This application claims all benefits accruing under 35 U.S.C. §119 from China Patent Application No. 200910110162.X, filed on Oct. 30, 2009 in the China Intellectual Property Office, the disclosure of which is incorporated herein by reference.
1. Technical Field
The present disclosure relates to a high-impedance line and a detecting system having the same.
2. Description of Related Art
Generally, a high-impedance line configured for shielding high frequency signals includes two high-impedance transmission lines parallel to each other. The high-impedance transmission lines are formed by spraying several high impedance materials such as ferrite and silicon repeatedly. Thus, a cost of the high-impedance line is increased.
What is needed therefore, is a high-impedance line with low cost.
Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Referring to
Referring to
Referring to
The first upper and lower portions 111a and 111b and the first connective portions 112 can include a conductive material such as metal, conductive polymers, metallic carbon nanotubes, and indium tin oxide (ITO). In one embodiment, the conductive material is a metallic material such as gold, silver, copper. The first upper and lower portions 111a and 111b and the first connective portions 112 can have a strip shape, rod shape, bar shape, wire shape, or yarn shape. For example, the first upper and lower portions 111a and 111b and the first connective portions 112 can be metal wires, or metal strips. The first upper and lower portions 111a and 111b and the first connective portions 112 can also be metal strip shaped films or layers printed on the circuit board 20. The first upper and lower portions 111a and 111b and the first connective portions 112 can be formed by means of screen printing or spraying. A length of each of the first upper and lower portions 111a and 111b can be less than or equal to 10 millimeters. A diameter or a thickness of each of the first upper and lower portions 111a and 111b can be less than or equal to 0.2 millimeters. A resistance of each of the first resistance units 113 can be greater than or equal to 500 ohms. In one embodiment, the resistance of each of the first resistance units 113 is greater than or equal to 1000 ohms.
The second transmission line 12 can have the same structure, shape, material and size as the first transmission line 11. The second transmission 12 can include a plurality of second upper and lower portions 121a and 121b, a plurality of second connective portions 122, and a plurality of second resistance units 123. A second connective portion 122 or a second resistance unit 123 can electrically connect two adjacent second upper and lower portion 121a and 121b to each other. Referring to
Each of the windings 13 can include one first upper portion 111a and one second lower portion 121b parallel to the first upper portion 111a, or include one first lower portion 111b and one second upper portion 121a. A distance between the first upper portion 111a and the second lower portion 121b corresponding to the same winding 13 can be less than or equal to 2 millimeters. A distance between the first lower portion 111b and the second upper portion 121a corresponding to the same winding 13 can be less than or equal to 2 millimeters. In one embodiment, the distance between the first upper portion 111a and the second lower portion 121b is less than or equal to 0.2 millimeters, and the distance between the first lower portion 111b and the second upper portion 121a is less than or equal to 0.2 millimeters. The first resistance units 113 and the second resistance units 123 can be disposed between the windings 13. A number of the first resistance units 113 can be equal to a number of the second resistance units 123; thus, a resistance of the first transmission line 11 can be equal to a resistance of the second transmission line 12. In one embodiment, the first resistance units 113 and the second resistance units 123 are alternately disposed between windings 13. A resistance of each of the windings 13 can be substantially equal to each other to ensure each of the windings 13 can have a determined resistance.
When the high-impedance line 10 is in operation and receives a radio frequency signal (RF signal), the high-impedance line 10 defines a distributed inductance and a distributed capacitance therein. The distributed inductance can be formed among the first upper and lower portions 111a and 111b and the second upper and lower portions 121a and 121b. The distributed capacitance can be formed between the first upper portions 111a, and the second lower portions 121b, or formed between the first lower portions 111b and the second upper portions 121a.
An equivalent circuit diagram of the distributed inductance, and the first upper and lower portions 111a and 111b and the second upper and lower portions 121a, 121b can be shown in
An equivalent circuit diagram of the distributed capacitance, and the first upper portions 111a and the second lower portions 121b can be shown in
Thus, the greater the frequency ω of the RF signals, the less the reactance Z formed by the distributed capacitance, and the greater the impedance of the high-impedance line 10.
An equivalent circuit diagram of the high-impedance line 10 can be shown in
The circuit board 20 can be configured for fixing the high-impedance line 10. The first upper and lower portions 111a and 111b, the second upper and lower portions 121a and 121b and the first and second connective portions 121 and 122 can be fixed on the circuit board 20 by means of printing or welding. The first and second resistance units 113 and 123 can be fixed on the circuit board 20 by means of welding or adhering. The circuit board 20 can be a panel or a printed circuit board (PCB). In one embodiment, the circuit board 20 is the PCB. The PCB can provide electrical connection among the high-impedance line 100 and other electrical elements such as the signal detecting device 30, and the signal processing device 40.
The signal detecting device 30 can be configured for detecting RF signals and inputting the RF signals to the high-impedance line 10. The high-impedance line 10 can converted the RF signals to signal envelops. The signal detecting device 30 can be a Hearing Aid Compatibility (HAC) probe or a detecting device detecting RF signals.
The signal processing device 40 can be configured for receiving signal envelopes converted by the high-impedance line 10. The signal processing device 40 can be an Analog-digital converter (ADC), a central processing unit (CPU) or other data-processing equipment.
Finally, it is to be understood that the above-described embodiments are intended to illustrate rather than limit the disclosure. Variations may be made to the embodiments without departing from the spirit of the disclosure as claimed. Elements associated with any of the above embodiments are envisioned to be associated with any other embodiments. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure.
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