relative to the first plane. In some embodiments, the second plane is angled relative to the first plane by an angle between approximately 30 and 45 degrees.

In some embodiments, a method of constructing a connector includes stamping a terminal assembly, where the terminal assembly includes a base extending in a first plane, a plurality of connected terminals having a first portion parallel to the first plane, and a second portion disposed at an angle relative to the first plane, a first wing including first projection receptacle, and a second wing including a second projection receptacle. The method also includes overmolding portions of the plurality of connected terminals with a dielectric material, and severing each of the plurality of connected terminals from one another. In some embodiments, overmolding portions of the plurality of connected terminals with a dielectric material further includes overmolding portions of the base. In some embodiments, the first wing of the stamped terminal assembly includes a first slot, and the second wing of the stamped terminal assembly includes a second slot. In some embodiments, stamping the terminal assembly includes spacing the first projection receptacle and second projection receptacle a predetermined distance from each of the plurality of terminals. In some embodiments, the predetermined distance has a tolerance within 0.25 mm. In some embodiments, the angular tolerance of the first wing, second wing, and second portion is within ±1 degree. In some embodiments, stamping the terminal assembly includes stamping the first wing with the first projection receptacle and the second wing with the second projection receptacle and the plurality of terminals from a unitary meal sheet in the same stamping operation. In some embodiments, the dielectric material is a plastic material. In some embodiments, overmolding the terminals includes forming an alignment post configured for insertion into a circuit board. In some embodiments, the first and second projection receptacles of the stamped terminal assembly are circular. In some embodiments, soldering each of the first portions of the terminals to a contact pad disposed on a circuit board. In some embodiments, soldering the first portions of the terminals includes reflow soldering. In some embodiments, the plurality of terminals includes 76 terminals. In some embodiments, each of the second portions of the plurality of terminals is angled at an angle between 15 and 45 degrees relative to the first plane. In some embodiments, each of the second portions of the plurality of terminals is angled at an angle between 20 and 30 degrees relative to the first plane.

The features of the above-described embodiments may be used alone or one or more of the above described features may be used together. For example, a board connector with one or more of the features described above may be mated with a cable connector with one or more of the features described above to form a connector assembly.

Accordingly, the foregoing description and drawings are by way of example only.

Claims

1. An electrical connector, comprising: a base;a first wing and a second wing extending perpendicularly from the base so as to define an opening between the first and second wings, wherein the base and the first wing and the second wing comprise integral portions of a sheet of metal, wherein the first wing and the second wing each comprises a receptacle configured to receive a projection of a mating electrical connector;a plurality of terminals, wherein each of the plurality of terminals comprises a first portion and a second portion transverse to the first portion extending into the opening; anddielectric material attached to the plurality of terminals and the base such that the plurality of terminals are physically supported relative to the base by the dielectric material.
2. The electrical connector of claim 1, wherein the first portion of each of the plurality of terminals is aligned with the base and comprises a solder mount tail.
3. The electrical connector of claim 2, wherein the second portion of each of the plurality of terminals comprises a compliant beam.
4. The electrical connector of claim 3, wherein the compliant beam of each of the plurality of terminals generates an ejection force between 25 and 75 N.
5. The electrical connector of claim 1, wherein the receptacles are circular.
6. The electrical connector of claim 5, wherein the receptacles are both spaced a predetermined distance from the plurality of terminals.
7. An electrical connector, comprising: a base;a plurality of terminals, wherein each of the plurality of terminals comprises a first portion aligned with the base and a second portion transverse to the base, wherein the plurality of terminals are integrally formed on the same piece of metal;dielectric material attached to the plurality of terminals and the base such that the plurality of terminals are physically supported relative to the base by the dielectric material; anda connector housing at least partially enclosing the base, plurality of terminals, and dielectric material.
8. The electrical connector of claim 7, wherein the first portion of each of the plurality of terminals comprises a solder mount tail.
9. The electrical connector of claim 8, wherein the second portion of each of the plurality of terminals comprises a compliant beam.
10. The electrical connector of claim 7, wherein the base includes a first wing and a second wing.
11. The electrical connector of claim 10, wherein the first wing and the second wing each comprises a receptacle configured to receive a projection of a mating electrical connector.
12. The electrical connector of claim 11, wherein the base and the first wing and the second wing comprise integral portions of a sheet of metal.
13. The electrical connector of claim 11, wherein the receptacles are circular.
14. The electrical connector of claim 13, wherein the receptacles are both spaced a predetermined distance from the plurality of terminals.
15. The electrical connector of claim 7, wherein: the base is disposed in a first plane;the first portion of each of the plurality of terminals is parallel to the first plane; andthe second portion of each of the plurality of terminals is disposed at an angle relative to the first plane.
16. The electrical connector of claim 15, wherein each of the second portions of the plurality of terminals is angled at an angle between approximately 20 and 30 degrees relative to the first plane.
17. The electrical connector of claim 7, wherein the connector housing comprises a tab receptacle, the base comprises at least one tab engaged with the tab receptacle to retain the base in the connector housing.
18. The electrical connector of claim 7, wherein the connector housing comprises at least one projection, wherein the at least one projection comprises an inclined face.
19. The electrical connector of claim 18, wherein the at least one projection is cylindrical.
20. The electrical connector of claim 7, wherein the connector housing comprises a bottom face disposed in a first plane, and wherein the plurality of terminals and base substantially extend in a second plane inclined relative to the first plane.
21. The electrical connector of claim 20, wherein the second plane is angled relative to the first plane by an angle between approximately 30 and 45 degrees.
22. An electrical connector, comprising: a base;a plurality of terminals, wherein each of the plurality of terminals comprises a first portion extending from the base, wherein the plurality of terminals are integrally formed of the same piece of metal;dielectric material attached to the plurality of terminals and the base such that the plurality of terminals are physically supported relative to the base by the dielectric material; anda plurality of cables disposed on the base.
23. The electrical connector of claim 22, further comprising a metal shield enclosing the plurality of cables between the metal shield and the base.
24. The electrical connector of claim 23, further comprising a dielectric connecting and at least partially surrounding the metal shield and base.
25. The electrical connector of claim 22, further comprising a metal shield enclosing the plurality of cables between the metal shield and the base.
26. The electrical connector of claim 25, further comprising a dielectric connecting and at least partially surrounding the metal shield and the base.
27. An electrical connector, comprising: a base; anda plurality of terminals, wherein each of the plurality of terminals comprises a portion aligned with the base, wherein a first portion of the plurality of terminals are integrally formed on the same piece of metal;wherein: a second portion of the plurality of terminals are physically severed from the base; andthe electrical connector further comprises dielectric material attached to the plurality of terminals and the base such that the plurality of terminals are physically supported relative to the base by the dielectric material.
28. The electrical connector of claim 27, further comprising a connector housing at least partially enclosing the base and the plurality of terminals.
29. The electrical connector of claim 28, wherein the connector housing comprises a tab receptacle, the base comprises at least one tab engaged with the tab receptacle to retain the base in the connector housing.
30. The electrical connector of claim 28, wherein the connector housing comprises at least one projection, wherein the at least one projection comprises an inclined face.
31. The electrical connector of claim 30, wherein the at least one projection is cylindrical.
32. The electrical connector of claim 28, wherein the connector housing comprises a bottom face disposed in a first plane, and wherein the plurality of terminals and base substantially extend in a second plane inclined relative to the first plane.
33. The electrical connector of claim 32, wherein the second plane is angled relative to the first plane by an angle between approximately 30 and 45 degrees.
34. The electrical connector of claim 27, wherein the first portion of each of the plurality of terminals comprises a solder mount tail.
35. The electrical connector of claim 34, wherein the second portion of each of the plurality of terminals comprises a compliant beam.
36. An electrical connector, comprising: a base;a plurality of terminals, wherein each of the plurality of terminals comprises a first portion aligned with the base and a portion of the plurality of terminals are ground terminals and the ground terminals are integrally formed of the same piece of metal;dielectric material attached to and physically supporting the plurality of terminals; anda ground conductor laser welded to the ground terminals of the plurality of terminals.
37. The electrical connector of claim 36, further comprising a plurality of cables disposed on the base.
38. The electrical connector of claim 37, further comprising, for each of the plurality of cables, a metal shield enclosing the plurality of cables between the metal shield and the base.
39. The electrical connector of claim 38, further comprising a dielectric connecting and at least partially surrounding the metal shield and base.
40. An electrical connector, comprising: a base;a first wing and a second wing extending perpendicularly from the base so as to define an opening between the first and second wings, wherein the base and the first wing and the second wing comprise integral portions of a sheet of metal; anda plurality of terminals, wherein each of the plurality of terminals comprises a first portion and a second portion transverse to the first portion extending into the opening, wherein the second portion of each of the plurality of terminals comprises a compliant beam, and wherein the compliant beam of each of the plurality of terminals generates an ejection force between 25 and 75 N.
41. The electrical connector of claim 40, wherein: the base is disposed in a first plane;the first portion of each of the plurality of terminals is parallel to the first plane; andthe second portion of each of the plurality of terminals is disposed at an angle relative to the first plane.
42. The electrical connector of claim 41, wherein each of the second portions of the plurality of terminals is angled at an angle between approximately 20 and 30 degrees relative to the first plane.

RELATED APPLICATIONS

This application claims the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Application No. 62/966,892, filed Jan. 28, 2020, which is hereby incorporated by reference in its entirety.

US Referenced Citations (938)

Number	Name	Date	Kind
2124207	Carl	Jul 1938	A
2996710	Pratt	Aug 1961	A
3002162	Garstang	Sep 1961	A
3007131	Dahlgren et al.	Oct 1961	A
3075167	Kinkaid	Jan 1963	A
3134950	Cook	May 1964	A
3229240	Harrison et al.	Jan 1966	A
3322885	May et al.	May 1967	A
3594613	Prietula	Jul 1971	A
3715706	Michel et al.	Feb 1973	A
3720907	Asick	Mar 1973	A
3786372	Epis et al.	Jan 1974	A
3825874	Peverill	Jul 1974	A
3863181	Glance et al.	Jan 1975	A
4083615	Volinskie	Apr 1978	A
4155613	Brandeau	May 1979	A
4157612	Rainal	Jun 1979	A
4195272	Boutros	Mar 1980	A
4275944	Sochor	Jun 1981	A
4276523	Boutros et al.	Jun 1981	A
4307926	Smith	Dec 1981	A
4371742	Manly	Feb 1983	A
4408255	Adkins	Oct 1983	A
4447105	Ruehl	May 1984	A
4471015	Ebneth et al.	Sep 1984	A
4484159	Whitley	Nov 1984	A
4490283	Kleiner	Dec 1984	A
4518651	Wolfe, Jr.	May 1985	A
4519664	Tillotson	May 1985	A
4519665	Althouse et al.	May 1985	A
4548451	Benarr et al.	Oct 1985	A
4615578	Stadler et al.	Oct 1986	A
4632476	Schell	Dec 1986	A
4636752	Saito	Jan 1987	A
4639054	Kersbergen	Jan 1987	A
4682129	Bakermans et al.	Jul 1987	A
4697862	Hasircoglu	Oct 1987	A
4708660	Claeys et al.	Nov 1987	A
4724409	Lehman	Feb 1988	A
4728762	Roth et al.	Mar 1988	A
4751479	Parr	Jun 1988	A
4761147	Gauthier	Aug 1988	A
4795375	Williams	Jan 1989	A
4804334	Alexeenko et al.	Feb 1989	A
4806107	Arnold et al.	Feb 1989	A
4826443	Lockard	May 1989	A
4846724	Sasaki et al.	Jul 1989	A
4846727	Glover et al.	Jul 1989	A
4871316	Herrell et al.	Oct 1989	A
4878155	Conley	Oct 1989	A
4889500	Lazar et al.	Dec 1989	A
4913667	Muz	Apr 1990	A
4924179	Sherman	May 1990	A
4948922	Varadan et al.	Aug 1990	A
4949379	Cordell	Aug 1990	A
4970354	Iwasa et al.	Nov 1990	A
4975084	Fedder et al.	Dec 1990	A
4990099	Marin et al.	Feb 1991	A
4992060	Meyer	Feb 1991	A
5000700	Masubuchi et al.	Mar 1991	A
5037330	Fulponi et al.	Aug 1991	A
5057029	Noorily	Oct 1991	A
5066236	Broeksteeg	Nov 1991	A
5112251	Cesar	May 1992	A
5139427	Boyd et al.	Aug 1992	A
5141454	Garrett et al.	Aug 1992	A
5150086	Ito	Sep 1992	A
5168252	Naito	Dec 1992	A
5168432	Murphy et al.	Dec 1992	A
5176538	Hansell, III et al.	Jan 1993	A
5197893	Morlion et al.	Mar 1993	A
5203079	Brinkman et al.	Apr 1993	A
5266055	Naito et al.	Nov 1993	A
5280191	Chang	Jan 1994	A
5280257	Cravens et al.	Jan 1994	A
5287076	Johnescu et al.	Feb 1994	A
5306171	Marshall	Apr 1994	A
5308252	Mroczkowski et al.	May 1994	A
5332397	Ingalsbe	Jul 1994	A
5332979	Roskewitsch et al.	Jul 1994	A
5334050	Andrews	Aug 1994	A
5340334	Nguyen	Aug 1994	A
5342211	Broeksteeg	Aug 1994	A
5346410	Moore, Jr.	Sep 1994	A
5358411	Mroczkowski et al.	Oct 1994	A
5366390	Kinross et al.	Nov 1994	A
5387130	Redder et al.	Feb 1995	A
5393234	Yamada et al.	Feb 1995	A
5402088	Pierro et al.	Mar 1995	A
5429520	Morlion et al.	Jul 1995	A
5429521	Morlion et al.	Jul 1995	A
5433617	Morlion et al.	Jul 1995	A
5433618	Morlion et al.	Jul 1995	A
5435757	Fedder et al.	Jul 1995	A
5441424	Morlion et al.	Aug 1995	A
5456619	Belopolsky et al.	Oct 1995	A
5461392	Mott et al.	Oct 1995	A
5484295	Mowry et al.	Jan 1996	A
5484310	McNamara et al.	Jan 1996	A
5487673	Hurtarte	Jan 1996	A
5496183	Soes et al.	Mar 1996	A
5498166	Rothenberger	Mar 1996	A
5499935	Powell	Mar 1996	A
5509827	Huppenthal et al.	Apr 1996	A
5551893	Johnson	Sep 1996	A
5554038	Morlion et al.	Sep 1996	A
5562497	Yagi et al.	Oct 1996	A
5597328	Mouissie	Jan 1997	A
5598627	Saka et al.	Feb 1997	A
5632634	Soes	May 1997	A
5637015	Tan et al.	Jun 1997	A
5651702	Hanning et al.	Jul 1997	A
5653598	Grabbe	Aug 1997	A
5669789	Law	Sep 1997	A
5691506	Miyazaki et al.	Nov 1997	A
5695354	Noda	Dec 1997	A
5702258	Provencher et al.	Dec 1997	A
5713764	Brunker et al.	Feb 1998	A
5733148	Kaplan et al.	Mar 1998	A
5743765	Andrews et al.	Apr 1998	A
5781759	Kashiwabara	Jul 1998	A
5796323	Uchikoba et al.	Aug 1998	A
5797770	Davis et al.	Aug 1998	A
5808236	Brezina et al.	Sep 1998	A
5831491	Buer et al.	Nov 1998	A
5865646	Ortega et al.	Feb 1999	A
5924890	Morin et al.	Jul 1999	A
5924899	Paagman	Jul 1999	A
5981869	Kroger	Nov 1999	A
5982253	Perrin et al.	Nov 1999	A
6019616	Yagi et al.	Feb 2000	A
6022239	Wright	Feb 2000	A
6029344	Khandros et al.	Feb 2000	A
6042387	Jonaidi	Mar 2000	A
6053770	Blom	Apr 2000	A
6068514	Zuin	May 2000	A
6077089	Bishop et al.	Jun 2000	A
6083046	Wu et al.	Jul 2000	A
6095825	Liao	Aug 2000	A
6095872	Lang et al.	Aug 2000	A
6102726	Tsuji et al.	Aug 2000	A
6109956	Kawase et al.	Aug 2000	A
6116926	Ortega et al.	Sep 2000	A
6142802	Berg et al.	Nov 2000	A
6144559	Johnson et al.	Nov 2000	A
6146151	Li	Nov 2000	A
6146202	Ramey et al.	Nov 2000	A
6152747	McNamara	Nov 2000	A
6168466	Chiou	Jan 2001	B1
6168469	Lu	Jan 2001	B1
6174203	Asao	Jan 2001	B1
6174944	Chiba et al.	Jan 2001	B1
6203376	Magajne et al.	Mar 2001	B1
6215666	Hileman et al.	Apr 2001	B1
6217372	Reed	Apr 2001	B1
6238241	Zhu et al.	May 2001	B1
6241542	Nishide et al.	Jun 2001	B1
6257915	Endo	Jul 2001	B1
6273753	Ko	Aug 2001	B1
6273758	Lloyd et al.	Aug 2001	B1
6280225	Nishide et al.	Aug 2001	B1
6283786	Margulis et al.	Sep 2001	B1
6285542	Kennedy, III et al.	Sep 2001	B1
6293827	Stokoe	Sep 2001	B1
6299438	Sahagian et al.	Oct 2001	B1
6299483	Cohen et al.	Oct 2001	B1
6322379	Ortega et al.	Nov 2001	B1
6328601	Yip et al.	Dec 2001	B1
6345987	Mori et al.	Feb 2002	B1
6347962	Kline	Feb 2002	B1
6350134	Fogg et al.	Feb 2002	B1
6358081	Saka et al.	Mar 2002	B1
6364711	Berg et al.	Apr 2002	B1
6364718	Polgar et al.	Apr 2002	B1
6366471	Edwards et al.	Apr 2002	B1
6371788	Bowling et al.	Apr 2002	B1
6375510	Asao	Apr 2002	B2
6379188	Cohen et al.	Apr 2002	B1
6383009	Kawase et al.	May 2002	B2
6398588	Bickford	Jun 2002	B1
6409543	Astbury, Jr. et al.	Jun 2002	B1
6447337	Anderson et al.	Sep 2002	B1
6452789	Pallotti et al.	Sep 2002	B1
6474997	Ochiai	Nov 2002	B1
6475014	Tsuji et al.	Nov 2002	B2
6482017	Van Doorn	Nov 2002	B1
6489563	Zhao et al.	Dec 2002	B1
6494732	Kashiyama et al.	Dec 2002	B2
6503103	Cohen et al.	Jan 2003	B1
6506076	Cohen et al.	Jan 2003	B2
6517360	Cohen	Feb 2003	B1
6517372	Jones	Feb 2003	B1
6517382	Flickinger et al.	Feb 2003	B2
6527578	Kashiyama et al.	Mar 2003	B2
6530790	McNamara et al.	Mar 2003	B1
6535367	Carpenter et al.	Mar 2003	B1
6537086	Mac Mullin	Mar 2003	B1
6537087	McNamara et al.	Mar 2003	B2
6537098	Kashiyama et al.	Mar 2003	B2
6551140	Billman et al.	Apr 2003	B2
6554647	Cohen et al.	Apr 2003	B1
6561833	Saka et al.	May 2003	B2
6565387	Cohen	May 2003	B2
6574115	Asano et al.	Jun 2003	B2
6575772	Soubh et al.	Jun 2003	B1
6579116	Brennan et al.	Jun 2003	B2
6582244	Fogg et al.	Jun 2003	B2
6592390	Davis et al.	Jul 2003	B1
6592401	Gardner et al.	Jul 2003	B1
6595802	Watanabe et al.	Jul 2003	B1
6602095	Astbury, Jr. et al.	Aug 2003	B2
6607402	Cohen et al.	Aug 2003	B2
6616864	Jiang et al.	Sep 2003	B1
6638098	Yamaoka	Oct 2003	B2
6645005	Wu	Nov 2003	B2
6652296	Kuroda et al.	Nov 2003	B2
6652318	Winings et al.	Nov 2003	B1
6655966	Rothermel et al.	Dec 2003	B2
6685501	Wu et al.	Feb 2004	B1
6692262	Loveless	Feb 2004	B1
6705893	Ko	Mar 2004	B1
6709294	Cohen et al.	Mar 2004	B1
6713672	Stickney	Mar 2004	B1
6743040	Nakamura	Jun 2004	B1
6743057	Davis et al.	Jun 2004	B2
6749448	Bright et al.	Jun 2004	B2
6776649	Pape et al.	Aug 2004	B2
6776659	Stokoe et al.	Aug 2004	B1
6780018	Shipe	Aug 2004	B1
6786771	Gailus	Sep 2004	B2
6797891	Blair et al.	Sep 2004	B1
6811326	Keeble et al.	Nov 2004	B2
6814619	Stokoe et al.	Nov 2004	B1
6816376	Bright et al.	Nov 2004	B2
6824426	Spink, Jr.	Nov 2004	B1
6830489	Aoyama	Dec 2004	B2
6843657	Driscoll et al.	Jan 2005	B2
6843659	Liao et al.	Jan 2005	B2
6846115	Shang et al.	Jan 2005	B1
6872085	Cohen et al.	Mar 2005	B1
6872094	Murr et al.	Mar 2005	B1
6877992	Grant et al.	Apr 2005	B2
6893270	Sercu	May 2005	B2
6903934	Lo et al.	Jun 2005	B2
6905343	Neidich	Jun 2005	B1
6916181	Brown et al.	Jul 2005	B2
6916183	Alger et al.	Jul 2005	B2
6932649	Rothermel et al.	Aug 2005	B1
6951487	Ozai	Oct 2005	B2
6955565	Lloyd et al.	Oct 2005	B2
6962499	Yamamoto et al.	Nov 2005	B2
6971887	Trobough	Dec 2005	B1
6979226	Otsu et al.	Dec 2005	B2
7025601	Dittmann	Apr 2006	B2
7044794	Consoli et al.	May 2006	B2
7056128	Driscoll et al.	Jun 2006	B2
7057570	Irion, II et al.	Jun 2006	B2
7070446	Henry et al.	Jul 2006	B2
7074086	Cohen et al.	Jul 2006	B2
7077658	Ashman et al.	Jul 2006	B1
7090503	Dittmann	Aug 2006	B2
7094102	Cohen et al.	Aug 2006	B2
7108556	Cohen et al.	Sep 2006	B2
7128580	Liao et al.	Oct 2006	B2
7148428	Meier et al.	Dec 2006	B2
7163421	Cohen et al.	Jan 2007	B1
7175444	Lang et al.	Feb 2007	B2
7179126	Chen	Feb 2007	B2
7198519	Regnier et al.	Apr 2007	B2
7214097	Hsu et al.	May 2007	B1
7223915	Hackman	May 2007	B2
7234944	Nordin et al.	Jun 2007	B2
7244137	Renfro et al.	Jul 2007	B2
7267515	Lappohn	Sep 2007	B2
7275966	Poh et al.	Oct 2007	B2
7280372	Grundy et al.	Oct 2007	B2
7285018	Kenny et al.	Oct 2007	B2
7303438	Dawiedczyk et al.	Dec 2007	B2
7307293	Fjelstad et al.	Dec 2007	B2
7331816	Krohn et al.	Feb 2008	B2
7331830	Minich	Feb 2008	B2
7335063	Cohen et al.	Feb 2008	B2
7354274	Minich	Apr 2008	B2
7354300	Shindo	Apr 2008	B2
7361042	Hashimoto et al.	Apr 2008	B2
7371117	Gailus	May 2008	B2
7384275	Ngo	Jun 2008	B2
7396236	Eldridge et al.	Jul 2008	B2
7402048	Meier et al.	Jul 2008	B2
7422483	Avery et al.	Sep 2008	B2
7431608	Sakaguchi et al.	Oct 2008	B2
7445471	Scherer et al.	Nov 2008	B1
7448897	Dawiedczyk et al.	Nov 2008	B2
7462942	Tan et al.	Dec 2008	B2
7485012	Daugherty et al.	Feb 2009	B2
7494383	Cohen et al.	Feb 2009	B2
7534142	Avery et al.	May 2009	B2
7540747	Ice et al.	Jun 2009	B2
7540781	Kenny et al.	Jun 2009	B2
7549897	Fedder et al.	Jun 2009	B2
7553190	Laurx	Jun 2009	B2
7575471	Long	Aug 2009	B2
7581990	Kirk et al.	Sep 2009	B2
7585188	Regnier	Sep 2009	B2
7588464	Kim	Sep 2009	B2
7613011	Grundy et al.	Nov 2009	B2
7621779	Laurx et al.	Nov 2009	B2
7628617	Brown et al.	Dec 2009	B2
7649368	Eldridge et al.	Jan 2010	B2
7652381	Grundy et al.	Jan 2010	B2
7654831	Wu	Feb 2010	B1
7658654	Ohyama et al.	Feb 2010	B2
7686659	Peng	Mar 2010	B2
7690930	Chen et al.	Apr 2010	B2
7713077	McGowan et al.	May 2010	B1
7719843	Dunham	May 2010	B2
7722398	Ma	May 2010	B2
7722401	Kirk et al.	May 2010	B2
7722404	Neumetzler	May 2010	B2
7731537	Amleshi et al.	Jun 2010	B2
7744414	Scherer et al.	Jun 2010	B2
7753731	Cohen et al.	Jul 2010	B2
7764504	Phillips et al.	Jul 2010	B2
7766668	Bishop	Aug 2010	B1
7771233	Gailus	Aug 2010	B2
7775802	Defibaugh et al.	Aug 2010	B2
7781294	Mauder et al.	Aug 2010	B2
7789676	Morgan et al.	Sep 2010	B2
7794240	Cohen et al.	Sep 2010	B2
7794278	Cohen et al.	Sep 2010	B2
7806698	Regnier	Oct 2010	B2
7811129	Glover et al.	Oct 2010	B2
7819675	Ko et al.	Oct 2010	B2
7824197	Westman et al.	Nov 2010	B1
7828560	Wu et al.	Nov 2010	B2
7857630	Hermant et al.	Dec 2010	B2
7862344	Morgan et al.	Jan 2011	B2
7871294	Long	Jan 2011	B2
7871296	Fowler et al.	Jan 2011	B2
7874873	Do et al.	Jan 2011	B2
7887371	Kenny et al.	Feb 2011	B2
7906730	Atkinson et al.	Mar 2011	B2
7914302	Zhu	Mar 2011	B1
7914304	Cartier et al.	Mar 2011	B2
7976318	Fedder et al.	Jul 2011	B2
7985097	Gulla	Jul 2011	B2
7993147	Cole et al.	Aug 2011	B2
8002581	Whiteman, Jr. et al.	Aug 2011	B1
8016616	Glover et al.	Sep 2011	B2
8018733	Jia	Sep 2011	B2
8036500	McColloch	Oct 2011	B2
8057266	Roitberg	Nov 2011	B1
8057267	Johnescu	Nov 2011	B2
8083553	Manter et al.	Dec 2011	B2
8092235	Frantum, Jr. et al.	Jan 2012	B2
8092254	Miyazaki et al.	Jan 2012	B2
8100699	Costello	Jan 2012	B1
8157573	Tanaka	Apr 2012	B2
8162675	Regnier et al.	Apr 2012	B2
RE43427	Dawiedczyk et al.	May 2012	E
8167651	Glover et al.	May 2012	B2
8182289	Stokoe et al.	May 2012	B2
8192222	Kameyama	Jun 2012	B2
8195017	Kaneshiro et al.	Jun 2012	B2
8197285	Farmer	Jun 2012	B2
8210877	Droesbeke	Jul 2012	B2
8215968	Cartier et al.	Jul 2012	B2
8226441	Regnier et al.	Jul 2012	B2
8251745	Johnescu	Aug 2012	B2
8272877	Stokoe et al.	Sep 2012	B2
8282402	Ngo	Oct 2012	B2
8292669	Wang	Oct 2012	B2
8308491	Nichols et al.	Nov 2012	B2
8308512	Ritter et al.	Nov 2012	B2
8337243	Elkhatib et al.	Dec 2012	B2
8338713	Fjelstad et al.	Dec 2012	B2
8358504	McColloch et al.	Jan 2013	B2
8371875	Gailus	Feb 2013	B2
8371876	Davis	Feb 2013	B2
8382524	Khilchenko et al.	Feb 2013	B2
8398433	Yang	Mar 2013	B1
8419472	Swanger et al.	Apr 2013	B1
8439704	Reed	May 2013	B2
8449312	Lang et al.	May 2013	B2
8449330	Schroll et al.	May 2013	B1
8465302	Regnier et al.	Jun 2013	B2
8465320	Long	Jun 2013	B2
8469738	Long	Jun 2013	B2
8469745	Davis et al.	Jun 2013	B2
8475210	Wang	Jul 2013	B2
8535065	Costello	Sep 2013	B2
8540525	Regnier et al.	Sep 2013	B2
8550861	Cohen et al.	Oct 2013	B2
8553102	Yamada	Oct 2013	B2
8556657	Nichols	Oct 2013	B1
8588561	Zbinden et al.	Nov 2013	B2
8588562	Zbinden et al.	Nov 2013	B2
8597045	Zhu	Dec 2013	B2
8597055	Regnier et al.	Dec 2013	B2
8597056	Blanchfield	Dec 2013	B2
8632365	Ngo	Jan 2014	B2
8647141	Lee et al.	Feb 2014	B2
8651880	Wu et al.	Feb 2014	B2
8657627	McNamara et al.	Feb 2014	B2
8662923	Wu	Mar 2014	B2
8672707	Nichols et al.	Mar 2014	B2
8678860	Minich et al.	Mar 2014	B2
8690589	Ngo	Apr 2014	B2
8690604	Davis	Apr 2014	B2
8715003	Buck et al.	May 2014	B2
8740644	Long	Jun 2014	B2
8753145	Lang et al.	Jun 2014	B2
8758051	Nonen et al.	Jun 2014	B2
8764464	Buck et al.	Jul 2014	B2
8771016	Atkinson et al.	Jul 2014	B2
8780581	Merz et al.	Jul 2014	B2
8787711	Zbinden et al.	Jul 2014	B2
8804342	Behziz et al.	Aug 2014	B2
8814595	Cohen et al.	Aug 2014	B2
8830679	Scholeno	Sep 2014	B2
8845364	Wanha et al.	Sep 2014	B2
8858243	Luo et al.	Oct 2014	B2
8860454	Oniyama et al.	Oct 2014	B2
8864521	Atkinson et al.	Oct 2014	B2
8870471	Ito et al.	Oct 2014	B2
8888531	Jeon	Nov 2014	B2
8888533	Westman et al.	Nov 2014	B2
8911255	Scherer et al.	Dec 2014	B2
8926377	Kirk et al.	Jan 2015	B2
8944831	Stoner et al.	Feb 2015	B2
8992236	Wittig et al.	Mar 2015	B2
8992237	Regnier et al.	Mar 2015	B2
8998642	Manter et al.	Apr 2015	B2
9004942	Paniauqa	Apr 2015	B2
9011177	Lloyd et al.	Apr 2015	B2
9022806	Cartier, Jr. et al.	May 2015	B2
9028201	Kirk et al.	May 2015	B2
9028281	Kirk et al.	May 2015	B2
9035183	Kodama et al.	May 2015	B2
9040824	Guetig et al.	May 2015	B2
9071001	Scherer et al.	Jun 2015	B2
9077118	Szu et al.	Jul 2015	B2
9118151	Tran et al.	Aug 2015	B2
9119292	Gundel	Aug 2015	B2
9124009	Atkinson et al.	Sep 2015	B2
9136634	De Geest et al.	Sep 2015	B2
9142921	Wanha et al.	Sep 2015	B2
9172161	Walden et al.	Oct 2015	B2
9190776	Lee et al.	Nov 2015	B2
9203171	Yu et al.	Dec 2015	B2
9210817	Briant	Dec 2015	B2
9214768	Pao et al.	Dec 2015	B2
9219335	Atkinson et al.	Dec 2015	B2
9225085	Cartier, Jr. et al.	Dec 2015	B2
9232676	Sechrist et al.	Jan 2016	B2
9246251	Regnier et al.	Jan 2016	B2
9246262	Brown	Jan 2016	B2
9246280	Neer	Jan 2016	B2
9257778	Buck et al.	Feb 2016	B2
9257794	Wanha et al.	Feb 2016	B2
9276358	Ista	Mar 2016	B2
9277649	Ellison	Mar 2016	B2
9281636	Schmitt	Mar 2016	B1
9300067	Yokoo	Mar 2016	B2
9306334	Zhu	Apr 2016	B2
9312618	Regnier et al.	Apr 2016	B2
9337585	Yang	May 2016	B1
9350108	Long	May 2016	B2
9356401	Horning et al.	May 2016	B1
9362678	Wanha et al.	Jun 2016	B2
9368916	Heyvaert et al.	Jun 2016	B2
9373917	Sypolt et al.	Jun 2016	B2
9374165	Zbinden et al.	Jun 2016	B2
9385455	Regnier et al.	Jul 2016	B2
9389368	Sharf	Jul 2016	B1
9391407	Bucher et al.	Jul 2016	B1
9413112	Heister et al.	Aug 2016	B2
9425525	Walden et al.	Aug 2016	B2
9450344	Cartier, Jr. et al.	Sep 2016	B2
9490558	Wanha et al.	Nov 2016	B2
9509089	Mathews et al.	Nov 2016	B2
9509094	Mathews et al.	Nov 2016	B2
9509101	Cartier, Jr. et al.	Nov 2016	B2
9509102	Sharf et al.	Nov 2016	B2
9520680	Hsu et al.	Dec 2016	B2
9520689	Cartier, Jr. et al.	Dec 2016	B2
9531133	Horning et al.	Dec 2016	B1
9553381	Regnier	Jan 2017	B2
9553401	Mathews et al.	Jan 2017	B2
9559446	Wetzel et al.	Jan 2017	B1
9560760	Wig	Jan 2017	B2
9564696	Gulla	Feb 2017	B2
9608348	Wanha et al.	Mar 2017	B2
9651752	Zbinden et al.	May 2017	B2
9653829	Long	May 2017	B2
9660364	Wig et al.	May 2017	B2
9666961	Horning et al.	May 2017	B2
9668378	Phillips	May 2017	B2
9671582	Yeh	Jun 2017	B2
9680266	Tomada	Jun 2017	B2
9680273	Light et al.	Jun 2017	B2
9685724	Tojo	Jun 2017	B2
9685736	Gailus et al.	Jun 2017	B2
9711901	Scholeno	Jul 2017	B2
9735495	Gross	Aug 2017	B2
9761974	L'Esperance et al.	Sep 2017	B2
9774144	Cartier, Jr. et al.	Sep 2017	B2
9801301	Costello	Oct 2017	B1
9829662	Kurashima	Nov 2017	B2
9841572	Zbinden et al.	Dec 2017	B2
9843135	Guetig et al.	Dec 2017	B2
9882303	Chalas et al.	Jan 2018	B1
9929500	Ista	Mar 2018	B1
9929512	Trout et al.	Mar 2018	B1
9948026	Mathews et al.	Apr 2018	B2
9985367	Wanha et al.	May 2018	B2
9985389	Morgan et al.	May 2018	B1
10020614	Bucher	Jul 2018	B1
10056706	Wanha et al.	Aug 2018	B2
10062984	Regnier	Aug 2018	B2
10062988	Vinther et al.	Aug 2018	B1
10069225	Wanha et al.	Sep 2018	B2
10096945	Cartier, Jr. et al.	Oct 2018	B2
10109968	Khazen	Oct 2018	B2
10114182	Zbinden et al.	Oct 2018	B2
10116080	Ju et al.	Oct 2018	B1
10128627	Kazav	Nov 2018	B1
10135199	Ju	Nov 2018	B1
10136517	Shirasaki	Nov 2018	B2
10148024	Ju et al.	Dec 2018	B2
10153571	Kachlic	Dec 2018	B2
10170869	Gailus et al.	Jan 2019	B2
10181663	Regnier	Jan 2019	B2
10205286	Provencher et al.	Feb 2019	B2
10243305	Pan et al.	Mar 2019	B1
10249988	Craton	Apr 2019	B2
10276995	Little	Apr 2019	B2
10305224	Girard, Jr.	May 2019	B2
RE47459	Vinther et al.	Jun 2019	E
10348007	Kataoka	Jul 2019	B2
10367283	L'Esperance et al.	Jul 2019	B2
10367308	Little et al.	Jul 2019	B2
10374355	Ayzenberg et al.	Aug 2019	B2
10381767	Milbrand, Jr. et al.	Aug 2019	B1
10446960	Guy Ritter et al.	Oct 2019	B2
10462904	Shirasaki	Oct 2019	B2
10511118	Beltran et al.	Dec 2019	B2
10551580	Regnier et al.	Feb 2020	B2
10555437	Little	Feb 2020	B2
10588243	Little et al.	Mar 2020	B2
10651606	Little	May 2020	B2
10680364	Champion et al.	Jun 2020	B2
10716213	Kim et al.	Jul 2020	B2
10797417	Scholeno et al.	Oct 2020	B2
10840622	Sasame et al.	Nov 2020	B2
10847930	Ayzenberg et al.	Nov 2020	B2
10847937	Cartier, Jr. et al.	Nov 2020	B2
10879643	Astbury et al.	Dec 2020	B2
10910770	Winey	Feb 2021	B2
10944215	Chua et al.	Mar 2021	B2
10958005	Dube	Mar 2021	B1
11050176	Yang et al.	Jun 2021	B2
11070006	Gailus et al.	Jul 2021	B2
11101611	Winey et al.	Aug 2021	B2
11143830	Luo et al.	Oct 2021	B2
11177592	Scholeno et al.	Nov 2021	B2
11189943	Zerebilov et al.	Nov 2021	B2
11205877	Diaz et al.	Dec 2021	B2
11271348	Chen et al.	Mar 2022	B1
11437762	Manter et al.	Sep 2022	B2
11444404	Si et al.	Sep 2022	B2
20010012730	Ramey et al.	Aug 2001	A1
20010042632	Manov et al.	Nov 2001	A1
20010046810	Cohen et al.	Nov 2001	A1
20020042223	Belopolsky et al.	Apr 2002	A1
20020088628	Chen	Jul 2002	A1
20020089464	Joshi	Jul 2002	A1
20020098738	Astbury et al.	Jul 2002	A1
20020111068	Cohen et al.	Aug 2002	A1
20020111069	Astbury et al.	Aug 2002	A1
20020157865	Noda	Oct 2002	A1
20020187688	Marvin et al.	Dec 2002	A1
20020192989	Ling et al.	Dec 2002	A1
20020197043	Hwang	Dec 2002	A1
20030003779	Rathburn	Jan 2003	A1
20030073331	Peloza et al.	Apr 2003	A1
20030119362	Nelson et al.	Jun 2003	A1
20030129876	Hasircoglu	Jul 2003	A1
20040005815	Mizumura et al.	Jan 2004	A1
20040018757	Lang et al.	Jan 2004	A1
20040020674	McFadden et al.	Feb 2004	A1
20040094328	Fjelstad et al.	May 2004	A1
20040110421	Broman et al.	Jun 2004	A1
20040115968	Cohen	Jun 2004	A1
20040121633	David et al.	Jun 2004	A1
20040121652	Gailus	Jun 2004	A1
20040127073	Ochiai	Jul 2004	A1
20040155328	Kline	Aug 2004	A1
20040157476	Maldonado et al.	Aug 2004	A1
20040196112	Welbon et al.	Oct 2004	A1
20040224559	Nelson et al.	Nov 2004	A1
20040229510	Lloyd et al.	Nov 2004	A1
20040252477	Brown et al.	Dec 2004	A1
20040259419	Payne et al.	Dec 2004	A1
20040264894	Cooke et al.	Dec 2004	A1
20050006126	Aisenbrey	Jan 2005	A1
20050032430	Otsu et al.	Feb 2005	A1
20050037655	Henry et al.	Feb 2005	A1
20050070160	Cohen et al.	Mar 2005	A1
20050087359	Tachibana et al.	Apr 2005	A1
20050093127	Fjelstad et al.	May 2005	A1
20050118869	Evans	Jun 2005	A1
20050133245	Katsuyama et al.	Jun 2005	A1
20050142944	Ling et al.	Jun 2005	A1
20050153600	Lu	Jul 2005	A1
20050170674	Lu	Aug 2005	A1
20050176835	Kobayashi et al.	Aug 2005	A1
20050208786	Dittmann	Sep 2005	A1
20050208787	Dittmann	Sep 2005	A1
20050208788	Dittmann	Sep 2005	A1
20050233610	Tutt et al.	Oct 2005	A1
20050239339	Pepe	Oct 2005	A1
20050255726	Long	Nov 2005	A1
20050283974	Richard et al.	Dec 2005	A1
20050287869	Kenny et al.	Dec 2005	A1
20060001163	Kolbehdari et al.	Jan 2006	A1
20060024987	Huang et al.	Feb 2006	A1
20060042821	Pax	Mar 2006	A1
20060063431	Yang	Mar 2006	A1
20060068640	Gailus	Mar 2006	A1
20060079119	Wu	Apr 2006	A1
20060091507	Fjelstad et al.	May 2006	A1
20060105631	Yang	May 2006	A1
20060160429	Dawiedczyk et al.	Jul 2006	A1
20060216969	Bright et al.	Sep 2006	A1
20060228922	Morriss	Oct 2006	A1
20060249820	Ice et al.	Nov 2006	A1
20060292934	Schell et al.	Dec 2006	A1
20070004282	Cohen et al.	Jan 2007	A1
20070021001	Laurx et al.	Jan 2007	A1
20070021002	Laurx et al.	Jan 2007	A1
20070032104	Yamada et al.	Feb 2007	A1
20070037419	Sparrowhawk	Feb 2007	A1
20070042639	Manter et al.	Feb 2007	A1
20070054515	Williams	Mar 2007	A1
20070054554	Do et al.	Mar 2007	A1
20070059961	Cartier et al.	Mar 2007	A1
20070075717	Kinghorn et al.	Apr 2007	A1
20070155241	Lappohn	Jul 2007	A1
20070197095	Feldman et al.	Aug 2007	A1
20070207641	Minich	Sep 2007	A1
20070218765	Cohen et al.	Sep 2007	A1
20070232091	Hong	Oct 2007	A1
20070243741	Yang	Oct 2007	A1
20070254517	Olson et al.	Nov 2007	A1
20080026638	Cohen et al.	Jan 2008	A1
20080153343	Kobayashi et al.	Jun 2008	A1
20080194146	Gailus	Aug 2008	A1
20080200955	Tepic	Aug 2008	A1
20080207023	Tuin et al.	Aug 2008	A1
20080246555	Kirk et al.	Oct 2008	A1
20080248658	Cohen et al.	Oct 2008	A1
20080248659	Cohen et al.	Oct 2008	A1
20080248660	Kirk et al.	Oct 2008	A1
20080264673	Chi et al.	Oct 2008	A1
20080267620	Cole et al.	Oct 2008	A1
20080297988	Chau	Dec 2008	A1
20080305689	Zhang et al.	Dec 2008	A1
20090011641	Cohen et al.	Jan 2009	A1
20090011645	Laurx et al.	Jan 2009	A1
20090011664	Laurx et al.	Jan 2009	A1
20090017682	Amleshi et al.	Jan 2009	A1
20090023330	Stoner et al.	Jan 2009	A1
20090051558	Dorval	Feb 2009	A1
20090098767	Long	Apr 2009	A1
20090117386	Vacanti et al.	May 2009	A1
20090130913	Yi et al.	May 2009	A1
20090130918	Nguyen et al.	May 2009	A1
20090134895	Miller	May 2009	A1
20090166082	Liu et al.	Jul 2009	A1
20090176400	Davis et al.	Jul 2009	A1
20090205194	Semba et al.	Aug 2009	A1
20090215309	Mongold et al.	Aug 2009	A1
20090227141	Pan	Sep 2009	A1
20090239395	Cohen et al.	Sep 2009	A1
20090247012	Pan	Oct 2009	A1
20090269971	Tamura et al.	Oct 2009	A1
20090291593	Atkinson et al.	Nov 2009	A1
20090291596	Miyazoe	Nov 2009	A1
20090305533	Feldman et al.	Dec 2009	A1
20090311908	Fogg et al.	Dec 2009	A1
20100009571	Scherer et al.	Jan 2010	A1
20100018738	Chen et al.	Jan 2010	A1
20100078738	Chambers et al.	Apr 2010	A1
20100081302	Atkinson et al.	Apr 2010	A1
20100099299	Moriyama et al.	Apr 2010	A1
20100112850	Rao et al.	May 2010	A1
20100144167	Fedder et al.	Jun 2010	A1
20100144168	Glover et al.	Jun 2010	A1
20100144175	Heister et al.	Jun 2010	A1
20100144201	Defibaugh et al.	Jun 2010	A1
20100144203	Glover et al.	Jun 2010	A1
20100177489	Yagisawa	Jul 2010	A1
20100183141	Arai et al.	Jul 2010	A1
20100203768	Kondo et al.	Aug 2010	A1
20100221951	Pepe et al.	Sep 2010	A1
20100248544	Xu et al.	Sep 2010	A1
20100291806	Minich et al.	Nov 2010	A1
20100294530	Atkinson et al.	Nov 2010	A1
20110003509	Gailus	Jan 2011	A1
20110034075	Feldman et al.	Feb 2011	A1
20110067237	Cohen et al.	Mar 2011	A1
20110074213	Schaffer et al.	Mar 2011	A1
20110081114	Togami	Apr 2011	A1
20110100694	Regnier et al.	May 2011	A1
20110104948	Girard, Jr. et al.	May 2011	A1
20110130038	Cohen et al.	Jun 2011	A1
20110136387	Matsuura et al.	Jun 2011	A1
20110177699	Crofoot et al.	Jul 2011	A1
20110212632	Stokoe et al.	Sep 2011	A1
20110212633	Regnier et al.	Sep 2011	A1
20110212649	Stokoe et al.	Sep 2011	A1
20110212650	Amleshi et al.	Sep 2011	A1
20110223807	Jeon et al.	Sep 2011	A1
20110230095	Atkinson et al.	Sep 2011	A1
20110230096	Atkinson et al.	Sep 2011	A1
20110230104	Lang et al.	Sep 2011	A1
20110263156	Ko	Oct 2011	A1
20110287663	Gailus et al.	Nov 2011	A1
20110300757	Regnier et al.	Dec 2011	A1
20110300760	Ngo	Dec 2011	A1
20120003848	Casher et al.	Jan 2012	A1
20120034798	Khemakhem et al.	Feb 2012	A1
20120034820	Lang et al.	Feb 2012	A1
20120040563	Wang et al.	Feb 2012	A1
20120052712	Wang	Mar 2012	A1
20120058665	Zerebilov	Mar 2012	A1
20120058670	Regnier et al.	Mar 2012	A1
20120077369	Andersen	Mar 2012	A1
20120077380	Minich et al.	Mar 2012	A1
20120094536	Khilchenko et al.	Apr 2012	A1
20120135643	Lange et al.	May 2012	A1
20120148198	Togami et al.	Jun 2012	A1
20120156929	Manter et al.	Jun 2012	A1
20120156938	Zhang	Jun 2012	A1
20120164860	Wang	Jun 2012	A1
20120171890	Kurachi	Jul 2012	A1
20120184136	Ritter	Jul 2012	A1
20120184145	Zeng	Jul 2012	A1
20120202363	McNamara et al.	Aug 2012	A1
20120202370	Mulfinger et al.	Aug 2012	A1
20120202386	McNamara et al.	Aug 2012	A1
20120214344	Cohen et al.	Aug 2012	A1
20120252232	Buck et al.	Oct 2012	A1
20120329294	Raybold et al.	Dec 2012	A1
20130012038	Kirk et al.	Jan 2013	A1
20130017715	Laarhoven et al.	Jan 2013	A1
20130017733	Kirk et al.	Jan 2013	A1
20130034999	Szczesny et al.	Feb 2013	A1
20130040482	Ngo et al.	Feb 2013	A1
20130065454	Milbrand Jr.	Mar 2013	A1
20130078870	Milbrand, Jr.	Mar 2013	A1
20130084744	Zerebilov et al.	Apr 2013	A1
20130092429	Ellison	Apr 2013	A1
20130109232	Paniaqua	May 2013	A1
20130143420	Light et al.	Jun 2013	A1
20130143442	Cohen et al.	Jun 2013	A1
20130164970	Regnier et al.	Jun 2013	A1
20130196553	Gailus	Aug 2013	A1
20130210246	Davis et al.	Aug 2013	A1
20130223036	Herring et al.	Aug 2013	A1
20130225006	Khilchenko et al.	Aug 2013	A1
20130237092	Rubens	Sep 2013	A1
20130273781	Buck et al.	Oct 2013	A1
20130288513	Masubuchi et al.	Oct 2013	A1
20130288521	McClellan et al.	Oct 2013	A1
20130288525	McClellan et al.	Oct 2013	A1
20130288539	McClellan et al.	Oct 2013	A1
20130309906	De Geest	Nov 2013	A1
20130340251	Regnier et al.	Dec 2013	A1
20140004724	Cartier, Jr. et al.	Jan 2014	A1
20140004726	Cartier, Jr. et al.	Jan 2014	A1
20140004746	Cartier, Jr. et al.	Jan 2014	A1
20140035755	Ward	Feb 2014	A1
20140041937	Lloyd et al.	Feb 2014	A1
20140057475	Tohjo	Feb 2014	A1
20140057493	De Geest et al.	Feb 2014	A1
20140057494	Cohen	Feb 2014	A1
20140057498	Cohen	Feb 2014	A1
20140065883	Cohen et al.	Mar 2014	A1
20140073174	Yang	Mar 2014	A1
20140073181	Yang	Mar 2014	A1
20140099844	Dunham	Apr 2014	A1
20140154912	Hirschy	Jun 2014	A1
20140193993	Meng	Jul 2014	A1
20140199885	Vinther et al.	Jul 2014	A1
20140242844	Wanha et al.	Aug 2014	A1
20140273551	Resendez et al.	Sep 2014	A1
20140273557	Cartier, Jr. et al.	Sep 2014	A1
20140273627	Cartier, Jr. et al.	Sep 2014	A1
20140273641	Light et al.	Sep 2014	A1
20140286613	Ito et al.	Sep 2014	A1
20140287627	Cohen	Sep 2014	A1
20140295680	YuQiang et al.	Oct 2014	A1
20140302706	YuQiang et al.	Oct 2014	A1
20140308852	Gulla	Oct 2014	A1
20140334792	Bragg	Nov 2014	A1
20140335707	Johnescu et al.	Nov 2014	A1
20140335736	Regnier et al.	Nov 2014	A1
20150056856	Atkinson et al.	Feb 2015	A1
20150072561	Schmitt et al.	Mar 2015	A1
20150072562	Little et al.	Mar 2015	A1
20150079829	Brodsgaard	Mar 2015	A1
20150079845	Wanha et al.	Mar 2015	A1
20150093083	Tsai et al.	Apr 2015	A1
20150132990	Nong Chou et al.	May 2015	A1
20150147895	Hanna	May 2015	A1
20150180578	Leigh et al.	Jun 2015	A1
20150194751	Herring	Jul 2015	A1
20150200483	Martin et al.	Jul 2015	A1
20150200496	Simpson et al.	Jul 2015	A1
20150207247	Regnier et al.	Jul 2015	A1
20150236450	Davis	Aug 2015	A1
20150236451	Cartier, Jr. et al.	Aug 2015	A1
20150236452	Cartier, Jr. et al.	Aug 2015	A1
20150255926	Paniagua	Sep 2015	A1
20150280351	Bertsch	Oct 2015	A1
20150280368	Bucher	Oct 2015	A1
20150288110	Tanguchi et al.	Oct 2015	A1
20150303608	Zerebilov et al.	Oct 2015	A1
20150333460	Regnier et al.	Nov 2015	A1
20150357736	Tran et al.	Dec 2015	A1
20150357747	Filipon et al.	Dec 2015	A1
20150357761	Wanha et al.	Dec 2015	A1
20160004022	Ishii	Jan 2016	A1
20160013594	Costello et al.	Jan 2016	A1
20160013596	Regnier	Jan 2016	A1
20160028189	Resendez et al.	Jan 2016	A1
20160054527	Tang et al.	Feb 2016	A1
20160104956	Santos et al.	Apr 2016	A1
20160104990	Laurx et al.	Apr 2016	A1
20160111825	Wanha et al.	Apr 2016	A1
20160131859	Ishii et al.	May 2016	A1
20160141807	Gailus et al.	May 2016	A1
20160149343	Atkinson et al.	May 2016	A1
20160149362	Ritter et al.	May 2016	A1
20160150633	Cartier, Jr.	May 2016	A1
20160150639	Gailus et al.	May 2016	A1
20160150645	Gailus et al.	May 2016	A1
20160156133	Masubuchi et al.	Jun 2016	A1
20160172803	Tamai	Jun 2016	A1
20160174412	Karaaslan et al.	Jun 2016	A1
20160181713	Peloza et al.	Jun 2016	A1
20160181732	Laurx et al.	Jun 2016	A1
20160190747	Regnier et al.	Jun 2016	A1
20160197423	Regnier	Jul 2016	A1
20160211623	Sharf et al.	Jul 2016	A1
20160218455	Sayre et al.	Jul 2016	A1
20160233598	Wittig	Aug 2016	A1
20160268714	Wanha et al.	Sep 2016	A1
20160268739	Zerebilov et al.	Sep 2016	A1
20160274316	Verdiell	Sep 2016	A1
20160308296	Pitten et al.	Oct 2016	A1
20160315425	Nishimori et al.	Oct 2016	A1
20160322770	Zerebilov	Nov 2016	A1
20160336692	Champion et al.	Nov 2016	A1
20160344141	Cartier, Jr. et al.	Nov 2016	A1
20170025204	Chapman et al.	Jan 2017	A1
20170025783	Astbury et al.	Jan 2017	A1
20170033478	Wanha et al.	Feb 2017	A1
20170042070	Baumler et al.	Feb 2017	A1
20170047692	Cartier, Jr. et al.	Feb 2017	A1
20170054234	Kachlic	Feb 2017	A1
20170054250	Kim et al.	Feb 2017	A1
20170077643	Zbinden et al.	Mar 2017	A1
20170093093	Cartier, Jr. et al.	Mar 2017	A1
20170098901	Regnier	Apr 2017	A1
20170162960	Wanha et al.	Jun 2017	A1
20170194721	Fan et al.	Jul 2017	A1
20170222374	Saito et al.	Aug 2017	A1
20170285282	Regnier et al.	Oct 2017	A1
20170294743	Gailus et al.	Oct 2017	A1
20170302011	Wanha et al.	Oct 2017	A1
20170338595	Girard, Jr.	Nov 2017	A1
20170365942	Regnier	Dec 2017	A1
20170365943	Wanha et al.	Dec 2017	A1
20180006406	Craton	Jan 2018	A1
20180006416	Lloyd et al.	Jan 2018	A1
20180026413	Dambach et al.	Jan 2018	A1
20180034175	Lloyd et al.	Feb 2018	A1
20180034190	Ngo	Feb 2018	A1
20180040989	Chen	Feb 2018	A1
20180062323	Kirk et al.	Mar 2018	A1
20180089966	Ward	Mar 2018	A1
20180109043	Provencher et al.	Apr 2018	A1
20180145438	Cohen	May 2018	A1
20180212385	Little	Jul 2018	A1
20180219331	Cartier, Jr. et al.	Aug 2018	A1
20180219332	Brungard et al.	Aug 2018	A1
20180269612	Pitten et al.	Sep 2018	A1
20180278000	Regnier	Sep 2018	A1
20180287280	Ratkovic	Oct 2018	A1
20180309214	Lloyd et al.	Oct 2018	A1
20180366880	Zerebilov et al.	Dec 2018	A1
20190013617	Ayzenberg et al.	Jan 2019	A1
20190013625	Gailus et al.	Jan 2019	A1
20190020155	Trout et al.	Jan 2019	A1
20190044284	Dunham	Feb 2019	A1
20190115677	Kachlic	Apr 2019	A1
20190157812	Gailus et al.	May 2019	A1
20190173236	Provencher et al.	Jun 2019	A1
20190181582	Beltran et al.	Jun 2019	A1
20190191094	Khoe et al.	Jun 2019	A1
20190260147	Pitten et al.	Aug 2019	A1
20200028302	Winey	Jan 2020	A1
20200076455	Sharf	Mar 2020	A1
20200091637	Scholeno et al.	Mar 2020	A1
20200142142	Luo et al.	May 2020	A1
20200220289	Scholeno et al.	Jul 2020	A1
20200227850	Do et al.	Jul 2020	A1
20200227851	Do et al.	Jul 2020	A1
20200244025	Winey et al.	Jul 2020	A1
20200274267	Zerebilov	Aug 2020	A1
20200274295	Briant	Aug 2020	A1
20200274301	Manter et al.	Aug 2020	A1
20210021085	Diaz et al.	Jan 2021	A1
20210091496	Cartier, Jr. et al.	Mar 2021	A1
20210098927	Si et al.	Apr 2021	A1
20210305731	Klein et al.	Sep 2021	A1
20210384691	Winey et al.	Dec 2021	A1
20210399455	Wang et al.	Dec 2021	A1
20220013962	Gailus et al.	Jan 2022	A1
20220094111	Duan et al.	Mar 2022	A1
20220158371	Zerebilov et al.	May 2022	A1
20220173550	Liu et al.	Jun 2022	A1
20220224057	Diaz et al.	Jul 2022	A1
20220287205	Huang et al.	Sep 2022	A1
20220352675	Zerebilov et al.	Nov 2022	A1

Foreign Referenced Citations (100)

Number	Date	Country
2519434	Oct 2002	CN
1127783	Nov 2003	CN
1681218	Oct 2005	CN
101132094	Feb 2008	CN
101164204	Apr 2008	CN
201114063	Sep 2008	CN
101312275	Nov 2008	CN
101330172	Dec 2008	CN
101752700	Jun 2010	CN
201562814	Aug 2010	CN
102106046	Jun 2011	CN
102160245	Aug 2011	CN
102377053	Mar 2012	CN
102598430	Jul 2012	CN
202564699	Nov 2012	CN
202678544	Jan 2013	CN
102986091	Mar 2013	CN
103250306	Aug 2013	CN
103969768	Aug 2014	CN
104025393	Sep 2014	CN
104518363	Apr 2015	CN
104779467	Jul 2015	CN
105051978	Nov 2015	CN
105612671	May 2016	CN
105826740	Aug 2016	CN
106030925	Oct 2016	CN
106104933	Nov 2016	CN
108713355	Oct 2018	CN
109273932	Jan 2019	CN
109980386	Jul 2019	CN
111769395	Oct 2020	CN
111769396	Oct 2020	CN
212412345	Jan 2021	CN
212571566	Feb 2021	CN
213151165	May 2021	CN
112993659	Jun 2021	CN
113078510	Jul 2021	CN
214100162	Aug 2021	CN
113422243	Sep 2021	CN
215184602	Dec 2021	CN
115347395	Nov 2022	CN
3447556	Jul 1986	DE
0635912	Jan 1995	EP
0 903 811	Mar 1999	EP
1 207 587	May 2002	EP
1 779 472	May 2007	EP
2 169 770	Mar 2010	EP
1272347	Apr 1972	GB
02-079571	Jun 1990	JP
H06-029061	Feb 1994	JP
H07-302649	Nov 1995	JP
2000-311749	Nov 2000	JP
2003-208928	Jul 2003	JP
2006-108115	Apr 2006	JP
2010-266729	Nov 2010	JP
2011-018651	Jan 2011	JP
2012-516021	Jul 2012	JP
2014195061	Oct 2014	JP
2016-528688	Sep 2016	JP
6193595	Sep 2017	JP
6599548	Oct 2019	JP
1656986	Apr 2020	JP
1668637	Sep 2020	JP
1668730	Sep 2020	JP
10-1989-0007458	Jun 1989	KR
10-2010-0055197	May 2010	KR
10-1425931	Aug 2014	KR
10-2015-0067010	Jun 2015	KR
10-2015-0101020	Sep 2015	KR
10-2016-0038192	Apr 2016	KR
10-2016-0076334	Jun 2016	KR
M357771	May 2009	TW
M403134	May 2011	TW
I446657	Jul 2014	TW
D209874	Feb 2021	TW
107122340	Nov 2022	TW
WO 8805218	Jul 1988	WO
WO 9956352	Nov 1999	WO
WO 2004059794	Jul 2004	WO
WO 2004059801	Jul 2004	WO
WO 2004098251	Nov 2004	WO
WO 2005048409	May 2005	WO
WO 2006002356	Jan 2006	WO
WO 2006039277	Apr 2006	WO
WO 2007005597	Jan 2007	WO
WO 2007005599	Jan 2007	WO
WO 2008072322	Jun 2008	WO
WO 2008124057	Oct 2008	WO
WO 2010039188	Apr 2010	WO
WO 2012078434	Jun 2012	WO
WO 2013006592	Jan 2013	WO
WO 2014146134	Sep 2014	WO
WO 2015013430	Jan 2015	WO
WO 2015112717	Jul 2015	WO
WO 2017015470	Jan 2017	WO
WO 2017123574	Jul 2017	WO
WO-2017164418	Sep 2017	WO
WO 2018118738	Jun 2018	WO
WO 2019195319	Oct 2019	WO
WO 2021070273	Apr 2021	WO

Non-Patent Literature Citations (73)

Entry
Chinese Office Action for Chinese Application No. 201880064336.0, dated Oct. 19, 2020.
Chinese Office Action dated Nov. 3, 2021 in connection with Chinese Application No. 201980036855.0.
Chinese Office Action dated May 10, 2022 in connection with Chinese Application No. 202080016725.3.
Chinese Office Action for Application No. CN201580069567.7 dated Jun. 17, 2019.
Chinese Office Action for Application No. CN201580069567.7 dated Oct. 9, 2019.
Extended European Search Report for European Application No. EP 11166820.8 dated Jan. 24, 2012.
International Search Report and Written Opinion for International Application No. PCT/US2005/034605 dated Jan. 26, 2006.
International Search Report and Written Opinion for International Application No. PCT/US2006/25562 dated Oct. 31, 2007.
International Search Report and Written Opinion for International Application No. PCT/US2010/056482 dated Mar. 14, 2011.
International Search Report and Written Opinion for International Application No. PCT/US2010/056495 dated Jan. 25, 2011.
International Search Report and Written Opinion for International Application No. PCT/US2011/026139 dated Nov. 22, 2011.
International Search Report and Written Opinion for International Application No. PCT/US2011/034747 dated Jul. 28, 2011.
International Search Report and Written Opinion for International Application No. PCT/US2012/023689 dated Sep. 12, 2012.
International Search Report and Written Opinion for International Application No. PCT/US2012/060610 dated Mar. 29, 2013.
International Preliminary Report on Patentability for International Application No. PCT/US2014/026381 dated Sep. 24, 2015.
International Search Report and Written Opinion for International Application No. PCT/US2014/026381 dated Aug. 12, 2014.
International Search Report and Written Opinion for International Application No. PCT/US2015/012463 dated May 13, 2015.
International Search Report and Written Opinion for International Application No. PCT/US2015/012542 dated Apr. 30, 2015.
International Preliminary Report on Patentability for International Application No. PCT/US2015/060472 dated May 26, 2017.
International Search Report and Written Opinion for International Application No. PCT/US2015/060472 dated Mar. 11, 2016.
International Preliminary Report on Patentability for International Application No. PCT/US2016/012937 dated Jul. 27, 2017.
International Search Report and Written Opinion for International Application No. PCT/US2016/012937 dated Apr. 25, 2016.
International Search Report and Written Opinion for International Application No. PCT/US2016/043358 dated Nov. 3, 2016.
International Preliminary Report on Patentability for International Application No. PCT/US2017/033122 dated Nov. 29, 2018.
International Search Report and Written Opinion for International Application No. PCT/US2017/033122 dated Aug. 8, 2017.
International Preliminary Report on Patentability for International Application No. PCT/US2017/057402 dated May 2, 2019.
International Search Report and Written Opinion for International Application No. PCT/US2017/057402 dated Jan. 19, 2018.
International Preliminary Report on Patentability for International Application No. PCT/US2018/045207 dated Feb. 13, 2020.
International Search Report and Written Opinion for International Application No. PCT/US2018/045207 dated Nov. 29, 2018.
International Preliminary Report on Patentability for International Application No. PCT/US2019/025426 dated Oct. 15, 2020.
International Search Report and Written Opinion for International Application No. PCT/US2019/025426 dated Jun. 28, 2019.
International Search Report and Written Opinion for International Application No. PCT/US2020/013487 dated Jun. 8, 2020.
International Search Report and Written Opinion for International Application No. PCT/US2020/013508 dated May 14, 2020.
International Search Report and Written Opinion for International Application No. PCT/US2020/014799, dated May 27, 2020.
International Search Report and Written Opinion for International Application No. PCT/US2020/014826, dated May 27, 2020.
International Preliminary Report on Patentability dated Sep. 2, 2021 in connection with International Application No. PCT/US2020/019019.
International Search Report and Written Opinion dated Jun. 24, 2020 in connection with International Application No. PCT/US2020/019019.
International Preliminary Report on Patentability dated Mar. 31, 2022 in connection with International Application No. PCT/US2020/051242.
International Search Report and Written Opinion for International Application No. PCT/US2020/051242, dated Feb. 1, 2021.
[No Author Listed], Amphenol TCS expands the Xcede Platform with 85 Ohm Connectors and High-Speed Cable Solutions. Press Release. Published Feb. 25, 2009. http://www.amphenol.com/about/news_archive/2009/58 [Retrieved on Mar. 26, 2019 from Wayback Machine]. 4 pages.
[No Author Listed], Agilent. Designing Scalable 10G Backplane Interconnect Systems Utilizing Advanced Verification Methodologies. White Paper, Published May 5, 2012. 24 pages.
[No Author Listed], Carbon Nanotubes For Electromagnetic Interference Shielding. SBIR/STTR. Award Information. Program Year 2001. Fiscal Year 2001. Materials Research Institute, LLC. Chu et al. Available at http://sbir.gov/sbirsearch/detail/225895. Last accessed Sep. 19, 2013. 2 pages.
[No Author Listed], Difference Between Weld Metal and Heat Affected Zone (HAZ). Minaprem.com. 2021. 7 pages. URL:http://www.difference.minaprem.com/joining/difference-between-weld-metal-and-heat-affected-zone-haz [date retrieved Dec. 20, 2021].
[No Author Listed], File:Wrt54gl-layout.jpg Sep. 8, 2006. Retrieved from the Internet: https://xinu.mscs.mu.edu/File:Wrt54gl-layout.jpg [retrieved on Apr. 9, 2019]. 2 pages.
[No Author Listed], Hitachi Cable America Inc. Direct Attach Cables. 8 pages. Retrieved Aug. 10, 2017 from http://www.hca.hitachi-cable.com/products/hca/catalog/pdfs/direct-attach-cable-assemblies.pdf [last accessed Mar. 6, 2019].
[No Author Listed], Size 8 High Speed Quadrax and Differential Twinax Contacts for Use in MIL-DTL-38999 Special Subminiature Cylindrical and ARINC 600 Rectangular Connectors. Published May 2008. 10 pages. Retrieved from https://www.peigenesis.com/images/content/news/amphenol_quadrax.pdf.
[No Author Listed], What is the Heat Affected Zone (HAZ)? TWI Ltd. 2021. 8 pages. URL:https://www.twi-global.com/technical-knowledge/faqs/what-is-the-heat-affected-zone [date retrieved Dec. 20, 2021].
Beaman, High Performance Mainframe Computer Cables. 1997 Electronic Components and Technology Conference. 1997;911-7.
Fjelstad, Flexible Circuit Technology. Third Edition. BR Publishing, Inc. Sep. 2006. 226 pages. ISBN 0-9667075-0-8.
Lehto et al, Characterisation of local grain size variation of welded structural steel. Weld World. 2016;60:673-688. 16 pages. URL:https://link.springer.com/content/pdf/10.1007/s40194-016-0318-8.pdf.
Lloyd et al., High Speed Bypass Cable Assembly, U.S. Appl. No. 15/271,903, filed Sep. 21, 2016.
Lloyd et al., High Speed Bypass Cable Assembly, U.S. Appl. No. 15/715,939, filed Sep. 26, 2017.
Shi et al. Improving Signal Integrity in Circuit Boards by Incorporating Absorbing Materials. 2001 Proceedings. 51st Electronic Components and Technology Conference, Orlando FL. 2001:1451-56.
Chinese Office Action for Chinese Application No. 201880057597.X, dated Dec. 3, 2021.
Chinese Office Action for Chinese Application No. 201880057597.X, dated Jan. 5, 2021.
Chinese Office Action dated Jun. 9, 2022 in connection with Chinese Application No. 202080019763.4.
International Preliminary Report on Patentability for International Application No. PCT/US2018/039919 dated Jan. 16, 2020.
International Search Report and Written Opinion for International Application No. PCT/US2018/039919, dated Nov. 8, 2018.
International Preliminary Report on Patentability dated Aug. 5, 2021 in connection with International Application No. PCT/US2020/014799.
International Preliminary Report on Patentability dated Aug. 5, 2021 in connection with International Application No. PCT/US2020/014826.
International Preliminary Report on Patentability dated Apr. 7, 2022 in connection with International Application No. PCT/US2020/052397.
International Search Report and Written Opinion for International Application No. PCT/US2020/052397 dated Jan. 15, 2021.
Invitation to Pay Additional Fees mailed Jul. 22, 2022 in connection with International Application No. PCT/US2022/026964.
International Search Report and Written Opinion dated Oct. 6, 2022 in connection with International Application No. PCT/US2022/026964.
Taiwanese Office Action dated Sep. 19, 2022 in connection with Taiwanese Application No. 107127074.
[No Author Listed], INF-8438i Specification for QSFP (Quad Small Formfactor Pluggable) Transceiver. Rev 1.0 Nov. 2006. SFF Committee. 75 pages.
[No Author Listed], INF-8628 Specification for QSFP-DD 8X Transceiver (QSFP Double Density) Rev 0.0 Jun. 27, 2016. SNIA SFF TWG Technology Affiliate. 1 page.
[No Author Listed], SFF-8663 Specification for QSFP+ 28 GB/s Cage (Style A) Rev 1.7. Oct. 19, 2017. SNIA SFF TWG Technology Affiliate. 18 pages.
Palkert (ed), QSFP-DD Overview. Mar. 14, 2017. 19 pages. URL:http://www.qsfp-dd.com.
Si et al., High Performance Stacked Connector, U.S. Appl. No. 17/940,250, filed Sep. 8, 2022.
Zerebilov et al., Miniaturized High Speed Connector, USAN filed Apr. 28, 2022.
Taiwanese Office Action dated Nov. 30, 2022 in connection with Taiwanese Application No. 107122340 (A0863.70105TWOO).
[No. Author Listed], Specification for Quad Small Form Factor Pluggable Module 112. QSFP112 Published Specification Rev. 2.0. QSFP112 Multi-Source Agreement. Jan. 22, 2022. 55 pages.

Related Publications (1)

	Number	Date	Country
	20210234291 A1	Jul 2021	US

Provisional Applications (1)

	Number	Date	Country
	62966892	Jan 2020	US

High frequency midboard connector

Information

Patent Number

Date Filed

Date Issued

Inventors

Original Assignees

Examiners

Agents

CPC

Field of Search

US

CPC

International Classifications

Term Extension

Abstract