This application is based upon and claims the benefit of priority from Japanese patent application No. 2023-176547, filed on Oct. 12, 2023, the disclosure of which is incorporated herein in its entirety by reference.
The present disclosure relates to a high-frequency switch circuit.
The high-frequency switch circuit disclosed in Japanese Unexamined Patent Application Publication No. 2016-10045 includes a first transmission line, a first transistor, a second transistor, and a second transmission line. One end of the first transmission line is connected to a first terminal, and when a first high-frequency signal to be transmitted is input, the line length becomes an integral multiple of ¼ of a wavelength of the first high-frequency signal. One end of the first transistor is connected to the other end of the first transmission line, the other end thereof is connected to the second terminal, and a first control signal is input to a control terminal thereof. One end of the second transistor is connected to the second terminal, and a second control signal is input to a control terminal thereof. One end of the second transmission line is connected to the other end of the second transistor, and the other end thereof is connected to the third terminal, and when a second high-frequency signal to be transmitted is input, the line length becomes an integral multiple of ¼ of a wavelength of the second high-frequency signal.
However, regarding the high-frequency switch circuit disclosed in Japanese Unexamined Patent Application Publication No. 2016-10045, in recent years it has been observed that a problem occurs; namely, the frequency of a signal handled by an electric circuit tends to increase, and hence a sufficient isolation cannot be obtained.
The present disclosure has been made to solve the above-described problem and an object thereof is to improve isolation characteristics of a high-frequency switch in a cut-off state.
A high-frequency switch circuit according to the present disclosure includes: an input terminal; an output terminal; a first switch connected between the input terminal and the output terminal; a first transmission line, one end of the first transmission line being connected to the input terminal and an input-side terminal of the first switch; a second transmission line, one end of the second transmission line being connected to the output terminal and an output-side terminal of the first switch; and a second switch connected between another end of the first transmission line and another end of the second transmission line, the second switch being controlled so that a conduction state and a cut-off state are exclusive to the first switch.
The above and other aspects, features and advantages of the present disclosure will become more apparent from the following description of certain example embodiments when taken in conjunction with the accompanying drawings, in which:
Example embodiments will be described hereinafter with reference to the drawings. For the clarification of the description, the following descriptions and the drawings are partially omitted and simplified as appropriate. Further, the same elements are denoted by the same reference numerals or symbols throughout the drawings, and redundant descriptions are omitted as necessary. Further, although descriptions will be given with reference to the drawings, the drawings used to illustrate a certain example embodiment are not applicable only to the certain example embodiment. Each of the drawings may be applied to all of the example embodiments.
A microstrip line, a strip line, a coplanar line, a coaxial line, or the like may be used as both the first transmission line and the second transmission line, and a description will be given below of an example of a case in which a microstrip line is used for them.
The switch 11 is connected between the input terminal P1 and the output terminal P2. One end of the microstrip line 13 is connected to the input terminal P1 and the input-side terminal of the switch 11. One end of the microstrip line 14 is connected to the output terminal P2 and the output-side terminal of the switch 11. The switch 12 is a switch controlled so that a conduction state and a cut-off state are exclusive to the first switch. Further, the switch 12 is connected between the other end of the microstrip line 13 and the other end of the microstrip line 14.
Further, a description will be given below of an example of a case in which Field Effect Transistor (FET) transistors are used as the switches 11 and 12. However, a PIN diode, a Microelectromechanical System (MEMS), a GaAs pHEMT, a bulk CMOS, a Silicon on Insulator (SOI), a Silicon on Sapphire (SOS), or the like may be used for the switches 11 and 12. Note that elements that can be used as the switches 11 and 12 may be any elements that can be used as these switches at a high frequency (a microwave, a millimeter wave), and are not limited to particular elements.
Note that, in the high-frequency switch circuit 1, the switch 11 is controlled so that it is in a cut-off state when the high-frequency switch circuit 1 is in a switch-on state (“when the switch is ON” in
An equivalent circuit diagram of the high-frequency switch circuit 1 according to the disclosure is shown in
Further, in the high-frequency switch circuit 1 according to the present disclosure, each of the microstrip lines 13 and 14 is formed so as to have a length of ¼ of a wavelength of a used frequency, or a length obtained by adding a length of ¼ of a wavelength of a used frequency to a length of an integral multiple of ½ of a wavelength of the used frequency. An isolation characteristic between the input terminal and the output terminal when the switch 11 is in a conduction state and the switch 12 is in a cut-off state (i.e., when the switch is off) is maximized at frequencies corresponding to the respective lengths of the microstrip lines 13 and 14. Note that although the characteristic impedance (Z0) of the transmission line is basically 50Ω, it can be changed in accordance with the connection circuits before and after the transmission line in order to optimize the insertion loss. Further, the length of the microstrip line may be an electric length.
In the high-frequency switch circuit 1 according to the present disclosure, when the switch circuit is switched on, a signal is transmitted from the input terminal P1 to the output terminal P2 through the microstrip line 13, the switch 12, and the microstrip line 14 in this order. Meanwhile, in the high-frequency switch circuit 1 according to the present disclosure, when the switch circuit is switched off, the switch 12 functions as a capacitor, so that the microstrip lines 13 and 14 function as open stubs to increase the isolation between the input terminal P1 and the output terminal P2.
In order to explain the characteristics of the high-frequency switch circuit 1 according to the present disclosure, a high-frequency switch circuit similar to the high-frequency switch circuit disclosed in Japanese Unexamined Patent Application Publication No. 2016-10045 as a comparative example will be described as a high-frequency switch circuit 100 according to the comparative example.
As shown in
Next, the characteristics of the high-frequency switch circuit 1 according to the present disclosure will be described with reference to
When
An example of a specific circuit of the high-frequency switch circuit 1 according to the present disclosure will be described below.
As described above, in the high-frequency switch circuit 1 according to the present disclosure, by providing transmission lines that serve as stubs before and after the switch 11 and connecting the other ends of the transmission lines to the switch 12, it is possible to both reduce the insertion loss and achieve high isolation characteristics.
While the present disclosure has been particularly shown and described with reference to example embodiments thereof, the present disclosure is not limited to these example embodiments. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the claims. And each example embodiment can be appropriately combined with at least one of example embodiments.
Each of the drawings or figures is merely an example to illustrate one or more example embodiments. Each figure may not be associated with only one particular example embodiment, but may be associated with one or more other example embodiments. As those of ordinary skill in the art will understand, various features or steps described with reference to any one of the figures can be combined with features or steps illustrated in one or more other figures, for example, to produce example embodiments that are not explicitly illustrated or described. Not all of the features or steps illustrated in any one of the figures to describe an example embodiment are necessarily essential, and some features or steps may be omitted. The order of the steps described in any of the figures may be changed as appropriate.
The whole or part of the example embodiments disclosed above can be described as, but not limited to, the following supplementary notes.
A high-frequency switch circuit comprising:
The high-frequency switch circuit according to supplementary note 1, wherein each of the first transmission line and the second transmission line is formed so as to have a length of ¼ of a wavelength of a used frequency, or a length obtained by adding a length of ¼ of a wavelength of a used frequency to a length of an integral multiple of ½ of a wavelength of the used frequency.
The high-frequency switch circuit according to supplementary note 1 or 2, wherein an isolation characteristic between the input terminal and the output terminal when the first switch is in a conduction state and the second switch is in a cut-off state is maximized at frequencies corresponding to the respective lengths of the first and the second transmission lines.
The high-frequency switch circuit according to any one of supplementary notes 1 to 3, wherein each of the first switch and the second switch is formed of one of a Field Effect Transistor (FET) transistor, a PIN diode, a Microelectromechanical System (MEMS), a GaAs pHEMT, a bulk CMOS, a Silicon on Insulator (SOI), and a Silicon on Sapphire (SOS).
The high-frequency switch circuit according to any one of supplementary notes 1 to 4, wherein
According to the present disclosure, it is possible to improve isolation characteristics of a high-frequency switch in a cut-off state.
Number | Date | Country | Kind |
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2023-176547 | Oct 2023 | JP | national |