1. Field of the Invention
The present invention generally relates to a high-frequency relay, and more particularly, to a high-frequency relay switching a high-frequency signal.
2. Description of the Related Art
FIG. 1A and
A high-frequency relay 1a comprises an electromagnet unit 2 and a contact unit 3.
The electromagnet unit 2 comprises an iron core 2a, a coil 2b wound around the iron core 2a, and a coil terminal 2c connected to the coil 2b. The coil terminal 2c hangs down so as to be connected to a substrate not shown in the figure.
The contact unit 3 comprises a moving contact unit 4, a fixed make contact unit 5 and a fixed break contact unit 6. The fixed make contact unit 5 and the fixed break contact unit 6 are provided at positions opposite both ends of the moving contact unit 4.
The moving contact unit 4 includes an armature 4b provided opposite the electromagnet unit 2. A permanent magnet 4a is mounted to the armature 4b. A moving spring 4c is arranged unitarily with the armature 4b. A moving make contact 4d and a moving break contact 4e are provided at both ends of the moving contact unit 4. The moving contact unit 4 also includes a common terminal 4f hanging down so as to be connected to a substrate not shown in the figure.
The fixed make contact unit 5 comprises a fixed make contact 5a arranged opposite the moving make contact 4d, and a make terminal 5b hanging down so as to be connected to a substrate not shown in the figure.
The fixed break contact unit 6 comprises a fixed break contact 6a arranged opposite the moving break contact 4e, and a break terminal 6b hanging down so as to be connected to a substrate not shown in the figure.
Besides, the relay has a structure in which a contact drive card is provided by bridging and holding the armature 4b and the moving spring 4c.
With the relay 1a in use, the moving spring 4c moves according to energization of the coil 2b so as to switch between a make state in which the moving make contact 4d contacts the fixed make contact 5a and a break state in which the moving break contact 4e contacts the fixed break contact 6a. This relay may be referred to as a one-point break one-point make structure type.
With such a high-frequency relay as above, that switches a high-frequency signal, an isolation characteristic is the most important of various characteristics required for the signal switching capability.
The isolation characteristic represents a leakage of a signal between a moving contact and a fixed contact (herein below simply referred to as contacts) in a state where the contacts are broken. As a frequency of the signal becomes higher, the leakage increases. The isolation is defined by the following expression and, as a value obtained by this expression becomes larger, the isolation exhibits a better characteristic:
In order to increase the isolation characteristic, it is necessary to reduce a capacitance between the broken contacts.
Specific methods for reducing the capacitance between the broken contacts include enlarging a clearance between the contacts, and decreasing opposing areas between the contacts.
However, in the example of the high-frequency relay 1a of the one-point break one-point make structure shown in FIG. 1A and
There is a method for solving the above-described problems of the relay 1a shown in FIG. 1A and FIG. 1B. In a relay 1b of a two-point break two-point make structure shown in
In addition, for the purpose of further improving the isolation characteristic, there are a relay 1e as shown in
Further, Japanese Laid-Open Patent Application No. 2000-340084 proposes a relay 1g, as shown in FIG. 7A and
However, the heretofore-described conventional relays do not necessarily provide a satisfactory isolation characteristic.
It is a general object of the present invention to provide an improved and useful high-frequency relay in which the above-mentioned problems are eliminated.
A more specific object of the present invention is to provide a high-frequency relay that exhibits an excellent isolation characteristic.
In order to achieve the above-mentioned objects, there is provided according to one aspect of the present invention a high-frequency relay comprising: a body containing a contact unit connected with at least one contact terminal protruded from a bottom surface of the body, the contact unit having contact states switched according as an energization to a coil; and a base covering at least the bottom surface, the base having a grounding function and including a conductive layer.
According to the present invention, the high-frequency relay can exhibit an excellent isolation characteristic.
More preferably, in the high-frequency relay according to the present invention, the base may be formed in a box shape covering the bottom surface and four side surfaces of the body, the box shape having an upward opening.
More preferably, the high-frequency relay according to the present invention may further comprise an openable and closable lid member capable of being closed on the upward opening, the lid member including a conductive layer so as to be electrically connected with the base.
More preferably, the high-frequency relay according to the present invention may further comprise a cover capable of covering surfaces of the body except the bottom surface, the cover including a conductive layer so as to be electrically connected with the base.
In order to achieve the above-mentioned objects, there is also provided according to another aspect of the present invention a high-frequency relay comprising: a body containing a contact unit connected with at least one contact terminal protruded from a bottom surface of the body, the contact unit having contact states switched according as an energization to a coil; a cover capable of covering surfaces of the body except the bottom surface, the cover having a grounding function and including a conductive layer; and a base covering at least the bottom surface, the base including a conductive layer so as to be electrically connected with the cover.
More preferably, in the high-frequency relay according to the present invention, one of the base and the cover may include a ground terminal having the grounding function. Alternatively, the base may include a mounting pad so as to be mounted on a substrate, the mounting pad having the grounding function.
Additionally, in the high-frequency relay according to the present invention, the base may be composed of a resinous molding coated with the conductive layer.
More preferably, in the high-frequency relay according to the present invention, the base may include at least one insertion hole accommodating the contact terminal inserted therethrough.
More preferably, in the high-frequency relay according to the present invention, the base may be formed from a metal plate by bending so as to comprise a ground terminal bent from a bottom surface of the base and a defective part formed in the bottom surface of the base by bending the ground terminal; the cover may be formed from a metal plate by bending so as to comprise a foldable projection capable of being folded with respect to the cover; and the defective part may be closed by the foldable projection.
Additionally, in the high-frequency relay according to the present invention, the cover may be composed of a resinous molding coated with the conductive layer.
More preferably, in the high-frequency relay according to the present invention, the cover and the base may comprise respective engaging members so that the cover and the base are engaged by the engaging members so as to be unified.
Additionally, in the high-frequency relay according to the present invention, one of the cover and the base may be inserted into the other so as to be unified.
Additionally, in the high-frequency relay according to the present invention, the cover and the base may be bonded to each other so as to be unified.
In order to achieve the above-mentioned objects, there is also provided according to another aspect of the present invention a high-frequency relay comprising: a body containing a contact unit connected with a contact terminal and a ground terminal protruded from a bottom surface of the body, the contact unit having contact states switched according as an energization to a coil; a base covering at least the bottom surface, the base including a conductive layer so as to be electrically connected with the ground terminal; and a cover capable of covering surfaces of the body except the bottom surface, the cover including a conductive layer so as to be electrically connected with the base.
According to the present invention, the ground terminal or the pad need not be especially provided on the base or the cover.
In order to achieve the above-mentioned objects, there is also provided according to another aspect of the present invention a high-frequency relay comprising:
a body containing a contact unit connected with at least one contact terminal protruded from a bottom surface of the body, the contact unit having contact states switched according as an energization to a coil;
a base covering at least the bottom surface, the base including a conductive layer;
a cover capable of covering surfaces of the body except the bottom surface, the cover including a conductive layer;
a ground terminal formed on one of the base and the cover; and
a standoff portion provided on one of the base and the cover.
According to the present invention, when the relay is mounted on a substrate, the base of the relay and a pattern formed on the substrate can surely be prevented from interfering with each other.
Other objects, features and advantages of the present invention will become more apparent from the following detailed description when read in conjunction with the accompanying drawings.
FIG. 19A and
FIG. 33A and
FIG. 34A and
FIG. 35A and
FIG. 36A and
FIG. 37A and
FIG. 38A and
FIG. 39A and
A description will now be given, with reference to the drawings, of embodiments of a high-frequency relay (hereinafter simply referred to as a relay) according to the present invention.
It is noted here that, since each of the relays according to the following embodiments has the same basic structure as the foregoing conventional relays, the same elements will be referenced by the same reference marks, if not especially mentioned; or, as occasion demands, the elements will not be specifically referenced by the reference marks or will not be shown in the figures, and will not be described in detail.
As shown in
The relay 10a comprises the body 1a of the relay, and a metal base 14. The body 1a contains the contact unit 3 in which the contact (make/break) state switches according as an energization to the coil 2b. The contact terminals 4f, 5b and 6b connected to the contact unit 3, and the coil terminal 2c, are protruded from a bottom surface of a resinous cover 12 covering these elements. The metal base 14 is formed in a box shape covering a bottom surface and four sides of the body 1a and opening upward. Ground terminals 16 realizing a grounding function are mounted on the base 14. The ground terminals 16 are terminals inserted into through holes of a substrate not shown in the figure. Insertion holes 18 are formed in a bottom surface of the base 14. The terminals 2c, 4f, 5b and 6b of the body 1a are inserted through the respective insertion holes 18.
The relay 10a according to the present first embodiment exhibits an excellent isolation characteristic.
The base 14 of the relay 10a according to the present first embodiment can be formed from a metal plate 20 into the box shape by deep drawing, for example as shown in FIG. 9. Then, for example as shown in
Alternatively, the base 14 of the relay 10a can be formed from the metal plate 20 into the box shape by bending, for example as shown in FIG. 11. Then, the ground terminals 16 are mounted on the metal base 14 by welding, in the same manner as in FIG. 10.
In this course, for example as shown in
Alternatively as a structure having a grounding function, a line of projection 22 may be formed as a pad (a ground connection portion) on a bottom surface 14a of the base 14, as shown in FIG. 15. Still alternatively, an insulating coating 24 may be applied throughout the surface of the metal plate 20 except a line of conductive portion 20a to be left as a pad (a ground connection portion) on the metal plate 20, as shown in FIG. 16.
Additionally, the ground terminals 16 may be formed by being bent from the metal plate 20. For example, as shown in
Still alternatively, the base 14 of the relay 10a may be formed as follows: a box member 28 is formed by molding a resin; and a metal film (a conductive layer) 30 is formed on the surface of the box member 28 by plating or coating the surface of the box member 28, as shown in FIG. 19A and FIG. 19B. Then, the ground terminals 16 are mounted on the metal base 14 by welding, in the same manner as in
Next, a relay according to a second embodiment of the present invention is different from the relay 10a according to the foregoing first embodiment in that the metal base 14 formed in the box shape is replaced by a base 26 formed in a shape having a bottom plate (a bottom surface) alone. Additionally, for example, the ground terminals 16 may be formed as shown in
As described above, the relay according to the present second embodiment has a simple structure that can provide a substantially equivalent advantage to the advantage provided by the relay 10a according to the foregoing first embodiment.
Next, a relay 10b according to a third embodiment of the present invention has a structure in which an openable and closable lid member 32 is provided on one of the sides 14b of the base 14, as shown in
The relay 10b according to the present third embodiment exhibits a more excellent isolation characteristic than the relay 10a according to the foregoing first embodiment.
Next, a relay 10c according to a fourth embodiment of the present invention comprises a metal cover 34 formed in a box shape opening downward, as shown in FIG. 27A and
The cover 34 has standoff portions 34a at four corners of lower edges of sides thereof. On the other hand, holes 36 are so formed in the base 14 that the standoff portions 34a pass through the respective holes 36.
After the body 1a is contained in the base 14, the cover 34 is inserted along inner side surfaces of the base 14. In this course, the standoff portions 34a are inserted through the respective holes 36. Thereby, the body 1a is covered tightly with the base 14 and the cover 34.
The relay 10c according to the present fourth embodiment provides a similar advantage to the advantage provided by the relay 10b according to the foregoing third embodiment. Additionally, when the relay 10c is mounted on the substrate not shown in the figure by inserting the terminals through the through holes of the substrate to protrude from the undersurface of the substrate, the standoff portions 34a provided in the relay 10c can surely prevent the base 14 and a pattern formed on the substrate from interfering with each other, because the standoff portions 34a contact the upper surface of the substrate so as to create a gap between the relay 10c and the substrate. (This point will be hereinafter described in detail with reference to
Additionally, in the relay 10c, the ground terminals 16 may be formed on the cover 34, instead of being formed on the base 14, such that the ground terminals 16 pass through holes formed in the base 14 (not shown in the figures). Additionally, the standoff portions 34a may be formed on the base 14.
The cover 34 of the relay 10c according to the present fourth embodiment can be formed from the metal plate 20 by deep drawing, for example as shown in FIG. 28. Alternatively, the cover 34 can be formed from the metal plate 20 by bending, for example as shown in FIG. 29.
Next, as shown in FIG. 30A and
Each of the base 14 and the cover 34 is formed from the metal plate by bending, and the ground terminals 16 of the base 14 are bent from the metal plate. In this course, bending the ground terminals 16 leaves defective parts, i.e., openings (indicated by arrows A in
Besides, in the heretofore-described embodiments, the base and the cover are unified by using insertion methods and structures. As such insertion structures, it is more preferable that the sides 14b of the base 14 to be inserted into the cover 34 are so formed as to have steps (indicated by arrows X1) near lower ends of the sides 14b, as shown in
Here, descriptions will be given, with reference to
In a relay 10e shown in FIG. 33A and
In the course of unifying the base and the cover of the relay 10e, after the body 1a is contained in the base 14, the cover 34 is put on the base 14 with the hooks 38 contacting smoothly on the sides 14b; then, the hooks 38 engage the holes 40 so as to fix the cover 34 to the base 14 unitarily.
In a relay 10f shown in FIG. 34A and
In the course of unifying the base and the cover of the relay 10f, the cover 34 containing the body 1a is inserted into the base 14 with the hooks 38 contacting smoothly on the sides 34c; then, the hooks 38 engage the holes 40 so as to fix the cover 34 to the base 14 unitarily.
In a relay 10g shown in FIG. 35A and
In the course of unifying the base and the cover of the relay 10g, after the body 1a is contained in the base 14, the cover 34 is put on the base 14, and then, the long projections 42 are bent inwardly so as to engage the bottom surface 14a of the base 14; thereby, the cover 34 is fixed to the base 14 unitarily.
In a relay 10h shown in FIG. 36A and
In the course of unifying the base and the cover of the relay 10h, the cover 34 containing the body 1a is inserted into the base 14 with the belt-shaped projections 44 of the cover 34 contacting smoothly on inner surfaces of the sides 14b of the base 14 until the belt-shaped projections 44 engage the belt-shaped holes 46; thereby, the cover 34 is fixed to the base 14 unitarily.
In a relay 10i shown in FIG. 37A and
In the course of unifying the base and the cover of the relay 10i, the cover 34 containing the body 1a is inserted into the base 14 with the sides 34c of the cover 34 contacting smoothly on the belt-shaped projections 44 of the base 14 until the belt-shaped projections 44 engage the belt-shaped holes 46; thereby, the cover 34 is fixed to the base 14 unitarily.
Besides, in the heretofore-described embodiments, the body of the relay is contained in and unified with the base or the cover by using insertion methods and structures. Here, descriptions will be given, with reference to
In a relay 10j shown in FIG. 38A and
In the course of containing and unifying the body in/with the base of the relay 10j, the body 1a is inserted into the base 14 with the belt-shaped projections 44 of the body 1a pushing open the sides 14b of the base 14 until the belt-shaped projections 44 engage the belt-shaped holes 46; thereby, the body 1a is contained in and unified with the base 14.
In a relay 10k shown in FIG. 39A and
In the course of containing and unifying the body in/with the base of the relay 10k, the body 1a is inserted into the base 14 with the sides 48a of the resinous cover 48 of the body 1a pushing open the sides 14b of the base 14 with the belt-shaped projections 44 of the base 14 located therebetween until the belt-shaped projections 44 engage the belt-shaped holes 46; thereby, the body 1a is contained in and unified with the base 14.
Further, descriptions will be given, with reference to
The base 14, the cover 34 and the body 1a of a relay 101 shown in
The base 14, the cover 34 and the body 1a of a relay 10m shown in
The solid adhesive 50 is formed according to a shape of a bonding part where the body 1a and the cover 34 are bonded to the base 14. Specifically, the solid adhesive 50 has an opening 52 so as to avoid a protuberance 53 located on the bottom surface (indicated by arrow X2) of the body 1a, the protuberance 53 being not required to be bonded. The solid adhesive 50 also has a plurality of openings 54 around the opening 52. The terminals (indicated by arrow X4) of the body 1a are inserted through the respective openings 54. It is noted that the opening 52 will not be formed when the protuberance 53 does not exist on the body 1a.
The base 14, the cover 34 and the body 1a of the relay 10m are fixed and unified all at one time, as follows: in a state where the body 1a is contained in the cover 34, the solid adhesive 50 is applied on the bottom surface (indicated by arrow X2) of the body 1a and on peripheral parts (indicated by arrow X3) of the cover 34 in the vicinity of the bottom surface of the body 1a, and thereafter, the base 14 is put on the cover 34. Then, the relay 10m is heated so as to melt the solid adhesive 50. Thereby, the bottom surface of the body 1a and the peripheral parts of the cover 34 are bonded to inner surfaces of the bottom of the base 14 so that the base 14, the cover 34 and the body 1a are fixed and unified. By using the solid adhesive 50, the base 14, the cover 34 and the body 1a can be bonded more simply than by using the liquid adhesive.
Besides, in the heretofore-described embodiments, the insertion holes 18 through which the terminals of the body 1a are inserted are formed in the base 14. Here, descriptions will be given, with reference to
Insertion holes 18a formed in the base 14 shown in
Each of insertion holes 18d formed in the base 14 shown in
Besides, in the heretofore-described embodiments, the ground terminals or the pad (the ground connection portion) are provided on the base or the cover. Here, descriptions will be given, with reference to
In a relay 10n shown in
Each of the engaging holes 56 is formed in such a H-shape that a width W1 of a part engaging the ground terminal 16 is formed slightly smaller than a thickness T1 of the ground terminal 16.
In the relay 10n, when the body 1a is inserted into the base 14, the ground terminals 16 of the body 1a are pressed into the respective engaging holes 56 of the base 14. Accordingly, the base 14 surely contacts the ground terminals 16; this enables the ground terminals 16 of the body 1a to be used for grounding the base 14. In this relay 10n, the ground terminals or the pad (the ground connection portion), such as the projection 22 shown in
Alternatively, in the relay 10n, each of the engaging holes 56 may be so formed that the part (indicated by arrow X5) engaging the ground terminal 16 has a saw-toothed form, as shown in FIG. 47.
Besides, in the heretofore-described embodiments, the standoff portions are provided on the base or the cover. Here, descriptions will be given, with reference to
In a relay 10o shown in
When the relay 10o is mounted on a substrate 58, the standoff portions 34a contact the substrate 58 so as to create an insulating gap having a measurement H3 between the base 14 and the substrate 58, as shown in
In a relay 10p shown in
The cover 34 shown in FIG. 50A and
Thereby, when the relay is mounted on the substrate, the substrate and the standoff portions 34a are surely insulated from each other; i.e., the substrate and the relay are surely insulated from each other.
The base 14 shown in FIG. 51A and
Next,
The measurements are carried out under condition that transmission impedance of each of the relay is 50 Ω.
In
Although the heretofore-described embodiments of the present invention set forth the conventional relay 1a as the body of the relay, the body of the relay is not limited thereto as long as the advantages of the present invention are secured. Additionally, the elements described in each of the embodiments are applicable to the corresponding elements in other embodiments as long as the advantages of the present invention are not hindered.
That is, the present invention is not limited to the specifically disclosed embodiments, and variations and modifications may be made without departing from the scope of the present invention.
The present application is based on Japanese priority application No. 2001-328209 filed on Oct. 25, 2001, the entire contents of which are hereby incorporated by reference.
Number | Date | Country | Kind |
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2001-328209 | Oct 2001 | JP | national |
Number | Name | Date | Kind |
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3377449 | Marquis | Apr 1968 | A |
4626812 | Nakanishi et al. | Dec 1986 | A |
5008487 | Shimmyo | Apr 1991 | A |
5815057 | Hoffman et al. | Sep 1998 | A |
5994988 | Ferree et al. | Nov 1999 | A |
6340923 | Yamanaka et al. | Jan 2002 | B1 |
6424242 | Shinoura et al. | Jul 2002 | B1 |
Number | Date | Country |
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2000-340084 | Dec 2000 | JP |
Number | Date | Country | |
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20030080840 A1 | May 2003 | US |