This application claims the benefit of U.S. Provisional Application Ser. No. 61/240,417, filed Sep. 8, 2009, under 35 U.S.C. §119, which is incorporated by reference herein.
A field of the invention is microfabrication and nanofabrication.
Microfabrication and nanofabrication processes to form features such as channels and trenches often involve complex masking and etching steps. These processes, while successful, require highly expensive equipment and procedures to conduct micro- or nanofabrication steps.
Some efforts have been made to find simpler ways to conduct microfabrication and nanofabrication. Microscale scribing, for instance, can be used to produce grooves, or pockets including grooves, of sub-micron depths. As an example, Atomic Force Microscopes (AFMs) have been used to perform nanofabrication by using the scanning probe as a tool. A typical AFM scribing process drags an AFM tip along a surface to cause a mechanical or chemical change in the surface. AFM probes including Si3N4 probes, diamond tipped probes, and diamond coated silicon probes have been used for scribing. AFM scribing has been used to create grooves with sub-micron depths in materials including Al, Au—Pd, SiO2, Ni, and Si. AFMs allow for highly precise control of scribing forces normal to a workpiece, and they provide a way to perform in-situ metrology of the resulting grooves following production.
However, the working volumes of these AFMs tend to be very limited. Further, the length of the scribes is typically limited to between a few microns and tens of microns, and the speed of the piezoelectric stages of these machines (between 0.006 and 1.2 mm/min, with a maximum speed typically in the range of 1.2-1.5 mm/min) is slower than would be desirable for production purposes, particularly for larger but still highly accurate grooves, including those with curvilinear shapes. The number of passes used to scribe a single groove can be, for instance, as high as one thousand. The low speed and short scribing length result, in part, from limitations in the piezoelectric actuators used in AFMs.
Other methods of producing long microgrooves include laser scribing and diamond scribing. Laser scribing is capable of rapidly cutting long grooves in materials including stainless steel, nickel, tungsten, and silicon. Laser scribing, however, provides less control over the shape of each groove cross-section than mechanical cutting processes provide.
A high speed scribing device shuttle unit exists, which can be equipped to the Fanuc Robonano α-OiB machine, and this machine can rapidly scribe nanoscale high precision grooves using a rigid diamond tool. However, the Fanuc Robonano α-OiB machine achieves this capability via extreme rigidity of the tool and machine structure, through the use of 1 nm resolution encoders, and through the use of static air bearings on all machine axes. As a result, the Fanuc Robonano α-OiB machine is extremely expensive.
As the demands of miniaturization technology grow, it is desirable to overcome shortcomings of traditional scribing systems and methods.
A high precision micro/nanoscale machining system is provided according to embodiments of the present invention. A multi-axis movement machine provides relative movement along multiple axes between a workpiece and a tool holder. A cutting tool is disposed on a flexible cantilever held by the tool holder, the tool holder being movable to provide at least two of the axes to set the angle and distance of the cutting tool relative to the workpiece. A feedback control system uses measurement of deflection of the cantilever during cutting to maintain a desired cantilever deflection and hence a desired load on the cutting tool.
In typical mechanical scribing processes, a key goal is to achieve high rigidity, which is deemed critical to accurate positioning and cutting. Therefore, conventional tools are designed to be rigid, and any deflection is deemed undesirable. In some conventional tools, rigid micro groove cutting tools and thread cutting tools have been created using focused ion beam (FIB) machining. Such tools have been used to cut features using a turning process and system. The rigid tools are used along with an extremely stiff and high-precision machine.
Embodiments of the present invention use a different approach, employing a flexible cutting tool that eliminates the need for the machine to be extremely rigid and relaxes requirements on position sensing and position control. This provides a relatively inexpensive cutting process compared to conventional high precision processes, such as diamond scribing/diamond turning processes.
An embodiment of the invention is a high precision micro/nanoscale machining system. A multi-axis movement machine provides relative movement among multiple axes between a workpiece and a tool holder. For example, linear axes X, Y, Z and rotary axes (e.g., B and C axes) can be provided. A nonlimiting example multi-axis movement machine is a microscale machining tool (mMT).
A cutting tool is disposed on a cantilever held by the tool holder. The tool holder is movable (e.g., along two axes) to set an orientation (e.g., angle and distance) of the cutting tool relative to the workpiece. A feedback control system uses measurement of cantilever deflection during cutting to maintain a desired cantilever deflection and hence a desired load on the cutting tool. A particular example control system includes a proportional-integral-derivative (PID) control algorithm with feedforward for one or more of the axes of relative movement to control the tool holder. This system maintains the cantilever at a particular (e.g., predetermined) angle relative to, and/or a particular (e.g., predetermined) distance from, the workpiece. The resulting cantilever deflection is either constant or varied to achieve a desired cutting profile.
An example system of the invention comprises a cutting tool that includes a cutting geometry suitable for planing/shaping and is attached to or is a unitary extension of a flexible cantilever. The particular cutting geometry of the tool can be determined by the size and shape of the features to be cut. An example tool can have submicron dimensions. The tool can include separate cutting geometry and cantilever units that are joined, or it can include a single monolithic unit. Example tools can be formed from materials such as silicon, silicon coated with a harder material such as diamond, pure diamond, or any sufficiently strong and wear-resistant material. The end of the cantilever opposite the cutting geometry is joined, e.g., mechanically or using adhesive, to a tool holder.
The tool holder in an example embodiment is part of a cutting assembly, which includes the tool holder, a displacement sensor that senses bending of the cantilever and provides a signal input for the control system, and one or more micro-stages for allowing the displacement sensor output (e.g., a laser beam or strain gage output signal) and the cantilever to be aligned with one another. The cutting assembly is mounted to a motion platform with multiple axes of motion, for instance three linear axes of motion and two rotary axes of motion between the cutting tool and the workpiece. Movement of the motion platform is preferably controlled using a precision controller, such as but not limited to a CNC controller. The motion platform can be custom fabricated or may be a modified machine, such as a high-precision milling machine with its spindle replaced with the cutting assembly.
In a particular example embodiment, the cutting tool comprises an atomic force microscope (AFM) tip disposed on a flexible cantilever. The AFM tip may be, for instance, an existing AFM tip, such as a commercially available tip, or it may be a modified AFM tip. A cutting tool can be fabricated, as a nonlimiting example, by modifying AFM probes using focused ion beam (FIB) machining. The cutting tool can also be fabricated in other ways. A nonlimiting example modified AFM tip is shaped to have a predetermined cutting geometry that provides a back rake face and an end clearance face. The intersection of the back rake face and end clearance face in an example tip provides a cutting edge that maintains contact with a workpiece when the cantilever is deflected due to loading of the cutting tool against a workpiece. In some example modifications, the modified cutting tool would not be suitable for use in an AFM, but it performs well for machining according to example methods.
Nonlimiting example embodiment systems with AFM tips and flexible tools provide an AFM-based micro-scribing or cutting assembly for a machining system. Particular resolutions and displacements in an example AFM tip-based system are a function of the properties of the movement platform (e.g., mMT) that is used. Such a system, however, is not intended to limit the invention in its broader aspects, including by resolution or displacement. An example cutting assembly fits onto a 5-axis mMT in place of a spindle. The cutting assembly permits an AFM probe or other flexible cutting tool to be mounted at varying angles relative to a workpiece, and permits the deflection of the AFM or flexible tool cantilever to be measured during workpiece-AFM or flexible tool contact with the workpiece.
A preferred machining process of the invention uses the highly flexible tool to cut a groove or a pocket of several grooves. In the process, the cutting assembly is first advanced toward a workpiece until the cutting geometry makes contact with the workpiece. The assembly is further advanced toward the workpiece until the deflection of the cantilever portion of the tool results in a desired load on the cutting geometry. The workpiece is then moved in a desired pattern while the tool is engaged, similar to a planing machine, which results in a matching pattern being cut into the workpiece. During cutting, the signal from the displacement sensor is used as an input to a feedback loop that dynamically adjusts the stage, controlling the distance between the cutting assembly and workpiece in order to maintain the desired cantilever deflection, and thus controlling the desired load on the cutting geometry. The applied load, the cutting geometry, the cutting speed, and the workpiece material determine the depth of cut. The relation between applied load, cutting geometry, cutting speed, workpiece material, and depth of cut can be determined via calibration cuts or via simulation. In other example embodiments, the angle of the cutting tool can be adjusted during cutting to maintain a desired cutting angle.
With an example system, a relatively large change in cantilever deflection is advantageously required to increase the load on the tool enough to achieve a small increase in depth of cut. Accordingly, lower precision actuators and position measurement devices can be used in an example motion platform, yet the system can still machine extremely precise features. Example systems can achieve high precision manufacturing at reduced cost compared to conventional high precision machining processes, which are dependent upon extremely rigid and expensive machines.
An example process and system of the invention achieves cutting load, cutting speed, and cutting distances that are much larger than can be achieved with a conventional AFM. Embodiments of the invention provide high-speed, high-precision micro/nanoscale machining systems that can cut grooves with depths and widths of a couple microns or less, as a nonlimiting example, and with lengths that can be greater than, as a nonlimiting example, 100 mm. The example system can also be used to machine pockets (produced from multiple grooves) with micro/nanoscale depths. Grooves cut using example systems can have arbitrary cross-sections, be cut in arbitrary patterns, and have arbitrary depths at various points in a groove. A wide variety of materials may be used. Compared to conventional AFM scribing, example systems and methods can also provide greater cutting forces and relatively larger curvilinear movements. In example embodiments in which the cutting geometry on each example cutting tool is different than the geometry on the end of an AFM tip, improved cutting performance can be provided when removing larger amounts of material than are typically removed when scribing with an AFM.
Example systems of the invention can achieve fabrication of MEMS features, yet a lengthy sequence of fabrication steps is not required to cut features such as grooves. Many other applications are also possible, as will be appreciated by those of ordinary skill in the art. Example systems allow more control of features, e.g., groove cross-section, than is possible with laser scribing. Example processes and systems of the invention also provide the ability to rotate the workpiece stage, which provides the capability of cutting smooth curvilinear grooves. Compared to some highly rigid diamond scribing machines, example embodiments provide relatively inexpensive systems and methods that employ highly flexible tools, tools with specialized cutting geometries, lower resolution encoders, and more conventional mechanical bearings. As a result, an example system can use much (e.g., by a factor of ten or more) less expensive hardware to accomplish suitable results.
Preferred embodiments will now be discussed with respect to the drawings. The drawings include schematic figures that are not to scale, which will be fully understood by skilled artisans with reference to the accompanying description. Features may be exaggerated for purposes of illustration. From the preferred embodiments, artisans will recognize additional features and broader aspects of the invention.
As best shown in
Measurement of axis position is accomplished in example embodiments using linear and rotary encoders equipped for each stage. Magnetic encoders or optical encoders may be used, for example. Other example precision methods for measuring linear and rotary axis positions include high accuracy distance measuring sensors such as LVDT, laser interferometer, or reflection-based laser displacement sensor. An example linear encoder is a 20 nm resolution linear optical encoder. Example encoders for the two rotary stages 64, 66 include 0.316 arcsec resolution encoders.
A controller, such as a computed numerically controlled (CNC) controller, and in a more particular nonlimiting example, a Delta Tau Turbo UMAC CNC controller, is provided to control movement of the example movement machine 52, including relative movement of the tool holder 56 and the workpiece 54. The example controller has a built-in implementation of proportional-integral-derivative (PID) control with feedforward for each of the axes of the mMT and has built-in implementation of standard CNC move commands.
For machining the workpiece 56, a cutting tool 68 is mounted to the tool holder 56. The cutting tool 68 generally includes a cutting tip (tip) 70 disposed at or near the end of a flexible cantilever 72 for contacting the workpiece 56 during machining. As a nonlimiting example, the cantilever 72 can have a flexibility of about 42 N/m, the stiffness of commercial silicon AFM probes. The upper bound on stiffness, though, could be, say, several thousand N/m. As used herein, “at the end” of the cantilever is intended to also refer to at or near the end of the cantilever. The cutting tool 68 can be mounted to the tool holder 56 at varying angles relative to the workpiece 54.
A nonlimiting example cutting tool 68 is an atomic force microscope (AFM) probe, either unmodified or modified, e.g., custom modified for machining. Example cutting tools in preferred systems of the invention can be provided to achieve desired feature cross sections. The shape of the cutting tools can have variations comparable to those that are used in macroscale planing and shaping tools. Nonlimiting example macroscale tool shapes are found in the ASM handbook (ASM International, 2009), incorporated in its entirety herein by reference. Particular embodiment tools of the invention can be fabricated by FIB processes, particular examples of which are described below.
Compared to known macroscale tools, cutting tools used in example systems are highly flexible. Also, FIB manufacture to produce an example tool provides geometries at a much smaller scale. FIB machining has previously been used to modify AFM tips, but into shapes suitable for metrology, not for cutting. The tip geometries of some commercial probes are optimized for metrology purposes, and may neither be structurally strong enough nor properly shaped to be good cutting tools. The FIB machining process is used in particular example fabrication methods of the invention to produce tools having predetermined cutting geometries.
In an alternative embodiment, the cutting tool can be a cantilever with a piece of single-crystal diamond with a prescribed cutting geometry attached to one end. A nonlimiting example includes a single-crystal diamond AFM tip bonded to a sapphire cantilever with a metallic adhesive. This cantilever can in turn be bonded to a substrate, e.g., a sapphire substrate, mounted to the tool holder 56. Such tools can be fabricated by modifying diamond AFM probes (e.g., those manufactured by Micro Star Technologies) via FIB machining. Examples of such probes can have a rectangular rake face, an end clearance face, and two side clearance faces, though other rake face shapes can be provided.
In an example embodiment, the tool holder 56 is part of a cutting assembly 74, shown in
The example cutting assembly 74, which supports the tool holder 56, includes a frame 76 on which is coupled (e.g., mounted) a first microstage 78, positioned by actuator 80, a second microstage 82, positioned by actuator 84, and a third microstage 81, positioned by actuator 83.
Generally, in an example microscale machining (e.g., scribing) process, the tool tip 70 is brought into contact with the workpiece 54, and the workpiece is moved relative to the tip in a direction coincident with the axis of the flexible cantilever 72. Moving the workpiece 54 along this direction helps to prevent twisting or buckling of the cantilever 72. However, it is also contemplated that the tool 68 and/or workpiece 54 could be moved relative to one another along other directions or via other methods. The example process is generally analogous to microscale planing, in that material is removed from a workpiece in the form of chips by moving the workpiece 54 along a set path at a set velocity underneath the tip 70, but it differs, among other ways, in that the radius of the tool tip 70 can be of the same order of magnitude as an uncut chip thickness and the tip is mounted on a highly flexible cantilever 72. This does not limit the types of geometries that can be generated, because the workpiece rotary stage (C axis stage 66) can be used to achieve curvilinear scribe geometries without violating this constraint.
The flexibility of the example cantilever 72 inhibits direct control of cut depth using the controller. Particularly, the high flexibility of the cantilever 72 renders it difficult to force the tip 70 to move relative to the workpiece 54 at a set depth. Instead, the depth of cut and effective rake angle of the tool 68 change as the cantilever 72 deflects under applied load and cutting forces. However, in an example system and method, depth of cut is dependent on tool geometry, cutting speed, probe mounting angle, and tool (cutting) load, all of which can be controlled. Thus, according to embodiments of the present invention, the tool load is controlled by measuring cantilever deflection and using the result as feedback to maintain a deflection corresponding to a desired load. In this way, example systems and methods rely on controlled deflecting during cutting. An advantage of this method is that the cantilever deflection required to develop a load that results in a very small depth of cut (e.g., less than 100 nm) is on the order of microns. Hence, stage movements do not need to be nearly as precise as with a rigid tool. Therefore, a less expensive machine with less rigid stages and lower cost encoders can be used.
According to embodiments of the present invention, deflections of the cantilever 72 are measured during workpiece-tip contact. This measurement in example embodiments is provided by a precision displacement sensor 90, which is part of the cutting assembly 74. The displacement sensor 90 can be, for instance, fixedly coupled (e.g., mounted) to a side surface 91 of the frame 76. In an example embodiment, the displacement sensor 90 is a laser displacement sensor and in a more particular embodiment is a confocal laser displacement sensor, such as but not limited to a Keyence LT-9010M confocal laser displacement sensor. Other types of displacement sensors are also contemplated, such as but not limited to a strain gage or other displacement sensor integrated into a cutting tool cantilever.
The example displacement sensor 90 supplies an output beam 92 to measure the deflection of the cantilever 72 during cutting. A nonlimiting example displacement sensor 90 can measure distance from itself with a resolution of 10 nm while continuously focusing on a single spot on the cantilever 72 (displacement mode) or while continuously sweeping back and forth across the cantilever (scanning mode). The former option allows displacement of a single point to be measured at a rate (for example) of 1562 Hz, while the latter option allows the bent shape of the cantilever to be measured at a rate of (for example) 27 Hz via 13 points located at 10 μm lateral increments. The first microstage 78 and the second microstage 84 permit alignment of the cantilever 72 with the output (e.g., laser) beam 92 of the displacement sensor 90 by providing selective adjustment of the tool holder 56.
The exact relationship between tool 68 load and depth of cut can be established via empirical testing and used to pick a set of conditions that will result in a desired depth of cut. The relationship between applied load and cantilever deflection can be established analytically using a cantilever beam model of the tool. In a particular example method, the deflection measurement from the displacement sensor 90 is used as input to a feedback loop that maintains a set load normal to the workpiece 54 during scribing and is used for contact detection during workpiece registration. The flexibility of the tools used in example systems 50 with controlled deflection based on feedback allows very small depths of cut to be possible using relatively inexpensive equipment.
Accordingly, in an example operating method for operating the cutting tool 68, workpiece registration is accomplished by contacting three points on the workpiece 54 with the tip that are not collinear and then fitting the coordinates of those points to a plane. Contact detection is accomplished by moving the workpiece 54 via X and Y stages 58, 60 to an X-Y coordinate of interest and then advancing the cutting assembly 68 towards the workpiece using the Z axis stage 62 while monitoring the laser displacement sensor output (beam 92). When the laser sensor output 92 indicates a change in cantilever 72 position of a prescribed amount (examples of which will be apparent to an artisan), the contact Z-coordinate is taken to be the Z-encoder output offset by that amount.
To control the load applied to the tool tip 70 (e.g., AFM tip), the displacement value output (beam 92) from the displacement sensor 90 is related to the load on the tool tip. The relationship between tip displacement and nominal load is dependent on the cantilever geometry and can be readily calculated. In an example embodiment, for each cutting tool 68, the relationship between the nominal load and tip 70 displacement normal to the workpiece 54 surface is first established using a model, such as but not limited to a 2D finite element model (FEM) of the cutting tool. In an example FEM, the nominal load is defined as the load normal to the workpiece 54 surface that would result in a given cantilever 72 deflection if the forces on the tip 70 in the direction of cut are zero. A cantilever beam model of the tool can also be used to establish the relationship between the load and the cantilever deflection. In an example method, an assumption is made of no forces in the direction of cut for simplicity. This assumption should be valid because such forces would have to act through a very short moment arm to affect cantilever deflection, and thus such an effect is not likely to be large. Plane stress with specified thickness is also assumed for all elements in the model, and the mean width of each cantilever 72 is used as the element thickness.
The relationship between the displacement sensor output 92 and the tip 70 displacement is then established via simulation and/or calibration. In an example method, calibration involves moving the tip 70 into contact with an artifact, e.g., a flat silicon artifact, and then continuing to slowly move the cutting assembly 74 towards the artifact up to a set distance. The relationship between the sensor output 92 and the known additional distance moved by the cutting assembly 74, which approximates the actual deflection, provides an example calibration curve. Using this curve and the results of the finite element analysis, the relationship between nominal load and displacement sensor output (e.g., laser output 92) is established.
During an example scribing method, the controller (e.g., the CNC controller with PID feedforward control) executes a planned XYC-stage trajectory, while a corresponding tip 70 nominal load trajectory is followed. Achieving a set nominal load involves, for example, continuously measuring the displacement of a point on the back of the cantilever 72 and then relating the measurement to the tip 70 displacement via the provided calibration curve. The difference between the measured tip 70 displacement and the displacement that would achieve a desired nominal load is used as an input to a control algorithm, which can be fairly simple. The output from the control algorithm is used to control the Z stage 62 of the movement machine 52 to control load on the cutting tool 68.
As stated above, the cutting tool 68 can comprise a probe of an AFM, including a commercial AFM probe or a modified AFM probe.
The example AFM tip has a constant apparent rake angle similar to a conventional cutting tool. However, the effective rake angle, the angle of the effective rake face relative to the direction of cut, is affected by more than just the AFM tip geometry. Particularly, the effective rake angle is dependent upon both tip geometry and the orientation of the tip during cutting.
The orientation of the axis of the tip is controlled by the unbent orientation of the AFM cantilever, which can be set via the mounting angle, the applied load normal to the workpiece Fn, and the total forces generated in the direction of cut (cutting force) Fc, as shown in
The micro-geometry of the example AFM tip also affects the effective rake angle. The cutting edges of an AFM tip have radii re that are close to, and often more than, the uncut chip thickness tc. As a result, the effective rake angle is more negative than the rake angle would be based on rake face orientation alone. Hence, the effective rake angle is determined by both the rake face orientation relative to the direction of cut and the edge radii of the tip relative to the uncut chip thickness. In previous simulations of microscale cutting, where the uncut chip thickness is less than the edge radius of the tool, the effective rake angle has been estimated by extending a line between the lowest point on the cutting edge and a point on the rake face with an elevation that is 1.5 times the uncut chip thickness. Hence, the effective rake angle is determined by both the rake face orientation relative to the direction of cut and the edge radii of the tool.
Additionally, the combination of micro-geometry and uncut chip thickness determines if a chip is formed during scribing or if workpiece material is only ploughed. Chip formation will not occur if the uncut chip thickness is less than the minimum chip thickness tcmin, which is a material dependent fraction λn of the cutting edge radius for many workpiece materials.
Using example methods using the AFM probe shown in
For employing long, multiple tool pass cuts using the example AFM probe, a low mounting angle (e.g., a more negative effective rake angle), high cutting speed, and a moderate load result in low wear over long scribing lengths. Lowering the cutting speed to be comparable to the speeds used when cutting inside an actual AFM (typically no greater than 1.2 mm/min) may not be beneficial. More positive effective rake angles (larger mounting angles) can give rise to high levels of tool wear and fracture.
While the depth of cut increases the most during the first couple of tool passes, the amount of material removed generally increases during all tool passes, and multiple tool passes result in a more uniform depth of cut over the course of the groove. A change in geometry (e.g., from a sharp tool to a duller tool) also affects the amount of material removed per pass and the groove shape. Formation of very short chips can result in large amounts of particle generation, which can be difficult to remove from the workpiece surface. However, short chips have the advantage of preventing chip snarling.
Nonlimiting example chips cut using example methods with an AFM probe vary in length from 1.6-961 μm and in average width from 0.4-0.75 μm. Ribbon chips, washer-type helical chips, and tubular chips can be generated. An example of each chip type is shown in
For short, single tool pass cuts, wear increases significantly with increased cutting load and with increasing mounting angle. Furthermore, significant tool fracture can occur at high mounting angles. Wear radius increases with increased load at low speeds and high mounting angles or at high speeds and low mounting angles. Conversely, wear radius decreases with increased load at low speeds and low mounting angles or high speeds and high mounting angles. At high mounting angles, the tip can experience fracture and can appear sharp while being unsuitable for cutting.
Groove depth, the distance between the original surface and the lowest point in the groove, generally decreases with increased mounting angle, increases with increasing load at a low mounting angle, and decreases with load at a higher mounting angle and high cutting speed. The change in groove width (how wide the groove is at the level of the original surface) with cutting conditions follows similar trends.
Comparison of groove skewness (indicates the amount of asymmetry in the groove) and kurtosis (indicates how square versus peaked the groove is) shows that squarer grooves tend to be very symmetric, while more peaked grooves tend to be more skewed. Burr height (an estimate of the height of a burr had it not folded over) is highly dependent on mounting angle at high speeds but not at low speeds. Burr height increases with load at low speed but decreases with load at high speed. Hence the interaction of speed with load and speed with mounting angle is significant.
In machining, rake angle has a strong influence on cutting forces and the quality of cut surfaces, and thus it is helpful to understand the effective rake angles present in scribing (e.g., AFM-based scribing).
If the cutting edge is assumed to be infinitely sharp, the resultant ideal rake angle would be defined as shown in
Vogler, M. P., “On the Modeling and Analysis of Machining Performance in Micro-Endmilling,” PhD. Thesis, University of Illinois, Urbana, Ill., 2003, estimated the effective rake angle during micro-scale cutting simulations by drawing a line between the lowest point on the tool and the point on the cutting face where the chip separates from the tool. The point of tool-chip separation can be estimated as some multiple ξ of the uncut chip thickness tc, as shown in
As can be seen in Table 1, the ideal rake angle could be either positive or negative depending on the mounting angle. However, the most positive effective rake angle, −40.5°, occurred when a high speed, low mounting angle, and high load was used. This means that the use of a higher mounting angle resulted in a much more positive ideal rake but the effective rake could be more negative. Also, the highly negative rake angles observed suggest that, despite significant chip formation, a large amount of ploughing also occurred, which is supported by the presence of side burrs. The number of tool passes can have a significant effect of chip morphology.
A high mounting angle of 30° generally results in much higher wear than a low mounting angle of 5°, which may be due to tool fracture. This is also true of a more moderate mounting angle of 15°. This angle approaches that of a typical commercial AFM, which uses a mounting angle of about 13°. Furthermore, a best case of groove formation occurred at a high load. Increased cutting speed did not result in any additional wear, provided that a low mounting angle was used. Also, loads that are too low can result in significant burr formation, but not a clear groove. This is likely due to severe ploughing, since the depth of cut will be small relative to the chip radius, i.e., due to the minimum chip thickness. Therefore, successful cutting with a DT-NCHR diamond-coated AFM probe may be possible using even higher loads and higher cutting speeds if a low mounting angle is used. Initial wear of the AFM probe can likely be reduced through the use of an AFM tip that converges to a chisel edge, with plenty of material supporting the cutting edge, as opposed to a pointed tip.
Cutting conditions resulting in low wear and good groove formation were provided by cutting short straight grooves. However, for many manufacturing applications, a curved groove may be desirable. The example system 50 allows formation of a curved groove, for example by rotating the workpiece 54 during contact with the tool 68.
In a nonlimiting example method for cutting a curvilinear groove, using a speed of 25 mm/min, a mounting angle of 5°, and a nominal load of 0.5 mN, the translational stages and the workpiece rotary stage were used to cut a continuous spiral pattern. The inner radius of the resulting spiral was 236 μn, the spacing between revolutions was 3 μm, and groove length was 82 mm. A section of the spiral shaped groove is shown in
The bottom of the spiral-shaped groove is tilted slightly so that the deepest part of the groove was on the side of the groove centerline closer to the center of the spiral. This can be seen in
Grooves as long as 82 mm with depths up to 0.29 μm can be cut in example embodiments using a single tool pass and cutting speeds at least as high as 25 mm/min. Generally, groove formation involves significant chip formation. However, ploughing can occur, particularly at low load levels or when conditions give rise to highly negative effective rake angles. Groove geometry is highly dependent on cutting conditions. Well-formed grooves and good tool wear can be achieved using a high cutting speed, a high cutting load, and a low AFM probe mounting angle. Multiple tool passes do not increase groove depth significantly but are likely responsible for improved consistency in groove depth along its length. Tool wear occurs either gradually or by the sudden appearance of a large fracture depending on cutting conditions. When wear occurs gradually, there may be a short initial period of fast wear followed by a long period of very slow wear.
While commercially available diamond coated silicon AFM probes can be used in example embodiments, the shapes of such commercial probes are typically optimized for metrology and not strength. Therefore, early during cutting, part of the AFM tip on each probe can wear away very quickly or even fracture, and the resultant tool that performs subsequent cutting can have an unpredictable shape. Additionally, the probes are typically pyramid shaped, which means that grooves with rectangular cross-sections cannot be cut. Further, the rake angle and clearance angle of commercial AFM probes cannot be specified. Also, the effective rake angle can be increased by increasing the mounting angle of the probe, but without a sufficiently structurally strong tool this tends to only result in tip fracture. Chip snarling can be an issue as well when cutting with an AFM tip.
Accordingly, additional example embodiments provide cutting tools for use with microscale and nanoscale machining systems, such as those provided herein, by modifying existing AFM probes, for example silicon AFM probes, using focused ion beam (FIB) machining. Such probes can be optimized for cutting exclusively, and in such cases they likely would not be suitable for metrology. Thus, these example modified probes are referred to herein as AFM probe-based micro-planing tools.
Example AFM probe-based micro-planing tools according to example embodiments can be configured to achieve one or several criteria to improve cutting performance. It is preferred that example AFM probe-based microplaning tools be structurally strong enough to avoid fracture during cutting. Each tool preferably has a sharp cutting edge so that the effective rake angle is not determined solely by the edge radius and depth of cut. This also reduces the minimum chip thickness and hence promotes more chip formation. Also, each tool preferably comprises clearance faces that avoid excessive rubbing between the tool and workpiece. Further, example tools are designed to minimize chip snarling. This can involve, for example, a change in edge radius/rake angle that results in discontinuous chip formation or incorporation of a chip breaker geometry. Additionally, it is preferred that such tools be producible using a minimum number of cuts on an FIB machine.
As shown in
A radius 112 is provided shown immediately above the rake face 110, which acts as a chip breaker. A radius-type chip breaker is preferred over a ramp-shaped chip breaker because the radius will result in a smaller stress concentration factor compared to the sharp corners involved with having a ramp. A notch-type chip breaker is also possible. It is also contemplated that the tool 100 can be provided with the chip breaker 112 omitted.
The example tool 100 can be produced using three FIB cuts. The first cut is made looking at the side of the AFM probe, resulting in formation of the back rake and end clearance face. The second cut is made looking at the front of the probe at a slight angle, and results in the formation of one of the side clearance faces. The third cut is made looking at the front of the probe at a slightly different angle, and results in the formation of the other side clearance face.
In an example FIB method using a diamond cutting tool, four through cuts are used. The first cut forms the rake and end clearance faces. The second and third cuts form the side clearance faces. The fourth cut intersects the rake face to form the cutting edge. This last cut is made because, when cutting through a piece of materials, a sharper edge is formed on the side furthest from the ion source. However, if a rake face shape such as a v-shape or curved shape does not lend itself to the use of a fourth cut, that step can be eliminated at the cost of a somewhat larger cutting edge radius.
During cutting with a cutting tool 68, 100, 120 such as a commercially available or modified AFM probe, the cantilever 72 will deflect due to cutting forces and the applied load normal to the workpiece 54 surface. The cantilever deflection changes the orientation of the cutting geometry of the tool. It is useful for the cutting and relief faces of the tool to remain in a single orientation regardless of the applied load, which is the situation that normally occurs with rigid cutting tools. In this way, rake angles and clearance angles could be specified during tool design independently of how the tool will be loaded.
To accomplish a uniform cutting geometry operation in an example embodiment, the end of the bent cantilever 72 (e.g., an AFM cantilever) should be at the same orientation relative to the workpiece 54 at all times. This can be accomplished by adjusting the mounting angle of the probe so that a given load will result in the desired orientation. Since the groove cutting assembly 74 is mounted on a rotary stage (B axis stage 64), the mounting angle can easily be varied by rotating that stage.
According to a method of the present invention, the mounting angle required for the end of the bent cantilever to be parallel to the workpiece surface can be calculated using a 2D beam model that accounts for loads applied to the tool tip 70 normal to the workpiece 54, the probe mounting angle, and the location of the cutting edge (contact point) relative to the end of the cantilever 72. As an example,
Using similar calculations, a uniform cutting geometry can be insured during steady state cutting for any combination of cantilever and FIB machined cutting geometry on its end. However, when the load is being ramped up to the desired value, the cutting geometry will experience transient orientations. If cutting is occurring during this period, i.e., depth of cut is being ramped up during a cut, the cutting edge should still be the only contact point between the tool and the workpiece, and the clearance face should not rub against the workpiece. Therefore, the end clearance angle should be greater than the mounting angle used. Based on
The example simplified tool design was constructed by modifying a silicon NCHR AFM probe using two cuts performed by FIB machining.
A tool 140 according to another embodiment of the present invention is similar to the tool 130, but further includes a 5 degree side relief angle 142 on both sides of the rake face to improve straightness of cut. Also, to keep the clearance face of the tool from rubbing against the workpiece, the end clearance angle is increased from 10 degrees to 20 degrees. This design is shown in
As opposed to conventional AFM scribing, example embodiments of the present invention can provide cuts that are much longer, with a much faster scribing speed to achieve a good production rate. These longer cuts can result in uninterrupted chip formation, unlike in cases where the cut is only a few microns long. A large tip and edge radii, due to coated (e.g., diamond coated) probes, and large cutting speed involve scribing loads on the order of several hundred μN (for example), which are larger than typically used in conventional AFM scribing.
Example embodiments can provide a microscale or nanoscale machining process that can cut relatively long freeform grooves at high speeds on relatively large workpiece areas. Example applications of the invention include: MEMS (micro-electromechanical systems) device fabrication; maskless lithography; manufacturing hot embossing molds; manufacturing microfluidic devices with very narrow and shallow channels in a wide range of materials; fabricating reflective optics based lithography masks by scratching thin reflective coatings off a non-reflective substrate; the production of complex surface patterns composed of closely spaced or intersecting grooves for changing surface properties such as hydrophobicity; and creating optically diffractive devices, such as (but not limited to) LCD backlight light guilds, which can include microgrooves with depths of, e.g., 2.5-10 μm separated by 100-250 μm.
While various embodiments of the present invention have been shown and described, it should be understood that other modifications, substitutions, and alternatives are apparent to one of ordinary skill in the art. Such modifications, substitutions, and alternatives can be made without departing from the spirit and scope of the invention, which should be determined from the appended claims.
Various features of the invention are set forth in the appended claims.
This invention was made with Government support under Contract No. DMI-0328162 awarded by National Science Foundation and under Contract Numbers DE-FG02-07ER46453 and DE-FG02-04ER46471 awarded by the Department of Energy. The Government has certain rights in the invention.
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Number | Date | Country | |
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61240417 | Sep 2009 | US |