Patent Application
20150147922
This disclosure relates to signal processing systems and, more particularly, to connectors for such systems.
Next generation high-bandwidth probes and future generations of active probes for test systems will require the ability to handle multiple signals at the tip while meeting bandwidth and noise specifications. Current probes require two coaxial signals with frequency performance of up to 33 GHz and up to six direct current (DC) signal lines. Lower performance active probes will require up to eight signal lines and lower bandwidth. Current custom interconnect systems use off-the shelf radio frequency (RF) and DC contacts along with a custom housing. However, such multiport connectors (i.e., hybrid RF and DC) need to be custom designed and built for each probe application and, consequently, are very expensive—often prohibitively so.
Accordingly, a need remains for a high-performance, multiport connector system.
Radio frequency (RF) connector suppliers have been developing a process to create high performance micro-springs. Such springs are typically fabricated by way of a process referred to herein as “LIGA” (which is short for Lithographie, Galvanoformung, and Abformung). LIGA processing generally consists of three main processing steps: lithography, electroplating, and molding. There are two main types of LIGA-fabrication technologies: x-ray LIGA, which uses X-rays produced by a synchrotron to create high-aspect ratio structures, and ultraviolet (UV) LIGA, which is a more accessible method that uses UV light to create structures having relatively low aspect ratios.
Embodiments of the disclosed technology are generally directed to the use of LIGA springs as part of a new interconnect system for probing applications that would allow for multiple signal types while being flexible and miniature in size while reducing the cost thereof from that of a typical RF connector system. Given the small size and significant range of performance, such an interconnect system could be standardized for an entire probe platform, thus allowing for a common set of probe accessories across multiple product lines.
The system 100 also includes a zero insertion force (ZIF) connector 110, e.g., a high-bandwidth connector, suitable for connecting to a circuit device 120 such as a flex circuit that may include multiple contact paths, for example. The circuit device 120 may be suitable for connecting to a device under test (DUT), for example. In this manner, engineers may debug a particular circuit on a circuit board of the DUT.
A connecting member 104, such as a bundle including coaxial cables and/or direct current (DC) lines, may be integrated with the first connector 102 and the ZIF connector 110 to provide electrical coupling between the first connector 102 and the ZIF connector 110.
The ZIF connector 110 may have positioned therein multiple LIGA springs that are suitable for establishing and maintaining electrical contact with portions, e.g., connection points, of the circuit device 120 so long as the circuit device 120 is engaged with, e.g., remains inserted in, the ZIF connector 110.
In the example, the circuit device 200 has multiple connection points 202 that may be used to establish and maintain multiple a multiport connection through the circuit device to a DUT, for example, at one end and an electronic device such as an oscilloscope, for example, at the other end. Such internal contacts may be modified to accommodate a wide range of contact types (e.g., DC, power, and high bandwidth) so long as they stay within the contact area. Using custom, configurable, high performance LIGA springs to establish electrical connections advantageously provide a multiport connector that is flexible, configurable, high performance, small in size, robust (improved cycle life), and significantly lower in cost.
In certain embodiments, a DUT may have multiple circuit devices attached thereto such that a user may quickly and efficiently test various portions or aspects of the DUT by connecting a ZIF connector to—and acquiring data from—any or all of the circuit devices one at a time, e.g., sequentially.
The ZIF connector 300 has a locking component 304 suitable for facilitating the mating of the mating member, e.g., a circuit device, with the ZIF connector 300. In certain embodiments, a user may press the locking component 304 and, responsive thereto, multiple LIGA springs positioned within the interior space may move or be caused to be moved to an “open” position such that the user (or another party) may easily insert the mating member through the opening 302 and into the interior portion of the ZIF connector 300.
Responsive to the user releasing the locking component 304, the LIGA springs positioned in the interior space may move or be caused to be moved to a “closed” positioned such that they make contact with—while concurrently applying pressure to—the mating member. In certain embodiments, the LIGA springs may also establish at least one electrical connection with the mating member and maintain the electrical connection(s) so long as the mating member remains secured within—and mated with—the ZIF connector 300.
In the example, the ZIF connector 300 includes a rear portion 306 suitable for receiving—or otherwise mating with—a connecting member such as the connecting member 104 of
The LIGA springs 402 may include DC springs, signal springs, ground springs, or any suitable combination thereof. Any or all of the LIGA springs 402 may have a generally helical shape, a cantilever shape, or a combination thereof depending on the production process used and/or intended application of the ZIF connector, for example.
Also within the ZIF connector 400 is a spring housing 404 and multiple positioning portions 406 and 408 (also referred to herein as positioning keys) configured to align a mating member, such as a circuit device, within the interior portion of the ZIF connector 400 while the mating member is within the interior portion. While the example illustrates two positioning portions 406 and 408, certain embodiments may include more than two positioning portions.
Two connecting members 410 and 412 serve to provide an electrical connection between the ZIF connector 400 and another connector such as the first connector 102 of
Having described and illustrated the principles of the invention with reference to illustrated embodiments, it will be recognized that the illustrated embodiments may be modified in arrangement and detail without departing from such principles, and may be combined in any desired manner. And although the foregoing discussion has focused on particular embodiments, other configurations are contemplated. In particular, even though expressions such as “according to an embodiment of the invention” or the like are used herein, these phrases are meant to generally reference embodiment possibilities, and are not intended to limit the invention to particular embodiment configurations. As used herein, these terms may reference the same or different embodiments that are combinable into other embodiments.
Consequently, in view of the wide variety of permutations to the embodiments described herein, this detailed description and accompanying material is intended to be illustrative only, and should not be taken as limiting the scope of the invention. What is claimed as the invention, therefore, is all such modifications as may come within the scope and spirit of the following claims and equivalents thereto.
