High performance magnetic angle sensor

Information

  • Patent Grant
  • 11280637
  • Patent Number
    11,280,637
  • Date Filed
    Thursday, November 14, 2019
    5 years ago
  • Date Issued
    Tuesday, March 22, 2022
    3 years ago
Abstract
A sensor is disclosed for detecting an orientation of a magnet, the sensor comprising: a first sensor array including a first plurality of sensor elements that are arranged along a first line; a second sensor array including a second plurality of sensor elements that are arranged along a second line; and a processing circuitry configured to: detect a magnetic field produced by the magnet by using the first sensor array, and identify a first point on the first line where at least one component of the magnetic field has a predetermined value; detect the magnetic field by using the second sensor array, and identify a second point on the second line where at least one component of the magnetic field has the predetermined value; detect an orientation of the magnet relative to the sensor based on the first point and the second point; and output an indication of the orientation of the magnet based on the first point and the second point.
Description
BACKGROUND

Magnetic angle sensors detect the orientation of an applied magnetic field by using integrated sensor elements. Magnetic angle sensors are used in industrial and automotive applications where it is desirable to measure a rotational position of a shaft (or another element). For example, in automotive applications, angle sensors may be used to detect camshaft position, steering wheel position, and throttle valve position. Magnetic angle sensors are advantageous over alternative means for detecting shaft position, such as potentiometers and optical sensors because they tend to be small, free of wear, and robust against dirt and pollution.


SUMMARY

This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.


According to aspects of the disclosure, a sensor is provided for detecting an orientation of a magnet, the sensor comprising: a first sensor array including a first plurality of sensor elements that are arranged along a first line; a second sensor array including a second plurality of sensor elements that are arranged along a second line; and a processing circuitry configured to: detect a magnetic field produced by the magnet by using the first sensor array, and identify a first point on the first line where at least one component of the magnetic field has a predetermined value; detect the magnetic field by using the second sensor array, and identify a second point on the second line where at least one component of the magnetic field has the predetermined value; detect an orientation of the magnet relative to the sensor based on the first point and the second point; and output an indication of the orientation of the magnet based on the first point and the second point.


According to aspects of the disclosure, a sensor for detecting an orientation of a magnet, the sensor comprising: a first sensor array including a first plurality of sensor elements that are arranged along a first line; a second sensor army including a second plurality of sensor elements that are arranged along a second line; and a processing circuitry configured to: identify a first pair of sensor elements in the first sensor array where a magnetic field produced by the magnet changes sign; identify a first point on the first line where at least one component of the magnetic field is substantially zero, the first point being identified based on respective readings that are taken using the sensor elements in the first pair; identify a second pair of sensor elements in the second sensor array where the magnetic field produced by the sensor changes sign; identify a second point on the second line where at least one component of the magnetic field is substantially zero, the second point being identified based on respective readings that are taken using the sensor elements in the second pair; detect the orientation of the magnet relative to the sensor based on the first point, the second point, and a distance between the first sensor array and the second sensor array; and output an indication of the orientation of the magnet.


According to aspects of the disclosure, a method for detecting an orientation of a magnet relative to a sensor, the sensor including a first sensor array having a plurality of sensor elements that are arranged along a first line and a second sensor array having a second plurality of sensor elements that are arranged along a second line, the method comprising: detecting a magnetic field produced by the magnet with the first sensor array; identifying a first point on the first line where at least one component of the magnetic field has a predetermined value; detecting the magnetic field with the second sensor array, and identifying a second point on the second line where the at least one component of the magnetic field has the predetermined value; detecting an orientation of the magnet relative to the sensor based on the first point and the second point; and outputting an indication of the orientation of the magnet based on the first point and the second point.





BRIEF DESCRIPTION OF THE DRAWING FIGURES

Other aspects, features, and advantages of the claimed concepts will become more fully apparent from the following detailed description, the appended claims, and the accompanying drawings in which like reference numerals identify similar or identical elements. Reference numerals that are introduced in the specification in association with a drawing figure may be repeated in one or more subsequent figures without additional description in the specification in order to provide context for other features.



FIG. 1A is a side view of an example of an electromechanical system, according to aspects of the disclosure;



FIG. 1B is a bottom-up view of the electromechanical system of FIG. 1A, according to aspects of the disclosure;



FIG. 1C is a side view of an example of a magnet that is part of the electromechanical system of FIG. 1A, according to aspects of the disclosure;



FIG. 1D is a top-down view of the magnet of FIG. 1B, according to aspects of the disclosure;



FIG. 1E is a plot of the level of the z-axis component of a magnetic field generated by the magnet of FIG. 1C, according to aspects of the disclosure;



FIG. 2 is a diagram of an example of a magnetic angle sensor, according to aspects of the disclosure;



FIG. 3 is a diagram of an example of a sensing module that is part of the magnetic angle sensor, according to aspects of the disclosure;



FIG. 4A is a flowchart of an example of a process that is performed by the sensor of FIG. 2, according to aspects of the disclosure;



FIG. 4B is a schematic diagram illustrating the execution of the process of FIG. 4A, according to aspects of the disclosure



FIG. 5A is a flowchart of an example of another process that is performed by the sensor of FIG. 2, according to aspects of the disclosure;



FIG. 5B is a schematic diagram illustrating the execution of the process of FIG. 4A, according to aspects of the disclosure



FIG. 6A is a diagram showing an alternative implementation of the sensing module of FIG. 3, according to aspects of the disclosure;



FIG. 6B is a diagram illustrating the division of the sensing module of FIG. 6A into quadrants, according to aspects of the disclosure; and



FIG. 7 is a flowchart of an example of yet another process that is performed by the sensor of FIG. 2, according to aspects of the disclosure.





DETAILED DESCRIPTION

According to aspects of the disclosure, a magnetic angle sensor is disclosed that is arranged to detect the orientation of a magnet relative to a die included in the sensor. The magnetic angle sensor may include a first sensor array, a second sensor array, and processing circuitry. The first sensor array may include a plurality of sensor elements that are arranged along a first axis. The second sensor array may include a plurality of sensor elements that are arranged along a second axis. The processing circuitry may be configured to: (i) identify a first point on the first axis where the level of a magnetic field produced by the magnet has a predetermined value (e.g., zero or another value), (ii) identify a second point on the second axis where the magnetic field has the predetermined value, and (iii) estimate an orientation of a magnet (e.g., an angular position of the magnet) based on the first point and the second point.



FIGS. 1A-B show an example of a system 100, according to aspects of the disclosure. The system 100 may include a sensor 110, a magnet 120, and a shaft 130. The shaft 130 may have a central, longitudinal axis S-S and it may be coupled to the magnet 120, as shown. In operation, the shaft 130 may be arranged to rotate about the longitudinal axis S-S, causing the magnet 120 to rotate with it. The sensor 110 may be disposed proximate the magnet 120 (e.g., positioned underneath the magnet as illustrated in FIG. 1A), and it may be configured to output a signal that indicates the rotational angle of the magnet 120 relative to the sensor 110. Although in the present example the sensor 110 is positioned underneath the magnet 120, alternative implementations are possible in which the sensor is positioned to the side of the magnet 120 and/or above the magnet 120. Stated succinctly, the present disclosure is not limited to any specific positioning of the sensor 110 with respect to the magnet 120.



FIGS. 1C-D shown the magnet 120 in further detail. As illustrated in FIGS. 1C-D, the magnet 120 may have a cylindrical shape, and magnetic axes M-M and E′-E′, which together define a plane that separates the magnet's 120 magnetic poles 122 and 124. Furthermore, the magnet 120 may have a zero-field line E′-E′, which is orthogonal to the magnetic axis F-F and parallel (or arranged at an angle) to the plane of the sensor 110. The magnet 120 may be configured to produce a magnetic field H which is defined in terms of a three-dimensional coordinate system 126. As illustrated, the coordinate system 126 may have an x-axis, a y-axis, and a z-axis. In this regard, the magnetic field H may have an x-axis component, a y-axis component, and a z-axis component. According to the present example, the magnetic axis M-M of the magnet 120 is parallel with the z-axis component of the magnetic field H (and the z-axis of the coordinate system 126), whereas the magnetic axis F-F is orthogonal to the z-axis component of the magnetic field H, and extends in the plane defined by the x-axis and the y-axis of the coordinate system 126. According to the present example, the x-axis component of the magnetic field H is parallel with the x-axis of the coordinate system 126, and the y-axis component of the magnetic field H is parallel with the y-axis of the coordinate system 126. Although in the present example, the axis M-M is aligned with the longitudinal axis S-S of the shaft 130, alternative implementations are possible in which the axis M-M is offset from to the longitudinal axis S-S.


Furthermore, according to the present example, the sensor 110 is configured to measure the level of the z-axis component of the magnetic field H, and use the level of the z-axis component of the magnetic field H as a basis for calculating the rotational angle of the magnet 120 relative to the sensor 110. The rotational angle of the magnet 120 can be expressed in terms of the orientation of the zero-field axis E′-E′ of the magnet 120 relative to axes A-A and B-B in the plane of the sensor 110. The relationship between: (i) the level of the z-axis component of the magnetic field H and (ii) the orientation of the zero-field axis E′-E′ of the magnet 120 relative to the plane of the sensor 110 is illustrated by FIG. 4B.



FIG. 1E shows a plot 142 of the field distribution of the z-axis component of the magnetic field H along the magnetic axis F-F. The origin of the plot corresponds to the location of the center of the magnet 120. The sensor 110, is positioned under the region of the axis F-F, which extends between 1 mm and −1 mm, and it is configured to measure the z-axis component of the magnetic field M in this region. The plot 142 is provided to illustrate that the z-axis component of the magnetic field M, in the region measured by the sensor 110, is quite linear, which in turn permits the use of interpolation to determine the orientation of the magnet 120 relative to the sensor 110. The manner in which interpolation is used to determine orientation of the magnet 120 is discussed further below with respect to FIGS. 2-7.



FIG. 2 shows a block diagram of the sensor 110, according to aspects of the disclosure. As illustrated, the sensor 110 may include a sensor module 210, an amplifier 220, an analog-to-digital converter (ADC 230), and a processing circuitry 240. The sensor 110 may include a plurality of sensor elements (shown in FIG. 3), and it may be configured to output signal(s) 212 that are generated by one or more of the sensor elements. The amplifier 220 may amplify the signal 212 to produce an amplified signal 222, which is subsequently supplied to the ADC 230. The ADC 230 may digitize the amplified signal 222 to produce a digital signal 232, which is subsequently supplied to the processing circuitry 240. The processing circuitry 240 may be configured to process the digital signal 232 to determine the orientation of the magnet 120 relative to the sensor 110 and output a signal 242 that indicates the orientation of the magnet 120 relative to the sensor 110. The signal 242 may be either a digital signal or an analog signal (in which case the processing circuitry 240 would include a DAC). Furthermore, the processing circuitry 240 may be configured to provide the sensor module 210 with a selection signal 244, which is used to select one or more of the sensor elements in the sensor 110. The manner in which the selection signal 244 is used is discussed further below with respect to FIG. 3.



FIG. 3 is a block diagram showing the sensor module 210 in further detail, according to aspects of the disclosure. According to the example of FIG. 3, the sensor module 210 may include a first sensor array 310, a second sensor array 320, and selection circuitry 330. The sensor array 310 may include a plurality of sensor elements 312, that are disposed along an axis A-A. The sensor array 320 may include a plurality of sensor elements 322 that are disposed along an axis B-B. According to the present example, each of the sensor elements 312 and 322 may include a Hall effect element that is arranged to measure the level of the z-axis component of the magnetic field H of the sensor 120. However, it will be understood that alternative implementations are possible in which another type of sensor element is used, such as a Vertical Hall sensor, a Giant magnetoresistance (GMR) sensor, a tunnel magnetoresistance (TMR) sensor, and/or any other suitable type of sensor.


The selection circuitry 330 may include one or more switching elements that are configured to selectively couple one, some or each of the sensor elements 312 and 322 to the amplifier 220 and/or processing circuitry 240. More specifically, the selection circuitry 330 may be configured to receive the selection signal 344 from the processing circuitry 240, which identifies one of the sensor elements 312 and 322. In response to the selection signal 344, the selection circuitry may electrically couple the identified sensor element to the amplifier 220, thereby enabling the processing circuitry 240 to obtain one or more sensor readings that are generated by the identified sensor element. Each of the sensor reading may identify the level of the z-axis component of the magnetic field H of the magnet 120. In operation, the processing circuitry may sample each of the sensors elements 312 and 322 in rapid succession, to obtain a set of sensor readings that are generated by the sensor elements 312 and 322, such that each of the sensor readings is generated by a different one of the sensor elements 312 and 314. As is further discussed below, the processing circuitry 240 may process the set of sensor readings to determine the orientation of the magnet 120 relative to the sensor 110.


According to the present example, the sensor module 210 is coupled to the processing circuitry 240 via a single channel, and the selection signal 244 is arranged to select only one of the sensor elements 312 and 322. However, it will be understood that alternative implementations are possible in which the sensor module 210 is coupled to the processing circuitry 240 via n channels, where n is an integer greater than 1. In such implementations, the selection signal 244 may be arranged to select n sensor elements, thereby allowing the processing circuitry to obtain n sensor readings in parallel.



FIGS. 4A-B illustrate a process 400 for determining the orientation of the magnet 120 relative to the sensor 110. According to the present example, the process 400 is performed by the processing circuitry 240, which is part of the sensor 110. However, alternative implementations are possible in which process 400 is performed by processing circuitry that is external to the sensor 110. Stated succinctly, the present disclosure is not limited to any specific processing circuitry or processing method for implementing the process 400.


At processing block 410, processing begins by detecting the magnetic field H with the sensor array 310. In some implementations, detecting the magnetic field H may include obtaining a first plurality of sensor readings, wherein each of the sensor readings is obtained by a different one of the sensor elements 312 in the array 310. In some implementations, each of the sensor readings may identify the z-axis component of the magnetic field H at the location of the sensor element 312 that has generated the reading. As used throughout the disclosure, the term “sensor reading” is defined as any number, string, and/or an alphanumerical string that identifies a quantity that is measured by a respective sensor element.


In processing block 420, the magnetic field H is detected by using the sensor array 320. In some implementations, detecting the magnetic field H may include obtaining a second plurality of sensor readings, wherein each of the sensor readings is obtained by a different one of the sensor elements 322 in the sensor array 320.


In processing block 430, the processing circuitry 240 identifies a point on the axis A-A where at least one component of the magnetic field H is equal to zero. According to the present example, the processing circuitry 240 identifies a point P1, on the axis A-A, where the level of the z-axis component of the magnetic field H is estimated to be equal to zero (or another predetermined value). In some implementations, the point P1 may be identified in accordance with the process 500, which is discussed further below with respect to FIGS. 5A-B.


In processing block 440, the processing circuitry 240 identifies a point on the axis B-B where at least one component of the magnetic field H is equal to zero. According to the present example, the processing circuitry 240 identifies a point P2, on the axis B-B, where the level of the z-axis component of the magnetic field H is estimated to be equal to zero (or another predetermined value). In some implementations, the point P2 may be identified in accordance with the process 500, which is discussed further below with respect to FIGS. 5A-B.


In processing block 450, the processing circuitry 240 detects the orientation of the magnet 120 relative to the sensor 110. In some implementations, detecting the orientation of the magnet 120 may include identifying the orientation of a zero-field line E-E (that connects points P1 and P2), as illustrated in FIG. 4B, relative to at least one of the axes A-A and B-B. In some respects, in the presence of stray magnetic fields, the position of the zero-field line E-E may shift (relative to zero-field line E′-E′ of the magnet 120, which is shown in FIGS. 1B-D), while remaining at the same angle relative to at least one of the axes A-A and B-B. However, when stray magnetic fields are not present, the zero-field line E-E may be substantially aligned with the zero-field line E′-E′ of the magnet 120. Because the orientation of the zero-field line E-E is unaffected by stray magnetic fields, the zero-field line E-E may be used as a proxy for determining the orientation of the magnet 120 relative to the sensor 120. As can be readily appreciated, in some implementations, zero field lines E′-E′ and E-E may remain substantially parallel to one another of all times, irrespective of whether stray magnetic fields are present.


According to the example of FIGS. 4A-B, to determine the orientation of the magnet 120 relative to the sensor 110, the processing circuitry 240 calculates an angle A between the zero-field line E-E and the axis A-A of the sensor array 310. In some implementations, the angle A may be determined by using Equation 1 below:









A
=

atan


(



P

2

-

P

1


D

)






(

Eq
.




1

)








where P1 is the position of point P1 along axis A-A (e.g., distance from a reference point on axis A-A), P2 is the position of point P2 along axis B-B (e.g., distance from the reference point), and D is the distance between axis A-A and axis B-B.


In processing block 460, the processing circuitry 240 outputs a signal indicating the orientation of the magnet 120 relative to the sensor 110. According to the present example, the signal indicates (or is otherwise based on) the value of angle A. However, alternative implementations are possible in which the signal indicates (or is otherwise based on) the value of any angle between the axis E-E and one of the axes A-A and B-B. Furthermore, in some implementations, the signal may be an analog signal. Additionally or alternatively, in some implementations, the signal may be a digital signal. It will be understood that the present disclosure is not limited to any specific type of signal being output by the processing circuitry 240.



FIGS. 5A-B illustrate a process 500 for determining a point on the axis A-A of the sensor array 310, where the z-axis component of the magnetic field H is equal to zero. Although the process 500 is described in the context of the sensor array 310, it will be understood that the process 500 may be used to determine a similar point on the axis B-B. In this regard, in some implementations, the process 500 may be used to determine the values of points P1 and P2, as discussed above with respect to processing blocks 430 and 440.


In processing block 510, a pair of sensor elements 312 are identified where the z-axis component magnetic field H changes direction. The pair may include a sensor element 312n, at which the z-axis component of the magnetic field H is positive and another sensor element 312n+1 at which the z-axis component of the magnetic field H is negative (e.g., as illustrated in FIG. 1E). According to the present example, n may be an integer that is greater than or equal to 1 and less than or equal to the count of sensors elements 312 in the sensor array 310. Although in the present example the pair includes adjacent sensor elements 312, alternative implementations are possible in which the sensor elements in the pair are non-adjacent. According to the present example, a pair of sensor elements in the same array are adjacent to one another when there are no other sensor elements from the array that are situated between them.


In processing block 520, the level (e.g., magnitude) of the magnetic field H is determined at the location of one of the sensor elements in the pair. According to the present example, the level (e.g., magnitude) An of the z-axis component of the magnetic field H is determined at the location of sensor element 312n. As can be readily appreciated, the level of the magnetic field H may be determined based on a reading that is obtained from the sensor element 312n.


In processing block 530, the level of the magnetic field H is determined at the location of the other one of the sensor elements in the pair. According to the present example, the level An+1 of the z-axis component of the magnetic field H is determined at the location of sensor element 312n+1. As can be readily appreciated, the level of the magnetic field H may be determined based on a reading that is obtained from the sensor element 312n+1.


In processing block 540, a location on the axis A-A of the sensor array 310 is determined where the magnetic field H is expected to be zero. According to the present example, a location x is determined, on the axis A-A, where the z-axis component of the magnetic field H is expected to be equal to zero. In some implementations, the location x is determined by interpolating between the first sensor reading that is obtained from the sensor element 312n with a second sensor reading that is obtained from the second sensor element 312n+1. In some implementations, the interpolation may be performed by using Equation 2 below:









x
=

p


(


B
n



B
n

-

B

n
+
1




)






(

Eq
.




2

)








where p is the distance between the sensor elements in the pair (e.g., pitch of the sensor element or a multiple of the pitch of the sensor elements, etc.).


In processing block 550, one or more coordinates of the point P are determined based on the location x. In some implementations, only an x-axis coordinate (e.g., in the coordinate system 126) may be determined for the point P. In such implementations, the x-axis coordinate of the point P may be determined by using Equation 3 below.

P=q+x  (Eq. 3)


where q is the distance (along the axis A-A) between the sensor element 3121 and the sensor element 312n.



FIG. 6A is a diagram of the sensor module 210, in accordance with another implementation. Unlike the example discussed with respect to FIG. 3, in the example of FIG. 6A, the sensor module 210 may include a sensor array 610 and a sensor array 620, in addition to the sensor arrays 310 and 320. As illustrated, the sensor array 610 may include a plurality of sensor elements that are distributed along an axis C-C and the sensor array 620 may include a plurality of sensor elements that are distributed along an axis D-D. Each of the sensor elements in the sensor arrays 610 and/or 620 may be the same or similar to any of the sensor elements 312 or 322. As shown, the sensor array 610 may include one sensor element in common with the sensor array 310 and another sensor element in common with the sensor array 620. Similarly, the sensor array 610 may include one sensor element in common with the sensor array 310 and another sensor element in common with the sensor array 620. According to the present example, the axes C-C and D-D are parallel to one another and orthogonal to the axes A-A and B-B. However, it will be understood that alternative implementations are possible in which any of the axes C-C and D-D intersects at least one of the axes A-A and B-B at a different angle (e.g., a sharp angle or an obtuse angle).



FIG. 6B is a schematic diagram illustrating the division of the sensor module 210 into quadrants, Q1, Q2, Q3, and Q4. In some implementations, when the sensor module 210 includes only the sensor arrays 310 and 320 (e.g., see FIG. 3), the sensor module 210 may be able to reliably measure the orientation of the magnet 120 only when the axis C-C of the magnet 120 overlaps with quadrants Q1 and Q2. In this regard, the addition of the sensor arrays 610 and 620 to the sensor module 210 (e.g., see FIG. 6B) enables the sensor module 210 to detect the orientation of the magnet 120 when the zero-field line E-E overlaps with quadrants Q3 and Q4. In other words, the addition of the sensor arrays 610 and 620 affords the sensor module 210 a complete 360-degree coverage.


In some implementations, when the sensor module 210 includes only the sensor arrays 310 and 320 (e.g., see FIG. 3), the sensor module 210 may be unable to reliably measure the orientation of the magnet 120 when the zero-field line E-E of the magnet 120 overlaps with quadrants Q3 and Q4 for at least several reasons. For instance, when the zero-field line E-E is parallel with any of the axes A-A and B-B, Equation 2 may not have a solution. Furthermore, because the length of the sensor arrays 310 and 320 is limited, the zero-field line E-E may not intersect the sensor arrays 310 and 320 when it is situated at a comparatively sharp angle relative to the axes A-A and B-B.



FIG. 7 is a flowchart of an example of a process 700 for using the sensor module 210′ that is shown in FIG. 6A. According to the present example, the process 700, may, for example, be performed by the processing circuitry 240, which is part of the sensor 110. However, alternative implementations are possible in which the process 700 is performed by processing circuitry that is external to the sensor 110. Stated succinctly, the present disclosure is not limited to any specific method for implementing the process 700.


In processing block 710, the processing circuitry 240 senses the magnetic field H by using the sensor arrays 310 and 320. In some implementations, sensing the magnetic field H may include obtaining a plurality of readings from the sensor arrays 310 and 320, wherein each of the readings in the plurality is generated by a different one of the sensor elements in the sensor arrays 310 and 320.


In processing block 720, the processing circuitry 240 senses the magnetic field H by using the sensor arrays 610 and 620. In some implementations, sensing the magnetic field H may include obtaining a plurality of readings from the sensor arrays 610 and 620, wherein each of the readings in the plurality is generated by a different one of the sensor elements in the sensor arrays 610 and 620.


In processing block 730, the processing circuitry 240 calculates a first estimate of the orientation of the magnet 120 relative to the sensor 110. The first estimate may include any suitable type of number, string, or alphanumerical string. The first estimate may be calculated based on any of the data that is obtained at processing block 710, as discussed with respect to processing blocks 430-450 of the process 400. In some implementations, the first estimate may have one of at least two possible values: (i) a value that indicates an angle between the zero-field line E-E of the magnet 120 and at least one of the axes A-A and B-B of the sensor arrays 310 and 320, and (ii) a second value that indicates that first estimate is invalid. In some implementations, the second value may be assigned to the first estimate when Equation 1 has no solution or when the solution of Equation 1 is out of predetermined bounds. As noted above, in some implementations, Equation 1 may lack a solution when the zero-field line E-E of the magnet 120 is parallel with the axes A-A and B-B of the sensor arrays 120. Similarly, in instances in which it is impossible to identify a pair of sensing elements at which the magnetic field H changes sign, Equation 1 may also be said to lack a solution.


In processing block 740, the processing circuitry 240 calculates a second estimate of the orientation of the magnet 120 relative to the sensor 110. The second estimate may include any suitable type of number, string, or alphanumerical string. The second estimate may be calculated based on any of the data that is obtained at processing block 720, as discussed with respect to processing blocks 430-450 of the process 400. In some implementations, the first estimate may have one of at least two possible values: (i) a value that indicates an angle between the zero-field line E-E of the magnet 120 and at least one of the axes C-C and D-D of the sensor arrays 310 and 320, and (ii) a second value that indicates that second estimate is invalid. In some implementations, the second value may be assigned to the second estimate when Equation 1 has no solution or when the solution of Equation 1 is out of predetermined bounds. As noted above, in some implementations, Equation 1 may lack a solution when the zero-field line E-E of the magnet 120 is parallel with the axes C-C and D-D of the sensor arrays 610 and 620, respectively. Similarly, in instances in which it is impossible to identify a pair of sensing elements at which the magnetic field H changes sign, Equation 1 may also be said to lack a solution.


In processing block 750, the processing circuitry 240 selects one of the first estimate and the second estimate. In some implementations, when the second estimate is invalid, the processing circuitry 240 may select the first estimate. Additionally or alternatively, in some implementations, when the first estimate is invalid, the processing circuitry 240 may select the second estimate. Additionally or alternatively, in some implementations, the sensor arrays 310, 320, 610, and 620 may be arranged such that only one of the first estimate and the second estimate is valid.


In processing block 760, the processing circuitry 240 outputs a signal indicating the orientation of the magnet 120. In some implementations, the signal may be generated based on the estimate selected at processing block 750. As noted above, the signal may be either an analog signal or a digital signal.


As used in this application, the word “exemplary” is used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, use of the word exemplary is intended to present concepts in a concrete fashion. As used throughout the disclosure, the term product may include a physical object that is being bought and sold, a service, and/or anything else that can be purchased and solved.


Additionally, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or”. That is, unless specified otherwise, or clear from context, “X employs A or B” is intended to mean any of the natural inclusive permutations. That is, if X employs A; X employs B; or X employs both A and B, then “X employs A or B” is satisfied under any of the foregoing instances. In addition, the articles “a” and “an” as used in this application and the appended claims should generally be construed to mean “one or more” unless specified otherwise or clear from context to be directed to a singular form.


To the extent directional terms are used in the specification and claims (e.g., upper, lower, parallel, perpendicular, etc.), these terms are merely intended to assist in describing and claiming the invention and are not intended to limit the claims in any way. Such terms, do not require exactness (e.g., exact perpendicularity or exact parallelism, etc.), but instead it is intended that normal tolerances and ranges apply. Similarly, unless explicitly stated otherwise, each numerical value and range should be interpreted as being approximate as if the word “about”, “substantially” or “approximately” preceded the value of the value or range.


Moreover, the terms “system,” “component,” “module,” “interface,”, “model” or the like are generally intended to refer to a computer-related entity, either hardware, a combination of hardware and software, software, or software in execution. For example, a component may be, but is not limited to being, a process running on a processor, a processor, an object, an executable, a thread of execution, a program, and/or a computer. By way of illustration, both an application running on a controller and the controller can be a component. One or more components may reside within a process and/or thread of execution and a component may be localized on one computer and/or distributed between two or more computers.


Although the subject matter described herein may be described in the context of illustrative implementations to process one or more computing application features/operations for a computing application having user-interactive components the subject matter is not limited to these particular embodiments. Rather, the techniques described herein can be applied to any suitable type of user-interactive component execution management methods, systems, platforms, and/or apparatus.


While the exemplary embodiments have been described with respect to processes of circuits, including possible implementation as a single integrated circuit, a multi-chip module, a single card, or a multi-card circuit pack, the described embodiments are not so limited. As would be apparent to one skilled in the art, various functions of circuit elements may also be implemented as processing blocks in a software program. Such software may be employed in, for example, a digital signal processor, micro-controller, or general-purpose computer.


Although in the example of FIGS. 1A-7 the magnet 120 has a cylindrical shape, it will be understood that the present disclosure is not limited to the magnet 120 having any specific shape. In this regard, alternative implementations are possible in which the magnet is shaped as a parallelepiped, a truncated pyramid, etc. Although in the example of FIG. 3 axes A-A and B-B are parallel to one another, alternative implementations are possible in which the axes A-A and B-B are not parallel. Although in the example of FIG. 3, the pitch of the sensor elements 312 in the sensor array 310 is uniform, alternative implementations are possible in which the pitch of the sensor elements 312 in the sensor array 310 is not uniform. Similarly, although in the example of FIG. 3, the pitch of the sensor elements 322 in the sensor array 320 is uniform, alternative implementations are possible in which the pitch of the sensor elements 322 in the sensor array 320 is not uniform.


Some embodiments might be implemented in the form of methods and apparatuses for practicing those methods. Described embodiments might also be implemented in the form of program code embodied in tangible media, such as magnetic recording media, optical recording media, solid state memory, floppy diskettes, CD-ROMs, hard drives, or any other machine-readable storage medium, wherein, when the program code is loaded into and executed by a machine, such as a computer, the machine becomes an apparatus for practicing the claimed invention. Described embodiments might also be implemented in the form of program code, for example, whether stored in a storage medium, loaded into and/or executed by a machine, or transmitted over some transmission medium or carrier, such as over electrical wiring or cabling, through fiber optics, or via electromagnetic radiation, wherein, when the program code is loaded into and executed by a machine, such as a computer, the machine becomes an apparatus for practicing the claimed invention. When implemented on a general-purpose processor, the program code segments combine with the processor to provide a unique device that operates analogously to specific logic circuits. Described embodiments might also be implemented in the form of a bitstream or other sequence of signal values electrically or optically transmitted through a medium, stored magnetic-field variations in a magnetic recording medium, etc., generated using a method and/or an apparatus of the claimed invention.


It should be understood that the processing blocks of the exemplary methods set forth herein are not necessarily required to be performed in the order described, and the order of the processing blocks of such methods should be understood to be merely exemplary. Likewise, additional processing blocks may be included in such methods, and certain processing blocks may be omitted or combined, in methods consistent with various embodiments.


Also, for purposes of this description, the terms “couple,” “coupling,” “coupled,” “connect,” “connecting,” or “connected” refer to any manner known in the art or later developed in which energy is allowed to be transferred between two or more elements, and the interposition of one or more additional elements is contemplated, although not required. Conversely, the terms “directly coupled,” “directly connected,” etc., imply the absence of such additional elements.


As used herein in reference to an element and a standard, the term “compatible” means that the element communicates with other elements in a manner wholly or partially specified by the standard, and would be recognized by other elements as sufficiently capable of communicating with the other elements in the manner specified by the standard. The compatible element does not need to operate internally in a manner specified by the standard.


It will be further understood that various changes in the details, materials, and arrangements of the parts which have been described and illustrated in order to explain the nature of the claimed invention might be made by those skilled in the art without departing from the scope of the following claims.

Claims
  • 1. A sensor for detecting an orientation of a magnet, the sensor comprising: a first sensor array including a first plurality of sensor elements that are arranged along a first line, the first sensor array including at least three sensor elements;a second sensor array including a second plurality of sensor elements that are arranged along a second line, the second sensor array including at least three sensor elements; anda processing circuitry configured to:identify a first pair of sensor elements in the first sensor array, the first pair including a sensor element at which a component of a magnetic field is positive and a sensor element at which the component of the magnetic field is negative;identify a first point on the first line where the component of the magnetic field has a predetermined value based on respective readings that are taken using the sensor elements in the first pair;identify a second pair of sensor elements in the second sensor array, the second pair including a sensor element at which the component of the magnetic field is positive and a sensor element at which the component of the magnetic field is negative;identify a second point on the second line where the component of the magnetic field has the predetermined value based on respective readings that are taken using the sensor elements in the second pair;detect the orientation of the magnet relative to the sensor based on the first point and the second point; andoutput an indication of the orientation of the magnet based on the first point and the second point.
  • 2. The sensor of claim 1, wherein the orientation of the magnet is detected further based on a distance between the first sensor array and the second sensor array.
  • 3. The sensor of claim 1, wherein: the component of the magnetic field includes a z-axis component of the magnetic field;the first point includes a location on the first line where the z-axis component of the magnetic field is estimated to be equal to zero, andthe second point includes a location on the second line where the z-axis component of the magnetic field is estimated to be equal to zero.
  • 4. The sensor of claim 1, wherein: detecting the orientation of the magnet includes detecting an angle between a zero-crossing line and one of the first line and the second line, andthe zero-crossing line extends between the first point and the second point.
  • 5. The sensor of claim 1, wherein either the first plurality of sensor elements or the second plurality of sensor elements comprises a Hall effect element.
  • 6. The sensor of claim 1, wherein the component of the magnetic field includes a z-axis component of the magnetic field.
  • 7. The sensor of claim 1, wherein the first sensor array has a non-uniform pitch, and the second sensor array has a non-uniform pitch.
  • 8. The sensor of claim 1, wherein the sensors in the first pair are adjacent to one another, and the sensors in the second pair are adjacent to one another.
  • 9. A sensor for detecting an orientation of a magnet, the sensor comprising: a first sensor array including a first plurality of sensor elements that are arranged along a first line;a second sensor array including a second plurality of sensor elements that are arranged along a second line;a third sensor array including a third plurality of sensor elements that are arranged along a third line, the third line being transverse to the first line and the second line; anda fourth sensor array including a fourth plurality of sensor elements that are arranged along a fourth line, the fourth line being transverse to the first line and the second line,a processing circuitry configured to: detect the orientation of the magnet by using the first sensor array, the second sensor array, the third sensor array and the fourth sensor array; and output an indication of the orientation of the magnet.
  • 10. A sensor for detecting an orientation of a magnet, the sensor comprising: a first sensor array including a first plurality of sensor elements that are arranged along a first line, the first plurality of sensor elements including at least three sensor elements;a second sensor array including a second plurality of sensor elements that are arranged along a second line, the second plurality of sensor elements including at least three sensor elements; anda processing circuitry configured to:identify a first pair of sensor elements in the first sensor array where a magnetic field produced by the magnet changes sign;identify a first point on the first line where at least one component of the magnetic field has a predetermined value, the first point being identified based on respective readings that are taken using the sensor elements in the first pair;identify a second pair of sensor elements in the second sensor array where the magnetic field produced by the sensor changes sign;identify a second point on the second line where the at least one component of the magnetic field has a predetermined value, the second point being identified based on respective readings that are taken using the sensor elements in the second pair;detect the orientation of the magnet relative to the sensor based on the first point, the second point, and a distance between the first sensor array and the second sensor array; andoutput an indication of the orientation of the magnet.
  • 11. The sensor of claim 10, wherein detecting the magnetic field with the first sensor array includes detecting only a z-axis component of the magnetic field and detecting the magnetic field with the second sensor array includes detecting only the z-axis component of the magnetic field, the z-axis component of the magnetic field being transverse to a plane of the magnet.
  • 12. The sensor of claim 10, wherein the sensor elements in the first pair are adjacent to one another, and the sensor elements in the second pair are adjacent to one another.
  • 13. The sensor of claim 10, wherein the first line is a straight line, and the second line is a straight line.
  • 14. The sensor of claim 10, wherein either the first plurality of sensor elements or the second plurality of sensor elements includes a Hall effect element.
  • 15. A method for detecting an orientation of a magnet relative to a sensor, the sensor including a first sensor array having at least three sensor elements that are arranged along a first line and a second sensor array having at least three sensor elements that are arranged along a second line, the method comprising: identifying a first pair of sensor elements in the first sensor array where a magnetic field produced by the magnet changes sign;identifying a first point on the first line where at least one component of the magnetic field has a predetermined value based on respective readings that are taken using the sensor elements in the first pair;identifying a second pair of sensor elements in the second sensor array where the magnetic field produced by the magnet changes sign;identifying a second point on the second line where the at least one component of the magnetic field has the predetermined value based on respective readings that are taken using the sensor elements in the second pair;detecting the orientation of the magnet relative to the sensor based on the first point and the second point; andoutputting an indication of the orientation of the magnet based on the first point and the second point.
  • 16. The method of claim 15, wherein: the first point includes a location on the first line where a z-axis component of the magnetic field is estimated to be equal to zero, andthe second point includes a location on the second line where the z-axis component of the magnetic field is estimated to be equal to zero.
  • 17. The method of claim 15, wherein the first line is a straight line, and the second line is a straight line.
  • 18. The method of claim 16, wherein the first sensor array has a non-uniform pitch and the second sensor array has a non-uniform pitch.
US Referenced Citations (504)
Number Name Date Kind
3132337 Martin May 1964 A
3195043 Burig et al. Jul 1965 A
3281628 Bauer et al. Oct 1966 A
3607528 Gassaway Sep 1971 A
3611138 Winebrener Oct 1971 A
3661061 Tokarz May 1972 A
3728786 Lucas et al. Apr 1973 A
4048670 Eysermans Sep 1977 A
4079360 Ookubo et al. Mar 1978 A
4180753 Cook, II Dec 1979 A
4188605 Stout Feb 1980 A
4204317 Winn May 1980 A
4236832 Komatsu et al. Dec 1980 A
4283643 Levin Aug 1981 A
4315523 Mahawili et al. Feb 1982 A
4438347 Gehring Mar 1984 A
4490674 Ito Dec 1984 A
4573258 Io et al. Mar 1986 A
4614111 Wolff Sep 1986 A
4649796 Schmidt Mar 1987 A
4668914 Kersten et al. May 1987 A
4670715 Fuzzell Jun 1987 A
4719419 Dawley Jan 1988 A
4733455 Nakamura et al. Mar 1988 A
4745363 Carr et al. May 1988 A
4746859 Malik May 1988 A
4752733 Petr et al. Jun 1988 A
4758943 Aström et al. Jul 1988 A
4760285 Nelson Jul 1988 A
4761569 Higgs Aug 1988 A
4764767 Ichikawa et al. Aug 1988 A
4769344 Sakai et al. Sep 1988 A
4772929 Manchester Sep 1988 A
4789826 Willett Dec 1988 A
4796354 Yokoyama et al. Jan 1989 A
4823075 Alley Apr 1989 A
4829352 Popovic et al. May 1989 A
4833406 Foster May 1989 A
4893027 Kammerer et al. Jan 1990 A
4908685 Shibasaki et al. Mar 1990 A
4910861 Dohogne Mar 1990 A
4935698 Kawaji et al. Jun 1990 A
4944028 Iijima et al. Jul 1990 A
4954777 Klopfer et al. Sep 1990 A
4970411 Halg et al. Nov 1990 A
4983916 Iijima et al. Jan 1991 A
5012322 Guillotte Apr 1991 A
5021493 Sandstrom Jun 1991 A
5028868 Murata et al. Jul 1991 A
5038130 Eck et al. Aug 1991 A
5045920 Vig et al. Sep 1991 A
5078944 Yoshino Jan 1992 A
5084289 Shin et al. Jan 1992 A
5121289 Gagliardi Jun 1992 A
5137677 Murata Aug 1992 A
5139973 Nagy et al. Aug 1992 A
5167896 Hirota et al. Dec 1992 A
5168244 Muranaka Dec 1992 A
5185919 Hickey Feb 1993 A
5196794 Murata Mar 1993 A
5200698 Thibaud Apr 1993 A
5210493 Schroeder et al. May 1993 A
5216405 Schroeder et al. Jun 1993 A
5220207 Kovalcik et al. Jun 1993 A
5244834 Suzuki et al. Sep 1993 A
5247202 Popovic et al. Sep 1993 A
5247278 Pant et al. Sep 1993 A
5250925 Shinkle Oct 1993 A
5286426 Rano, Jr. et al. Feb 1994 A
5289344 Gagnon et al. Feb 1994 A
5291133 Gokhale et al. Mar 1994 A
5304926 Wu Apr 1994 A
5315245 Schroeder et al. May 1994 A
5329416 Ushiyama et al. Jul 1994 A
5331478 Aranovsky Jul 1994 A
5332956 Oh Jul 1994 A
5332965 Wolf et al. Jul 1994 A
5341097 Wu Aug 1994 A
5351028 Krahn Sep 1994 A
5399968 Sheppard et al. Mar 1995 A
5412255 Wallrafen May 1995 A
5414355 Davidson et al. May 1995 A
5424558 Borden et al. Jun 1995 A
5432444 Yasohama et al. Jul 1995 A
5434105 Liou Jul 1995 A
5453727 Shibasaki et al. Sep 1995 A
5469058 Dunnam Nov 1995 A
5477143 Wu Dec 1995 A
5479695 Grader et al. Jan 1996 A
5486759 Seiler et al. Jan 1996 A
5488294 Liddell et al. Jan 1996 A
5491633 Henry et al. Feb 1996 A
5497081 Wolf et al. Mar 1996 A
5497083 Nakazato et al. Mar 1996 A
5500589 Sumcad Mar 1996 A
5500994 Itaya Mar 1996 A
5508611 Schroeder et al. Apr 1996 A
5521501 Dettmann et al. May 1996 A
5541506 Kawakita et al. Jul 1996 A
5545983 Okeya et al. Aug 1996 A
5551146 Kawabata et al. Sep 1996 A
5552706 Carr Sep 1996 A
5572058 Biard Nov 1996 A
5581170 Mammano et al. Dec 1996 A
5581179 Engel et al. Dec 1996 A
5583436 Van De Walle et al. Dec 1996 A
5585574 Sugihara et al. Dec 1996 A
5596272 Busch Jan 1997 A
5612618 Arakawa Mar 1997 A
5619137 Vig et al. Apr 1997 A
5621319 Bilotti et al. Apr 1997 A
5627315 Figi et al. May 1997 A
5631557 Davidson May 1997 A
5640090 Furuya et al. Jun 1997 A
5657189 Sandhu Aug 1997 A
5691637 Oswald et al. Nov 1997 A
5694038 Moody et al. Dec 1997 A
5696790 Graham et al. Dec 1997 A
5712562 Berg Jan 1998 A
5714102 Highum et al. Feb 1998 A
5719496 Wolf Feb 1998 A
5729128 Bunyer et al. Mar 1998 A
5757181 Wolf et al. May 1998 A
5781005 Vig et al. Jul 1998 A
5789658 Henn et al. Aug 1998 A
5789915 Ingraham Aug 1998 A
5796249 Andräet et al. Aug 1998 A
5818222 Ramsden Oct 1998 A
5818223 Wolf Oct 1998 A
5831513 Lue Nov 1998 A
5839185 Smith et al. Nov 1998 A
5841276 Makino et al. Nov 1998 A
5844411 Vogt Dec 1998 A
5859387 Gagnon Jan 1999 A
5886070 Honkura et al. Feb 1999 A
5883567 Mullins, Jr. Mar 1999 A
5912556 Frazee et al. Jun 1999 A
5942895 Popovic et al. Aug 1999 A
5963028 Engel et al. Oct 1999 A
6011770 Tan Jan 2000 A
6016055 Jager et al. Jan 2000 A
6043644 de Coulon et al. Mar 2000 A
6043646 Jansseune Mar 2000 A
6064199 Walter et al. May 2000 A
6064202 Steiner et al. May 2000 A
6091239 Vig et al. Jul 2000 A
6100680 Vig et al. Aug 2000 A
6100754 Kim et al. Aug 2000 A
6136250 Brown Oct 2000 A
6166535 Irle et al. Dec 2000 A
6169396 Yokotani et al. Jan 2001 B1
6175232 De Coulon et al. Jan 2001 B1
6175233 McCurley et al. Jan 2001 B1
6180041 Takizawa Jan 2001 B1
6181036 Kazama et al. Jan 2001 B1
6184679 Popovic et al. Feb 2001 B1
6194893 Yokotani et al. Feb 2001 B1
6198373 Ogawa et al. Mar 2001 B1
6232768 Moody et al. May 2001 B1
6236199 Irle et al. May 2001 B1
6242604 Hudlicky et al. Jun 2001 B1
6242904 Shirai et al. Jun 2001 B1
6242905 Draxelmayr Jun 2001 B1
6265864 De Winter et al. Jul 2001 B1
6265865 Engel et al. Jul 2001 B1
6278269 Vig et al. Aug 2001 B1
6288533 Haeberli et al. Sep 2001 B1
6291989 Schroeder Sep 2001 B1
6297627 Towne et al. Oct 2001 B1
6297628 Bicking et al. Oct 2001 B1
6323642 Nishimura et al. Nov 2001 B1
6339322 Loreck et al. Jan 2002 B1
6351506 Lewicki Feb 2002 B1
6356068 Steiner et al. Mar 2002 B1
6356741 Bilotti et al. Mar 2002 B1
6366079 Uenoyama Apr 2002 B1
6392478 Mulder et al. May 2002 B1
6429640 Daughton et al. Aug 2002 B1
6436748 Forbes et al. Aug 2002 B1
6437558 Li et al. Aug 2002 B2
6452381 Nakatani et al. Sep 2002 B1
6462536 Mednikov et al. Oct 2002 B1
6492804 Tsuge et al. Dec 2002 B2
6501270 Opie Dec 2002 B1
6504363 Dogaru et al. Jan 2003 B1
6522131 Hiligsmann et al. Feb 2003 B1
6525531 Forrest et al. Feb 2003 B2
6528992 Shinjo et al. Mar 2003 B2
6542068 Drapp et al. Apr 2003 B1
6542847 Lohberg et al. Apr 2003 B1
6545332 Huang Apr 2003 B2
6545457 Goto et al. Apr 2003 B2
6545462 Schott et al. Apr 2003 B2
6566862 Goto et al. May 2003 B1
6566872 Sugitani May 2003 B1
6590804 Perner Jul 2003 B1
6622012 Bilotti et al. Sep 2003 B2
6640451 Vinarcik Nov 2003 B1
6653968 Schneider Nov 2003 B1
6674679 Perner et al. Jan 2004 B1
6687644 Zinke et al. Feb 2004 B1
6692676 Vig et al. Feb 2004 B1
6759843 Furlong Jul 2004 B2
6768301 Hohe et al. Jul 2004 B1
6770163 Kuah et al. Aug 2004 B1
6781233 Zverev et al. Aug 2004 B2
6781359 Stauth et al. Aug 2004 B2
6798193 Zimmerman et al. Sep 2004 B2
6815944 Vig et al. Nov 2004 B2
6822443 Dogaru Nov 2004 B1
6853178 Hayat-Dawoodi Feb 2005 B2
6896407 Nomiyama et al. May 2005 B2
6902951 Goller et al. Jun 2005 B2
6917321 Haurie et al. Jul 2005 B1
6969988 Kakuta et al. Nov 2005 B2
7023205 Krupp Apr 2006 B1
7026808 Vig et al. Apr 2006 B2
7030606 Kato et al. Apr 2006 B2
7031170 Daeche et al. Apr 2006 B2
7038448 Schott et al. May 2006 B2
7049924 Hayashi et al. May 2006 B2
7085119 Bilotti et al. Aug 2006 B2
7112955 Buchhold Sep 2006 B2
7112957 Bicking Sep 2006 B2
7119538 Blossfeld Oct 2006 B2
7126327 Busch Oct 2006 B1
7132825 Martin Nov 2006 B2
7159556 Yoshihara Jan 2007 B2
7184876 Tuelings et al. Feb 2007 B2
7190784 Li Mar 2007 B2
7193412 Freeman Mar 2007 B2
7199579 Scheller et al. Apr 2007 B2
7235968 Popovic et al. Jun 2007 B2
7250760 Ao Jul 2007 B2
7259545 Stauth et al. Aug 2007 B2
7259556 Popovic et al. Aug 2007 B2
7265531 Stauth et al. Sep 2007 B2
7269992 Lamb et al. Sep 2007 B2
7285952 Hatanaka et al. Oct 2007 B1
7292095 Burt et al. Nov 2007 B2
7295000 Werth Nov 2007 B2
7307824 Bilotti et al. Dec 2007 B2
7319319 Jones et al. Jan 2008 B2
7323780 Daubenspeck et al. Jan 2008 B2
7323870 Tatschl et al. Jan 2008 B2
7325175 Momtaz Jan 2008 B2
7345468 Okada et al. Mar 2008 B2
7355388 Ishio Apr 2008 B2
7361531 Sharma et al. Apr 2008 B2
7362094 Voisine et al. Apr 2008 B2
7365530 Bailey et al. Apr 2008 B2
7385394 Auburger et al. Jun 2008 B2
7425821 Monreal et al. Sep 2008 B2
7474093 Ausserlechner Jan 2009 B2
7476953 Taylor et al. Jan 2009 B2
7518354 Stauth et al. Apr 2009 B2
7592801 Bailey et al. Sep 2009 B2
7598601 Taylor et al. Oct 2009 B2
7605647 Romero et al. Oct 2009 B1
7635993 Boeve Dec 2009 B2
7694200 Forrest et al. Apr 2010 B2
7701208 Nishikawa Apr 2010 B2
7714570 Thomas et al. May 2010 B2
7729675 Krone Jun 2010 B2
7746056 Stauth et al. Jun 2010 B2
7746065 Pastre et al. Jun 2010 B2
7759929 Forsyth Jul 2010 B2
7764118 Kusuda et al. Jul 2010 B2
7768083 Doogue et al. Aug 2010 B2
7769110 Momtaz Aug 2010 B2
7772838 Bailey et al. Aug 2010 B2
7800389 Friedrich et al. Sep 2010 B2
7808074 Knittl Oct 2010 B2
7816772 Engel et al. Oct 2010 B2
7816905 Doogue et al. Oct 2010 B2
7839141 Werth et al. Nov 2010 B2
7872322 Schott et al. Jan 2011 B2
7911203 Thomas et al. Mar 2011 B2
7915886 Stolfus et al. Mar 2011 B2
7923996 Doogue et al. Apr 2011 B2
7936144 Vig et al. May 2011 B2
7956604 Ausserlechner Jun 2011 B2
7961823 Kolze et al. Jun 2011 B2
7965076 Schott Jun 2011 B2
7990209 Romero Aug 2011 B2
7994774 Thomas et al. Aug 2011 B2
8030918 Doogue et al. Oct 2011 B2
8058870 Sterling Nov 2011 B2
8063631 Fermon et al. Nov 2011 B2
8063634 Sauber et al. Nov 2011 B2
8080993 Theuss et al. Dec 2011 B2
8089276 Kentsch Jan 2012 B2
8106649 Kaita et al. Jan 2012 B2
8106654 Theuss et al. Jan 2012 B2
8128549 Testani et al. Mar 2012 B2
8134358 Charlier et al. Mar 2012 B2
8143169 Engel et al. Mar 2012 B2
8253210 Theuss et al. Aug 2012 B2
8274279 Gies Sep 2012 B2
8362579 Theuss et al. Jan 2013 B2
8542010 Cesaretti et al. Sep 2013 B2
8559139 Theuss Oct 2013 B2
8577634 Donovan et al. Nov 2013 B2
8610430 Werth et al. Dec 2013 B2
8624588 Vig et al. Jan 2014 B2
8629539 Milano et al. Jan 2014 B2
8680846 Cesaretti et al. Mar 2014 B2
8723512 Burdette et al. May 2014 B1
8754640 Vig et al. Jun 2014 B2
8773124 Ausserlechner Jul 2014 B2
8860404 Dwyer et al. Oct 2014 B2
9081041 Friedrich et al. Jul 2015 B2
9116018 Frachon Aug 2015 B2
9164156 Elian et al. Oct 2015 B2
9201122 Cesaretti et al. Dec 2015 B2
9201123 Elian et al. Dec 2015 B2
9347799 Nazarian et al. May 2016 B2
9411025 David et al. Aug 2016 B2
9719806 Foletto et al. Aug 2017 B2
9720054 Drouin et al. Aug 2017 B2
9810519 Taylor et al. Nov 2017 B2
9823090 Foletto et al. Nov 2017 B2
9823092 David et al. Nov 2017 B2
10041810 Vig et al. Aug 2018 B2
10234513 Vig et al. Mar 2019 B2
10408892 David et al. Sep 2019 B2
20010002791 Tsuge et al. Jun 2001 A1
20010009367 Seitzer et al. Jul 2001 A1
20010026153 Nakamura et al. Oct 2001 A1
20020027488 Hayat-Dawoodi et al. Mar 2002 A1
20020084923 Li Jul 2002 A1
20020097639 Ishizaki et al. Jul 2002 A1
20030001563 Turner Jan 2003 A1
20030038675 Gailus et al. Feb 2003 A1
20030062891 Slates Apr 2003 A1
20030102909 Motz Jun 2003 A1
20030107366 Busch et al. Jun 2003 A1
20030151406 Wan et al. Aug 2003 A1
20030173955 Uenoyama Sep 2003 A1
20030222642 Butzmann Dec 2003 A1
20030227286 Dunisch et al. Dec 2003 A1
20040032251 Zimmerman et al. Feb 2004 A1
20040046248 Waelti et al. Mar 2004 A1
20040056647 Stauth et al. Mar 2004 A1
20040062362 Matsuya Apr 2004 A1
20040080314 Tsujii et al. Apr 2004 A1
20040135220 Goto Jul 2004 A1
20040170052 Inui Sep 2004 A1
20040174164 Ao Sep 2004 A1
20040184196 Jayasekara Sep 2004 A1
20040189285 Uenoyama Sep 2004 A1
20040196045 Larsen Oct 2004 A1
20040252563 Hokuto et al. Dec 2004 A1
20040263014 Miya Dec 2004 A1
20050017709 Stolfus et al. Jan 2005 A1
20050120782 Kishibata et al. Jun 2005 A1
20050122095 Dooley Jun 2005 A1
20050122099 Imamoto et al. Jun 2005 A1
20050167790 Khor et al. Aug 2005 A1
20050179429 Lohberg Aug 2005 A1
20050225318 Bailey et al. Oct 2005 A1
20050280411 Bicking Dec 2005 A1
20060011999 Schott et al. Jan 2006 A1
20060028204 Oohira Feb 2006 A1
20060033487 Nagano et al. Feb 2006 A1
20060038559 Lamb et al. Feb 2006 A1
20060038561 Honkura et al. Feb 2006 A1
20060068237 Murphy Mar 2006 A1
20060097715 Oohira et al. May 2006 A1
20060097717 Tokuhara et al. May 2006 A1
20060125473 Frachon et al. Jun 2006 A1
20060175674 Taylor Aug 2006 A1
20060181263 Doogue et al. Aug 2006 A1
20060202692 Tatschl et al. Sep 2006 A1
20060238190 Ishio Oct 2006 A1
20060261801 Busch Nov 2006 A1
20070110199 Momtaz et al. May 2007 A1
20070170533 Doogue et al. Jul 2007 A1
20070247141 Pastre et al. Oct 2007 A1
20070285089 Ibuki et al. Dec 2007 A1
20070290682 Oohira et al. Dec 2007 A1
20080012558 Rossler et al. Jan 2008 A1
20080013298 Sharma et al. Jan 2008 A1
20080094055 Monreal et al. Apr 2008 A1
20080116884 Rettig et al. May 2008 A1
20080116885 Van Zon et al. May 2008 A1
20080137784 Krone Jun 2008 A1
20080237818 Engel et al. Oct 2008 A1
20080238410 Charlier et al. Oct 2008 A1
20090001964 Strzalkowski Jan 2009 A1
20090001965 Ausserlechner et al. Jan 2009 A1
20090001972 Fernandez et al. Jan 2009 A1
20090009163 Yamada Jan 2009 A1
20090058404 Kurumado Mar 2009 A1
20090085706 Baarman et al. Apr 2009 A1
20090102467 Snell et al. Apr 2009 A1
20090121707 Schott May 2009 A1
20090137398 Bozovic et al. May 2009 A1
20090140725 Ausserlechner Jun 2009 A1
20090146647 Ausserlechner Jun 2009 A1
20090152696 Dimasacat et al. Jun 2009 A1
20090167298 Kreutzbruck et al. Jul 2009 A1
20090167301 Ausserlechner Jul 2009 A1
20090168286 Berkley et al. Jul 2009 A1
20090174395 Thomas et al. Jul 2009 A1
20090189600 Kurkovskiy Jul 2009 A1
20090206827 Aimuta et al. Aug 2009 A1
20090206831 Fermon et al. Aug 2009 A1
20090212765 Doogue et al. Aug 2009 A1
20090243601 Feldtkeller Oct 2009 A1
20090251134 Uenoyama Oct 2009 A1
20090256552 Guo et al. Oct 2009 A1
20090262466 Kurata et al. Oct 2009 A1
20090315543 Guo et al. Dec 2009 A1
20090322325 Ausserlechner Dec 2009 A1
20090326860 Hainz et al. Dec 2009 A1
20100026279 Vig et al. Feb 2010 A1
20100026288 Sauber et al. Feb 2010 A1
20100033175 Boeve et al. Feb 2010 A1
20100045268 Kilian Feb 2010 A1
20100052667 Kohama et al. Mar 2010 A1
20100072988 Hammerschmidt et al. Mar 2010 A1
20100141249 Ararao et al. Jun 2010 A1
20100156397 Yabusaki et al. Jun 2010 A1
20100164491 Kejik et al. Jul 2010 A1
20100188078 Foletto et al. Jul 2010 A1
20100201356 Koller et al. Aug 2010 A1
20100211347 Friedrich et al. Aug 2010 A1
20100237450 Doogue et al. Sep 2010 A1
20100276769 Theuss et al. Nov 2010 A1
20100295140 Theuss et al. Nov 2010 A1
20100330708 Engel et al. Dec 2010 A1
20110004278 Aghassian et al. Jan 2011 A1
20110018533 Cesaretti et al. Jan 2011 A1
20110031960 Hohe et al. Feb 2011 A1
20110048102 Fernandez et al. Mar 2011 A1
20110074405 Doogue et al. Mar 2011 A1
20110127998 Elian et al. Jun 2011 A1
20110175605 Kim et al. Jul 2011 A1
20110224537 Brunner Sep 2011 A1
20110248708 Thomas et al. Oct 2011 A1
20110267040 Frachon Nov 2011 A1
20110285384 Nomura Nov 2011 A1
20110291650 Franke et al. Dec 2011 A1
20110298448 Foletto et al. Dec 2011 A1
20120007589 Okada Jan 2012 A1
20120013333 Ararao et al. Jan 2012 A1
20120019236 Tiernan et al. Jan 2012 A1
20120062215 Ide et al. Mar 2012 A1
20120086090 Sharma et al. Apr 2012 A1
20120200290 Ausserlechner Aug 2012 A1
20120249133 Friedrich Oct 2012 A1
20120274314 Cesaretti et al. Nov 2012 A1
20120293167 Kitanaka et al. Nov 2012 A1
20120303305 Bergqvist et al. Nov 2012 A1
20130015845 Fox Jan 2013 A1
20130057257 Friedrich et al. Mar 2013 A1
20130113474 Elian May 2013 A1
20130214774 Cesaretti et al. Aug 2013 A1
20130238278 Shoemaker et al. Sep 2013 A1
20130241543 Stenson et al. Sep 2013 A1
20130249546 David et al. Sep 2013 A1
20130265037 Friedrich et al. Oct 2013 A1
20130278246 Stegerer et al. Oct 2013 A1
20130300401 Krapf et al. Nov 2013 A1
20130320970 Foletto et al. Dec 2013 A1
20130335069 Vig et al. Dec 2013 A1
20140084906 Ruigrok et al. Mar 2014 A1
20140175584 Foletto et al. Jun 2014 A1
20140176126 Friedrich et al. Jun 2014 A1
20140232379 Nazarian et al. Aug 2014 A1
20140266176 Fernandez et al. Sep 2014 A1
20140266181 Milano et al. Sep 2014 A1
20140305761 Kimes Oct 2014 A1
20140327435 Röhrer Nov 2014 A1
20140347044 Monreal et al. Nov 2014 A1
20150022186 Ausserlechner Jan 2015 A1
20150022187 Taylor et al. Jan 2015 A1
20150022193 Burdette et al. Jan 2015 A1
20150022197 David et al. Jan 2015 A1
20150022198 David et al. Jan 2015 A1
20150211895 Reitsma et al. Jul 2015 A1
20150256328 Kamatani Sep 2015 A1
20150292907 Kawase Oct 2015 A1
20150346289 Ausserlechner Dec 2015 A1
20150377648 Sirohiwala et al. Dec 2015 A1
20160025820 Scheller et al. Jan 2016 A1
20160069662 Mullenix et al. Mar 2016 A1
20160123774 Foletto et al. May 2016 A1
20170271399 Lee et al. Sep 2017 A1
20170285117 Drouin et al. Oct 2017 A1
20170307696 Werth et al. Oct 2017 A1
20170314907 Taylor et al. Nov 2017 A1
20170328739 David et al. Nov 2017 A1
20170356760 David et al. Dec 2017 A1
20180011150 Pepka et al. Jan 2018 A1
20180172423 Ausserlechner Jun 2018 A1
20180340911 Romero et al. Nov 2018 A1
20180340986 Latham et al. Nov 2018 A1
20180340988 Latham et al. Nov 2018 A1
20180340989 Latham et al. Nov 2018 A1
20190018080 Marauska et al. Jan 2019 A1
20190033096 David et al. Jan 2019 A1
20190162784 Lassalle-Balier et al. May 2019 A1
Foreign Referenced Citations (157)
Number Date Country
683469 Mar 1994 CH
102323554 Jan 2012 CN
102483443 May 2012 CN
102713654 Oct 2012 CN
102954808 Mar 2013 CN
2518054 Nov 1976 DE
4031560 Apr 1992 DE
19539458 Apr 1997 DE
68927973 Sep 1997 DE
19634715 Mar 1998 DE
19650935 Jun 1998 DE
19838433 Mar 1999 DE
19851839 Nov 1999 DE
19961504 Jun 2001 DE
10210184 Sep 2003 DE
10314602 Oct 2004 DE
102005014509 Oct 2006 DE
102006037226 Feb 2008 DE
102007018238 Oct 2008 DE
102007041230 Apr 2009 DE
102010016584 Nov 2010 DE
102011102483 Nov 2012 DE
0146091 Jun 1985 EP
0289414 Feb 1988 EP
0289414 Feb 1988 EP
0357013 Mar 1990 EP
0357013 Mar 1990 EP
0361456 Apr 1990 EP
0361456 Apr 1990 EP
0504583 Sep 1992 EP
0629834 Dec 1994 EP
0631416 Dec 1994 EP
0680103 Nov 1995 EP
0875733 Nov 1998 EP
0944888 Sep 1999 EP
1306687 May 2003 EP
1443332 Aug 2004 EP
0898180 Nov 2004 EP
1580560 Sep 2005 EP
1637898 Mar 2006 EP
1662353 May 2006 EP
1679524 Jul 2006 EP
1850143 Oct 2007 EP
2000814 Dec 2008 EP
2063229 May 2009 EP
2402719 Jan 2012 EP
2466265 Jun 2012 EP
2730893 May 2014 EP
3410075 May 2017 EP
2748105 Oct 1997 FR
2909756 Jun 2008 FR
2135060 Aug 1984 GB
2276727 Oct 1994 GB
2481482 Dec 2011 GB
6148777 Mar 1986 JP
S 6367583 Mar 1988 JP
363084176 Apr 1988 JP
63263782 Oct 1988 JP
63300911 Dec 1988 JP
H 02116753 May 1990 JP
H 02149013 Jun 1990 JP
H 0329817 Feb 1991 JP
H 04095817 Mar 1992 JP
04152688 May 1992 JP
H 06273437 Sep 1994 JP
0897486 Apr 1996 JP
H 08511348 Nov 1996 JP
09166612 Jun 1997 JP
1038988 Feb 1998 JP
10332725 Dec 1998 JP
H 10318784 Dec 1998 JP
1174142 Mar 1999 JP
11064363 Mar 1999 JP
H 11287669 Oct 1999 JP
2000-183241 Jun 2000 JP
2001-043475 Feb 2001 JP
2001-141738 May 2001 JP
2001-153683 Jun 2001 JP
2001-165702 Jun 2001 JP
2001-1659951 Jun 2001 JP
2002-117500 Apr 2002 JP
2002-149013 May 2002 JP
2002-357920 Dec 2002 JP
2003-042709 Feb 2003 JP
2003-177171 Jun 2003 JP
2003-202365 Jul 2003 JP
2004-055932 Feb 2004 JP
2004-093381 Mar 2004 JP
2004-152688 May 2004 JP
2004-356338 Dec 2004 JP
2004-357858 Dec 2004 JP
2005-517928 Jun 2005 JP
2005-241269 Sep 2005 JP
2005-337866 Dec 2005 JP
2005-345302 Dec 2005 JP
2006-003096 Jan 2006 JP
2006-3116 Jan 2006 JP
2006098059 Apr 2006 JP
2006098059 Apr 2006 JP
2006-275764 Oct 2006 JP
2007-012582 Jan 2007 JP
2007-218799 Aug 2007 JP
2007-240202 Sep 2007 JP
2008-180550 Aug 2008 JP
2008-286667 Nov 2008 JP
2009-002911 Jan 2009 JP
2009-150732 Jul 2009 JP
2009-222524 Oct 2009 JP
2009-250725 Oct 2009 JP
2009-250931 Oct 2009 JP
2010-014607 Jan 2010 JP
2010-078366 Apr 2010 JP
2012-501446 Jan 2012 JP
WO 8809026 Nov 1988 WO
WO 93012403 Jun 1993 WO
WO 9408203 Apr 1994 WO
WO 9429672 Dec 1994 WO
WO 9518982 Jul 1995 WO
WO 9602849 Feb 1996 WO
WO 98010302 Mar 1998 WO
WO 9854547 Dec 1998 WO
WO 9949322 Sep 1999 WO
WO 00002266 Jan 2000 WO
WO 0174139 Oct 2001 WO
WO 0174139 Oct 2001 WO
WO 03036732 May 2003 WO
WO 03069358 Aug 2003 WO
WO 03069358 Aug 2003 WO
WO 03107018 Dec 2003 WO
WO 2004025742 Mar 2004 WO
WO 2004027436 Apr 2004 WO
WO 2004072672 Aug 2004 WO
WO 2005013363 Feb 2005 WO
WO 2006056829 Jun 2006 WO
WO 2006074989 Jul 2006 WO
WO 2006083479 Aug 2006 WO
WO 2007033168 Mar 2007 WO
WO 2007095971 Aug 2007 WO
WO 2007138508 Dec 2007 WO
WO 2008008140 Jan 2008 WO
WO 2008008140 Jan 2008 WO
WO 2008048379 Apr 2008 WO
WO 2008121443 Oct 2008 WO
WO 2008 145662 Dec 2008 WO
WO 2009030361 Mar 2009 WO
WO 2009108422 Sep 2009 WO
WO 2009108422 Sep 2009 WO
WO 2009124969 Oct 2009 WO
WO 2010014309 Feb 2010 WO
WO 2010027658 Mar 2010 WO
WO 2010065315 Jun 2010 WO
WO 2010096367 Aug 2010 WO
WO 2011011479 Jan 2011 WO
WO 2012148646 Nov 2012 WO
WO 2013169455 Nov 2013 WO
WO 2015009532 Jan 2015 WO
WO 2015058733 Apr 2015 WO
Non-Patent Literature Citations (339)
Entry
Notice of Allowance dated Jun. 27, 2011; for U.S. Appl. No. 12/959,672; 8 pages.
Request for Continued Examination dated Jul. 13, 2011; for U.S. Appl. No. 12/959,672; 2 pages.
Notice of Allowance dated Jul. 19, 2011; for U.S. Appl. No. 12/959,672; 8 pages.
Office Action dated May 12, 2011; for U.S. Appl. No. 12/183,367; 17 pages.
Response to Office Action filed on Aug. 10, 2011; for U.S. Appl. No. 12/183,367; 13 pages.
Office Action dated Oct. 20, 2011; for U.S. Appl. No. 12/183,367; 9 pages.
Response to Office Action filed on Jan. 17, 2012; for U.S. Appl. No. 12/183,367; 15 pages.
Office Action/Restriction Requirement dated Apr. 12, 2012; for U.S. Appl. No. 12/183,367; 6 pages.
Response to Restriction Requirement filed on May 9, 2012; for U.S. Appl. No. 12/183,367; 2 pages.
Supplemental Response to Office Action/Restriction Requirement filed on Feb. 11, 2013; for U.S. Appl. No. 12/183,367;2 pages.
Final Office Action dated May 2, 2013; for U.S. Appl. No. 12/183,367; 15 pages.
Response to Final Office Action filed on Jun. 19, 2013; for U.S. Appl. No. 12/183,367; 8 pages.
Final Office Action dated Jul. 1, 2013; for U.S. Appl. No. 12/183,367; 7 pages.
Final Office Action dated Jul. 23, 2013; for U.S. Appl. No. 12/183,367; 8 pages.
Response to Office Action filed on Aug. 27, 2013; for U.S. Appl. No. 12/183,367; 13 pages.
Notice of Allowance dated Sep. 6, 2013; for U.S. Appl. No. 12/183,367; 7 pages.
Office Action/Restriction Requirement dated Oct. 23, 2009; for U.S. Appl. No. 12/328,798; 7 pages.
Response to Office Action/Restriction Requirement filed on Nov. 4, 2009; for U.S. Appl. No. 12/328,798; 1 page.
Office Action dated Dec. 14, 2009; for U.S. Appl. No. 12/328,798; 15 pages.
Response to Office Action filed on Jan. 28, 2010; for U.S. Appl. No. 12/328,798; 22 pages.
Final Office Action dated May 24, 2010; for U.S. Appl. No. 12/328,798; 20 pages.
Response to Final Office Action filed Jul. 21, 2010 for U.S. Appl. No. 12/328,798; 23 pages.
Office Action dated Oct. 31, 2011; for U.S. Appl. No. 12/328,798; 12 pages.
Response to Office Action filed on Feb. 28, 2012; for U.S. Appl. No. 12/328,798; 15 pages.
Final Office Action dated May 10, 2012; for U.S. Appl. No. 12/328,798; 13 pages.
Response to Final Office Action filed on Oct. 9, 2012; for U.S. Appl. No. 12/328,798; 6 pages.
Notice of Allowance dated Oct. 26, 2012; for U.S. Appl. No. 12/328,798; 13 pages.
Request for Continued Examination filed on Jan. 24, 2013; for U.S. Appl. No. 12/328,798; 2 pages.
Notice of Allowance dated Mar. 1, 2013; for U.S. Appl. No. 12/328,798; 10 pages.
Office Action dated Feb. 22, 2012; for U.S. Appl. No. 13/241,380; 14 pages.
Response to Office Action filed on May 3, 2012; for U.S. Appl. No. 13/241,380; 16 pages.
Final Office Action dated Jul. 19, 2012; for U.S. Appl. No. 13/241,380; 13 pages.
Response to Final Office Action dated Oct. 9, 2012; for U.S. Appl. No. 13/241,380; 6 pages.
Notice of Allowance dated Oct. 29, 2012; for U.S. Appl. No. 13/241,380; 11 pages.
Request for Continued Examination dated Jan. 24, 2013; for U.S. Appl. No. 13/241,380; 3 pages.
Notice of Allowance dated Feb. 21, 2013; for U.S. Appl. No. 13/241,380; 9 pages.
Office Action dated Jul. 6, 2012; for U.S. Appl. No. 12/706,318; 29 pages.
Response to Office Action filed Sep. 27, 2012; for U.S. Appl. No. 12/706,318; 12 pages.
Supplemental Response to Office Action filed on Oct. 2, 2012; for U.S. Appl. No. 12/706,318; 12 pages.
Notice of Allowance dated Dec. 10, 2012; for U.S. Appl. No. 12/706,318; 9 pages.
Letter under 37 C.F.R. §1.56 filed Jul. 25, 2013 for U.S. Appl. No. 13/946,380; 2 pages.
Non-Final Office Action dated Jul. 9, 2015; for U.S. Appl. No. 13/946,380; 31 pages.
Amendment in response to Office Action dated Jul. 9, 2015 filed on Nov. 9, 2015 for U.S. Appl. No. 13/946,380; 26 pages.
Final Office Action dated Dec. 15, 2015; For U.S. Appl. No. 13/946,380; 36 pages.
Amendment in response to Final Office Action dated Dec. 15, 2015 and filed on Apr. 12, 2016 for U.S. Appl. No. 13/946,380; 17 pages.
Non-Final Office Action dated Aug. 26, 2016 for U.S. Appl. No. 13/946,380; 40 pages.
Response filed on Nov. 9, 2016 to the Non-Final Office Action dated Aug. 26, 2016; for U.S. Appl. No. 13/946,380; 19 pages.
Final Office Action dated Jan. 12, 2017 for U.S. Appl. No. 13/946,380; 32 pages.
Amendment filed on Apr. 11, 2017 for U.S. Appl. No. 13/946,380; 18 pages.
Non-Final Office Action for U.S. Appl. No. 13/946,380 dated May 19, 2017; 20 pages.
Amendment for U.S. Appl. No. 13/946,380, filed Jun. 22, 2017; 8 pages.
Notice of Allowance dated Jul. 13, 2017 for U.S. Appl. No. 13/946,380; 11 pages.
Amendment Under 37 C.F.R. §1.312 for U.S. Appl. No. 13/946,380, filed Aug. 29, 2017; 3 pages.
DCMD Instruction letter regarding filing regarding Request for Examination dated Feb. 13, 2019 for KR Pat. Appl. No. 10-2016-7004180; 2 pages.
21st Century Letter dated Mar. 14, 2019 regarding Voluntary Amendment and Substantive Examination for KR Pat. Appl. No. 10-2016-7004180; 1 page.
21st Century Listing of Pending Claims filed on Mar. 14, 2019 regarding Voluntary Amendment and Substantive Examination for KR Pat. Appl. No. 10-2016-7004180; 13 pages.
Non-final office action dated Jan. 26, 2018 for U.S. Appl. No. 15/655,135; 49 pages.
Response to Non-Final Office Action dated Jan. 26, 2018 for U.S. Appl. No. 15/655,135; Response filed Apr. 3, 2018; 20 pages.
Response to Office Action filed on Aug. 25, 2020 for U.S. Appl. No. 16/232,348; 16 pages.
U.S. Appl. No. 16/683,800, filed Nov. 14, 2019, David et al.
Infineon Product Brief, TLE 4941plusC, “Differential Hall IC for Wheel Speed Sensing”, Oct. 2010, www.infineon.com/sensors, 2 pages.
Infineon Technologies; “Differential Two-Wire Hall Effect Sensor IC;” TLE4942 Preliminary Data Sheet; Jun. 2000; 13 pages.
Johnson et al., “Hybrid Hall Effect Device,” Appl. Phys. Lett., vol. 71, No. 7, Aug. 1997, 3 pages.
Kanda et al.; “The Piezo-Hall Effect in n-Silicon;” 22nd International Conference on the Physics of Semiconductors; vol. 1, Jan. 1995; 4 pages.
Kapser et al.; “Integrated GMR Based Wheel Speed Sensor for Automotive Applications;” IEEE 2007 Conference on Sensors; Oct. 2007; 4 pages.
Kejik et al.; “Circular Hall Transducer for Angular Position Sensing;” International Solid-State Sensors, Actuators and Microsystems Conference; Transducers; Jun. 2007; 4 pages.
Kejik, P. et al.; “Purely CMOS Angular Position Sensor Based on a New Hall Microchip;” 34th Annual Conference of IEEE Industrial Electronics; IECON; Nov. 10-13, 2008; 5 pages.
Kejik, P.et al.; “Ultra Low-Power Angular Position Sensor for High-Speed Portable Applications;” 2009 IEEE Sensors Conference; Oct. 25-28, 2009; 4 pages.
Krammerer et al.: “A Hall effect sensors network insensitive to mechanical stress;” Proceedings of IEEE Sensors; vol. 3, Oct. 2004; 4 pages.
Lagorce et al.; “Magnetic and Mechanical Properties of Micromachined Strontium Ferrite/Polyimide Composites;” Journal of Microelectromechanical Systems; vol. 6, No. 4; Dec. 1997; 15 pages.
Lequesne et al.; “High-Accuracy Magnetic Position Encoder Concept;” IEEE Transactions on Industry Applications; vol. 35, No. 3; May/Jun. 1999; 9 pages.
Lou Law; “Angular Position Sensing with 2-Axis Hall ICs;” Sensors Magazine, vol. 20, No. 3; Mar. 2003; 7 pages.
Magnani et al.; “Mechanical Stress Measurement Electronics Based on Piezo-Resistive and Piezo-Hall Effects;” 9th International Conference on Electronics, Circuits and Systems 2002; vol. 1; SBN: 0-7803-7596-3; Dec. 2002; 4 pages.
Manic; “Drift in Silicon Integrated Sensors and Circuits Due to the Thermo-Mechanical Stresses;” Lausanne, École Polytechnique Fédérale De Lausanne 2000; Part 1 of 2; 74 pages.
Manic; “Drift in Silicon Integrated Sensors and Circuits Due to the Thermo-Mechanical Stresses;” Lausanne, École Polytechnique Fédérale De Lausanne 2000; Part 2 of 2; 102 pages.
Manic; “Short and Long-Term Stability Problems of Hall Plates in Plastic Packages;” IEEE 38th Annual International Reliability Physics Symposium; Apr. 2000; 6 pages.
Masson et al.; “Multiturn and high precision through-shaft magnetic sensors;” Sensor + Text Conference; Proceedings II; May 2009; 6 pages.
Melexis Microelectronic Integrated Systems; MLX90333; “Triaxis 3D-Joystick Position Sensor;” Data Sheet; Mar. 2009; 43 pages.
Melexis Microelectronic Systems, Hall Applications Guide, Section 3—Applications, 1997, 48 pages.
Melexis MLX 90324; ““Under-the-Hood” Triaxis Rotary Position feat. SENT Protocol;” 3901090324 Data Sheet; Dec. 2008; 40 pages.
Memsic Corporation; AN-00MM-001; “Magnetometer Fundamentals;” Jun. 2008; 6 pages.
Memsic Corporation; AN-00MM-002; “Magnetometer Soldering Methodology;” Jun. 2008; 2 pages.
Memsic Corporation; AN-00MM-003; “Magnetic Sensor Calibration;” Mar. 2008; 5 pages.
Memsic Corporation; AN-00MM-004; “Electronic Tilt Compensation;” Mar. 2008; 5 pages.
Memsic Corporation; AN-00MM-005; “Magnetic Sensor Placement Guidelines;” Oct. 2008; 2 pages.
Memsic Corporation; MMC312xMQ; “Tri-axis Magnetic Sensor, with I2C Interface;” Aug. 14, 2008; 9 pages.
Memsic Corporation; MMC314xMQ; “Ultra Small 3-axis Magnetic Sensor, with I2C Interface;” Mar. 31, 2010; 8 pages.
Metz et al.; “Contactless Angle Measurement Using Four Hall Devices on Single Chip;”; International Conference on Solid State Sensors and Actuators; Transducers; vol. 1; Jun. 16-19, 1997; 4 pages.
Micronas GmbH; “HAL® 3625 Programmable Direct Angle Sensor;” Product Information; Sep. 2009; 2 pages.
Motz, et al.; “An Integrated Hall Sensor Platform Design for Position, Angle and Current Sensing;” IEEE Sensors 2006; Exco, Daegu, Korea / Oct. 22-25, 2006; 4 pages.
Motz et al.; “An Integrated Magnetic Sensor with Two Continuous-Time ΔΣ-Converters and Stress Compensation Capability;” IEEE International Solid-State Circuits Conference; Digest of Technical Papers; Feb. 6, 2006; ISBN: 1-4244-0079-1; 7 pages.
Motz, et al.; “A Chopped Hall Sensor with Small Jitter and Programmable “True Power-On”Function;” IEEE Journal of Solid-State Circuits; vol. 40, No. 7; Jul. 2005; 8 pages.
Munter; “A Low-offset Spinning-current Hall Plate;” Sensors and Actuators, vol. A21-A23; Jan. 1990; 4 pages.
Munter; “Electronic Circuitry for a Smart Spinning-current Hall Plate with Low Offset;” Sensors and Actuators A; Jun. 1991;.5 pages.
Novotechnik Siedle Group; “How New Angular Positioning Sensor Technology Opens a Broad Range of New Applications;” Vert-X Technology; Dec. 2001; 5 pages.
Oniku et al., “High-Energy-Density Permanent Micromagnets Formed From Heterogeneous Magnetic Powder Mixtures”, Interdisciplinary Microsystems Group, Dept. of Electrical and Computer Engineering, University of Florida, Gainesville, FL 32611, USA; Preprint of MEMS 2012 Conf. Paper, 4 pages.
Paranjape et al.; “A CMOS-compatible 2-D vertical Hall magnetic-field sensor using active carrier confinement and post-process micromachining;” The 8th International Conference on Solid-State Sensors and Acutators, Physical vol. 53, Issues 1-3; May 1996; 6 pages.
Park et al.: “Batch-Fabricated Microinductors with Electroplated Magnetically Anisotropic and Laminated Alloy Cores”, IEEE Transactions on Magnetics, vol. 35, No. 5, Sep. 1999, 10 pages.
Park et al.; “Ferrite-Based Integrated Planar Inductors and Transformers Fabricated at Low Temperature;” IEEE Transactions on Magnetics; vol. 33, No. 5; Sep. 1997; 3 pages.
Partin et al.; “Temperature Stable Hall Effect Sensors;” IEEE Sensors Journal, vol. 6, No. 1; Feb. 2006; 5 pages.
Pastre, et al.; “A Hall Sensor Analog Front End for Current Measurement with Continuous Gain Calibration;” IEEE Sensors Journal; vol. 7, No. 5; May 2007; 8 pages.
Pastre, et al.; “A Hall Sensor-Based Current Measurement Microsystem With Continuous Gain Calibration;” Research in Microelectronics and Electronics, IEEE vol. 2; Jul. 25, 2005; ISBN: 0-7803-9345-7; 4 pages.
Petoussis et al.; “A Novel Hall Effect Sensor Using Elaborate Offset Cancellation Method;” Sensors & Transducers Journal, vol. 100, Issue 1; Jan. 2009; 7 pages.
Petrie; “Circular Vertical Hall Magnetic Field Sensing Element and Method with a Plurality of Continuous Output Signals;” U.S. Appl. No. 13/035,243, filed Feb. 25, 2011; 56 pages.
Popovic; “Not-plate-like Hall magnetic sensors and their applications;” Sensors and Actuators A: Physical, vol. 85, Issues 1-3; Aug. 2000; 9 pages.
Popovic; “Sensor Microsystems;” Proc. 20th International Conference on Microelectronics (MWIL 95); vol. 2, NIS, Serbia, 12-14; Sep. 1995; 7 pages.
Randhawa; “Monolithic Integrated Hall Devices in Silicon Circuits;” Microelectronics Journal; vol. 12, No. 6; Sep. 14-17, 1981; 6 pages.
Reymond, S. et al.; “True 2D CMOS Integrated Hall Sensor,” 2007 IEEE Sensors Conference; Oct. 28-31, 2007; 4 pages.
Roumenin et al.; “Vertical Hall Effect Devices in the Basis of Smart Silicon Sensors;” IEEE Workshop on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications; Sep. 5-7, 2005; 4 pages.
Roumenin; “Magnetic sensors continue to advance towards perfection;” Sensors and Actuators A: Physical, vol. 46-47, Issues 1-3; Jan.-Feb. 1995; 7 pages.
Ruther et al.; “Integrated CMOS-Based Sensor Array for Mechanical Stress Mapping;” 5th IEEE Conference on Sensors, Oct. 2007; 4 pages.
Ruther et al.; “Thermomagnetic Residual Offset in Integrated Hall Plates;” IEEE Sensors Journal; vol. 3, No. 6; Dec. 2003; 7 pages.
Sargent; “Switched-capacitor IC controls feedback loop;” EDN; Design Ideas; Feb. 17, 2000; 2 pages.
Schneider et al.; “Temperature Calibration of CMOS Magnetic Vector Probe for Contactless Angle Measurement System;” International Electron Devices Meeting; Dec. 8-11, 1996; 4 pages.
Schott et al.; “Linearizing Integrated Hall Devices;” 1997 International Conference on Solid-State Sensors and Actuators, Jun. 16-19, 1997; 4 pages.
Schott, et al.; “CMOS Single-Chip Electronic Compass with Microcontroller;” IEEE Journal of Solid-State Circuits; vol. 42, No. 12; Dec. 2007; 11 pages.
SENSIMA technology sa; “CVHD: a new concept of Angular Position Sensor;” Slide Presentation for Allegro MicroSystems; Mar. 2009; 17 pages.
Sentron; AN-101; “Angular position sensing with 2-Axis Hall IC 2SA-10;” Feb. 12, 2004; http://www.diegm.uniud.it/petrella/Azionamenti%20Elettrici%20II/Sensori%20e%20trasduttori/Data%20Sheet%20-%202SA-10.pdf; 7 pages.
U.S. Appl. No. 16/899,702, filed Jun. 12, 2020, David et al.
Simon et al.; “Autocalibration of Silicon Hall Devices;” 8th International Conference on Solid-State Sensors and Actuators; vol. 2; Jun. 25, 1995; 4 pages.
Smith et al.; “Low Magnetic Field Sensing with GMR Sensors;” Sensor Magazine; Part 1; Sep. 1999; http://archives.sensorsmag.com/articles/0999/76mail.shtml; 8 pages.
Smith et al.; “Low Magnetic Field Sensing with GMR Sensors;” Sensor Magazine; Part 2; Oct. 1999; http://archives.sensorsmag.com/articles/1099/84/mail.shtml; 11 pages.
Steiner et al.; “Double-Hall Sensor with Self-Compensated Offset;” International Electron Devices Meeting; Dec. 7, 1997; ISBN: 0-7803-4100-7; 4 pages.
Steiner et al; “Offset Reduction in Hall Devices by Continuous Spinning Current Method” Sensors and Actuators A66; 1998; 6 pages.
Stellrecht et al.; Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages; IEEE Transactions on Components and Packaging Technologies; vol. 27, No. 3; Sep. 2004; 8 pages.
Tian et al.; “Multiple Sensors on Pulsed Eddy-Current Detection for 3-D Subsurface Crack Assessment;” IEEE Sensors Journal, vol. 5, No. 1; Feb. 2005; 7 pages.
Trontelj et al; “CMOS Integrated Magnetic Field Source Used as a Reference in Magnetic Field Sensors on Common Substrate;” WEP 1-6; IMTC; May 1994; 3 pages.
Van der Meer; et al; “CMOS quad spinning-current Hall-sensor system for compass application;” IEEE Proceedings of Sensors, vol. 3; Oct. 24-27, 2004; 4 pages.
Vogelgesang et al.; Robert Bosch GmbH; “GMR sensors in automotive application;” CS-SNS/ECS Slides Presentation; Mar. 2, 2005; 16 pages.
Volder; “The CORDIC Trigonometric Computing Technique;” The Institute of Radio Engineers, Inc.; IRE Transactions on Electronic Computers, vol. EC, Issue 3; Sep. 1959; 5 pages.
Wu, et al.; “A Chopper Current-Feedback Instrumentation Amplifier with a 1mHz 1/ƒ Noise Corner and an AC-Coupled Ripple-Reduction Loop;” IEEE International Solid-State Circuits Conference; Feb. 10, 2009; 3 pages.
Zou et al.; “Three-Dimensional Die Surface Stress Measurements in Delaminated and Non-Delaminated Plastic Packages;” 48th Electronic Components and Technology Conference; May 25, 1998; 12 pages.
Invitation to Pay Additional fees dated Oct. 2, 2003 for PCT Pat. App. No. PCT/US03/02489; 3 pages.
PCT Search Report dated Nov. 19, 2003 for PCT Pat. App. No. PCT/US03/02489; 9 pages.
EP Board of Appeals Datasheet for the Decision dated Nov. 22, 2007; for European Pat. App. No. 97108803.4; 22 pages.
EP Communication for the Board of Appeals dated Apr. 30, 2009; for European Pat. App. No. 03 710 766.1; 2 pages.
EP Preliminary Opinion from the Board of Appeal dated May 26, 2009; for European Pat. App. No. 03 710 766.1; 52 pages.
Letter from Yuasa and Hara dated Jun. 4, 2008; Japanese First Office Action issued Apr. 7, 2008; for JP Pat. App. No. 2003-568426; 5 pages.
Letter from Yuasa and Hara dated Oct. 21, 2008; Japanese Response to First Office Action filed Sep. 22, 2008; for JP Pat. App. No. 2003-568426; 14 pages.
Letter from Yuasa and Hara dated Dec. 12, 2008; Japanese Second Office Action; for JP Pat. App. No. 2003-568426; 4 pages.
Letter from Yuasa and Hara dated Apr. 23, 2009; Japanese Response to Second Office Action filed Mar. 25, 2009; for JP Pat. App. No. 2003-568426; 8 pages.
Letter from Yuasa and Hara dated Jun. 9, 2011; Japanese Response to Third Office Action filed May 13, 2011; for JP Pat. App. No. 2003-568426; 27 pages.
JP Notice of Allowance dated Nov. 8, 2011; for Japanese Pat. App. No. 2003-568426; 3 pages.
PCT Search Report and Written Opinion of the ISA dated Jul. 15, 2008 for PCT/US2008/053551; 11 pages.
PCT International Preliminary Report on Patentability for PCT/US2008/053551; dated Oct. 8, 2009; 8 pages.
CN Office Action (with English translation) dated Sep. 10, 2010; for Chinese Pat. App. No. 200880008895.6; 14 pages.
Letter from NTD Patent & Trademark Agency Limited Regarding Office Action dated Oct. 13, 2010; for Chinese Pat. App. No. 200880008895.6; 2 pages.
CN Response to Office Action dated Mar. 28, 2011; for Chinese Pat. App. No. 200880008895.6; 7 pages.
CN Notice of Allowance (with English translation) dated Jul. 4, 2011; for Chinese Pat. App. No. 200880008895.6; 4 pages.
JP First Office Action (English translation) dated Jun. 11, 2012; for Japanese Pat. App. No. 2010-501028; 7 pages.
JP Response to First Office Action (with English translation) dated Oct. 16, 2012; for Japanese Pat. App. No. 2010-501028; 12 pages.
JP Second Office Action (English translation) dated Aug. 7, 2013; for Japanese Pat. App. No. 2010-501028; 7 pages.
Office Action/Restriction Requirement dated May 14, 2010; for U.S. Appl. No. 12/037,393; 6 pages.
Response to Office Action/Restriction Requirement filed on Jun. 2, 2010; for U.S. Appl. No. 12/037,393; 1 page.
Office Action dated Jun. 30, 2010; for U.S. Appl. No. 12/037,393; 11 pages.
Response to Office Action filed Oct. 14, 2010; for U.S. Appl. No. 12/037,393; 34 pages.
Notice of Allowance dated Nov. 3, 2010; for U.S. Appl. No. 12/037,393; 7 pages.
Request for Continued Examination dated Jan. 26, 2011; for U.S. Appl. No. 12/037,393; 1 page.
Notice of Allowance dated Feb. 11, 2011; for U.S. Appl. No. 12/037,393; 6 pages.
Search Report dated Oct. 23, 2009 for PCT Application No. PCT/US2009/031776; 20 pages.
International Preliminary Report on Patentability dated Sep. 10, 2010 for Application No. PCT/US2009/031776; 10 pages.
CN First Office Action (with English translation) dated Aug. 29, 2012; for Chinese Pat. App. No. 200980106535.4; 8 pages.
CN Response to Chinese First Office Action with English claims dated Aug. 29, 2012 filed on Jan. 24, 2013; for Chinese Pat. App. No. 200980106535.4; 20 pages.
Letter from NTD Patent and Trademark Office dated Oct. 10, 2012; for Chinese Pat. App. No. 200980106535.4; 2 pages.
Letter to NTD Patent and Trademark Office dated Dec. 11, 2012; for Chinese Pat. App. No. 200980106535.4; 3 pages.
Letter from NTD Patent and Response filed dated Jan. 19, 2013; for Chinese Pat. App. No. 200980106535.4; 13 pages.
CN Second Office Action (with English translation) dated Apr. 15, 2013; for Chinese Pat. App. No. 200980106535.4; 9 pages.
Letter from NTD Patent and Trademark Office dated May 21, 2013; for Chinese Pat. App. No. 200980106535.4; 2 pages.
Letter to NTD Patent and Trademark Agency dated Jun. 19, 2013; for Chinese Pat. App. No. 200980106535.4; 11 pages.
Letter from NTD Patent and Trademark Agency dated Jul. 11, 2013; for Chinese Pat. App. No. 200980106535.4; 1 page.
JP Notice of Reasons for Rejection (English translation) dated Apr. 4, 2013 for Japanese Pat. App. No. 2010-547666; 4 pages.
Letter from Yuasa and Hara dated May 27, 2013; for Japanese Pat. App. No. 2010-547666; 2 pages.
Response to Reason for Rejection with English claims filed Jul. 3, 2013; for Japanese Pat. App. No. 2010-547666; 11 pages.
JP Notice of Reasons for Rejection (English translation) dated Sep. 29, 2014 for Japanese Pat. App. No. 2010-547666; 8 pages.
Response to Reason for Rejection with English claims filed Jan. 27, 2015; for Japanese Pat. App. No. 2010-547666; 10 pages.
Office Action dated Feb. 2, 2011; for U.S. Appl. No. 12/959,672; 13 pages.
Response to Office Action filed on May 24, 2011; for U.S. Appl. No. 12/959,672; 8 pages.
Response to European Communication filed on Jan. 6, 2021 for European Application No. 19209914.1; 28 pages.
Final Office Action dated Jul. 26, 2018 for U.S. Appl. No. 15/655,135; 38 Pages.
Response to Final Office Action dated Jul. 26, 2018 for U.S. Appl. No. 15/655,135, filed Oct. 11, 2018; 21 Pages.
Request for Continued Examination dated Oct. 29, 2018 for U.S. Appl. No. 15/655,135; 3 Pages.
Notice of Allowance dated Dec. 4, 2018 or U.S. Appl. No. 15/655,135; 13 pages.
Supplemental Notice of Allowability dated Jan. 3, 2019 for U.S. Appl. No. 15/655,135; 9 pages.
Supplemental Notice of Allowability dated Jan. 30, 2019 for U.S. Appl. No. 15/655,135; 9 pages.
Supplemental Notice of Allowability dated Feb. 13, 2019 for U.S. Appl. No. 15/655,135; 9 pages.
Office Action dated Jul. 28, 2016 for U.S. Appl. No. 14/529,669; 25 pages.
Response to Office Action filed on Oct. 28, 2016 for U.S. Appl. No. 14/529,669; 18 pages.
Final Office Action dated Jan. 9, 2017 for U.S. Appl. No. 14/529,669; 11 pages.
Response to Final Office Action filed Mar. 30, 2017 for U.S. Appl. No. 14/529,669; 12 pages.
Notice of Allowance dated Apr. 20, 2017 for U.S. Appl. No. 14/529,669; 8 Pages.
Request for Continued Examination filed Apr. 24, 2017 for U.S. Appl. No. 14/529,669; 3 pages.
Notice of Allowance dated May 18, 2017 for U.S. Appl. No. 14/529,669; 8 pages.
Amendment under 37 C.F.R. §1.312 filed on Jun. 29, 2017 for U.S. Appl. No. 14/529,669; 11 pages.
Response to Rule 312 Communication from USPTO dated Jul. 28, 2017 for U.S. Appl. No. 14/529,669; 2 pages.
PCT International Search Report and Written Opinion of the ISA dated Dec. 23, 2015; For PCT App. No. PCT/US2015/055233; 12 pages.
PCT International Preliminary Report and Written Opinion dated May 11, 2017 for International Application No. PCT/US2015/055233; 8 Pages.
Allowed Specification dated May 6, 2016 for EP Pat. Appl. No. 15787099.9; 71 pages.
Examination report dated May 28, 2018 for European Application No. 15787099.9; 7 Pages.
Notice of Intention to Grant dated May 27, 2019 for EP Pat. Appl. No. 15787099.9; 7 pages.
Reasons for Rejection with English translation dated Mar. 1, 2019 for JP Pat. Appl. No. 2017-522907; 9 pages.
Yuasa and Hara Letter dated Apr. 1, 2019 regarding Reasons for Rejection and English Claims for JP Pat. Appl. No. 2017-522907; 15 pages.
Response filed on May 29, 2019 for Japanese Patent Application No. 2017-522907 with English Translation; 40 Pages.
Notice of Allowance with English Allowed Claims dated Oct. 31, 2019 for Japanese Application No. 2017-522907; 17 pages.
Office Action dated Jul. 10, 2019 for U.S. Appl. No. 15/658,757; 23 pages.
Response to Office Action dated Sep. 23, 2019 for U.S. Appl. No. 15/658,757; 15 pages.
Final Office Action dated Nov. 21, 2019 for U.S. Appl. No. 15/658,757; 24 pages.
Response to Office Action and Request for Continued Examination (RCE) dated Jan. 17, 2020 for U.S. Appl. No. 15/658,757; 19 pages.
Office Action dated Feb. 12, 2020 for U.S. Appl. No. 15/658,757; 24 pages.
Partial European Search Report dated Dec. 4, 2019 for EP Application No. 19198294.1-1022, 13 Pages.
Office Action dated Oct. 24, 2019 for U.S. Appl. No. 16/136,844; 21 pages.
Response to Office Action filed Jan. 17, 2020 for U.S. Appl. No. 16/136,844; 14 pages.
Final Office Action dated Mar. 2, 2020 for U.S. Appl. No. 16/136,844; 22 pages.
Office Action dated Mar. 20, 2015; for U.S. Appl. No. 13/946,417; 54 pages.
Response to Office Action dated Mar. 20, 2015 and filed on Jun. 19, 2015; for U.S. Appl. No. 13/946,417; 15 pages.
Final Office Action dated Aug. 28, 2015; for U.S. Appl. No. 13/946,417; 34 pages.
Response to Final Office Action and Request for Continued Examination dated Nov. 9, 2015; For U.S. Appl. No. 13/946,417; 17 pages.
Non-Final Office Action dated Dec. 3, 2015; for U.S. Appl. No. 13/946,417; 29 pages.
Response to Office Action dated Dec. 3, 2015 and filed on Mar. 3, 2016; For U.S. Appl. No. 13/946,417; 17 pages.
Final Office Action dated Oct. 6, 2016; for U.S. Appl. No. 13/946,417; 45 pages.
Response to Final Office Action dated Oct. 6, 2016 from U.S. Appl. No. 13/946,417, filed Jan. 24, 2017; 14 Pages.
Office Action dated Mar. 15, 2017 from U.S. Appl. No. 13/946,417; 43 Pages.
Response to Office Action filed on Jun. 14, 2017 for U.S. Appl. No. 13/946,417; 10 pages.
Final Office Action dated Sep. 8, 2017 for U.S. Appl. No. 13/946,417; 56 pages.
Response (with RCE) to Final Office Action dated Sep. 8, 2017 for U.S. Appl. No. 13/946,417; Response with RCE filed Nov. 29, 2017; 16 pages.
Office Action dated Feb. 8, 2018 for U.S. Appl. No. 13/946,417; 37 Pages.
Response to Non-Final Office Action dated Feb. 8, 2018 for U.S. Appl. No. 13/946,417; Response filed on Apr. 19, 2018; 14 pages.
Final Office Action dated Jun. 15, 2018 for U.S. Appl. No. 13/946,417; 33 Pages.
Response to Final Office Action dated Jun. 15, 2018 for U.S. Appl. No. 13/946,417, filed Sep. 14, 2018; 15 Pages.
Office Action dated Feb. 7, 2019 for U.S. Appl. No. 13/946,417; 35 pages.
Response to Office Action dated Feb. 7, 2019 for U.S. Appl. No. 13/946,417; Response filed Apr. 22, 2019; 14 pages.
Notice of Allowance dated Sep. 11, 2019 for U.S. Appl. No. 13/946,417; 10 pages.
Supplemental Notice of Allowability dated Oct. 2, 2019 for U.S. Appl. No. 13/946,417; 7 pages.
International Search Report and Written Opinion dated Oct. 28, 2014 for Int'l PCT Application PCT/US2014/044991; 12 pages.
PCT International Preliminary Report and Written Opinion dated Jan. 28, 2016 for International Application No. PCT/US2014/044991; 9 Pages.
Office Action dated Nov. 3, 2016 regarding U.S. Appl. No. 14/529,606; 11 pages.
Response to Examination report dated May 28, 2018 for European Application No. 15787099.9 as filed on Sep. 17, 2018; 15 Pages.
Response to European Communication filed on Nov. 6, 2020 for European Application No. 19198294.1; 16 pages.
Response to Office Action filed on Jan. 25, 2017 for U.S. Appl. No. 14/529,606; 19 pages.
Notice of Allowance dated Mar. 16, 2017 for U.S. Appl. No. 14/529,606; 9 pages.
Preliminary Amendment filed on Apr. 21, 2017 for U.S. Appl. No. 14/529,606; 12 pages.
Request for Continued Examination filed on Apr. 21, 2017 for U.S. Appl. No. 14/529,606; 3 pages.
Non-final Office Action dated May 19, 2017 for U.S. Appl. No. 14/529,606; 11 pages.
Response to Office Action filed on Jul. 5, 2017 for U.S. Appl. No. 14/529,606; 13 pages.
Notice of Allowance dated Aug. 4, 2017 for U.S. Appl. No. 14/529,606; 9 pages.
Instruction Letter to Yuasa & Hara dated Jul. 30, 2018 instructions to file Voluntary Amendment for Japanese Application No. 2017-522906; 2 Pages.
English translations of Claims on File dated Sep. 20, 2018 for Japanese Application No. 2017-522906; 7 Pages.
Letter from Foreign Associate dated Sep. 20, 2018 reporting voluntary amendment filed for Japanese Application No. 2017-522906; 2 Pages.
Notice of Reason for rejection with English translation dated Oct. 23, 2019 for Japanese Application No. 2017-522906; 5 pages.
Response to Notice of Reason for rejection with English translation dated Dec. 26, 2019 for Japanese Application No. 2017-522906; 16 pages.
Allowed Specification dated Jul. 7, 2016 for EP Pat. Appl. No. 15853626.8; 104 pages.
A.A. Thornton letter dated Nov. 26, 2018 in response to Official Communication dated Jul. 9, 2018 for EP Pat. Appl. No. 15853626.8; 4 pages.
Amended Claims filed on Nov. 26, 2018 for EP Pat. Appl. No. 15853626.8; 4 pages.
Intention to Grant dated Apr. 25, 2019 for EP Pat. Appl. No. 15853626.8-1022; 7 pages.
Communication under Rule 71(3) EPC dated Oct. 10, 2018 for International Application No. 15791066.2; 7 Pages.
Allowed Specification dated May 6, 2016 for International Application No. 15791066.2; 102 Pages.
Notice of Allowance with English Allowed claims dated Jun. 10, 2019 for Japanese Patent Application No. 2017-522908 with English Translation of Allowed Claims; 12 Pages.
Office Action dated Jul. 14, 2016 for U.S. Appl. No. 14/529,594; 94 pages.
Response to Office Action filed Oct. 14, 2016 for U.S. Appl. No. 14/529,594; 29 pages.
Final Office Action dated Jan. 4, 2017 for U.S. Appl. No. 14/529,594; 38 pages.
Response to Final Office Action filed on Mar. 31, 2017 for U.S. Appl. No. 14/529,594, 16 pages.
Notice of Allowance dated May 10, 2017 for U.S. Appl. No. 14/529,594; 8 pages.
Preliminary Amendment filed on Jun. 16, 2017 for U.S. Appl. No. 15/624,898; 15 pages.
Office Action dated Nov. 28, 2018 for U.S. Appl. No. 15/624,898; 35 Pages.
Response to Office Action dated Nov. 28, 2018 and filed on Jan. 11, 2019 for U.S. Appl. No. 15/624,898; 17 pages.
Final Office Action dated Feb. 14, 2019 for U.S. Appl. No. 15/624,898; 30 pages.
Amendment under 37 C.F.R. §1.114 filed on Apr. 10, 2019 for U.S. Appl. No. 15/624,898; 19 pages.
Office Action dated Sep. 26, 2019 for U.S. Appl. No. 15/624,898; 10 pages.
Response to Office Action dated Nov. 7, 2019 for U.S. Appl. No. 15/624,898; 14 pages.
Final Office Action dated Jan. 17, 2020 for U.S. Appl. No. 15/624,898; 13 pages.
Response to Final Office Action dated Apr. 9, 2020 for U.S. Appl. No. 15/624,898; 15 pages.
Notice of Allowance dated Apr. 22, 2020 for U.S. Appl. No. 15/624,898; 8 pages.
Extended European Search Report dated Apr. 3, 2020 for European Application No. 19198294.1; 20 pages.
Response to Office Action filed on May 11, 2020 for U.S. Appl. No. 15/658,757; 15 pages.
Extended European Search Report dated May 4, 2020 for European Application No. 19209914.1; 9 pages.
Notice of Allowance dated May 28, 2020 for U.S. Appl. No. 15/658,757; 8 pages.
Response to Office Action and Request for Examination (RCE) dated Jun. 2, 2020 for U.S. Appl. No. 16/136,844; 13 pages.
Notice of Allowance dated Jun. 23, 2020 for U.S. Appl. No. 16/136,844; 12 pages.
Office Action dated Jun. 8, 2020 for U.S. Appl. No. 16/232,348; 64 pages.
Notice of Allowance dated Sep. 16, 2020 for U.S. Appl. No. 16/232,348; 8 pages.
Ahn et al., “A New Toroidal-Meander Type Integrated Inductor With A Multilevel Meander Magnetic Core”, IEEE Transactions on Magnetics, vol. 30, No. 1, Jan. 1994, 7 pages.
Allegro MicroSystems, Inc.; “3212 Data Sheet: Micropower, Ultra-Sensitive Hall-Effect Switch”, published Sep. 22, 2004; 12 pages.
Allegro MicroSystems, Inc.; “3235 Data Sheet: Dual-Output Hall-Effect Switch”, http://www.datasheetcatalog.org/datasheets/90/205047_DS.pdf; downloaded Sep. 29, 2010; 6 pages.
Allegro MicroSystems, Inc.; “3425 Data Sheet: Dual, Chopper-Stabilized, Ultra-Sensitive Bipolar Hall-Effect Switch”, published Jun. 28, 2002; 10 pages.
Allegro MicroSystems, Inc.; “27701-AN Data Sheet: Hall-Effect IC Applications Guide”, Application Information, Rev. 2; http://www.allegromicro.com/en/products/design/hall-effect-sensor-ic-applications-guide/AN27701.pdf; downloaded Sep. 29, 2010; 40 pages.
Allegro MicroSystems, Inc.; “A1140/41/42/43 Data Sheet: Sensitive Two-Wire Chopper-Stabilized Unipolar Hall-Effect Switches”, published Sep. 9, 2004; 10 pages.
Allegro MicroSystems, Inc.; “A1174 Data Sheet: Ultrasensitive Hall Effect Latch with Internally or Externally Controlled Sample and Sleep Periods for Track Ball and Scroll Wheel Applications”, published Jul. 25, 2008; 13 pages.
Allegro MicroSystems, Inc.; “A1230 Data Sheet: Ultra-Sensitive Dual-Channel Quadrature Hall-Effect Bipolar Switch”, published Mar. 26, 2010; 16 pages.
Allegro MicroSystems, Inc. “A1341 Data Sheet: High Precision, Highly Programmable Linear Hall Effect Sensor IC with EEPROM, Output Protocols SENT and PWM, and Advanced Output Linearization Capabilities”, May 17, 2010; 46 pages.
Allegro MicroSystems, Inc.; “A1351 Data Sheet: High Precision Linear Hall Effect Sensor with a Push/Pull, Pulse Width Modulated Output”, published Mar. 7, 2008; 23 pages.
Allegro MicroSystems, Inc., “A1354 Data Sheet: High Precision 2-Wire Linear Hall Effect Sensor IC with a Pulse Width Modulated Output”, 22 pages.
Allegro MicroSystems, Inc.; “A1356 Data Sheet: High Precision Linear Hall-Effect Sensor with an Open Drain Pulse Width Modulated Output”, 20 pages.
Allegro MicroSystems, Inc.; “A1360, A1361 and A1362 Data Sheet: Low-Noise Programmable Linear Hall Effect Sensors with Adjustable Bandwidth (50 kHz Maximum) and Analog Output”, published Mar. 18, 2008; 25 pages.
Allegro MicroSystems, Inc. “Data Sheet ATS601LSG: Non-TPOS, Tooth Detecting Speed Sensor”, Nov. 1, 2011; 9 pages.
Allegro “True Zero-Speed Low-Jitter High Accuracy Gear Tooth Sensor”, ATS625LSG; 2005; Allegro MicroSystems, Inc. Worcester, MA 01615; 21 pages.
Allegro MicroSystems, Inc. “ATS645LSH Data Sheet: Two-Wire True Zero Speed Miniature Differential Peak-Detecting Gear Tooth Sensor”,2004; Allegro MicroSystems, Inc., Worcester, MA 01615; 14 pages.
Allegro MicroSystems, Inc.; “ATS675LSE Data Sheet: Self-Calibrating TPOS Speed Sensor Optimized for Automotive Cam Sensing Applications”, published Jul. 11, 2008; 13 pages.
Allegro MicroSystems, Inc., “Gear-Tooth Sensor For Automotive Applications”, Aug. 3, 2001, 2 pages.
Allegro MicroSystems, Inc., “Hall-Effect IC Applications Guide”, http://www.allegromicro.com/en/Products/Design/an/an27701.pdf, Copyright 1987, 1997, 36 pages.
Atherton et al.; “Sensor Signal Conditioning—an IC Designer's Perspective”, IEEE Electro International; Apr. 26-28, 1991; 6 pages.
Ausserlechner et al.; “Compensation of the Piezo-Hall Effect in Integrated Hall Sensors on (100)-Si”, IEEE Sensors Journal, vol. 7, No. 11; Nov. 2007; ISBN: 1530-437X; 8 pages.
Ausserlechner et al.; “Drift of Magnetic Sensitivity of Small Hall Sensors Due to Moisture Absorbed by the IC-Package”, Proceedings of IEEE Sensors, 2004; vol. 1; Oct. 24, 2004; ISBN:0-7803-8692-2; 4 pages.
Ausserlechner; “Limits of Offset Cancellation by the Principle of Spinning Current Hall Probe”, Proceedings of IEEE Sensors; Oct. 2004; 4 pages.
Ausserlechner; “The piezo-Hall effect in n-silicon for arbitrary crystal orientation”, Proceedings of IEEE Sensors; vol. 3; Oct. 24, 2004; ISBN: 0-7803-8692-2; 4 pages.
Austria Microsystems; “AS5040 datasheet; 10-Bit Programmable Magnetic Rotary Encoder”, Revision 1.1; Jan. 2004; 20 pages.
Bahreyni, et al.; “A Resonant Micromachined Magnetic Field Sensor”, IEEE Sensors Journal; vol. 7, No. 9, Sep. 2007; 9 pages.
Banjevic et al.; “2D CMOS Integrated Magnetometer Based on the Miniaturized Circular Vertical Hall Device” International Solid-State Sensors, Actuators and Microsystems Conference; Transducers; Jun. 21-25, 2009; p. 4 pages.
Banjevic; “High Bandwidth CMOS Magnetic Sensors Based on the Miniaturized Circular Vertical Hall Device” Sep. 2011; 153 pages.
Barrettino, et al.; “CMOS-Based Monolithic Controllers for Smart Sensors Comprising Micromembranes and Microcantilevers” IEEE Transactions on Circuits and Systems—I Regular Papers vol. 54, No. 1; Jan. 2007; 12 pages.
Baschirotto et al.; “Development and Analysis of PCB Vector 2-D Magnetic Field Sensor System for Electronic Compass” IEEE Sensors Journal vol. 6, No. 2; Apr. 2006; 7 pages.
Bilotti et al.; “Monolithic Magnetic Hall Sensor Using Dynamic Quadrature Offset Cancellation;” IEEE Journal of Solid-State Circuits; vol. 32, Issue 6; Jun. 1997; 8 pages.
Blanchard et al.; “Cylindrical Hall Device;” International Electron Devices Meeting; Dec. 8-11, 1996; 4 pages.
Bosch, Robert, GMBH Stuttgart; “Active Sensor for ABS/ASR/VDC-Systems with 2-Wire-Current Interface;” Specification TLE4941/TLE4942; Version 5; Jul. 25, 2000; 44 pages.
Bowers et al.; “Microfabrication and Process Integration of Powder-Based Permanent Magnets;” Technologies for Future Micro-Nano Manufacturing Workshop; Aug. 2011; 4 pages.
Burger et al.; “New fully integrated 3-D silicon Hall sensor for precise angular-position measurements;” Sensors and Actuators, A 67; May 1998; 5 pages.
Daughton “Spin-Dependent Sensors” Proceedings of the IEEE, vol. 91, No. 5, May 2003; 6 pages.
Demierre, et al.; “Reference Magnetic Actuator for Self-Calibration of a Very Small Hall Sensor Array;” Sensors and Actuators A97-98; Apr. 2002; 8 pages.
Drljaca, et al.; “Nonlinear Effects In Magnetic Angular Position Sensor With Integrated Flux Concentrator;” Proc. 23rd International Conference on Microelectronics (MIEL2002); vol. 1; NIS; Yugoslavia; May 12-15, 2002; 4 pages.
Dwyer, “Back-Biased Packaging Advances (SE, SG & SH versus SA & SB),” http://www.allegromicro.com/en/Products/Design/packaging_advances/index.asp, Copyright 2008, 5 pages.
Dwyer; Allegro MicroSystems, Inc.; “AN296061 Data Sheet: Ring Magnet Speed Sensing for Electronic Power Steering;” published Jul. 21, 2009; 4 pages.
Freitas et al.; “Giant magnetoresistive sensors for rotational speed control;” Journal of Applied Physics, vol. 85, No. 8; Apr. 15, 1999; 3 pages.
Frick, et al.; “CMOS Microsystem for AC Current Measurement with Galvanic Isolation;” IEEE Sensors Journal; vol. 3, No. 6; Dec. 2003; 9 pages.
Gerhauser, H., “Intelligente 3D-Magnetfeld Sensorik;” Fraunhofer-Institut for Integrierte Schaltungen IIS; www.iis.fraunhofer.de/asic/analog; Oct. 2009; 12 pages.
Gilbert; “Technical Advances in Hall-Effect Sensing;” Allegro MicroSystems, Inc. Product Description; May 10, 2008; 7 pages.
Häberli et al.; “Contactless Angle Measurements by CMOS Magnetic Sensor with On Chip Read-Out Circuit;” The 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX; Jan. 25-29, 1995; 4 pages.
Häberli et al.; “Two-Dimensional Magnetic Microsensor with On-Chip Signal Processing for Contactless Angle Measurement;” IEEE Journal of Solid-State Circuits, vol. 31, No. 12; Dec. 1996; 6 pages.
Halg; “Piezo-Hall Coefficients of n-Type Silicon;” Journal of Applied Physics; vol. 64, No. 1; Jul. 1, 1998; 7 pages.
Hiligsmann et al.; “Monolithic 360 Degrees Rotary Position Sensor IC;” 2004 IEEE Proceedings of Sensors, vol. 3; Oct. 24-27, 2004; 6 pages.
Honeywell International, Inc., “Hall Effect Sensing and Application”, Micro Switch Sensing and Control, Chapter 3, http://content.honeywell.com/sensing/prodinfo/solidstate/technical/hallbook.pdf, date unavailable, 10 pages.
Hosticka; “CMOS Sensor Systems;” Sensors and Actuators A66; Apr. 1998; 7 pages.
Office Action dated Jun. 8, 2020 for U.S. Appl. No. 16/232,348; 11 pages.
Notice of Allowance dated Jun. 23, 2020 for U.S. Appl. No. 16/136,844; 9 pages.
Notice of Allowance dated Sep. 16, 2020 for U.S. Appl. No. 16/232,348; 6 pages.
U.S. Appl. No. 16/232,348, filed Dec. 26, 2018, Eagen et al.
Extended European Search Report dated Jun. 18, 2021 for European Application No. 21164122.0; 12 Pages.
European Examination Report dated Apr. 22, 2021 for European Application No. 19198294.1; 9 pages.
Notice of Allowance dated Sep. 24, 2021 for U.S. Appl. No. 16/683,800; 11 pages.
Office Action dated Nov. 10, 2021 for U.S. Appl. No. 16/899,702; 25 pages.
European Response filed Oct. 27, 2021 for European Application No. 19198294.1; 40 pages.
Korean Office Action dated Oct. 29, 2021 for Korean Application No. 10-2017-7014362; 19 pages.
Related Publications (1)
Number Date Country
20210148731 A1 May 2021 US