Claims
- 1. A forming station in a DIP handling apparatus operable to align leads in predetermined orientation and at a predetermined angle relative to the body portion, the leads having a shoulder adjacent the body portion, said handling apparatus including a trackway for operatively supporting and moving DIPs therealong from a loading station to a discharge station, said forming station positioned along said trackway subsequent to said loading station comprising laterally spaced rotatable forming rollers on opposite sides of said trackway, anvil means confronting the inner faces of said leads, said rollers and anvil means having cooperating confronting surfaces adapted to engage the DIP leads adjacent the shoulder to the outer terminal ends, said forming rollers cooperatively associated with said anvil means and spaced therefrom to define a nip gap, selectively variable pressure-applying means mounting the forming rollers and anvil means relative to one another which normally urges the cooperating surfaces toward one another and permits a continuously variable nip gap adjustable as determined by the leads passing through the nip gap and means for moving DIPs through said nip gap.
Parent Case Info
This is a continuation of application Ser. No. 06/710,032 filed on Mar. 11, 1985, now U.S. Pat. No. 4,665,954 and entitled HIGH-SPEED ELECTRONIC COMPONENT LEAD FORMING APPARATUS AND METHOD.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4103719 |
Witt |
Aug 1978 |
|
4219053 |
Tyner et al. |
Aug 1980 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
710032 |
Mar 1985 |
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