Claims
- 1. A relay system comprising a relay operable at the low power levels used in energizing integrated circuits having an insulating base, stationary contact means mounted on said base, movable contact means mounted on said base for movement between a closed circuit position engaging said stationary contact means and an open circuit position spaced from said stationary contact means, spring means mounted on said base biasing said movable contact means from one of said positions to the other of said positions, and a metal wire secured between said movable contact means and said base, said wire being of a selected nickel-titanium alloy to be deformed from an original length to a second length by said spring bias as said movable contact means is moved from said one position to said other position by said spring bias while said alloy displays a relatively low modulus of elasticity below a transition temperature and to abruptly return to said original length and to display a relatively higher modulus of elasticity to move said movable contact means back to said one position against said spring bias with a force of at least about 15 grams when said wire is heated to said transition temperature, said wire having a selected cross-sectional size corresponding to a diameter of less than about 0.004 inches and a selected length to be heated from room temperature to said transition temperature by passing electrical current through said wire with a power input of less than about 2 watts for permitting operation of said relay with a gain of at least about 500 to 1 at power levels used in energizing integrated circuits; integrated circuit means energizable at low power levels to supply a control pulse; a power source for energizing said integrated circuit means to supply said control pulse; transistor switch means connected in series with said relay wire to direct relay energizing current from said power source through said nickel-titanium wire when said transistor switch means is rendered conductive, said transistor switch means being connected to said integrated circuit means for receiving said control pulse to selectively render said transistor switch means conductive for operating said relay.
- 2. A relay system as set forth in claim 1 wherein said transistor switch means is connected in series between said relay wire and said integrated circuit means.
- 3. A relay system as set forth in claim 1 wherein said transistor switch means is connected in series between said relay wire and said power source.
- 4. A relay system as set forth in claim 1 wherein capacitor means are arranged to receive charging current from said power source in said transistor switch means is connected in series between said capacitor means and said relay wire for selectively discharging said capacitor means through said relay wire when said transistor switch means is rendered conductive.
- 5. A relay system as set forth in claim 4 wherein said capacitor means is arranged to be charged directly from said power source.
- 6. A relay system as set forth in claim 1 having said capacitor means arranged to be charged from said intergrated circuit means.
- 7. A relay system as set forth in claim 1 wherein said power source comprises a d.c. power source and wherein an inductance coil means is disposed in series with said transistor switch means between said relay wire and said power source, said control pulse applied to said transistor switch means being adapted to render said transistor switch means conductive intermittently for effectively matching the impedance of said power source and said relay wire.
- 8. A relay system comprising a relay operable at the low power levels used in energizing integrated circuits, said relay having an electrically insulating base, a pair of stationary contact means mounted on said base, movable contact means movable between a position engaging one of said stationary contacts and a position engaging the other of said stationary contacts, means releasably latching said movable contact means in either of said positions, a pair of wires of a selected nickel-titanium alloy secured between said base and said movable contact means, each of said wires being adapted to be deformed from an original length to a greater length as said movable contact means is moved from one of said positions to the other of said positions by the other wire while said alloy displays a relatively low modulus of elasticity below a transition temperature and to abruptly return to said original length and to display a relatively higher modulus of elasticity to return said movable contact means to said one position with a force of at least about 15 grams when said wire is heated to said transition temperature, each of said wires having a selected cross-sectional size corresponding to a diameter of less than about 0.004 inches and a selected length to be heated from room temperature to said transition temperature by passing electrical current through said wire with a power input of less than about 2 watts for permitting operation of said relay with a gain of at least about 500 to 1 at power levels used in energizing integrated circuits; integrated circuit means energizable at low power levels to alternatively supply a pair of control pulses; a power source for energizing said integrated circuit means to alternately supply said pair of control pulses; a pair of capacitors arranged to be charged from said integrated circuit means; and a pair of transistors connected in series between respective capacitors and said respective relay wires for discharging said capacitors through said wires when said transitors are rendered conductive, said transistors being connected to said integrated circuit means for receiving respective control pulses for operating said relay.
- 9. A relay system comprising a relay operable at the low power levels used in energizing integrated circuits having an insulating base, stationary contact means mounted on said base, movable contact means mounted on said base for movement between a closed circuit position engaging said stationary contact means and an open circuit position spaced from said stationary contact means, spring means mounted on said base biasing said movable contact means from one of said positions to the other of said positions, and a metal wire secured between said movable contact means and said base, said wire being of a selected nickel-titanium alloy to be deformed from an original length to a second length by said spring bias as said movable contact means is moved from said one position to said other position by said spring bias while said alloy displays a relatively low modulus of elasticity below a transition temperature and to abruptly return to said original length and to display a relatively higher modulus of elasticity to move said movable contact means back to said one position against said spring bias with a force of at least about 15 grams when said wire is heated to said transition temperature, said wire having a selected cross-sectional size corresponding to a diameter of less than about 0.004 inches and a selected length to be heated from room temperature to said transition temperature by passing electrical current through said wire with a power input of less than about 2 watts for permitting operation of said relay with a gain of at least about 500 to 1 at power levels used in energizing integrated circuits; integrated circuit means energizable at low power levels to supply a control pulse; a first alternating current power source; a gated semiconductive device connecting said first power source to said relay wire for directing relay energizing current from said first power source through said relay wire when said semiconductive device is rendered conductive; a second alternating current power source for energizing said integrated circuit means to supply said control pulse, said second power source being synchronous with said first power source; and means for applying said control pulse to said semiconductive device for rendering said device conductive during a selected part of each alternating current cycle for said power sources for matching the impedance of said first power source to said relay wire.
- 10. A relay system as set forth in claim 9 wherein said semiconductive device comprises an SCR.
- 11. A relay system as set forth in claim 9 wherein said semiconductive device comprises a triac.
Parent Case Info
This is a division of application Ser. No. 351,683, filed Apr. 16, 1973, now U.S. Pat. No. 3,893,055.
US Referenced Citations (8)
Divisions (1)
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Number |
Date |
Country |
Parent |
351683 |
Apr 1973 |
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