Patent Application
20160007445
(a) Technical Field of the Invention
The present invention is generally related to high-frequency signal processing methods, and more particular to a method providing segmented suppression and successive isolation to the interference produced by signal transmission conductor.
(b) Description of the Prior Art
As electronic appliances are getting more sophisticated, they are also more susceptible to interferences arising from such as electromagnetic waves.
The noises in signal transmission due to various interferences often cause the malfunction of the electronic appliances.
A signal whose frequency is above 2.4 GHz is referred to as a high-frequency signal. High frequency signals cannot be picked up by human hearing but noises are also difficult to filter or remove. Usually a casing and some form of shielding on the casing are employed to isolate the interference, or a ground terminal is added besides the signal terminals so as to reduce high-frequency signal noise.
As shown in
These existing isolation structures have the following disadvantages.
First of all, the requirement of having a casing limits the further miniaturization of the form factors of the electronic appliances.
Secondly, a single ground terminal 5 has limited isolation effect and noises still require further reduction.
Thirdly, for a multi-layered substrate, the isolation effect of a single ground terminal is even weaker.
In order to achieve enhanced interference isolation, the present invention teaches a novel design where shielding is directly applied to the signal source inside an electronic appliance.
A major objective of the present invention is to provide at least two isolation terminals between adjacent signal transmission conductor sets. No matter how the signal transmission conductor sets are arranged, there are always two isolation terminals in between the signal transmission conductor sets.
To achieve the objective, between adjacent signal transmission conductor sets of a substrate, at least two vias through the substrate are embedded with conductive pillars, respectively. Each conductive pillar penetrates the dielectric layers of the substrate from a top side to a bottom side of the substrate. Each via with the embedded conductive pillar functions as an isolation terminal perpendicular to the signal transmission conductor sets. The signal transmission conductor sets are as such segregated by the isolation terminals and the isolation terminals provides two layers of shielding.
With the present invention, there is no requirement of having a casing and the miniaturization of form factors of the electronic appliances is not compromised. The dual isolation terminals significantly suppress the strength and influence of interference produced by a signal transmission conductor. For a multi-layered (more than three layers) substrate, the present invention can include an additional isolation layer between adjacent isolation terminals so as to further enhance the isolation effect.
The foregoing objectives and summary provide only a brief introduction to the present invention. To fully appreciate these and other objects of the present invention as well as the invention itself, all of which will become apparent to those skilled in the art, the following detailed description of the invention and the claims should be read in conjunction with the accompanying drawings. Throughout the specification and drawings identical reference numerals refer to identical or similar parts.
Many other advantages and features of the present invention will become apparent to those versed in the art upon making reference to the detailed description and the accompanying sheets of drawings in which a preferred structural embodiment incorporating the principles of the present invention is shown by way of illustrative example.
The following descriptions are exemplary embodiments only, and are not intended to limit the scope, applicability or configuration of the invention in any way. Rather, the following description provides a convenient illustration for implementing exemplary embodiments of the invention. Various changes to the described embodiments may be made in the function and arrangement of the elements described without departing from the scope of the invention as set forth in the appended claims.
In addition, as described above, the signal transmission conductor sets can be arranged in various ways such as in parallel, in an array, in a vertical stack in the substrate, as long as there are at least two isolation terminals between adjacent signal transmission conductor sets.
The advantages of the present invention therefore are as follows.
First of all, there is no requirement of having a casing and the miniaturization of form factors of the electronic appliances is not compromised.
Secondly, dual isolation terminals 3 significantly suppress the strength and influence of interference produced by a signal transmission conductor.
Thirdly, for a multi-layered (more than three layers) substrate, the inclusion of an additional isolation layer 31a further enhances the isolation effect.
While certain novel features of this invention have been shown and described and are pointed out in the annexed claim, it is not intended to be limited to the details above, since it will be understood that various omissions, modifications, substitutions and changes in the forms and details of the device illustrated and in its operation can be made by those skilled in the art without departing in any way from the spirit of the present invention.
