High performance card edge connector for high bandwidth transmission

Information

  • Patent Grant
  • 12300920
  • Patent Number
    12,300,920
  • Date Filed
    Tuesday, July 12, 2022
    2 years ago
  • Date Issued
    Tuesday, May 13, 2025
    10 days ago
Abstract
A card edge connector for high bandwidth transmission. The connector may include a housing having a groove between two walls. The walls may include slots holding terminals of the connector. The terminals of the connector may each include a mating contact portion, a mounting contact portion opposite the mating contact portion, a bearing portion extending from the mounting contact portion and fixed in the housing, and a beam extending from the bearing portion. The beams may be configured to flex when the mating contact portions make contact with pads on a card. The terminals may each include a curved transition portion between the mating contact portion and the beam so as to prevent the beam from touching the card. The housing may include holes through the walls between mating contact portions of selected adjacent terminals. Such a configuration reduces impedance mismatch at the mating interface and therefore improve signal integrity.
Description
RELATED APPLICATIONS

This application claims priority to and the benefit of Chinese Patent Application Serial No. 202121908685.1, filed on Aug. 13, 2021, entitled “HIGH PERFORMANCE CARD EDGE CONNECTOR FOR HIGH-BANDWIDTH TRANSMISSION.” The entire content of this application is incorporated herein by reference in its entirety.


TECHNICAL FIELD

The present disclosure relates to connectors, and in particular to a high performance card edge connector for high bandwidth transmission.


BACKGROUND

Electrical connectors are used in many ways within electronic systems and to connect different electronic systems together. For example, printed circuit boards (PCBs) can be electrically coupled using one or more electrical connectors, allowing individual PCBs to be manufactured for particular purposes and electrically coupled with a connector to form a desired system rather than manufacturing the entire system as a single assembly. One type of electrical connector is an “edge connector,” which is a type of female connector that interfaces directly with conductive traces on or near the edge of a PCB without the need for a separate male connector because the PCB itself acts as the male connector that interfaces with the edge connector. In addition to providing electrical connections between a PCB and another electronic system, some edge connector may also provide mechanical support for the inserted PCB such that the PCB is held in a substantially immovable position relative to the other electronic system.


Some electrical connectors utilize differential signaling to transmit a signal from a first electronic system to a second electronic system. Specifically, a pair of conductors is used to transmit a signal. One conductor of the pair is driven with a first voltage and the other conductor is driven with a voltage complementary to the first voltage. The difference in voltage between the two conductors represents the signal. An electrical connector may include multiple pairs of conductors to transmit multiple signals. To control the impedance of these conductors and to reduce crosstalk between the signals, ground conductors may be included adjacent each pair of conductors.


As electronic systems have become smaller, faster and functionally more complex, both the number of circuits in a given area and the operational frequencies have increased. Consequently, the electrical connectors used to interconnect these electronic systems are required to handle the transfer of data at higher speeds without significantly distorting the data signals (via, e.g., cross-talk and/or interference) using electrical contacts that have a high density (e.g., a pitch less than 1 mm, where the pitch is the distance between adjacent electrical contacts within an electrical connector).


BRIEF SUMMARY

The present disclosure provides a high performance card edge connector for high bandwidth transmission.


Some embodiments relate to an electrical connector. The electrical connector may include a plurality of conductive elements each comprising a mating contact portion, a mounting contact portion opposite the mating contact portion, and an intermediate portion between the mating contact portion and the mounting contact portion, the plurality of conductive elements comprising a plurality of differential pairs of conductive elements; and an insulative housing holding the plurality of conductive elements, the insulative housing comprising a plurality of holes extending through the insulative housing, with holes of the plurality of holes disposed between the conductive elements of respective pairs of the plurality of differential pairs of conductive elements.


In some embodiments, the insulative housing may comprise a plurality of slots each holding a conductive element of the plurality of conductive elements. The plurality of holes may connect adjacent slots of the plurality of slots.


In some embodiments, the plurality of holes may be disposed between the mating contact portions of the conductive elements of respective pairs.


In some embodiments, the insulative housing may comprise a first portion, a second portion, and a separator between the first portion and the second portion. The second portion of the insulative housing may comprise the plurality of holes.


In some embodiments, the first portion of the insulative housing may comprise a first bottom portion that separates slots of the plurality of slots in the first portion of the insulative housing. The second portion of the insulative housing may comprise a second bottom portion that separates slots of the plurality of slots in the second portion of the insulative housing. The electrical connector may comprise a member comprising a bar adjacent the bottom of the second portion and a plurality of ribs disposed into selected slots of the slots of the plurality of slots in the second portion of the insulative housing.


In some embodiments, the plurality of holes may each extend through the insulative housing in a first direction. The plurality of slots may each extend through the insulative housing in a second direction perpendicular to the first direction.


In some embodiments, the intermediate portions of the plurality of conductive elements may each comprise a beam, a bearing portion between the beam and the mounting contact portion and fixed in the insulative housing, and a transition portion between the mating contact portion and the beam, the transition portion curved away from the mating contact portion.


In some embodiments, the mounting contact portions of the plurality of conductive elements may be L-shaped.


In some embodiments, the plurality of conductive elements may each comprise a tip extending from a respective mating contact portion and being thinner than the respective mating contact portions.


Some embodiments relate to an electrical connector. The electrical connector may include an insulative housing; and a plurality of conductive elements held by the insulative housing, the plurality of conductive elements each comprising a mating contact portion, a mounting contact portion opposite the mating contact portion, a beam, a bearing portion between the beam and the mounting contact portion and fixed in the insulative housing, and a transition portion between the mating contact portion and the beam. The transition portions may be curved such that gaps exist between a mating board and the beams of the plurality of conductive elements and the beams of the plurality of conductive elements are in parallel with a surface of the mating board.


In some embodiments, the plurality of conductive elements may each comprise a tip extending from a respective mating contact portion and being thinner than the respective mating contact portions.


In some embodiments, for each of the plurality of conductive elements, the bearing portion may comprise a plurality of barbs in the insulative housing such that the bearing portion is fixed in the insulative housing and the tip is thinner than the respective mating contact portion.


In some embodiments, the plurality of conductive elements may comprise a plurality of differential pairs of signal conductive elements and a plurality of reference conductive elements disposed between the differential pairs. The plurality of conductive elements may be identical.


In some embodiments, for each of the plurality of conductive elements, the mating contact portion may be narrower than the beam.


In some embodiments, for each of the plurality of conductive elements, the mounting contact portion may be narrower than the bearing portion.


In some embodiments, the plurality of conductive elements may comprise a plurality of differential pairs of conductive elements. The insulative housing may comprise a plurality of holes extending therethrough. The plurality of holes may be disposed between the conductive elements of respective pairs of the plurality of differential pairs of conductive elements.


In some embodiments, the insulative housing may comprise a plurality of slots each holding a conductive element of the plurality of conductive elements. The plurality of slots may extend through the insulative housing. The insulative housing may comprise a bottom portion that separates the plurality of slots from each other. The electrical connector may comprise a member comprising a bar adjacent the bottom portion of the insulative housing and a plurality of ribs extending from the bar to selected slots of the plurality of slots of the insulative housing.


Some embodiments relate to an electrical connector. The electrical connector may include a plurality of conductive elements each comprising a mating contact portion, a mounting contact portion opposite the mating contact portion, a beam, and a bearing portion between the beam and the mounting contact portion and fixed in the insulative housing; an insulative housing comprising a plurality of slots each holding a conductive element of the plurality of conductive elements; and a member attached to the insulative housing, the member comprising a bar and a plurality of ribs extending perpendicular to the bar and into selected slots of the plurality of slots, the plurality of ribs contacting the bearing portions of the conductive elements in the selected slots of the plurality of slots, wherein the member is at least partially conductive.


In some embodiments, the insulative housing may comprise a first portion and a second portion separated from each other by a separator. The member may be attached to the second portion of the insulative housing.


In some embodiments, the first portion of the insulative housing may have a first bottom portion. The second portion of the insulative housing may have a second bottom portion. The member may be attached to the second bottom portion and may be flush with the first bottom portion.


Some embodiments relate to a high performance card edge connector for high bandwidth transmission. The connector may include a housing formed with a bar-shaped groove that opens at an upper end thereof, wherein several slots for placing terminals are formed in opposing walls of the housing with lower ends of the slots extending through a lower end of the housing; an end of each terminal may be formed with an arc-shaped contact face and protrude toward the groove; a lower end of each of the terminals may be formed with an L-shaped mounting contact portion extending out of the lower end of the housing; and several air holes may be formed in the opposing walls of the housing.


In some embodiments, a bar may be inserted from a lower end of the housing, several ribs may be provided on both sides of the bar, the ribs may be pressed against surfaces of the terminals.


In some embodiments, a retention edge may be formed at upper ends of the slots, and the upper end of each terminal may be disposed between the retention edge and the respective slot.


In some embodiments, the end of each terminal may comprise a trapezoidal tip structure.


In some embodiments, a positioning post may be provided on the lower surface of the housing at opposite ends.


In some embodiments, a fixing lug may be provided at each of the opposite ends of the housing, a T-shaped slot may be provided at a side of each fixing lug, and a fixing piece may be inserted into each T-shaped slot.


In some embodiments, the fixing piece may be of an L-shaped structure, and a lower end of the fixing piece may comprise a through hole.


In some embodiments, several air holes may be uniformly arranged along a length direction of the housing, and the height of each air hole may correspond to the height of the contact faces of the terminals.


These techniques may be used alone or in any suitable combination. The foregoing summary is provided by way of illustration and is not intended to be limiting.





BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings are not intended to be drawn to scale. In the drawings, identical or nearly identical components that are illustrated in various figures may be represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:



FIG. 1A is a top perspective view of a card edge connector, according to some embodiments.



FIG. 1B is a bottom perspective view of the card edge connector of FIG. 1A.



FIG. 2A is an exploded view of the card edge connector of FIG. 1A.



FIG. 2B is a partially exploded view of the card edge connector of FIG. 1B.



FIG. 3 is a cross-sectional view of the card edge connector of FIG. 1A along the line marked “a-a” in FIG. 1A.



FIG. 4A is an electrical system comprising the card edge connector of FIG. 1A, according to some embodiments.



FIG. 4B is an exploded view of the electrical system of FIG. 4A.



FIG. 5A is a front perspective view of a terminal of the card edge connector of FIG. 1A, according to some embodiments.



FIG. 5B is a side perspective view of the terminal of FIG. 5A in a free state, according to some embodiments.



FIG. 5C is a side perspective view the terminal of FIG. 5A in a mated state, according to some embodiments.



FIG. 6 is a schematic illustrating a simulation result of a differential impedance along a path from a contact pad of a printed circuit board to a terminal of the connector of FIG. 1A, compared with a simulation result of a differential impedance along a similar path for an existing connector.





DETAILED DESCRIPTION

The inventors have recognized and appreciated connector design techniques that satisfy electrical and mechanical requirements to support greater bandwidth while providing flexibility to be compatible with earlier industrial standards. The inventors have recognized and appreciated that the impedance of a conventional connector may be disrupted at a mating interface where the connector's terminals mate with complementary electrical components. The inventors have recognized and appreciated that the disruption to a connector's impedance may be reduced by introducing, at selected locations adjacent the mating interface, a material having a suitable dielectric constant value. Such a configuration may reduce impedance mismatch at the mating interface and therefore improve signal integrity. The inventors have also recognized and appreciated that thinning tips of the terminal may enable shortening the tips and therefore reduce stubs caused by the tips, which improves connector signal integrity. The inventors have further recognized that having a removable lossy member configured to electrically connect selected terminals enables the connector to support greater bandwidth. These techniques, used alone or in any suitable combination, also enable the connector to mate with and provide electrical connection for electrical components manufactured according to earlier industrial standards.


An electrical connector may have terminals held by a housing. The housing may include two walls extending along a longitudinal direction, and a groove between the two walls and configured to receive a printed circuit board such as a daughter card. The walls may include slots facing the groove and extending in a transverse direction perpendicular to the longitudinal direction. The slots may each hold a terminal. The housing may include a bottom portion that may separate the slots from each other so as to provide isolation among the terminals in the slots. The housing may include a retention edge having protrusions projecting into the slots and configured to support tips of the terminals so as to preload the terminals.


The terminals may each have a mating contact portion curving into the groove and configured for contacting pads on the card inserted in the groove. Each terminal may have a tip extending from the mating contact portion and resting on a respective protrusion of the housing. Each terminal may have a mounting contact portion opposite the mating contact portion and configured for mounting the connector to another electrical component, such as a mother board. Each terminal may also have a bearing portion extending from the mounting contact portion and fixed in the housing, and a beam extending from the bearing portion. The beam may be configured to flex when the mating contact portion contacts a pad on a card. Each terminal may also have a curved transition portion between the mating contact portion and the beam, which may create a gap between the beam and the card inserted in the groove and enable the beams of the plurality of conductive elements to be in parallel with a surface of the mating board. This configuration prevents the beam from touching the card.


A material different from the housing material may be introduced at selected locations adjacent the mating interface. In some embodiments, the housing may include holes extending through the walls in a lateral direction perpendicular to the longitudinal direction and the transverse direction. The holes may be disposed between mating contact portions of selected adjacent terminals such as signal terminals. Since air has a lower dielectric constant than the housing material, such a configuration may reduce impedance mismatch at the mating interface and therefore improve signal integrity. In some embodiments, the holes may be filled with a material having a desired dielectric constant.


A member may be removably attached to the bottom portion of the connector housing. The member may have a bar extending in the longitudinal direction, and ribs extending from the sides of the bar in the transverse direction. The ribs are configured for contacting the bearing portions of terminals selected for reference such that the selected terminals are electrically connected to each other. Such a configuration may reduce crosstalk and improve signal integrity. Depending on the desired application, the member may be removed, and the terminals may be reassigned for different purposes.



FIGS. 1A-2B illustrate a card edge connector 100, according to some embodiments. The card edge connector 100 may include terminals 8 and a housing 5 holding the terminals. The housing 5 may include walls 108 extending along a longitudinal direction (L) and a groove 110 between the walls 108. The groove 110 may receive a mating component such as a daughter card 404 as shown in FIGS. 4A-4B. The groove 110 may be bar-shaped and open at an upper end of the housing 5. Slots 6 may be formed in the opposing walls 108 with lower ends of the slots 6 extending through a bottom portion 112 of the housing 5 and separated from each other by the bottom portion 112. Positioning posts 7 may be provided on the lower surface of the housing 5 at opposite ends, which may facilitate mounting the connector 100 to another electrical component, such as a mother board 402 as shown in FIGS. 4A-4B. Fixing lugs 1 may be provided at opposite ends of the housing 5. Each fixing lug 1 may have a T-shaped slot 9 holding a fixing piece 2 inserted therein. The fixing piece 2 may be L-shaped and has a through hole.


The housing 5 may be separated into multiple portions. In the illustrated example, the housing 5 is separated into a first portion 102 and a second portion 104 by a separator [6] 106. Correspondingly, the bottom portion 112 may be separated into a first bottom portion 114 and a second bottom portion 204. A member 202 may be movably installed to one or more portion of the bottom portion 112 of the housing 5. In the illustrated example, the member is attached to the second bottom portion 204 of the housing 5. The member 202 has a bar 10 extending in the longitudinal direction, and ribs 12 extending from the sides of the bar 10 and in the transverse direction. The bar 10 of the member 202 may be flush with the first bottom portion 114. The ribs 12 may extend into selected ones of the slots 6. The ribs 12 may press against the selected terminals 8, which may secure the terminals 8 in position.


As illustrated, the terminals 8 may be configured the same. Such a configuration enables reconfiguration of the functions of the terminals according to the desired application. For example, when the member 202 is not installed, the terminals 8 may be configured to support earlier standards such as Peripheral Component Interconnect express (PCIe) Card Electromechanical specification (CEM); when the member 202 is installed, the terminals may be configured to support higher bandwidth transmission.


The connector may include holes 3 at selected locations adjacent the mating interface. Since air has a lower dielectric constant than the housing material, such a configuration may reduce impedance mismatch at the mating interface and therefore improve signal integrity. FIG. 6 shows a simulation result 602 of a differential impedance along a path from the contact pad 406 of the card 404 to a terminal 8 of the connector 100, compared with a simulation result 604 of a differential impedance along a similar path for an existing connector. The result 602 shows increased impedance at the mating interface than the result 604 of the existing connector. It should also be appreciated that a different material may be introduced at selected locations adjacent the mating interface. In some embodiments, the holes may be filled with a material having a desired dielectric constant.



FIG. 3 illustrates a cross-sectional view of the card edge connector 100 along the line marked “a-a” in FIG. 1A. FIG. 5A illustrates a front perspective view of a terminal 8 of the card edge connector 100. FIG. 5B and FIG. 5C illustrate side perspective views of the terminal 8 in a free state and a mated state, respectively. As illustrated, the terminals 8 may each have a mating contact portion 304 curving into the groove 110 and configured for contacting pads on the card inserted in the groove (e.g., pads 406 on the card 404). The holes 3 may be disposed between mating contact portions 304 of terminals 8, for example, between a pair of terminals 8 configured for differential signals. As illustrated in FIG. 3, a hole 3 may connect two adjacent slots 6 that may hold the pair of terminals 8.


Each terminal 8 may have a tip 302 extending from the mating contact portion. The housing 5 may include an extension edge 11 having protrusions 312 projecting into respective slots 6. The protrusions 312 may have slanted surfaces, on which the tips of the terminals 8 held in respective slots 6 may rest. The tip 302 may be thinner than the mating contact portion. Thinning the tips 302 of the terminals 8 may enable the tips 302 to rest on the slanted surfaces of the protrusions 312 of the housing 5, without additional portions that extend beyond the slanted surfaces and hook to the straight surfaces of the protrusions like conventional designs. Such a configuration enables the tips 302 of the terminals 8 to be shorter and therefore reduce stubs caused by the tips 302, which improves connector signal integrity.


Each terminal 8 may have a mounting contact portion 4 opposite the mating contact portion 304 and configured for mounting the connector 100 to another electrical component, such as a mother board 402 as shown in FIGS. 4A-4B. The mating contact portion 4 may be L-shaped and extend out of the bottom portion 112 of the housing 5.


Each terminal 8 may have a bearing portion 310 extending from the mounting contact portion. The bearing portion 310 may have barbs 502 extending outwardly from the sides so as to fit in features of the housing 5. The ribs 12 of the member 202 may contact the bearing portions 310 of the terminals 8 held in the selected ones of the slots 6. The member 202 may be made of material that is electrically conductive or lossy such that the selected terminals 8 are electrically coupled through the member 202.


Each terminal 8 may have a beam 308 extending from the bearing portion 310. The beam 308 may be configured to flex when the mating contact portion 340 contacts a pad on a card. Each terminal 8 may also have a transition portion 306 between the mating contact portion 304 and the beam 308. The transition portion 306 may curve away from the groove 110. Such a configuration may create a gap 502 between the beam 308 and the card 404 inserted in the groove 110 and enable the beams 308 to be in parallel with a surface of the card 404. This configuration prevents the beam 308 from touching the card 404.


In some embodiments, a connector housing such as the housing 5 may be dielectric members molded from a dielectric material such as plastic or nylon. Examples of suitable materials include, but are not limited to, liquid crystal polymer (LCP), polyphenyline sulfide (PPS), high temperature nylon or polyphenylenoxide (PPO) or polypropylene (PP). Other suitable materials may be employed, as aspects of the present disclosure are not limited in this regard.


In some embodiments, conductive elements such as terminals 8 may be made of metal or any other material that is conductive and provides suitable mechanical properties for conductive elements in an electrical connector. Phosphor-bronze, beryllium copper and other copper alloys are non-limiting examples of materials that may be used. The conductive elements may be formed from such materials in any suitable way, including by stamping and/or forming.


Materials that dissipate a sufficient portion of the electromagnetic energy interacting with that material to appreciably impact the performance of a connector may be regarded as lossy. A meaningful impact results from attenuation over a frequency range of interest for a connector. In some configurations, lossy material may suppress resonances within ground structures of the connector and the frequency range of interest may include the natural frequency of the resonant structure, without the lossy material in place. In other configurations, the frequency range of interest may be all or part of the operating frequency range of the connector.


For testing whether a material is lossy, the material may be tested over a frequency range that may be smaller than or different from the frequency range of interest of the connector in which the material is used. For example, the test frequency range may extend from 10 GHz to 25 GHz. Alternatively, lossy material may be identified from measurements made at a single frequency, such as 15 GHz.


Loss may result from interaction of an electric field component of electromagnetic energy with the material, in which case the material may be termed electrically lossy. Alternatively or additionally, loss may result from interaction of a magnetic field component of the electromagnetic energy with the material, in which case the material may be termed magnetically lossy.


Electrically lossy materials can be formed from lossy dielectric and/or poorly conductive materials. Electrically lossy material can be formed from material traditionally regarded as dielectric materials, such as those that have an electric loss tangent greater than approximately 0.01, greater than 0.05, or between 0.01 and 0.2 in the frequency range of interest. The “electric loss tangent” is the ratio of the imaginary part to the real part of the complex electrical permittivity of the material.


Electrically lossy materials can also be formed from materials that are generally thought of as conductors, but are relatively poor conductors over the frequency range of interest. These materials may conduct, but with some loss, over the frequency range of interest such that the material conducts more poorly than a conductor of an electrical connector, but better than an insulator used in the connector. Such materials may contain conductive particles or regions that are sufficiently dispersed that they do not provide high conductivity or otherwise are prepared with properties that lead to a relatively weak bulk conductivity compared to a good conductor such as copper over the frequency range of interest. Die cast metals or poorly conductive metal alloys, for example, may provide sufficient loss in some configurations.


Electrically lossy materials of this type typically have a bulk conductivity of about 1 Siemen/meter to about 100,000 Siemens/meter, or about 1 Siemen/meter to about 30,000 Siemens/meter, or 1 Siemen/meter to about 10,000 Siemens/meter. In some embodiments, material with a bulk conductivity of between about 1 Siemens/meter and about 500 Siemens/meter may be used. As a specific example, material with a conductivity between about 50 Siemens/meter and 300 Siemens/meter may be used. However, it should be appreciated that the conductivity of the material may be selected empirically or through electrical simulation using known simulation tools to determine a conductivity that provides suitable signal integrity (SI) characteristics in a connector. The measured or simulated SI characteristics may be, for example, low cross talk in combination with a low signal path attenuation or insertion loss, or a low insertion loss deviation as a function of frequency.


It should also be appreciated that a lossy member need not have uniform properties over its entire volume. A lossy member, for example, may have an insulative skin or a conductive core, for example. A member may be identified as lossy if its properties on average in the regions that interact with electromagnetic energy sufficiently attenuate the electromagnetic energy.


In some embodiments, lossy material is formed by adding to a binder a filler that contains particles. In such an embodiment, a lossy member may be formed by molding or otherwise shaping the binder with filler into a desired form. The lossy material may be molded over and/or through openings in conductors, which may be ground conductors or shields of the connector. Molding lossy material over or through openings in a conductor may ensure intimate contact between the lossy material and the conductor, which may reduce the possibility that the conductor will support a resonance at a frequency of interest. This intimate contact may, but need not, result in an Ohmic contact between the lossy material and the conductor.


Alternatively or additionally, the lossy material may be molded over or injected into insulative material, or vice versa, such as in a two shot molding operation. The lossy material may press against or be positioned sufficiently near a ground conductor that there is appreciable coupling to a ground conductor. Intimate contact is not a requirement for electrical coupling between lossy material and a conductor, as sufficient electrical coupling, such as capacitive coupling, between a lossy member and a conductor may yield the desired result. For example, in some scenarios, 100 pF of coupling between a lossy member and a ground conductor may provide an appreciable impact on the suppression of resonance in the ground conductor. In other examples with frequencies in the range of approximately 10 GHz or higher, a reduction in the amount of electromagnetic energy in a conductor may be provided by sufficient capacitive coupling between a lossy material and the conductor with a mutual capacitance of at least about 0.005 pF, such as in a range between about 0.01 pF to about 100 pF, between about 0.01 pF to about 10 pF, or between about 0.01 pF to about 1 pF. To determine whether lossy material is coupled to a conductor, coupling may be measured at a test frequency, such as 15 GHz or over a test range, such as 10 GHz to 25 GHz.


To form an electrically lossy material, the filler may be conductive particles. Examples of conductive particles that may be used as a filler to form an electrically lossy material include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles. Various forms of fiber, in woven or non-woven form, coated or non-coated may be used. Non-woven carbon fiber is one suitable material. Metal in the form of powder, flakes, fibers or other particles may also be used to provide suitable electrically lossy properties. Alternatively, combinations of fillers may be used. For example, metal plated carbon particles may be used. Silver and nickel are suitable metal plating for fibers. Coated particles may be used alone or in combination with other fillers, such as carbon flake.


Preferably, the fillers will be present in a sufficient volume percentage to allow conducting paths to be created from particle to particle. For example, when metal fiber is used, the fiber may be present in about 3% to 40% by volume. The amount of filler may impact the conducting properties of the material.


The binder or matrix may be any material that will set, cure, or can otherwise be used to position the filler material. In some embodiments, the binder may be a thermoplastic material traditionally used in the manufacture of electrical connectors to facilitate the molding of the electrically lossy material into the desired shapes and locations as part of the manufacture of the electrical connector. Examples of such materials include liquid crystal polymer (LCP) and nylon. However, many alternative forms of binder materials may be used. Curable materials, such as epoxies, may serve as a binder. Alternatively, materials such as thermosetting resins or adhesives may be used.


While the above-described binder materials may be used to create an electrically lossy material by forming a binder around conducting particle fillers, lossy materials may be formed with other binders or in other ways. In some examples, conducting particles may be impregnated into a formed matrix material or may be coated onto a formed matrix material, such as by applying a conductive coating to a plastic component or a metal component. As used herein, the term “binder” encompasses a material that encapsulates the filler, is impregnated with the filler or otherwise serves as a substrate to hold the filler.


Magnetically lossy material can be formed, for example, from materials traditionally regarded as ferromagnetic materials, such as those that have a magnetic loss tangent greater than approximately 0.05 in the frequency range of interest. The “magnetic loss tangent” is the ratio of the imaginary part to the real part of the complex electrical permeability of the material. Materials with higher loss tangents may also be used.


In some embodiments, a magnetically lossy material may be formed of a binder or matrix material filled with particles that provide that layer with magnetically lossy characteristics. The magnetically lossy particles may be in any convenient form, such as flakes or fibers. Ferrites are common magnetically lossy materials. Materials such as magnesium ferrite, nickel ferrite, lithium ferrite, yttrium garnet or aluminum garnet may be used. Ferrites will generally have a loss tangent above 0.1 at the frequency range of interest. Presently preferred ferrite materials have a loss tangent between approximately 0.1 and 1.0 over the frequency range of 1 GHz to 3 GHz and more preferably a magnetic loss tangent above 0.5 over that frequency range.


Practical lossy magnetic materials or mixtures containing lossy magnetic materials may also exhibit useful amounts of dielectric loss or conductive loss effects over portions of the frequency range of interest. Suitable materials may be formed by adding fillers that produce magnetic loss to a binder, similar to the way that electrically lossy materials may be formed, as described above.


It is possible that a material may simultaneously be a lossy dielectric or a lossy conductor and a magnetically lossy material. Such materials may be formed, for example, by using magnetically lossy fillers that are partially conductive or by using a combination of magnetically lossy and electrically lossy fillers.


Lossy portions also may be formed in a number of ways. In some examples the binder material, with fillers, may be molded into a desired shape and then set in that shape. In other examples the binder material may be formed into a sheet or other shape, from which a lossy member of a desired shape may be cut. In some embodiments, a lossy portion may be formed by interleaving layers of lossy and conductive material such as metal foil. These layers may be rigidly attached to one another, such as through the use of epoxy or other adhesive, or may be held together in any other suitable way. The layers may be of the desired shape before being secured to one another or may be stamped or otherwise shaped after they are held together. As a further alternative, lossy portions may be formed by plating plastic or other insulative material with a lossy coating, such as a diffuse metal coating.


Although details of specific configurations of conductive elements and housings are described above, it should be appreciated that such details are provided solely for purposes of illustration, as the concepts disclosed herein are capable of other manners of implementation. In that respect, various connector designs described herein may be used in any suitable combination, as aspects of the present disclosure are not limited to the particular combinations shown in the drawings.


Having thus described several embodiments, it is to be appreciated various alterations, modifications, and improvements may readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be within the spirit and scope of the invention. Accordingly, the foregoing description and drawings are by way of example only.


Furthermore, although many inventive aspects are shown and described with reference to a plug connector having a right angle configuration, a receptacle connector, and card edge connectors, it should be appreciated that aspects of the present disclosure is not limited in this regard, as any of the inventive concepts, whether alone or in combination with one or more other inventive concepts, may be used in other types of electrical connectors, such as backplane connectors, stacking connectors, mezzanine connectors, I/O connectors, chip sockets, etc.


In some embodiments, mounting ends were illustrated as surface mount elements that are designed to fit within pads of printed circuit boards. However, other configurations may also be used, such as press fit “eye of the needle” compliant sections, spring contacts, solderable pins, etc.


All definitions, as defined and used, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.


Numerical values and ranges may be described in the specification and claims as approximate or exact values or ranges. For example, in some cases the terms “about,” “approximately,” and “substantially” may be used in reference to a value. Such references are intended to encompass the referenced value as well as plus and minus reasonable variations of the value.


In the claims, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to. Only the transitional phrases “consisting of” and “consisting essentially of” shall be closed or semi-closed transitional phrases, respectively.


The claims should not be read as limited to the described order or elements unless stated to that effect. It should be understood that various changes in form and detail may be made by one of ordinary skill in the art without departing from the spirit and scope of the appended claims. All embodiments that come within the spirit and scope of the following claims and equivalents thereto are claimed.

Claims
  • 1. An electrical connector, comprising: a plurality of conductive elements each comprising a mating contact portion, a mounting contact portion opposite the mating contact portion, and an intermediate portion between the mating contact portion and the mounting contact portion, the plurality of conductive elements comprising a plurality of differential pairs of conductive elements; andan insulative housing holding the plurality of conductive elements, the insulative housing comprising a plurality of holes extending through the insulative housing, wherein, for each pair of the plurality of differential pairs of conductive elements:a hole of the plurality of holes is disposed between the conductive elements of the pair.
  • 2. The electrical connector of claim 1, wherein: the insulative housing comprises a plurality of slots each holding a conductive element of the plurality of conductive elements, andthe plurality of holes connect adjacent slots of the plurality of slots.
  • 3. The electrical connector of claim 2, wherein: the plurality of holes each extends through the insulative housing in a first direction, andthe plurality of slots each extends through the insulative housing in a second direction perpendicular to the first direction.
  • 4. The electrical connector of claim 1, wherein: the plurality of holes are disposed between the mating contact portions of the conductive elements of respective pairs.
  • 5. The electrical connector of claim 2, wherein: the insulative housing comprises a first portion, a second portion, and a separator between the first portion and the second portion, andthe second portion of the insulative housing comprises the plurality of holes.
  • 6. The electrical connector of claim 5, wherein: the first portion of the insulative housing comprises a first bottom portion that separates slots of the plurality of slots in the first portion of the insulative housing,the second portion of the insulative housing comprises a second bottom portion that separates slots of the plurality of slots in the second portion of the insulative housing,the electrical connector comprises a member comprising a bar adjacent the bottom of the second portion and a plurality of ribs disposed into selected slots of the slots of the plurality of slots in the second portion of the insulative housing.
  • 7. The electrical connector of claim 1, wherein: the intermediate portions of the plurality of conductive elements each comprises a beam, a bearing portion between the beam and the mounting contact portion and fixed in the insulative housing, and a transition portion between the mating contact portion and the beam, the transition portion curved away from the mating contact portion.
  • 8. The electrical connector of claim 1, wherein: the mounting contact portions of the plurality of conductive elements are L-shaped.
  • 9. The electrical connector of claim 1, wherein: the plurality of conductive elements each comprises a tip extending from a respective mating contact portion and being thinner than the respective mating contact portions.
  • 10. An electrical connector, comprising: an insulative housing; anda plurality of conductive elements held by the insulative housing, the plurality of conductive elements each comprising a mating contact portion, a mounting contact portion opposite the mating contact portion, a beam, a bearing portion between the beam and the mounting contact portion and fixed in the insulative housing, and a transition portion between the mating contact portion and the beam,wherein the transition portions are curved such that gaps exist between a mating board and the beams of the plurality of conductive elements and the beams of the plurality of conductive elements are in parallel with a surface of the mating board.
  • 11. The electrical connector of claim 10, wherein: the plurality of conductive elements each comprises a tip extending from a respective mating contact portion and being thinner than the respective mating contact portions.
  • 12. The electrical connector of claim 11, wherein for each of the plurality of conductive elements: the bearing portion comprises a plurality of barbs in the insulative housing such that the bearing portion is fixed in the insulative housing and the tip is thinner than the respective mating contact portion.
  • 13. The electrical connector of claim 10, wherein: the plurality of conductive elements comprise a plurality of differential pairs of signal conductive elements and a plurality of reference conductive elements disposed between the differential pairs, andthe plurality of conductive elements are identical.
  • 14. The electrical connector of claim 10, wherein for each of the plurality of conductive elements: the mating contact portion is narrower than the beam.
  • 15. The electrical connector of claim 10, wherein for each of the plurality of conductive elements: the mounting contact portion is narrower than the bearing portion.
  • 16. The electrical connector of claim 10, wherein: the plurality of conductive elements comprise a plurality of differential pairs of conductive elements,the insulative housing comprises a plurality of holes extending therethrough, andthe plurality of holes are disposed between the conductive elements of respective pairs of the plurality of differential pairs of conductive elements.
  • 17. The electrical connector of claim 10, wherein: the insulative housing comprises a plurality of slots each holding a conductive element of the plurality of conductive elements,the plurality of slots extend through the insulative housing,the insulative housing comprise a bottom portion that separates the plurality of slots from each other, andthe electrical connector comprises a member comprising a bar adjacent the bottom portion of the insulative housing anda plurality of ribs extending from the bar to selected slots of the plurality of slots of the insulative housing.
  • 18. An electrical connector, comprising: a plurality of conductive elements each comprising a mating contact portion, a mounting contact portion opposite the mating contact portion, a beam, and a bearing portion between the beam and the mounting contact portion;an insulative housing comprising a first portion, a second portion, a separator separating the second portion from the first portion, and a plurality of slots each holding a conductive element of the plurality of conductive elements; anda member attached to the second portion of the insulative housing, the member comprising a bar and a plurality of ribs extending perpendicular to the bar and into selected slots of the plurality of slots, the plurality of ribs contacting the bearing portions of the conductive elements in the selected slots of the plurality of slots, wherein the member is at least partially conductive,wherein the bearing portion is fixed in the insulative housing.
  • 19. The electrical connector of claim 18, wherein: the plurality of conductive elements comprise a plurality of differential pairs of conductive elements;the insulative housing comprise a plurality of holes, andfor each pair of the plurality of differential pairs of conductive elements, a hole of the plurality of holes is disposed between the conductive elements of the pair.
  • 20. The electrical connector of claim 18, wherein: the first portion of the insulative housing has a first bottom portion,the second portion of the insulative housing has a second bottom portion,the member is attached to the second bottom portion and is flush with the first bottom portion.
Priority Claims (1)
Number Date Country Kind
202121908685.1 Aug 2021 CN national
US Referenced Citations (781)
Number Name Date Kind
2996710 Pratt Aug 1961 A
3002162 Garstang Sep 1961 A
3134950 Cook May 1964 A
3243756 Ruete et al. Mar 1966 A
3322885 May et al. May 1967 A
3390369 Zavertnik et al. Jun 1968 A
3390389 Bluish Jun 1968 A
3505619 Bishop Apr 1970 A
3530422 Goodman Sep 1970 A
3573677 Detar Apr 1971 A
3631381 Pittman Dec 1971 A
3731259 Occhipinti May 1973 A
3743978 Fritz Jul 1973 A
3745509 Woodward et al. Jul 1973 A
3786372 Epis et al. Jan 1974 A
3825874 Peverill Jul 1974 A
3848073 Simons et al. Nov 1974 A
3863181 Glance et al. Jan 1975 A
3977757 Yurtin Aug 1976 A
3999830 Herrmann, Jr. et al. Dec 1976 A
4155613 Brandeau May 1979 A
4175821 Hunter Nov 1979 A
4195272 Boutros Mar 1980 A
4215910 Walter Aug 1980 A
4272148 Knack, Jr. Jun 1981 A
4276523 Boutros et al. Jun 1981 A
4286837 Yasutake et al. Sep 1981 A
4371742 Manly Feb 1983 A
4408255 Adkins Oct 1983 A
4447105 Ruehl May 1984 A
4457576 Cosmos et al. Jul 1984 A
4471015 Ebneth et al. Sep 1984 A
4472765 Hughes Sep 1984 A
4484159 Whitley Nov 1984 A
4490283 Kleiner Dec 1984 A
4518651 Wolfe, Jr. May 1985 A
4519664 Tillotson May 1985 A
4519665 Althouse et al. May 1985 A
4571014 Robin et al. Feb 1986 A
4605914 Harman Aug 1986 A
4607907 Bogursky Aug 1986 A
4632476 Schell Dec 1986 A
4636752 Saito Jan 1987 A
4655518 Johnson et al. Apr 1987 A
4674812 Thom et al. Jun 1987 A
4678260 Gallusser et al. Jul 1987 A
4682129 Bakermans et al. Jul 1987 A
4686607 Johnson Aug 1987 A
4687267 Header et al. Aug 1987 A
4728762 Roth et al. Mar 1988 A
4737598 O'Connor Apr 1988 A
4751479 Parr Jun 1988 A
4761147 Gauthier Aug 1988 A
4787548 Abbagnaro et al. Nov 1988 A
4806107 Arnold et al. Feb 1989 A
4824383 Lemke Apr 1989 A
4836791 Grabbe et al. Jun 1989 A
4846724 Sasaki et al. Jul 1989 A
4846727 Glover et al. Jul 1989 A
4871316 Herrell et al. Oct 1989 A
4876630 Dara Oct 1989 A
4878155 Conley Oct 1989 A
4889500 Lazar et al. Dec 1989 A
4902243 Davis Feb 1990 A
4948922 Varadan et al. Aug 1990 A
4970354 Iwasa et al. Nov 1990 A
4971726 Maeno et al. Nov 1990 A
4975084 Fedder et al. Dec 1990 A
4984992 Beamenderfer et al. Jan 1991 A
4992060 Meyer Feb 1991 A
5000700 Masubuchi et al. Mar 1991 A
5041023 Lytle Aug 1991 A
5046084 Barrett et al. Sep 1991 A
5046952 Cohen et al. Sep 1991 A
5046960 Fedder Sep 1991 A
5066236 Broeksteeg Nov 1991 A
5135405 Fusselman et al. Aug 1992 A
5141454 Garrett et al. Aug 1992 A
5150086 Ito Sep 1992 A
5166527 Solymar Nov 1992 A
5168252 Naito Dec 1992 A
5168432 Murphy et al. Dec 1992 A
5171161 Kachlic Dec 1992 A
5176538 Hansell, III et al. Jan 1993 A
5190472 Voltz et al. Mar 1993 A
5246388 Collins et al. Sep 1993 A
5259773 Champion et al. Nov 1993 A
5266055 Naito et al. Nov 1993 A
5280257 Cravens et al. Jan 1994 A
5281762 Long et al. Jan 1994 A
5287076 Johnescu et al. Feb 1994 A
5323299 Weber Jun 1994 A
5334050 Andrews Aug 1994 A
5335146 Stucke Aug 1994 A
5340334 Nguyen Aug 1994 A
5346410 Moore, Jr. Sep 1994 A
5352123 Sample et al. Oct 1994 A
5403206 McNamara et al. Apr 1995 A
5407622 Cleveland et al. Apr 1995 A
5429520 Morlion et al. Jul 1995 A
5429521 Morlion et al. Jul 1995 A
5433617 Morlion et al. Jul 1995 A
5433618 Morlion et al. Jul 1995 A
5456619 Belopolsky et al. Oct 1995 A
5461392 Mott et al. Oct 1995 A
5474472 Niwa et al. Dec 1995 A
5484310 McNamara et al. Jan 1996 A
5490372 Schlueter Feb 1996 A
5496183 Soes et al. Mar 1996 A
5499935 Powell Mar 1996 A
5539148 Konishi et al. Jul 1996 A
5551893 Johnson Sep 1996 A
5554050 Marpoe, Jr. Sep 1996 A
5562497 Yagi et al. Oct 1996 A
5564949 Wellinsky Oct 1996 A
5571991 Highum et al. Nov 1996 A
5597328 Mouissie Jan 1997 A
5605469 Wellinsky et al. Feb 1997 A
5620340 Andrews Apr 1997 A
5651702 Hanning et al. Jul 1997 A
5660551 Sakurai Aug 1997 A
5669789 Law Sep 1997 A
5702258 Provencher et al. Dec 1997 A
5755597 Panis et al. May 1998 A
5795191 Preputnick et al. Aug 1998 A
5796323 Uchikoba et al. Aug 1998 A
5803768 Zell et al. Sep 1998 A
5831491 Buer et al. Nov 1998 A
5833486 Shinozaki Nov 1998 A
5833496 Hollander et al. Nov 1998 A
5842887 Andrews Dec 1998 A
5870528 Fukuda Feb 1999 A
5885088 Brennan et al. Mar 1999 A
5885095 Cohen et al. Mar 1999 A
5887158 Sample et al. Mar 1999 A
5904594 Longueville et al. May 1999 A
5924899 Paagman Jul 1999 A
5931686 Sasaki et al. Aug 1999 A
5959591 Aurand Sep 1999 A
5961355 Morlion et al. Oct 1999 A
5971809 Ho Oct 1999 A
5980321 Cohen et al. Nov 1999 A
5981869 Kroger Nov 1999 A
5982253 Perrin et al. Nov 1999 A
5993259 Stokoe et al. Nov 1999 A
5997361 Driscoll et al. Dec 1999 A
6019616 Yagi et al. Feb 2000 A
6042394 Mitra et al. Mar 2000 A
6083047 Paagman Jul 2000 A
6102747 Paagman Aug 2000 A
6116926 Ortega et al. Sep 2000 A
6120306 Evans Sep 2000 A
6123554 Ortega et al. Sep 2000 A
6132255 Verhoeven Oct 2000 A
6132355 Derie Oct 2000 A
6135824 Okabe et al. Oct 2000 A
6146202 Ramey et al. Nov 2000 A
6152274 Blard et al. Nov 2000 A
6152742 Cohen et al. Nov 2000 A
6152747 McNamara Nov 2000 A
6163464 Ishibashi et al. Dec 2000 A
6168469 Lu Jan 2001 B1
6171115 Mickievicz et al. Jan 2001 B1
6171149 van Zanten Jan 2001 B1
6174202 Mitra Jan 2001 B1
6174203 Asao Jan 2001 B1
6174944 Chiba et al. Jan 2001 B1
6179651 Huang Jan 2001 B1
6179663 Bradley et al. Jan 2001 B1
6196853 Harting et al. Mar 2001 B1
6203396 Asmussen et al. Mar 2001 B1
6206729 Bradley et al. Mar 2001 B1
6210182 Elco et al. Apr 2001 B1
6210227 Yamasaki et al. Apr 2001 B1
6217372 Reed Apr 2001 B1
6227875 Wu et al. May 2001 B1
6231391 Ramey et al. May 2001 B1
6238245 Stokoe et al. May 2001 B1
6267604 Mickievicz et al. Jul 2001 B1
6273758 Lloyd et al. Aug 2001 B1
6293827 Stokoe Sep 2001 B1
6296491 Pickles Oct 2001 B1
6296496 Trammel Oct 2001 B1
6299438 Sahagian et al. Oct 2001 B1
6299483 Cohen et al. Oct 2001 B1
6299484 Van Woensel Oct 2001 B2
6299492 Pierini et al. Oct 2001 B1
6315615 Raistrick Nov 2001 B1
6322395 Nishio et al. Nov 2001 B1
6328572 Higashida et al. Dec 2001 B1
6328601 Yip et al. Dec 2001 B1
6333468 Endoh et al. Dec 2001 B1
6343955 Billman et al. Feb 2002 B2
6343957 Kuo et al. Feb 2002 B1
6347962 Kline Feb 2002 B1
6350134 Fogg et al. Feb 2002 B1
6358088 Nishio et al. Mar 2002 B1
6358092 Siemon et al. Mar 2002 B1
6361363 Hwang Mar 2002 B1
6364711 Berg et al. Apr 2002 B1
6364713 Kuo Apr 2002 B1
6375510 Asao Apr 2002 B2
6379188 Cohen et al. Apr 2002 B1
6380485 Beaman et al. Apr 2002 B1
6392142 Uzuka et al. May 2002 B1
6394839 Reed May 2002 B2
6394842 Sakurai et al. May 2002 B1
6396712 Kuijk May 2002 B1
6398588 Bickford Jun 2002 B1
6409543 Astbury, Jr. et al. Jun 2002 B1
6413119 Gabrisko, Jr. et al. Jul 2002 B1
6428344 Reed Aug 2002 B1
6431914 Billman Aug 2002 B1
6435913 Billman Aug 2002 B1
6435914 Billman Aug 2002 B1
6441313 Novak Aug 2002 B1
6447170 Takahashi et al. Sep 2002 B1
6454605 Bassler et al. Sep 2002 B1
6461202 Kline Oct 2002 B2
6471549 Lappohn Oct 2002 B1
6478624 Ramey et al. Nov 2002 B2
6482017 Van Doorn Nov 2002 B1
6491545 Spiegel et al. Dec 2002 B1
6503103 Cohen et al. Jan 2003 B1
6506076 Cohen et al. Jan 2003 B2
6517360 Cohen Feb 2003 B1
6520803 Dunn Feb 2003 B1
6527587 Ortega et al. Mar 2003 B1
6528737 Kwong et al. Mar 2003 B1
6530790 McNamara et al. Mar 2003 B1
6533613 Turner et al. Mar 2003 B1
6537087 McNamara et al. Mar 2003 B2
6538524 Miller Mar 2003 B1
6538899 Krishnamurthi et al. Mar 2003 B1
6540522 Sipe Apr 2003 B2
6540558 Paagman Apr 2003 B1
6540559 Kemmick et al. Apr 2003 B1
6541712 Gately et al. Apr 2003 B1
6544072 Olson Apr 2003 B2
6544647 Hayashi et al. Apr 2003 B1
6551140 Billman et al. Apr 2003 B2
6554647 Cohen et al. Apr 2003 B1
6565387 Cohen May 2003 B2
6565390 Wu May 2003 B2
6579116 Brennan et al. Jun 2003 B2
6582244 Fogg et al. Jun 2003 B2
6585540 Gutierrez et al. Jul 2003 B2
6592381 Cohen et al. Jul 2003 B2
6595801 Leonard et al. Jul 2003 B1
6595802 Watanabe et al. Jul 2003 B1
6602095 Astbury, Jr. et al. Aug 2003 B2
6607402 Cohen et al. Aug 2003 B2
6608762 Patriche Aug 2003 B2
6609922 Torii Aug 2003 B2
6609933 Yamasaki Aug 2003 B2
6612871 Givens Sep 2003 B1
6616482 De La Cruz et al. Sep 2003 B2
6616864 Jiang et al. Sep 2003 B1
6621373 Mullen et al. Sep 2003 B1
6652318 Winings et al. Nov 2003 B1
6652319 Billman Nov 2003 B1
6655966 Rothermel et al. Dec 2003 B2
6663427 Billman et al. Dec 2003 B1
6663429 Korsunsky et al. Dec 2003 B1
6692272 Lemke et al. Feb 2004 B2
6705895 Hasircoglu Mar 2004 B2
6706974 Chen et al. Mar 2004 B2
6709294 Cohen et al. Mar 2004 B1
6712648 Padro et al. Mar 2004 B2
6713672 Stickney Mar 2004 B1
6717825 Volstorf Apr 2004 B2
6722897 Wu Apr 2004 B1
6726492 Yu Apr 2004 B1
6741141 Kormanyos May 2004 B2
6743057 Davis et al. Jun 2004 B2
6749444 Murr et al. Jun 2004 B2
6762941 Roth Jul 2004 B2
6764341 Lappoehn Jul 2004 B2
6776645 Roth et al. Aug 2004 B2
6776659 Stokoe et al. Aug 2004 B1
6786771 Gailus Sep 2004 B2
6792941 Andersson Sep 2004 B2
6806109 Furuya et al. Oct 2004 B2
6808419 Korsunsky et al. Oct 2004 B1
6808420 Whiteman, Jr. et al. Oct 2004 B2
6814519 Policicchio et al. Nov 2004 B2
6814619 Stokoe et al. Nov 2004 B1
6816486 Rogers Nov 2004 B1
6817870 Kwong et al. Nov 2004 B1
6823587 Reed Nov 2004 B2
6830478 Ko et al. Dec 2004 B1
6830483 Wu Dec 2004 B1
6830489 Aoyama Dec 2004 B2
6857899 Reed et al. Feb 2005 B2
6872085 Cohen et al. Mar 2005 B1
6875031 Korsunsky et al. Apr 2005 B1
6899566 Kline et al. May 2005 B2
6903939 Chea, Jr. et al. Jun 2005 B1
6913490 Whiteman, Jr. et al. Jul 2005 B2
6932649 Rothermel et al. Aug 2005 B1
6957967 Petersen et al. Oct 2005 B2
6960103 Tokunaga Nov 2005 B2
6971916 Tokunaga Dec 2005 B2
6979202 Benham et al. Dec 2005 B2
6979226 Otsu et al. Dec 2005 B2
6982378 Dickson Jan 2006 B2
6986681 Tsai Jan 2006 B2
7004793 Scherer et al. Feb 2006 B2
7021969 Matsunaga Apr 2006 B2
7044794 Consoli et al. May 2006 B2
7057570 Irion, II et al. Jun 2006 B2
7074086 Cohen et al. Jul 2006 B2
7086872 Myer et al. Aug 2006 B2
7094102 Cohen et al. Aug 2006 B2
7104842 Huang et al. Sep 2006 B1
7108556 Cohen et al. Sep 2006 B2
7120327 Bozso et al. Oct 2006 B2
7137849 Nagata Nov 2006 B2
7156672 Fromm et al. Jan 2007 B2
7163421 Cohen et al. Jan 2007 B1
7182643 Winings et al. Feb 2007 B2
7229318 Winings et al. Jun 2007 B2
7232344 Gillespie et al. Jun 2007 B1
7261591 Korsunsky et al. Aug 2007 B2
7270573 Houtz Sep 2007 B2
7285018 Kenny et al. Oct 2007 B2
7303427 Swain Dec 2007 B2
7309239 Shuey et al. Dec 2007 B2
7309257 Minich Dec 2007 B1
7316585 Smith et al. Jan 2008 B2
7318740 Henry et al. Jan 2008 B1
7320614 Toda et al. Jan 2008 B2
7322845 Regnier et al. Jan 2008 B2
7322855 Mongold et al. Jan 2008 B2
7331822 Chen Feb 2008 B2
7331830 Minich Feb 2008 B2
7335063 Cohen et al. Feb 2008 B2
7347721 Kameyama Mar 2008 B2
7351114 Benham et al. Apr 2008 B2
7354274 Minich Apr 2008 B2
7364464 Iino et al. Apr 2008 B2
7365269 Donazzi et al. Apr 2008 B2
7371117 Gailus May 2008 B2
7390218 Smith et al. Jun 2008 B2
7390220 Wu Jun 2008 B1
7407413 Minich Aug 2008 B2
7467977 Yi et al. Dec 2008 B1
7473124 Briant et al. Jan 2009 B1
7494383 Cohen et al. Feb 2009 B2
7540781 Kenny et al. Jun 2009 B2
7554096 Ward et al. Jun 2009 B2
7581990 Kirk et al. Sep 2009 B2
7585186 McAlonis et al. Sep 2009 B2
7588464 Kim Sep 2009 B2
7588467 Chang Sep 2009 B2
7594826 Kobayashi et al. Sep 2009 B2
7604490 Chen et al. Oct 2009 B2
7604502 Pan Oct 2009 B2
7645165 Wu et al. Jan 2010 B2
7674133 Fogg et al. Mar 2010 B2
7690946 Knaub et al. Apr 2010 B2
7699644 Szczesny et al. Apr 2010 B2
7699663 Little et al. Apr 2010 B1
7722401 Kirk et al. May 2010 B2
7727027 Chiang et al. Jun 2010 B2
7727028 Zhang et al. Jun 2010 B1
7731537 Amleshi et al. Jun 2010 B2
7753731 Cohen et al. Jul 2010 B2
7758357 Pan et al. Jul 2010 B2
7771233 Gailus Aug 2010 B2
7789676 Morgan et al. Sep 2010 B2
7794240 Cohen et al. Sep 2010 B2
7794278 Cohen et al. Sep 2010 B2
7806729 Nguyen et al. Oct 2010 B2
7824192 Lin et al. Nov 2010 B2
7828595 Mathews Nov 2010 B2
7871296 Fowler et al. Jan 2011 B2
7874873 Do et al. Jan 2011 B2
7883369 Sun et al. Feb 2011 B1
7887371 Kenny et al. Feb 2011 B2
7887379 Kirk Feb 2011 B2
7906730 Atkinson et al. Mar 2011 B2
7914304 Cartier et al. Mar 2011 B2
7927143 Helster et al. Apr 2011 B2
7946889 Mizumura May 2011 B2
7985097 Gulla Jul 2011 B2
7993147 Cole et al. Aug 2011 B2
8018733 Jia Sep 2011 B2
8057267 Johnescu Nov 2011 B2
8083553 Manter et al. Dec 2011 B2
8123544 Kobayashi Feb 2012 B2
8182289 Stokoe et al. May 2012 B2
8215968 Cartier et al. Jul 2012 B2
8216001 Kirk Jul 2012 B2
8251745 Johnescu Aug 2012 B2
8262411 Kondo Sep 2012 B2
8267721 Minich Sep 2012 B2
8272877 Stokoe et al. Sep 2012 B2
8337247 Zhu Dec 2012 B2
8348701 Lan et al. Jan 2013 B1
8371875 Gailus Feb 2013 B2
8382524 Khilchenko et al. Feb 2013 B2
8440637 Elmen May 2013 B2
8480432 Wu Jul 2013 B2
8506319 Ritter et al. Aug 2013 B2
8506331 Wu Aug 2013 B2
8545253 Amidon et al. Oct 2013 B2
8550861 Cohen et al. Oct 2013 B2
8597051 Yang et al. Dec 2013 B2
8657627 McNamara et al. Feb 2014 B2
8678860 Minich et al. Mar 2014 B2
8715003 Buck et al. May 2014 B2
8715005 Pan May 2014 B2
8740637 Wang et al. Jun 2014 B2
8764492 Chiang Jul 2014 B2
8771016 Atkinson et al. Jul 2014 B2
8864506 Little Oct 2014 B2
8864521 Atkinson et al. Oct 2014 B2
8905777 Zhu et al. Dec 2014 B2
8926377 Kirk et al. Jan 2015 B2
8944831 Stoner et al. Feb 2015 B2
8968034 Hsu Mar 2015 B2
8998642 Manter et al. Apr 2015 B2
9004942 Paniauqa Apr 2015 B2
9011177 Lloyd et al. Apr 2015 B2
9022806 Cartier, Jr. et al. May 2015 B2
9028201 Kirk et al. May 2015 B2
9028281 Kirk et al. May 2015 B2
9065230 Milbrand, Jr. Jun 2015 B2
9077115 Yang Jul 2015 B2
9083130 Casher et al. Jul 2015 B2
9124009 Atkinson et al. Sep 2015 B2
9219335 Atkinson et al. Dec 2015 B2
9225083 Krenceski et al. Dec 2015 B2
9225085 Cartier, Jr. et al. Dec 2015 B2
9246253 Defibaugh et al. Jan 2016 B1
9257778 Buck et al. Feb 2016 B2
9257794 Wanha et al. Feb 2016 B2
9263835 Guo Feb 2016 B2
9281590 Liu et al. Mar 2016 B1
9287668 Chen et al. Mar 2016 B2
9300074 Gailus Mar 2016 B2
9337585 Yang May 2016 B1
9350095 Arichika et al. May 2016 B2
9431734 Guo et al. Aug 2016 B2
9450344 Cartier, Jr. et al. Sep 2016 B2
9461378 Chen Oct 2016 B1
9484674 Cartier, Jr. et al. Nov 2016 B2
9490587 Phillips et al. Nov 2016 B1
9509101 Cartier, Jr. et al. Nov 2016 B2
9520686 Hu et al. Dec 2016 B2
9520689 Cartier, Jr. et al. Dec 2016 B2
9537250 Kao et al. Jan 2017 B2
9640915 Phillips May 2017 B2
9692183 Phillips Jun 2017 B2
9692188 Godana et al. Jun 2017 B2
9705255 Atkinson et al. Jul 2017 B2
9742132 Hsueh Aug 2017 B1
9748698 Morgan et al. Aug 2017 B1
9831588 Cohen Nov 2017 B2
9831605 Buck et al. Nov 2017 B2
9843135 Guetig et al. Dec 2017 B2
9899774 Gailus Feb 2018 B2
9923309 Aizawa et al. Mar 2018 B1
9935385 Phillips et al. Apr 2018 B2
9972945 Huang et al. May 2018 B1
9985389 Morgan et al. May 2018 B1
9997853 Little et al. Jun 2018 B2
9997871 Zhong Jun 2018 B2
10038284 Krenceski et al. Jul 2018 B2
10096921 Johnescu et al. Oct 2018 B2
10122129 Milbrand, Jr. et al. Nov 2018 B2
10135197 Little et al. Nov 2018 B2
10148025 Trout et al. Dec 2018 B1
10186814 Khilchenko et al. Jan 2019 B2
10211577 Milbrand, Jr. et al. Feb 2019 B2
10243304 Kirk et al. Mar 2019 B2
10270191 Li et al. Apr 2019 B1
10276995 Little Apr 2019 B2
10283910 Chen et al. May 2019 B1
10320102 Phillips et al. Jun 2019 B2
10320125 Ju et al. Jun 2019 B2
10348040 Cartier, Jr. et al. Jul 2019 B2
10355416 Pickel et al. Jul 2019 B1
10381767 Milbrand, Jr. et al. Aug 2019 B1
10431936 Horning et al. Oct 2019 B2
10439311 Phillips et al. Oct 2019 B2
10446983 Krenceski et al. Oct 2019 B2
10511128 Kirk et al. Dec 2019 B2
10541482 Sasame et al. Jan 2020 B2
10573987 Osaki et al. Feb 2020 B2
10601181 Lu et al. Mar 2020 B2
10680387 Cheng et al. Jun 2020 B2
10714875 Wan et al. Jul 2020 B2
10777921 Lu et al. Sep 2020 B2
10797417 Scholeno et al. Oct 2020 B2
10797446 Liu et al. Oct 2020 B2
10826214 Phillips et al. Nov 2020 B2
10833437 Huang et al. Nov 2020 B2
10840622 Sasame et al. Nov 2020 B2
10916894 Kirk et al. Feb 2021 B2
10931050 Cohen Feb 2021 B2
10965063 Krenceski et al. Mar 2021 B2
10965064 Hsu et al. Mar 2021 B2
11146025 Lu et al. Oct 2021 B2
11189971 Lu Nov 2021 B2
11264755 Te Mar 2022 B2
11381015 Lu Jul 2022 B2
11444397 Sasame et al. Sep 2022 B2
11469553 Johnescu et al. Oct 2022 B2
11469554 Ellison et al. Oct 2022 B2
20010012730 Ramey et al. Aug 2001 A1
20010041477 Billman et al. Nov 2001 A1
20010042632 Manov et al. Nov 2001 A1
20010046810 Cohen et al. Nov 2001 A1
20020042223 Belopolsky et al. Apr 2002 A1
20020061671 Torii May 2002 A1
20020086582 Nitta et al. Jul 2002 A1
20020089464 Joshi Jul 2002 A1
20020098738 Astbury et al. Jul 2002 A1
20020102885 Kline Aug 2002 A1
20020111068 Cohen et al. Aug 2002 A1
20020111069 Astbury et al. Aug 2002 A1
20020115335 Saito Aug 2002 A1
20020123266 Ramey et al. Sep 2002 A1
20020132518 Kobayashi Sep 2002 A1
20020136506 Asada et al. Sep 2002 A1
20020146926 Fogg et al. Oct 2002 A1
20020168898 Billman et al. Nov 2002 A1
20020172469 Benner et al. Nov 2002 A1
20020181215 Guenthner Dec 2002 A1
20020192988 Droesbeke et al. Dec 2002 A1
20030003803 Billman et al. Jan 2003 A1
20030008561 Lappoehn Jan 2003 A1
20030008562 Yamasaki Jan 2003 A1
20030022555 Vicich et al. Jan 2003 A1
20030027439 Johnescu et al. Feb 2003 A1
20030109174 Korsunsky et al. Jun 2003 A1
20030119360 Jiang et al. Jun 2003 A1
20030143894 Kline et al. Jul 2003 A1
20030147227 Egitto et al. Aug 2003 A1
20030162441 Nelson et al. Aug 2003 A1
20030220018 Winings et al. Nov 2003 A1
20030220021 Whiteman et al. Nov 2003 A1
20040001299 van Haaster et al. Jan 2004 A1
20040005815 Mizumura et al. Jan 2004 A1
20040020674 McFadden et al. Feb 2004 A1
20040043661 Okada et al. Mar 2004 A1
20040058572 Fromm et al. Mar 2004 A1
20040072473 Wu Apr 2004 A1
20040097112 Minich et al. May 2004 A1
20040115968 Cohen Jun 2004 A1
20040121652 Gailus Jun 2004 A1
20040171305 McGowan et al. Sep 2004 A1
20040196112 Welbon et al. Oct 2004 A1
20040224559 Nelson et al. Nov 2004 A1
20040235352 Takemasa Nov 2004 A1
20040259419 Payne et al. Dec 2004 A1
20050006119 Cunningham et al. Jan 2005 A1
20050020135 Whiteman et al. Jan 2005 A1
20050039331 Smith Feb 2005 A1
20050048818 Pan Mar 2005 A1
20050048838 Korsunsky et al. Mar 2005 A1
20050048842 Benham et al. Mar 2005 A1
20050070160 Cohen et al. Mar 2005 A1
20050090299 Tsao et al. Apr 2005 A1
20050133245 Katsuyama et al. Jun 2005 A1
20050148239 Hull et al. Jul 2005 A1
20050176300 Hsu et al. Aug 2005 A1
20050176835 Kobayashi et al. Aug 2005 A1
20050215121 Tokunaga Sep 2005 A1
20050233610 Tutt et al. Oct 2005 A1
20050277315 Mongold et al. Dec 2005 A1
20050283974 Richard et al. Dec 2005 A1
20050287869 Kenny et al. Dec 2005 A1
20060009080 Regnier et al. Jan 2006 A1
20060019517 Raistrick et al. Jan 2006 A1
20060019525 Lloyd et al. Jan 2006 A1
20060019538 Davis et al. Jan 2006 A1
20060024983 Cohen et al. Feb 2006 A1
20060024984 Cohen et al. Feb 2006 A1
20060068640 Gailus Mar 2006 A1
20060073709 Reid Apr 2006 A1
20060104010 Donazzi et al. May 2006 A1
20060110977 Matthews May 2006 A1
20060141866 Shiu Jun 2006 A1
20060166551 Korsunsky et al. Jul 2006 A1
20060166560 Shuey et al. Jul 2006 A1
20060216969 Bright et al. Sep 2006 A1
20060255876 Kushta et al. Nov 2006 A1
20060276082 Hung et al. Dec 2006 A1
20060292932 Benham et al. Dec 2006 A1
20070004282 Cohen et al. Jan 2007 A1
20070004828 Khabbaz Jan 2007 A1
20070021000 Laurx Jan 2007 A1
20070021001 Laurx et al. Jan 2007 A1
20070021002 Laurx et al. Jan 2007 A1
20070021003 Laurx et al. Jan 2007 A1
20070021004 Laurx et al. Jan 2007 A1
20070037419 Sparrowhawk Feb 2007 A1
20070042639 Manter et al. Feb 2007 A1
20070054554 Do et al. Mar 2007 A1
20070059961 Cartier et al. Mar 2007 A1
20070111597 Kondou et al. May 2007 A1
20070141872 Szczesny et al. Jun 2007 A1
20070155241 Lappohn Jul 2007 A1
20070197063 Ngo et al. Aug 2007 A1
20070218765 Cohen et al. Sep 2007 A1
20070243764 Liu et al. Oct 2007 A1
20070275583 McNutt et al. Nov 2007 A1
20070293084 Ngo Dec 2007 A1
20080020640 Zhang et al. Jan 2008 A1
20080050968 Chang Feb 2008 A1
20080194146 Gailus Aug 2008 A1
20080246555 Kirk et al. Oct 2008 A1
20080248658 Cohen et al. Oct 2008 A1
20080248659 Cohen et al. Oct 2008 A1
20080248660 Kirk et al. Oct 2008 A1
20080318455 Beaman et al. Dec 2008 A1
20090011641 Cohen et al. Jan 2009 A1
20090011643 Amleshi et al. Jan 2009 A1
20090011645 Laurx et al. Jan 2009 A1
20090029602 Cohen et al. Jan 2009 A1
20090035955 McNamara Feb 2009 A1
20090061661 Shuey et al. Mar 2009 A1
20090117386 Vacanti et al. May 2009 A1
20090124101 Minich et al. May 2009 A1
20090149045 Chen et al. Jun 2009 A1
20090203259 Nguyen et al. Aug 2009 A1
20090239395 Cohen et al. Sep 2009 A1
20090258516 Hiew et al. Oct 2009 A1
20090291593 Atkinson et al. Nov 2009 A1
20090305530 Ito et al. Dec 2009 A1
20090305533 Feldman et al. Dec 2009 A1
20090305553 Thomas et al. Dec 2009 A1
20100048058 Morgan et al. Feb 2010 A1
20100068934 Li et al. Mar 2010 A1
20100075538 Ohshida Mar 2010 A1
20100081302 Atkinson et al. Apr 2010 A1
20100099299 Moriyama et al. Apr 2010 A1
20100112846 Kotaka May 2010 A1
20100124851 Xiong et al. May 2010 A1
20100144167 Fedder et al. Jun 2010 A1
20100203772 Mao et al. Aug 2010 A1
20100273359 Walker et al. Oct 2010 A1
20100291806 Minich et al. Nov 2010 A1
20100294530 Atkinson et al. Nov 2010 A1
20110003509 Gailus Jan 2011 A1
20110067237 Cohen et al. Mar 2011 A1
20110104948 Girard, Jr. et al. May 2011 A1
20110130038 Cohen et al. Jun 2011 A1
20110143605 Pepe Jun 2011 A1
20110212649 Stokoe et al. Sep 2011 A1
20110212650 Amleshi et al. Sep 2011 A1
20110230095 Atkinson et al. Sep 2011 A1
20110230096 Atkinson et al. Sep 2011 A1
20110256739 Toshiyuki et al. Oct 2011 A1
20110287663 Gailus et al. Nov 2011 A1
20120077380 Minich et al. Mar 2012 A1
20120094536 Khilchenko et al. Apr 2012 A1
20120115371 Chuang et al. May 2012 A1
20120156929 Manter et al. Jun 2012 A1
20120184145 Zeng Jul 2012 A1
20120184154 Frank et al. Jul 2012 A1
20120202363 McNamara et al. Aug 2012 A1
20120202386 McNamara et al. Aug 2012 A1
20120202387 McNamara Aug 2012 A1
20120214343 Buck et al. Aug 2012 A1
20120214344 Cohen et al. Aug 2012 A1
20130012038 Kirk et al. Jan 2013 A1
20130017733 Kirk et al. Jan 2013 A1
20130065454 Milbrand Jr. Mar 2013 A1
20130078870 Milbrand, Jr. Mar 2013 A1
20130078871 Milbrand, Jr. Mar 2013 A1
20130090001 Kagotani Apr 2013 A1
20130109232 Paniaqua May 2013 A1
20130143442 Cohen et al. Jun 2013 A1
20130196553 Gailus Aug 2013 A1
20130217263 Pan Aug 2013 A1
20130225006 Khilchenko et al. Aug 2013 A1
20130237100 Affeltranger Sep 2013 A1
20130273781 Buck et al. Oct 2013 A1
20130288513 Masubuchi et al. Oct 2013 A1
20130316590 Hon Nov 2013 A1
20130340251 Regnier et al. Dec 2013 A1
20140004724 Cartier, Jr. et al. Jan 2014 A1
20140004726 Cartier, Jr. et al. Jan 2014 A1
20140004746 Cartier, Jr. et al. Jan 2014 A1
20140024263 Dong et al. Jan 2014 A1
20140057498 Cohen Feb 2014 A1
20140113487 Chen et al. Apr 2014 A1
20140273557 Cartier, Jr. et al. Sep 2014 A1
20140273627 Cartier, Jr. et al. Sep 2014 A1
20140370729 Wang Dec 2014 A1
20140377992 Chang et al. Dec 2014 A1
20150056856 Atkinson et al. Feb 2015 A1
20150072546 Li Mar 2015 A1
20150099408 Myer et al. Apr 2015 A1
20150111401 Guo Apr 2015 A1
20150111427 Wu et al. Apr 2015 A1
20150126068 Fang May 2015 A1
20150140866 Tsai et al. May 2015 A1
20150214673 Gao et al. Jul 2015 A1
20150236451 Cartier, Jr. et al. Aug 2015 A1
20150236452 Cartier, Jr. et al. Aug 2015 A1
20150255904 Ito Sep 2015 A1
20150255926 Paniagua Sep 2015 A1
20150340798 Kao et al. Nov 2015 A1
20150380868 Chen et al. Dec 2015 A1
20160000616 Lavoie Jan 2016 A1
20160134057 Buck et al. May 2016 A1
20160149343 Atkinson et al. May 2016 A1
20160156133 Masubuchi et al. Jun 2016 A1
20160172794 Sparrowhawk et al. Jun 2016 A1
20160211618 Gailus Jul 2016 A1
20160268744 Little et al. Sep 2016 A1
20170077654 Yao et al. Mar 2017 A1
20170352970 Liang et al. Dec 2017 A1
20180062323 Kirk et al. Mar 2018 A1
20180076555 Scholeno et al. Mar 2018 A1
20180109043 Provencher et al. Apr 2018 A1
20180145438 Cohen May 2018 A1
20180166828 Gailus Jun 2018 A1
20180198220 Sasame et al. Jul 2018 A1
20180205177 Zhou et al. Jul 2018 A1
20180212376 Wang et al. Jul 2018 A1
20180212385 Little Jul 2018 A1
20180219331 Cartier, Jr. et al. Aug 2018 A1
20180241156 Huang et al. Aug 2018 A1
20180269607 Wu et al. Sep 2018 A1
20180331444 Ono Nov 2018 A1
20190006778 Fan et al. Jan 2019 A1
20190036256 Martens et al. Jan 2019 A1
20190044284 Dunham Feb 2019 A1
20190052019 Huang et al. Feb 2019 A1
20190067854 Ju et al. Feb 2019 A1
20190173209 Lu et al. Jun 2019 A1
20190173232 Lu et al. Jun 2019 A1
20190214755 Manickam Jul 2019 A1
20190334292 Cartier, Jr. et al. Oct 2019 A1
20190393634 Kao Dec 2019 A1
20200021052 Milbrand, Jr. et al. Jan 2020 A1
20200076132 Yang et al. Mar 2020 A1
20200076135 Tang et al. Mar 2020 A1
20200153134 Sasame et al. May 2020 A1
20200161811 Lu May 2020 A1
20200194940 Cohen et al. Jun 2020 A1
20200203865 Wu et al. Jun 2020 A1
20200203867 Lu Jun 2020 A1
20200203886 Wu et al. Jun 2020 A1
20200220289 Scholeno et al. Jul 2020 A1
20200235529 Kirk et al. Jul 2020 A1
20200251841 Stokoe et al. Aug 2020 A1
20200259294 Lu Aug 2020 A1
20200266584 Lu Aug 2020 A1
20200266585 Paniagua et al. Aug 2020 A1
20200335914 Hsu et al. Oct 2020 A1
20200358226 Lu et al. Nov 2020 A1
20200395698 Hou et al. Dec 2020 A1
20200403350 Hsu Dec 2020 A1
20210036452 Phillips et al. Feb 2021 A1
20210050683 Sasame et al. Feb 2021 A1
20210126403 Zhang Apr 2021 A1
20210135389 Jiang May 2021 A1
20210135403 Yang et al. May 2021 A1
20210135404 Jiang May 2021 A1
20210159643 Kirk et al. May 2021 A1
20210175670 Cartier, Jr. et al. Jun 2021 A1
20210203096 Cohen Jul 2021 A1
20210203104 Chen Jul 2021 A1
20210218195 Hsu et al. Jul 2021 A1
20210234314 Johnescu et al. Jul 2021 A1
20210234315 Ellison et al. Jul 2021 A1
20210242632 Trout et al. Aug 2021 A1
20210399449 Guo et al. Dec 2021 A1
20220059954 Yue Feb 2022 A1
20220069496 Yi et al. Mar 2022 A1
20220077632 Chen et al. Mar 2022 A1
20220094099 Liu et al. Mar 2022 A1
20220102916 Liu et al. Mar 2022 A1
20220336980 Lu Oct 2022 A1
Foreign Referenced Citations (253)
Number Date Country
1075390 Aug 1993 CN
1098549 Feb 1995 CN
1175101 Mar 1998 CN
1192068 Sep 1998 CN
1237652 Dec 1999 CN
1265470 Sep 2000 CN
2400938 Oct 2000 CN
1275825 Dec 2000 CN
1276597 Dec 2000 CN
1280405 Jan 2001 CN
1299524 Jun 2001 CN
2513247 Sep 2002 CN
2519434 Oct 2002 CN
2519458 Oct 2002 CN
2519592 Oct 2002 CN
1394829 Feb 2003 CN
1398446 Feb 2003 CN
1401147 Mar 2003 CN
1471749 Jan 2004 CN
1489810 Apr 2004 CN
1491465 Apr 2004 CN
1502151 Jun 2004 CN
1516723 Jul 2004 CN
1179448 Dec 2004 CN
1561565 Jan 2005 CN
1203341 May 2005 CN
1639866 Jul 2005 CN
1650479 Aug 2005 CN
1764020 Apr 2006 CN
1799290 Jul 2006 CN
2798361 Jul 2006 CN
2865050 Jan 2007 CN
2896615 May 2007 CN
1985199 Jun 2007 CN
1996678 Jul 2007 CN
2930006 Aug 2007 CN
101019277 Aug 2007 CN
101032060 Sep 2007 CN
201000949 Jan 2008 CN
101124697 Feb 2008 CN
101176389 May 2008 CN
101208837 Jun 2008 CN
101273501 Sep 2008 CN
201112782 Sep 2008 CN
101312275 Nov 2008 CN
101316012 Dec 2008 CN
201222548 Apr 2009 CN
201252183 Jun 2009 CN
101552410 Oct 2009 CN
201323275 Oct 2009 CN
101600293 Dec 2009 CN
201374433 Dec 2009 CN
201374434 Dec 2009 CN
101752700 Jun 2010 CN
101790818 Jul 2010 CN
101120490 Nov 2010 CN
101926055 Dec 2010 CN
101964463 Feb 2011 CN
101124697 Mar 2011 CN
201846527 May 2011 CN
102106041 Jun 2011 CN
201868621 Jun 2011 CN
102195173 Sep 2011 CN
102224640 Oct 2011 CN
102232259 Nov 2011 CN
102239605 Nov 2011 CN
102282731 Dec 2011 CN
102292881 Dec 2011 CN
101600293 May 2012 CN
102456990 May 2012 CN
102487166 Jun 2012 CN
102570100 Jul 2012 CN
102593661 Jul 2012 CN
102598430 Jul 2012 CN
202395248 Aug 2012 CN
101258649 Sep 2012 CN
102694318 Sep 2012 CN
102738621 Oct 2012 CN
102176586 Nov 2012 CN
102859805 Jan 2013 CN
202695788 Jan 2013 CN
202695861 Jan 2013 CN
102986091 Mar 2013 CN
103036081 Apr 2013 CN
103594871 Feb 2014 CN
203445304 Feb 2014 CN
103840285 Jun 2014 CN
203690614 Jul 2014 CN
204030057 Dec 2014 CN
204167554 Feb 2015 CN
104409906 Mar 2015 CN
204190038 Mar 2015 CN
104577577 Apr 2015 CN
104659573 May 2015 CN
204349140 May 2015 CN
204577746 Aug 2015 CN
204696287 Oct 2015 CN
205212085 May 2016 CN
105633660 Jun 2016 CN
105703103 Jun 2016 CN
102820589 Aug 2016 CN
106099546 Nov 2016 CN
107069274 Aug 2017 CN
107069281 Aug 2017 CN
304240766 Aug 2017 CN
304245430 Aug 2017 CN
206712072 Dec 2017 CN
206712089 Dec 2017 CN
107706632 Feb 2018 CN
207677189 Jul 2018 CN
208078300 Nov 2018 CN
208209042 Dec 2018 CN
208797273 Apr 2019 CN
109994892 Jul 2019 CN
210111108 Feb 2020 CN
210326355 Apr 2020 CN
111430991 Jul 2020 CN
111512499 Aug 2020 CN
111555069 Aug 2020 CN
112072400 Dec 2020 CN
212412336 Jan 2021 CN
107706675 Apr 2021 CN
212874843 Apr 2021 CN
213636403 Jul 2021 CN
113517619 Oct 2021 CN
4109863 Oct 1992 DE
4238777 May 1993 DE
19853837 Feb 2000 DE
102006044479 May 2007 DE
60216728 Nov 2007 DE
0560551 Sep 1993 EP
0774807 May 1997 EP
0820124 Jan 1998 EP
0903816 Mar 1999 EP
1018784 Jul 2000 EP
1779472 May 2007 EP
1794845 Jun 2007 EP
2169770 Mar 2010 EP
2262061 Dec 2010 EP
2388867 Nov 2011 EP
2405537 Jan 2012 EP
1794845 Mar 2013 EP
1049435 Nov 1966 GB
1272347 Apr 1972 GB
2161658 Jan 1986 GB
2283620 May 1995 GB
1043254 Sep 2002 HK
H3-156761 Jul 1991 JP
H05-54201 Mar 1993 JP
H05-234642 Sep 1993 JP
H07-57813 Mar 1995 JP
H07-302649 Nov 1995 JP
H09-63703 Mar 1997 JP
H09-274969 Oct 1997 JP
2711601 Feb 1998 JP
H11-67367 Mar 1999 JP
2896836 May 1999 JP
H11-233200 Aug 1999 JP
H11-260497 Sep 1999 JP
2000-013081 Jan 2000 JP
2000-311749 Nov 2000 JP
2001-068888 Mar 2001 JP
2001-510627 Jul 2001 JP
2001-217052 Aug 2001 JP
2002-042977 Feb 2002 JP
2002-053757 Feb 2002 JP
2002-075052 Mar 2002 JP
2002-075544 Mar 2002 JP
2002-117938 Apr 2002 JP
2002-151190 May 2002 JP
2002-246107 Aug 2002 JP
2003-017193 Jan 2003 JP
2003-309395 Oct 2003 JP
2004-192939 Jul 2004 JP
2004-259621 Sep 2004 JP
3679470 Aug 2005 JP
2006-344524 Dec 2006 JP
2008-515167 May 2008 JP
2009-043717 Feb 2009 JP
2009-110956 May 2009 JP
2010-129173 Jun 2010 JP
9907324 Aug 2000 MX
466650 Dec 2001 TW
517002 Jan 2003 TW
534494 May 2003 TW
200501874 Jan 2005 TW
200515773 May 2005 TW
M274675 Sep 2005 TW
M329891 Apr 2008 TW
200835073 Aug 2008 TW
M357771 May 2009 TW
200926536 Jun 2009 TW
M403141 May 2011 TW
M474278 Mar 2014 TW
M494411 Jan 2015 TW
I475770 Mar 2015 TW
M502979 Jun 2015 TW
M518837 Mar 2016 TW
I535129 May 2016 TW
M534922 Jan 2017 TW
I596840 Aug 2017 TW
M558481 Apr 2018 TW
M558482 Apr 2018 TW
M558483 Apr 2018 TW
M559006 Apr 2018 TW
M559007 Apr 2018 TW
M560138 May 2018 TW
M562507 Jun 2018 TW
M565894 Aug 2018 TW
M565895 Aug 2018 TW
M565899 Aug 2018 TW
M565900 Aug 2018 TW
M565901 Aug 2018 TW
M605564 Dec 2020 TW
M613035 Jun 2021 TW
WO 8502265 May 1985 WO
WO 8805218 Jul 1988 WO
WO 9835409 Aug 1998 WO
WO 0139332 May 2001 WO
WO 0157963 Aug 2001 WO
WO 2002061892 Aug 2002 WO
WO 03013199 Feb 2003 WO
WO 03047049 Jun 2003 WO
WO 2004034539 Apr 2004 WO
WO 2004051809 Jun 2004 WO
WO 2004059794 Jul 2004 WO
WO 2004059801 Jul 2004 WO
WO 2004114465 Dec 2004 WO
WO 2005011062 Feb 2005 WO
WO 2005114274 Dec 2005 WO
WO 2006039277 Apr 2006 WO
WO 2007005597 Jan 2007 WO
WO 2007005598 Jan 2007 WO
WO 2007005599 Jan 2007 WO
WO 2008124052 Oct 2008 WO
WO 2008124054 Oct 2008 WO
WO 2008124101 Oct 2008 WO
WO 2009111283 Sep 2009 WO
WO 2010030622 Mar 2010 WO
WO 2010039188 Apr 2010 WO
WO 2011060236 May 2011 WO
WO 2011100740 Aug 2011 WO
WO 2011106572 Sep 2011 WO
WO 2011139946 Nov 2011 WO
WO 2011140438 Nov 2011 WO
WO 2011140438 Dec 2011 WO
WO 2012106554 Aug 2012 WO
WO 2013059317 Apr 2013 WO
WO 2015112717 Jul 2015 WO
WO 2016008473 Jan 2016 WO
WO 2017007429 Jan 2017 WO
WO 2018039164 Mar 2018 WO
WO 2019084717 May 2019 WO
Non-Patent Literature Citations (232)
Entry
CN 200580040906.5, Aug. 17, 2021, Chinese Invalidation Request.
CN 200680023997.6, Jun. 1, 2021, Chinese Invalidation Request.
CN 201110008089.2, Sep. 9, 2021, Chinese Invalidation Request.
CN 201180033750.3, Jun. 15, 2021, Chinese Invalidation Request.
CN 201210249710.9, Jun. 17, 2021, Chinese Supplemental Observations.
CN 201580014851.4, Jun. 1, 2020, Chinese communication.
CN 201580014851.4, Sep. 4, 2019, Chinese Office Action.
CN 201610952606.4, Mar. 17, 2021, Chinese Invalidation Request.
CN 201680051491.X, Apr. 30, 2019, Chinese Office Action.
CN 201780064531.9, Jan. 2, 2020, Chinese Office Action.
CN 201780097919.9, Dec. 3, 2021, Chinese Office Action.
CN 201780097919.9, Mar. 10, 2021, Chinese Office Action.
CN 202010031395.7, Jan. 18, 2021, Chinese Office Action.
CN 202010467444.1, Apr. 2, 2021, Chinese Office Action.
CN 202010825662.8, Sep. 3, 2021, Chinese Office Action.
CN 202010922401.8, Aug. 6, 2021, Chinese Office Action.
EP 11166820.8, Jan. 24, 2012, Extended European Search Report.
EP 17930428.2, Sep. 8, 2022, European Communication.
EP 17930428.2, May 19, 2021, Extended European Search Report.
PCT/CN2017/108344, Mar. 6, 2020, International Preliminary Report on Patentability Chapter II.
PCT/CN2017/108344, Aug. 1, 2018, International Search Report and Written Opinion.
PCT/CN2018/118798, Jul. 18, 2019, International Search Report and Written Opinion.
PCT/CN2021/114671, Nov. 29, 2021, International Search Report and Written Opinion.
PCT/CN2021/119849, Dec. 28, 2021, International Search Report and Written Opinion.
PCT/SG2016/050317, Jan. 18, 2018, International Preliminary Report on Patentability.
PCT/SG2016/050317, Oct. 18, 2016, International Search Report and Written Opinion.
PCT/US2005/034605, Apr. 3, 2007, International Preliminary Report on Patentability.
PCT/US2005/034605, Jan. 26, 2006, International Search Report and Written Opinion.
PCT/US2006/025562, Jan. 9, 2008, International Preliminary Report on Patentability.
PCT/US2006/025562, Oct. 31, 2007, International Search Report and Written Opinion.
PCT/US2010/056482, May 24, 2012, International Preliminary Report on Patentability.
PCT/US2010/056482, Mar. 14, 2011, International Search Report and Written Opinion.
PCT/US2011/026139, Sep. 7, 2012, International Preliminary Report on Patentability.
PCT/US2011/026139, Nov. 22, 2011, International Search Report and Written Opinion.
PCT/US2011/034747, Jul. 28, 2011, International Search Report and Written Opinion.
PCT/US2012/023689, Aug. 15, 2013, International Preliminary Report on Patentability.
PCT/US2012/023689, Sep. 12, 2012, International Search Report and Written Opinion.
PCT/US2012/060610, May 1, 2014, International Preliminary Report on Patentability.
PCT/US2012/060610, Mar. 29, 2013, International Search Report and Written Opinion.
PCT/US2015/012463, Aug. 4, 2016, International Preliminary Report on Patentability.
PCT/US2015/012463, May 13, 2015, International Search Report and Written Opinion.
PCT/US2017/047905, Mar. 7, 2019, International Preliminary Report on Patentability.
PCT/US2017/047905, Dec. 4, 2017, International Search Report and Written Opinion.
PCT/US2021/015048, Apr. 5, 2022, International Preliminary Report on Patentability Chapter II.
PCT/US2021/015048, Jul. 1, 2021, International Search Report and Written Opinion.
PCT/US2021/015073, Apr. 1, 2022, International Preliminary Report on Patentability Chapter II.
PCT/US2021/015073, May 17, 2021, International Search Report and Written Opinion.
TW 106128439, Mar. 5, 2021, Taiwanese Office Action.
TW 107138468, Jun. 16, 2022, Taiwanese Office Action.
TW 110140608, Mar. 15, 2022, Taiwanese Office Action.
Chinese Invalidation Request dated Aug. 17, 2021 in connection with Chinese Application No. 200580040906.5.
Chinese Invalidation Request dated Jun. 1, 2021 in connection with Chinese Application No. 200680023997.6.
Chinese Invalidation Request dated Sep. 9, 2021 in connection with Chinese Application No. 201110008089.2.
Chinese Invalidation Request dated Jun. 15, 2021 in connection with Chinese Application No. 201180033750.3.
Chinese Supplemental Observations dated Jun. 17, 2021 in connection with Chinese Application No. 201210249710.9.
Chinese communication for Chinese Application No. 201580014851.4, dated Jun. 1, 2020.
Chinese Office Action for Chinese Application No. 201580014851.4 dated Sep. 4, 2019.
Chinese Invalidation Request dated Mar. 17, 2021 in connection with Chinese Application No. 201610952606.4.
Chinese Office Action for Application No. 201680051491.X dated Apr. 30, 2019.
Chinese Office Action for Chinese Application No. 201780064531.9 dated Jan. 2, 2020.
Chinese Office Action for Chinese Application No. 201780097919.9, dated Dec. 3, 2021.
Chinese Office Action for Chinese Application No. 201780097919.9, dated Mar. 10, 2021.
Chinese Office Action dated Jan. 18, 2021 in connection with Chinese Application No. 202010031395.7.
Chinese Office Action for Chinese Application No. 202010467444.1 dated Apr. 2, 2021.
Chinese Office Action for Chinese Application No. 202010825662.8 dated Sep. 3, 2021.
Chinese Office Action for Chinese Application No. 202010922401.8 dated Aug. 6, 2021.
Extended European Search Report for European Application No. EP 11166820.8 dated Jan. 24, 2012.
European Communication Pursuant to Article 94(3) EPC dated Sep. 8, 2022 for European Application No. 17930428.2.
Extended European Search Report dated May 19, 2021 in connection with European Application No. 17930428.2.
International Preliminary Report on Patentability Chapter II for International Application No. PCT/CN2017/108344 mailed Mar. 6, 2020.
International Search Report and Written Opinion for International Application No. PCT/CN2017/108344 dated Aug. 1, 2018.
International Search Report and Written Opinion mailed Jul. 18, 2019 for International Application No. PCT/CN2018/118798.
International Search Report and Written Opinion mailed Nov. 29, 2021 for International Application No. PCT/CN2021/114671.
International Search Report and Written Opinion mailed Dec. 28, 2021 in connection with International Application No. PCT/CN2021/119849.
International Preliminary Report on Patentability for International Application No. PCT/SG2016/050317 dated Jan. 18, 2018.
International Search Report and Written Opinion for International Application No. PCT/SG2016/050317 dated Oct. 18, 2016.
International Preliminary Report on Patentability for International Application No. PCT/US2005/034605 dated Apr. 3, 2007.
International Search Report and Written Opinion for International Application No. PCT/US2005/034605 mailed Jan. 26, 2006.
International Preliminary Report on Patentability for International Application No. PCT/US2006/025562 dated Jan. 9, 2008.
International Search Report with Written Opinion for International Application No. PCT/US2006/025562 mailed Oct. 31, 2007.
International Preliminary Report on Patentability for International Application No. PCT/US2010/056482 mailed May 24, 2012.
International Search Report and Written Opinion for International Application No. PCT/US2010/056482 mailed Mar. 14, 2011.
International Preliminary Report on Patentability for International Application No. PCT/US2011/026139 mailed Sep. 7, 2012.
International Search Report and Written Opinion for International Application No. PCT/US2011/026139 mailed Nov. 22, 2011.
International Search Report and Written Opinion for International Application No. PCT/US2011/034747 mailed Jul. 28, 2011.
International Preliminary Report on Patentability for International Application No. PCT/US2012/023689 mailed Aug. 15, 2013.
International Search Report and Written Opinion for International Application No. PCT/US2012/023689 mailed Sep. 12, 2012.
International Preliminary Report on Patentability for International Application No. PCT/US2012/060610 mailed May 1, 2014.
International Search Report and Written Opinion for International Application No. PCT/US2012/060610 mailed Mar. 29, 2013.
International Preliminary Report on Patentability for International Application No. PCT/US2015/012463 mailed Aug. 4, 2016.
International Search Report and Written Opinion for International Application No. PCT/US2015/012463 mailed May 13, 2015.
International Preliminary Report on Patentability for International Application No. PCT/US2017/047905, mailed Mar. 7, 2019.
International Search Report and Written Opinion for International Application No. PCT/US2017/047905 dated Dec. 4, 2017.
International Preliminary Report on Patentability Chapter II mailed Apr. 5, 2022 in connection with International Application No. PCT/US2021/015048.
International Search Report and Written Opinion mailed Jul. 1, 2021 in connection with International Application No. PCT/US2021/015048.
International Preliminary Report on Patentability Chapter II mailed Apr. 1, 2022 in connection with International Application No. PCT/US2021/015073.
International Search Report and Written Opinion mailed May 17, 2021 in connection with International Application No. PCT/US2021/015073.
Taiwanese Office Action dated Mar. 5, 2021 in connection with Taiwanese Application No. 106128439.
Taiwanese Office Action dated Jun. 16, 2022 for Taiwan Application No. 107138468.
Taiwanese Office Action dated Mar. 15, 2022 in connection with Taiwanese Application No. 110140608.
Decision Invalidating CN Patent Application No. 201610952606.4, which issued as CN Utility Model Patent No. 107069274B, and Certified Translation.
In re Certain Electrical Connectors and Cages, Components Thereof, and Prods. Containing the Same, Inv. No. 337-TA-1241, Order No. 31 (Oct. 19, 2021): Construing Certain Terms of the Asserted Claims of the Patents at Issue.
In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Complainant Amphenol Corporation's Corrected Initial Post-Hearing Brief. Public Version. Jan. 5, 2022. 451 pages.
In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Complainant Amphenol Corporation's Post-Hearing Reply Brief. Public Version. Dec. 6, 2021. 159 pages.
In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Luxshare Respondents' Initial Post-Hearing Brief. Public Version. Nov. 23, 2021. 348 pages.
In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Luxshare Respondents' Reply Post-Hearing Brief. Public Version. Dec. 6, 2021. 165 pages.
In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Notice of Prior Art. Jun. 3, 2021. 319 pages.
In re Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Respondents' Pre-Hearing Brief. Redacted. Oct. 21, 2021. 219 pages.
In the Matter of Certain Electrical Connectors and Cages, Components Thereof, and Products Containing the Same, Inv. No. 337-TA-1241, Final Initial Determination on Violation of Section 337. Public Version. Mar. 11, 2022. 393 pages.
Invalidity Claim Charts Based on CN 201112782Y (“Cai”). Luxshare Respondents' Supplemental Responses to Interrogatories Nos. 13 and 14, Exhibit 25. May 7, 2021. 147 pages.
Invalidity Claim Charts Based on U.S. Pat. No. 6,179,651 (“Huang”). Luxshare Respondents' Supplemental Responses to Interrogatories Nos. 13 and 14, Exhibit 26. May 7, 2021. 153 pages.
Invalidity Claim Charts Based on U.S. Pat. No. 7,261,591 (“Korsunsky”). Luxshare Respondents' Supplemental Responses to Interrogatories Nos. 13 and 14, Exhibit 27. May 7, 2021. 150 pages.
Petition for Inter Partes Review. Luxshare Precision Industry Co., Ltd v. Amphenol Corp. U.S. Pat. No. 10,381,767. IPR2022-00132. Nov. 4, 2021. 112 pages.
[No Author Listed], All About ESD Plastics. Evaluation Engineering. Jul. 1, 1998. 8 pages. https://www.evaluationengineering.com/home/article/13001136/all-about-esdplastics [last accessed Mar. 14, 2021].
[No Author Listed], AMP Incorporated Schematic, Cable Assay, 2 Pair, HMZD. Oct. 3, 2002. 1 page.
[No Author Listed], Board to Backplane Electrical Connector. The Engineer. Mar. 13, 2001, [last accessed Apr. 30, 2021]. 2 pages.
[No Author Listed], Borosil Vision Mezzo Mug Set of 2. Zola. 3 pages. https://www.zola.com/shop/product/borosil_vision_mezzao_mug_setof2_3.25. [date retrieved May 4, 2021].
[No Author Listed], Cable Systems. Samtec. Aug. 2010. 148 pages.
[No Author Listed], Carbon Nanotubes For Electromagnetic Interference Shielding. SBIR/STTR. Award Information. Program Year 2001. Fiscal Year 2001. Materials Research Institute, LLC. Chu et al. Available at http://sbir.gov/sbirsearch/detail/225895. Last accessed Sep. 19, 2013.
[No Author Listed], Coating Electrical Contacts. Brush Wellman Engineered Materials. Jan. 2002;4(1). 2 pages.
[No Author Listed], Common Management Interface Specification. Rev 4.0. MSA Group. May 8, 2019. 265 pages.
[No Author Listed], Electronics Connector Overview. FCI. Sep. 23, 2009. 78 pages.
[No Author Listed], EMI Shielding Compounds Instead of Metal. RTP Company. Last Accessed Apr. 30, 2021. 2 pages.
[No Author Listed], EMI Shielding Solutions and EMC Testing Services from Laird Technologies. Laird Technologies. Last acessed Apr. 30, 2021. 1 page.
[No Author Listed], EMI Shielding, Dramatic Cost Reductions for Electronic Device Protection. RTP. Jan. 2000. 10 pages.
[No Author Listed], Excerpt from The Concise Oxford Dictionary, Tenth Edition. 1999. 3 pages.
[No Author Listed], Excerpt from The Merriam-Webster Dictionary, Between. 2005. 4 pages.
[No Author Listed], Excerpt from Webster's Third New International Dictionary, Contact. 1986. 3 pages.
[No Author Listed], FCI—High Speed Interconnect Solutions, Backpanel Connectors. FCI. [last accessed Apr. 30, 2021). 2 pages.
[No Author Listed], General Product Specification for GbX Backplane and Daughtercard Interconnect System. Revision “B”. Teradyne. Aug. 23, 2005. 12 pages.
[No Author Listed], High Speed Backplane Connectors. Tyco Electronics. Product Catalog No. 1773095. Revised Dec. 1, 2008—40 pages.
[No Author Listed], HOZOX EMI Absorption Sheet and Tape. Molex. Laird Technologies. 2013. 2 pages.
[No Author Listed], INF-8074i Specification for SFP (Small Formfactor Pluggable) Transceiver. SFF Committee. Revision 1.0. May 12, 2001. 39 pages.
[No Author Listed], INF-8438i Specification for QSFP (Quad Small Formfactor Pluggable) Transceiver. Rev 1.0 Nov. 2006. SFF Committee. 76 pages.
[No Author Listed], Interconnect Signal Integrity Handbook. Samtec. Aug. 2007 21 pages.
[No Author Listed], Mcio 124pos 85ohm. Amphenol Assembletech. 1 page. URL:http://www.amphenol-ast.com/v3/en/overview.aspx?classId=234 [retrieved on Apr. 11, 2022].
[No Author Listed], Metallized Conductive Products: Fabric-Over-Foam, Conductive Foam, Fabric, Tape. Laird Technologies. 2003. 32 pages.
[No Author Listed], Metral® 2000 Series. FCI. 2001. 2 pages.
[No Author Listed], Metral® 2mm High-Speed Connectors 1000, 2000, 3000 Series. FCI. 2000. 119 pages.
[No Author Listed], Metral® 3000 Series. FCI. 2001. 2 pages.
[No Author Listed], Metral® 4000 Series. FCI. 2002. 2 pages.
[No Author Listed], Metral® 4000 Series: High-Speed Backplane Connectors. FCI, Rev. 3. Nov. 30, 2001. 21 pages.
[No Author Listed], Military Fibre Channel High Speed Cable Assembly. www.gore.com. 2008. [last accessed Aug. 2, 2012 via Internet Archive: Wayback Machine http://web.archive.org] Link archived: http://www.gore.com/en.sub.--xx/products/cables/copper/networking/militar-y/military.sub.--fibre . . . . Last archive date Apr. 6, 2008.
[No Author Listed], Mini Cool Edge IO—The Ideal Solution to Transmit Next Generation High-Speed Signal to Designated Area in Your System. Jul. 25, 2018. 2 pages. URL:https://www.amphenol-icc.com/connect/mini-cool-edge-io-the-ideal-solution-to-transmit-next-generation-high-speedsignal.html [retrieved on Apr. 11, 2022].
[No Author Listed], Mini Cool Edge IO Connector. Commercial IO. Amphenol ICC. 5 pages. URL:https://cdn.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/inputoutput/io_mini_cool_edge_io.pdf [retrieved on Apr. 11, 2022].
[No Author Listed], Molex Connectors as InfiniBand Solutions. Design World. Nov. 19, 2008. 7 pages. https://www.designworldonline.com/molex-connectors-as-infiniband-solutions/. [last accessed May 3, 2021].
[No Author Listed], OSFP MSA Specification for OSFP Octal Small Form Factor Pluggable Module. Revision 1.11. OSFP MSA. Jun. 26, 2017. 53 pages.
[No Author Listed], OSFP MSA Specification for OSFP Octal Small Form Factor Pluggable Module. Revision 1.12. OSFP MSA. Aug. 1, 2017. 53 pages.
[No Author Listed], OSFP MSA Specification for OSFP Octal Small Form Factor Pluggable Module. Revision 2.0 OSFP MSA. Jan. 14, 2019. 80 pages.
[No Author Listed], OSFP MSA Specification for OSFP Octal Small Form Factor Pluggable Module. Revision 3.0 OSFP MSA. Mar. 14, 2020. 99 pages.
[No Author Listed], Photograph of Molex Connector. Oct. 2021. 1 page.
[No Author Listed], Photograph of TE Connector. Oct. 2021. 1 page.
[No Author Listed], Pluggable Form Products. Tyco Electronics. Mar. 5, 2006. 1 page.
[No Author Listed], Pluggable Input/Output Solutions. Tyco Electronics Catalog 1773408-1. Revised Feb. 2009. 40 pages.
[No Author Listed], QSFP Market Evolves, First Products Emerge. Lightwave. Jan. 22, 2008. pp. 1-8. https://www.lightwaveonline.com/home/article/16662662.
[No Author Listed], QSFP-DD Hardware Specification for QSFP Double Density 8X Pluggable Transceiver, Rev 3.0. QSFP-DD MSA. Sep. 19, 2017. 69 pages.
[No Author Listed], QSFP-DD Hardware Specification for QSFP Double Density 8X Pluggable Transceiver, Rev 4.0. QSFP-DD MSA. Sep. 18, 2018. 68 pages.
[No Author Listed], QSFP-DD MSA QSFP-DD Hardware Specification for QSFP Double Density 8X Pluggable Transceiever. Revision 5.0. QSFP-DD-MSA. Jul. 9, 2019. 82 pages.
[No Author Listed], QSFP-DD MSA QSFP-DD Hardware Specification for QSFP Double Density 8X Pluggable Transceiver. Revision 5.1. QSFP-DD MSA. Aug. 7, 2020. 84 pages.
[No Author Listed], QSFP-DD MSA QSFP-DD Specification for QSFP Double Density 8X Pluggable Transceiver. Revision 1.0. QSFP-DD-MSA. Sep. 15, 2016. 69 pages.
[No Author Listed], QSFP-DD Specification for QSFP Double Density 8X Pluggable Transceiver Specification, Rev. 2.0. QSFP-DD MSA. Mar. 13, 2017. 106 pages.
[No Author Listed], RTP Company Introduces “Smart” Plastics for Bluetooth Standard. Press Release. RTP. Jun. 4, 2001. 2 pages.
[No Author Listed], RTP Company Specialty Compounds. RTP. Mar. 2002. 2 pages.
[No Author Listed], RTP Company-EMI/RFI Shielding Compounds (Conductive) Data Sheets. RTP Company. Last accessed Apr. 30, 2021. 4 pages.
[No Author Listed], Samtec Board Interface Guide. Oct. 2002. 253 pages.
[No Author Listed], SFF Committee SFF-8079 Specification for SFP Rate and Application Selection. Revision 1.7. SFF Committee. Feb. 2, 2005. 21 pages.
[No Author Listed], SFF Committee SFF-8089 Specification for SFP (Small Formfactor Pluggable) Rate and Application Codes. Revision 1.3. SFF Committee. Feb. 3, 2005. 18 pages.
[No Author Listed], SFF Committee SFF-8436 Specification for QSFP+ 4X 10 Gb/s Pluggable Transceiver. Revision 4.9. SFF Committee. Aug. 31, 2018. 88 pages.
[No Author Listed], SFF Committee SFF-8665 Specification for QSFP+ 28 Gb/s 4X Pluggable Transceiver Solution (QSFP28). Revision 1.9. SFF Committee. Jun. 29, 2015. 14 pages.
[No Author Listed], SFF-8075 Specification for PCI Card Version of SFP Cage. Rev 1.0. SFF Committee. Jul. 3, 2001. 11 pages.
[No Author Listed], SFF-8431 Specifications for Enhanced Small Form Factor Pluggable Module SFP+. Revision 4.1. SFF Committee. Jul. 6, 2009. 132 pages.
[No Author Listed], SFF-8432 Specification for SFP+ Module and Cage. Rev 5.1. SFF Committee. Aug. 8, 2012. 18 pages.
[No Author Listed], SFF-8433 Specification for SFP+ Ganged Cage Footprints and Bezel Openings. Rev 0.7. SFF Committee. Jun. 5, 2009. 15 pages.
[No Author Listed], SFF-8477 Specification for Tunable XFP for ITU Frequency Grid Applications. Rev 1.4. SFF Committee. Dec. 4, 2009. 13 pages.
[No Author Listed], SFF-8672 Specification for QSFP+ 4x 28 Gb/s Connector (Style B). Revision 1.2. SNIA. Jun. 8, 2018. 21 pages.
[No Author Listed], SFF-8679 Specification for QSFP+ 4X Base Electrical Specification. Rev 1.7. SFF Committee. Aug. 12, 2014. 31 pages.
[No Author Listed], SFF-8682 Specification for QSFP+ 4X Connector. Rev 1.1. SNIA SFF TWG Technology Affiliate. Jun. 8, 2018. 19 pages.
[No Author Listed], SFF-TA-1016 Specification for Internal Unshielded High Speed Connector System. Rev 0.0.1. SNIA SFF TWG Technology Affiliate. Nov. 15, 2019. 40 pages.
[No Author Listed], Shielding Theory and Design. Laird Technologies. Last accessed Apr. 30, 2021. 1 page.
[No Author Listed], Shielding Theory and Design. Laird Technologies. Last accessed Apr. 30, 2021. 2 pages. URL:web.archive.org/web/20030226182710/http://www.lairdtech.com/catalog/staticdata/shieldingtheorydesign/std_3.htm.
[No Author Listed], Shielding Theory and Design. Laird Technologies. Last accessed Apr. 30, 2021. 2 pages. URL:web.archive.org/web/20021223144443/http://www.lairdtech.com/catalog/staticdata/shieldingtheorydesign/std_2.htm.
[No Author Listed], Signal Integrity—Multi-Gigabit Transmission Over Backplane Systems. International Engineering Consortium. 2003;1-8.
[No Author Listed], Signal Integrity Considerations for 10Gbps Transmission over Backplane Systems. DesignCon2001. Teradyne Connections Systems, Inc. 2001. 47 pages.
[No Author Listed], Specification for OSFP Octal Small Form Factor Pluggable Module. Rev 1.0. OSFP MSA. Mar. 17, 2017. 53 pages.
[No Author Listed], TB-2092 GbX Backplane Signal and Power Connector Press-Fit Installation Process. Teradyne. Aug. 8, 2002;1-9.
[No Author Listed], Teradyne Beefs Up High-Speed GbX Connector Platform. EE Times. Sep. 20, 2005. 3 pages.
[No Author Listed], Teradyne Connection Systems Introduces the GbX L-Series Connector. Press Release. Teradyne. Mar. 22, 2004. 5 pages.
[No Author Listed], Teradyne Schematic, Daughtercard Connector Assembly 5 Pair GbX, Drawing No. C-163-5101-500. Nov. 6, 2002. 1 page.
[No Author Listed], Tin as a Coating Material. Brush Wellman Engineered Materials. Jan. 2002;4(2). 2 pages.
[No Author Listed], Two and Four Pair HM-Zd Connectors. Tyco Electronics. Oct. 14, 2003;1-8.
[No Author Listed], Tyco Electronics Schematic, Header Assembly, Right Angle, 4 Pair HMZd, Drawing No. C-1469048. Jan. 10, 2002. 1 page.
[No Author Listed], Tyco Electronics Schematic, Receptacle Assembly, 2 Pair 25mm HMZd, Drawing No. C-1469028. Apr. 24, 2002. 1 page.
[No Author Listed], Tyco Electronics Schematic, Receptacle Assembly, 3 Pair 25mm HMZd, Drawing No. C1469081. May 13, 2002. 1 page.
[No Author Listed], Tyco Electronics Schematic, Receptacle Assembly, 4 Pair HMZd, Drawing No. C1469001. Apr. 23, 2002. 1 page.
[No Author Listed], Tyco Electronics Z-Dok+ Connector. May 23, 2003. pp. 1-15. http://zdok.tycoelectronics.com.
[No Author Listed], Tyco Electronics, SFP System. Small Form-Factor Pluggable (SFP) System. Feb. 2001. 1 page.
[No Author Listed], Typical conductive additives—Conductive Compounds. RTP Company. https://www.rtpcompany.com/products/conductive/additives.htm. Last accessed Apr. 30, 2021. 2 pages.
[No Author Listed], Z-Pack HM-Zd Connector, High Speed Backplane Connectors. Tyco Electronics. Catalog 1773095. 2009;5-44.
[No Author Listed], Z-Pack HM-Zd: Connector Noise Analysis for XAUI Applications. Tyco Electronics. Jul. 9, 2001. 19 pages.
Atkinson et al., High Frequency Electrical Connector, U.S. Appl. No. 15/645,931, filed Jul. 10, 2017.
Beaman, High Performance Mainframe Computer Cables. 1997 Electronic Components and Technology Conference. 1997;911-7.
Chung, Electrical applications of carbon materials. J. of Materials Science. 2004;39:2645-61.
Dahman, Recent Innovations of Inherently Conducting Polymers for Optimal (106-109 Ohm/Sq) ESD Protection Materials. RTD Company. 2001. 8 pages.
Do et al., A Novel Concept Utilizing Conductive Polymers on Power Connectors During Hot Swapping in Live Modular Electronic Systems. IEEE Xplore 2005; downloaded Feb. 18, 2021;340-345.
Eckardt, Co-Injection Charting New Territory and Opening New Markets. Battenfeld GmbH. Journal of Cellular Plastics. 1987;23:555-92.
Elco, Metral® High Bandwidth—A Differential Pair Connector for Applications up to 6 GHz. FCI. Apr. 26, 1999;1-5.
Feller et al., Conductive polymer composites: comparative study of poly(ester)-short carbon fibres and poly(epoxy)-short carbon fibres mechanical and electrical properties. Materials Letters. Feb. 21, 2002;57:64-71.
Getz et al., Understanding and Eliminating EMI in Microcontroller Applications. National Semiconductor Corporation. Aug. 1996. 30 pages.
Grimes et al., A Brief Discussion of EMI Shielding Materials. IEEE. 1993:217-26.
Housden et al., Moulded Interconnect Devices. Prime Faraday Technology Watch. Feb. 2002. 34 pages.
Hsu, Compact Electrical Connector, U.S. Appl. No. 17/867,067, filed Jul. 18, 2022.
McAlexander, CV of Joseph C. McAlexander III . Exhibit 1009. 2021. 31 pages.
McAlexander, Declaration of Joseph C. McAlexander III in Support of Petition for Inter Partes Review of U.S. Pat. No. 10,381,767. Exhibit 1002. Nov. 4, 2021. 85 pages.
Nadolny et al., Optimizing Connector Selection for Gigabit Signal Speeds. Sep. 2000. 5 pages.
Neelakanta, Handbook of Electromagnetic Materials: Monolithic and Composite Versions and Their Applications. CRC. 1995. 246 pages.
Okinaka, Significance of Inclusions in Electroplated Gold Films for Electronics Applications. Gold Bulletin. Aug. 2000;33(4):117-127.
Ott, Noise Reduction Techniques In Electronic Systems. Wiley. Second Edition. 1988. 124 pages.
Patel et al., Designing 3.125 Gbps Backplane System. Teradyne. 2002. 58 pages.
Preusse, Insert Molding vs. Post Molding Assembly Operations. Society of Manufacturing Engineers. 1998. 8 pages.
Reich et al., Microwave Theory and Techniques. Boston Technical Publishers, Inc. 1965;182-91.
Ross, Focus on Interconnect: Backplanes Get Reference Designs. EE Times. Oct. 27, 2003 [last accessed Apr. 30, 2021]. 4 pages.
Ross, GbX Backplane Demonstrator Helps System Designers Test High-Speed Backplanes. EE Times. Jan. 27, 2004 [last accessed May 5, 2021]. 3 pages.
Sasame et al., Electrical connector with cavity between terminals, U.S. Appl. No. 17/942,435, filed Sep. 12, 2022.
Shi et al. Improving Signal Integrity in Circuit Boards by Incorporating Absorbing Materials. 2001 Proceedings. 51st Electronic Components and Technology Conference, Orlando FL. 2001:1451-56.
Silva et al., Conducting Materials Based on Epoxy/Graphene Nanoplatelet Composites With Microwave Absorbing Properties: Effect of the Processing Conditions and Ionic Liquid. Frontiers in Materials. Jul. 2019;6(156):1-9. doi: 10.3389/fmats.2019.00156.
Tracy, Rev. 3.0 Specification IP (Intellectual Property). Mar. 20, 2020. 8 pages.
Violette et al., Electromagnetic Compatibility Handbook. Van Nostrand Reinhold Company Inc. 1987. 229 pages.
Wagner et al., Recommended Engineering Practice to Enhance the EMI/EMP Immunity of Electric Power Systems. Electric Research and Management, Inc. Dec. 1992. 209 pages.
Weishalla, Smart Plastic for Bluetooth. RTP Imagineering Plastics. Apr. 2001. 7 pages.
White, A Handbook on Electromagnetic Shielding Materials and Performance. Don Whie Consultants. 1998. Second Edition. 77 pages.
White, EMI Control Methodology and Procedures. Don White Consultants, Inc. Third Edition 1982. 22 pages.
Williams et al., Measurement of Transmission and Reflection of Conductive Lossy Polymers at Millimeter-Wave Frequencies. IEEE Transactions on Electromagnetic Compatibility. Aug. 1990;32(3):236-240.
Related Publications (1)
Number Date Country
20230049560 A1 Feb 2023 US