Patent Grant
12166304
Disclosed embodiments are related to midboard connector assemblies and designs, materials and related methods of use of such cable connector assemblies.
Electrical connectors are used in many electronic systems. It is generally easier and more cost effective to manufacture a system as separate electronic subassemblies, such as printed circuit boards (PCBs), which may be joined together with electrical connectors. Having separable connectors enables components of the electronic system manufactured by different manufacturers to be readily assembled. Separable connectors also enable components to be readily replaced after the system is assembled, either to replace defective components or to upgrade the system with higher performance components.
A known arrangement for joining several printed circuit boards is to have one printed circuit board serve as a backplane. Other printed circuit boards, called “daughterboards,” “daughtercards,” or “midboards” may be connected through the backplane. A backplane is a printed circuit board onto which many connectors may be mounted. Conducting traces in the backplane may be electrically connected to signal conductors in the connectors so that signals may be routed between the connectors. Daughtercards may also have connectors mounted thereon. The connectors mounted on a daughtercard may be plugged into the connectors mounted on the backplane. In this way, signals may be routed among the daughtercards through the backplane. The daughtercards may plug into the backplane at a right angle. The connectors used for these applications may therefore include a right angle bend and are often called “right angle connectors.”
Connectors may also be used in other configurations for interconnecting printed circuit boards. Sometimes, one or more smaller printed circuit boards may be connected to another larger printed circuit board. In such a configuration, the larger printed circuit board may be called a “motherboard” and the printed circuit boards connected to it may be called daughterboards. Also, boards of the same size or similar sizes may sometimes be aligned in parallel. Connectors used in these applications are often called “stacking connectors” or “mezzanine connectors.”
Connectors may also be used to enable signals to be routed to or from an electronic device. A connector, called an “I/O connector,” may be mounted to a printed circuit board, usually at an edge of the printed circuit board. That connector may be configured to receive a plug at one end of a connector assembly, such that the cable is connected to the printed circuit board through the I/O connector. The other end of the connector assembly may be connected to another electronic device.
Cables have also been used to make connections within the same electronic device. The cables may be used to route signals from an I/O connector to a processor assembly that is located at the interior of printed circuit board, away from the edge at which the I/O connector is mounted. In other configurations, both ends of a cable may be connected to the same printed circuit board. The cables can be used to carry signals between components mounted to the printed circuit board near where each end of the cable connects to the printed circuit board.
Routing signals through a cable, rather than through a printed circuit board, may be advantageous because the cables provide signal paths with high signal integrity, particularly for high frequency signals, such as those above 40 Gbps using an NRZ protocol. Known cables have one or more signal conductors, which is surrounded by a dielectric material, which in turn is surrounded by a conductive layer. A protective jacket, often made of plastic, may surround these components. Additionally the jacket or other portions of the cable may include fibers or other structures for mechanical support.
One type of cable, referred to as a “twinax cable,” is constructed to support transmission of a differential signal and has a balanced pair of signal wires embedded in a dielectric and encircled by a conductive layer. The conductive layer is usually formed using foil, such as aluminized Mylar. The twinax cable can also have a drain wire. Unlike a signal wire, which is generally surrounded by a dielectric, the drain wire may be uncoated so that it contacts the conductive layer at multiple points over the length of the cable. At an end of the cable, where the cable is to be terminated to a connector or other terminating structure, the protective jacket, dielectric and the foil may be removed, leaving portions of the signal wires and the drain wire exposed at the end of the cable. These wires may be attached to a terminating structure, such as a connector. The signal wires may be attached to conductive elements serving as mating contacts in the connector structure. The foil may be attached to a ground conductor in the terminating structure, either directly or through the drain wire, if present. In this way, any ground return path may be continued from the cable to the terminating structure.
High speed, high bandwidth cables and connectors have been used to route signals to or from processors and other electrical components that process a large number of high speed, high bandwidth signals. These cables and connectors reduce the attenuation of the signals passing to or from these components to a fraction of what might occur were the same signals routed through a printed circuit board.
In some embodiments, a connector assembly having at least one cable including at least a first cable conductor and an electrical connector includes a first contact tip including a superelastic conductive material configured to mate with a first signal contact of a circuit board, and a first conductive coupler mechanically coupling the first contact tip to the first cable conductor. The first conductive coupler at least partially surrounds a circumference of the first contact tip and a circumference of the first cable conductor.
In some embodiments, a connector assembly includes a plurality of cables, each of the plurality of cables including at least one cable conductor having an end, a plurality of contact tips, where each of the plurality of contact tips includes an end abutting the end of a respective cable conductor and is made from a different material than the respective cable conductor, and a plurality of conductive couplers. Each of the plurality of conductive couplers includes a first end with tines at least partially surrounding a contact tip of the plurality of contact tips and a second end with tines at least partially surrounding the end of the respective cable conductor.
In some embodiments, a connector assembly includes a first contact tip, a first cable conductor in electrical communication with the contact tip, a first conductive coupler including a first end mechanically coupled to the first contact tip and a second end coupled to the first cable conductor, and a housing including an opening therethrough, where the opening includes a first end defined by a first wall and a second end defined by a second wall and the first contact tip passes through the first wall, the first cable conductor passes through the second wall, and the first conductive coupler is disposed in the opening.
In some embodiments, an electrical connector includes a housing including a first surface, a first side transverse to the first surface, an electrical contact tip projecting from the cable connector housing and exposed at the first surface, and at least one member configured as a receptacle sized to receive the housing therein, where the receptacle is bounded by a second side. The first side including a first portion with a second surface making an angle of greater than 0 degrees and less than 90 degrees with respect to the first surface. The second side includes a second portion with a third surface, parallel to the second surface and positioned to engage the second surface when the housing is received in the receptacle.
In some embodiments, a method of connecting a cable to a substrate includes positioning the housing with a first surface of the housing facing a surface of the substrate, applying a first force to the housing in a first direction, where the first direction is parallel to the surface of the substrate, engaging a second surface on the housing with a third surface on the receptacle, such that a second force in a second direction, perpendicular to the first direction, is generated on the housing, urging, with the second force, a ground contact tip against a ground contact disposed on the surface of the substrate, and urging, with the second force, a first electrical contact tip against a first signal contact disposed on the surface of the substrate.
In some embodiments, a method of manufacturing an electrical connector includes mechanically and electrically connecting a first cable conductor formed of a first material to a first electrical contact tip formed of a conductive superelastic material different from the first material, attaching a member to the first cable conductor and/or the first electrical contact tip, and positioning the member in a housing with the first electrical contact tip exposed in a surface of the housing and the first cable conductor extending from the housing.
In some embodiments, an electrical connector includes a first contact tip formed of a first material, a first cable conductor formed of a second material different from the first material and electrically connected to the first contact tip at a joint, and a housing including an opening therethrough, where the joint is disposed in the opening, where the opening is bounded by interior surfaces of the housing, and at least a portion of the interior surfaces are coated with a conductor.
In some embodiments, an electrical connector kit includes a contact tip, a conductive coupler including a first end configured to be mechanically coupled to the first contact tip and a second end configured to be mechanically coupled to a cable conductor, and a housing including an opening therethrough, where the opening includes a first end defined by a first wall and a second end defined by a second wall. The housing is configured to receive the first contact tip through the first wall, the housing is configured to receive the cable conductor through the second wall, and the opening is configured to receive the conductive coupler.
In some embodiments, an electrical connector includes a first contact tip formed of a first material, a first cable conductor formed of a second material different from the first material, a capacitor electrically connecting the first contact tip to the first cable conductor, and a housing including an opening therethrough, where the capacitor is disposed in the opening.
In some embodiments, a connector assembly includes a circuit board including a first contact pad, where the first contact pad includes a recess, and a first contact tip including a superelastic conductive material configured to mate with the first contact pad, where the first contact pad is configured to align the first contact tip with respect to the recess when the first contact tip mates with the first contact pad.
It should be appreciated that the foregoing concepts, and additional concepts discussed below, may be arranged in any suitable combination, as the present disclosure is not limited in this respect. Further, other advantages and novel features of the present disclosure will become apparent from the following detailed description of various non-limiting embodiments when considered in conjunction with the accompanying figures.
The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures may be represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:
The inventors have recognized and appreciated designs for cable connectors that enable efficient manufacture of small, high performance electronic devices, such as servers and switches. These cable connectors support a high density of high-speed signal connections to processors and other components in the midboard region of the electronic device. The other end of cables terminated to the connector may be connected to an I/O connector or at another location remote from the midboard such that the cables of a connector assembly may carry high-speed signals, with high signal integrity, over long distances.
The connector may support a pressure mount interface to a substrate (e.g., a PCB or semiconductor chip substrate) carrying a processor or other components processing a large number of high speed signals. The connector may incorporate features that provide a large number of pressure mount interconnection points in a relatively small volume. In some embodiments, the connector may support mounting on the top and bottom of a daughtercard or other substrate separated by a short distance from a motherboard, providing a high density of interconnections. Further, the connector may have superelastic contact tips, for example, which may have a very small diameter but nonetheless generate sufficient and consistent contact force to provide reliable electrical connections, even if there are variations in the force pressing the connector towards the substrate.
The connector may terminate multiple cables with a contact tip for each conductor in each cable designed as a signal conductor and one or more contact tips coupled to a grounding structure within the cable. For drainless twinax cable, for example, the connector may have, for each cable, two contact tips electrically coupled to the cable conductors and either one or two contact tips coupled to a shield around the cable conductors.
According to exemplary embodiments described herein, any suitably sized cable conductors may be employed and coupled to a suitably sized contact tip. In some embodiments, cable conductors may have a diameter less than or equal to 30 AWG. In other embodiments, cable conductors may have a diameter less than or equal to 36 AWG.
Contact tips may be connected to conductive structures within the cables directly or through the use of one or more intermediate components. For signal conductors, contact tips may be connected, for example, through a coupler. The coupler may hold the cable conductor and the contact tip in axial alignment. Each of the tip and cable conductor may be secured to the coupler, such as through welding, soldering or crimping, which may electrically and mechanically couple the tip and cable conductor. In some embodiments, the coupler may be configured to hold an electronic component, such as a surface mount capacitor, such that the capacitor is coupled between the tip and cable conductor. Ground tips may be coupled to shields of the cables through compliant conductive members, such as conductive elastomers.
The inventors have recognized and appreciated that, at the scale required for high density interconnections, more reliable pressure-mount connections may be formed by inhibiting sliding of the cable conductors and/or tips relative to the insulative structures of the cables and/or connector housing. Members may be attached to the cable conductors and/or tips to prevent such sliding. The members may abut the connector housing or cable insulator, blocking sliding motion. For example, the member may fit within an opening in the connector housing such that sliding motion in both directions along the axial direction of the cable is inhibited. The coupler, electrically coupling the cable conductor and contact tip, may serve as the member inhibiting sliding motion.
To support high signal integrity interconnections, portions of the cable connectors extending beyond shielding of the cable may be partially or totally surrounded by grounded structures so as to ensure that there are only small impedance changes within the connector. Those grounded structures may include portions of the connector housing that are plated with metal, such as through a PVD process. Those grounded structures may include contact tips or metal sheets connected to the ground structures within the cable and/or on a surface of a substrate to which the connector is mounted. Grounded structures, in some embodiments, may include conductive elastomer and/or electrically lossy members.
Mating force may be generated with a camming structure that generates a force, urging the connector towards a substrate, based on a force on the connector parallel to the surface of the substrate. The camming structure may be implemented with surfaces on the connector housing and mounted to the substrate that are angled relative to the substrate. Those surfaces may be positioned to engage when the connector is inserted into the receptacle such that mating force can be generated by a simple motion and without the need to tighten screws or otherwise activate a mechanism that generates force towards the substrate. Generating force through a camming structure reduces the need for mechanical components above or below the connector, which can expand the locations in which the connector can be used in a compact electronic device. Additionally, generating mating as a result of moving the connection parallel to the substrate can cause contact tips of the connector to wipe along the surface of the substrate, removing contaminants at the interface between the tips and the substrate and making more reliable electrical connections.
The pressure mount connector also may be relatively thin, further expanding the locations in which such a connector may be used. Connectors may be thin enough to fit below a heat sink mounted on a chip, for example, or mounted to an upper and/or lower surface of a card containing a processor, such as a daughter card that is spaced from a motherboard by a relatively small distance. Mounting connectors to both upper and lower surfaces of a card may increase contact density expanding the number of contacts per linear inch of the card edge and, likewise per square inch of card used for the mating interface between connector assemblies and the midboard of the electronic device.
A high contact density may also be enabled through the use of modules. Each module may couple contact tips to conductive structures within a limited number of cables, such as a single cable. Each module may have an insulative member with openings in which the conductors of a cable are spliced to contact tips. Contact tips coupled to the shield of the cable may be mounted on the outside of the insulative member. The modules may be aligned in one or more rows, creating an array of contact tips. The modules may be tightly spaced without walls of a connector housing separating them, as the ground structures on the outside of adjacent modules may touch one another, further increasing the density of the array of tips. The ground contact tips of adjacent modules may pass through the same openings in the insulative members of the adjacent modules.
Electronic systems may be significantly improved by providing pressure mount electrical connectors that incorporate shape memory materials exhibiting superelastic behavior (also known as pseudoelasticity), herein referred to as superelastic materials.
Superelastic materials may be characterized by the amount of strain required for those materials to yield, with superelastic materials tolerating a higher strain before yielding. Additionally, the shape of the stress-strain curve for a superelastic material includes a “superelastic” region. Illustrative stress-strain curves for a conventional and superelastic material are shown in
Superelastic materials may include shape memory materials that undergo a reversible martensitic phase transformation when a suitable mechanical driving force is applied. The phase transformation may be a diffusionless solid-solid phase transformation which has an associated shape change; the shape change allows superelastic materials to accommodate relatively large strains compared to conventional (i.e. non-superelastic) materials, and therefore superelastic materials often exhibit a much larger elastic limit than traditional materials. The elastic limit is herein defined as the maximum strain to which a material may be reversibly deformed without yielding.
Superelastic behavior is exhibited by many shape memory materials which have the shape memory effect. Similar to superelasticity, the shape memory effect involves a reversible transformation between the austenite and martensite phases with a corresponding shape change. However, the transformation in the shape memory effect is driven by a temperature change, rather than mechanical deformation as in superelasticity. In particular, a material which exhibits the shape memory effect may reversibly transition between two predetermined shapes upon a temperature change which crosses a transition temperature. For example, a shape memory material may be “trained” to have a first shape at low temperatures (below the transition temperature), and a second, different shape above the transition temperature. Training a particular shape for a shape memory material may be accomplished by constraining the shape of the material and performing a suitable heat treatment.
Depending on the particular embodiment, the superelastic material may have a suitable intrinsic conductivity or may be made suitably conductive by coating or attachment to a conductive material. For example, a suitable conductivity may be in the range of about 1.5 μΩcm to about 200 μΩcm. Examples of superelastic materials which may have a suitable intrinsic conductivity include, but are not limited to, metal alloys such as copper-aluminum-nickel, copper-aluminum-zinc, copper-aluminum-manganese-nickel, nickel-titanium (e.g. Nitinol), and nickel-titanium-copper. Additional examples of metal alloys which may be suitable include Ag—Cd (approximately 44-49 at % Cd), Au—Cd (approximately 46.5-50 at % Cd), Cu—Al—Ni (approximately 14-14.5 wt %, approximately 3-4.5 wt % Ni), Cu—Au—Zn (approximately 23-28 at % Au, approximately 45-47 at % Zn), Cu—Sn (approximately 15 at % Sn), Cu—Zn (approximately 38.5-41.5 wt % Zn), Cu—Zn—X (X═Si, Sn, Al, Ga, approximately 1-5 at % X), Ni—Al (approximately 36-38 at % Al), Ti—Ni (approximately 49-51 at % Ni), Fe—Pt (approximately 25 at % Pt), and Fe—Pd (approximately 30 at % Pd).
In some embodiments, a particular superelastic material may be chosen for its mechanical response, rather than its electronic properties, and may not have a suitable intrinsic conductivity. In such embodiments, the superelastic material may be coated with a more conductive metal, such as silver, to improve the conductivity. For example, a coating may be applied with a chemical vapor deposition (CVD) process, particle vapor deposition process (PVD) or any other suitable coating process, as the disclosure is not so limited. Coated superelastic materials also may be particularly beneficial in high frequency applications in which most of the electrical conduction occurs near the surface of conductors. As described in more detail below, in some embodiments, the conductivity of a connector element including a superelastic material may be improved by attaching a superelastic material to a conventional material which may have a higher conductivity than the superelastic material. For example, a superelastic material may be employed only in a portion of the connector element which may be subjected to large deformations, and other portions of the connector which do not deform significantly may be made from a conventional (high conductivity) material.
In some embodiments, a contact pad disposed on a substrate (e.g., PCB) may include a recess configured to receive a contact tip and align the contact tip with the contact pad. The inventors have recognized the benefits of such an arrangement, which ensures consistent electrical connections between a contact tip and contact pad. In some cases, improper alignment of a contact tip and a contact pad may degrade signal launch and electrical impedance at the interface between the contact tip and the contact pad. That is, the electrical impedance and signal carrying capacity may be tuned based on specific position of a contact tip and a contact pad. Accordingly, if the contact pad aligns the contact tip when the contact tip is brought into engagement with the contact pad, the intended impedance and signal characteristics may be reliably achieved. In some embodiments, a contact pad may include a semi-circular or otherwise curved depression configured to generate normal forces that align a contact tip with a longitudinal centerline of the depression. In other embodiments, a contact pad may include a V-shaped groove with inclined walls configure to generate normal forces that align a contact tip with a longitudinal centerline of the groove. A recessed contact pad may be employed for signal contact pads and/or ground contact pads, as the present disclosure is not so limited.
Turning to the figures, specific non-limiting embodiments are described in further detail. It should be understood that the various systems, components, features, and methods described relative to these embodiments may be used either individually and/or in any desired combination as the disclosure is not limited to only the specific embodiments described herein.
In the illustrated example, the midboard connector assembly 112A couples signals to and from component 108 through an I/O connector 120 mounted in panel 104 of an enclosure. The I/O connector may mate with a transceiver terminating an active optical cable assembly that routes signal to or from another device. Panel 104 is shown to be orthogonal to circuit board 102 and daughterboard 106. Such a configuration may occur in many types of electronic equipment, as high speed signals frequently pass through a panel of an enclosure containing a printed circuit board and must be coupled to high speed components, such as processors or ASICS, that are further from the panel than high speed signals can propagate through the printed circuit board with acceptable attenuation. However, a midboard connector assembly may be used to couple signals between a location in the interior of a printed circuit board and one or more other locations, either internal or external to the enclosure.
In the example of
Cables 114A and 114B may electrically connect midboard connector assemblies 112A and 112B to locations remote from component 108 or otherwise remote from the location at which midboard connector assemblies 112A or 112B are attached to daughterboard 106. In the illustrated embodiment of
Cables 114B may have first ends 116 attached to midboard connector assembly 112B and second ends 118 attached to another location, which may be a connector like connector 120 or other suitable configuration. Cables 114A and 114B may have a length that enables midboard connector assembly 112A to be spaced from second ends 118 at connector assembly 120 by a first distance. In some embodiments, the first distance may be longer than a second distance over which signals at the frequencies passed through cables 114A could propagate along traces within PCB 102 and daughterboard 106 with acceptable losses. In some embodiments, the first distance may be at least 6 inches, in the range of 1 to 20 inches, or any value within the range, such as between 6 and 20 inches. However, the upper limit of the range may depend on the size of PCB 102.
Taking midboard connector assembly 112A as representative, the midboard connector assembly may be mated to printed circuit board, such as daughter card 106, near components, such as component 108, which receive or generate signals that pass through cables 114A. As a specific example, midboard connector assembly 112A may be mounted within six inches of component 108, and in some embodiments, within four inches of component 108 or within two inches of component 108. Midboard connector assembly 112A may be mounted at any suitable location at the midboard, which may be regarded as the interior regions of daughterboard 106, set back equal distances from the edges of daughterboard 106 so as to occupy less than 100% of the area of the daughterboard 106. Such an arrangement may provide a low loss path through cables 114. In the electronic device illustrated in
In some embodiments, midboard connector assembly 112A may be configured for mating to a daughterboard 106 or other PCB in a manner that allows for ease of routing of signals coupled through the connector assembly. For example, an array of signal pads to which contact tips of midboard connector assembly 112A are mated may be spaced from the edge of daughterboard 106 or another PCB such that traces may be routed out of that portion of the footprint in all directions, such as towards component 108.
According to the embodiment of
As shown in
While the embodiments of
As discussed herein, midboard connector assemblies may be used to make connections to processors or other electronic components. Those components may be mounted to a printed circuit board or other substrate to which the midboard connector might be attached. Those components may be implemented as integrated circuits, with for example one or more processors in an integrated circuit package, including commercially available integrated circuits known in the art by names such as CPU chips, GPU chips, microprocessor, microcontroller, or co-processor. Alternatively, a processor may be implemented in custom circuitry, such as an ASIC, or semicustom circuitry resulting from configuring a programmable logic device. As yet a further alternative, a processor may be a portion of a larger circuit or semiconductor device, whether commercially available, semi-custom or custom. As a specific example, some commercially available microprocessors have multiple cores in one package such that one or a subset of those cores may constitute a processor. Though, a processor may be implemented using circuitry in any suitable format.
In the illustrated embodiment, the processor is illustrated as a packaged component separately attached to daughtercard 106, such as through a surface mount soldering operation. In such a scenario, daughtercard 106 serves as a substrate to which midboard connector 112A is mated. In some embodiments, the connector may be mated to other substrates. For example semiconductor devices, such as processors, are frequently made on a substrate, such as semiconductor wafer. Alternatively, one or more semiconductor chips may be attached, such as in a flip chip bonding process, to a wiring board, which may be a multi-layer ceramic, resin or composite structure. The wiring board may serve as a substrate. The substrate for manufacture of the semiconductor device may be the same substrate to which the midboard connector is mated.
As shown in
As shown in
To support mating to such a footprint, connector 111 may have contact tips connected to the signal and/or ground conductive structures of the cable. Those contact tips may be positioned to press against corresponding conductive structures within the footprint on PCB 102. In the configuration of
As shown in
The housing is formed of multiple pieces that are held together, which allows internal components of the connector 111 to be arranged before being surrounded by the housing. Here, an upper piece 128 and a lower piece 130 are fastened together to form the housing modules. The two housing pieces are shaped to fit around the first ends 116 of the cables, which may enter the housing. Within the housing, conductive elements of the cable may be connected to contact tips. The upper piece and lower piece may be connected together with housing fasteners 132, which provide a clamping force to hold the connector its components together.
As shown in
As shown in
The housing may hold inserts 910A, 910B. Each of the inserts may support an end of the conductors of a cable and signal contact tips 932A, 932B that are electrically and mechanically coupled to the end of the conductors of the cable. Couplers 920A, 920B are shown coupling a cable conductor to a contact tip, which may similarly be supported by the insert. The coupler 920A, 920B is configured to electrically and physically couple the cable conductors 930A, 930B to the signal contact tips 932A, 932B, so that an electrical signal may be transmitted from the PCB 102 through the contact tips and to a respective cable conductor. Additionally, an insert may support ground contact tips, which may be electrically and, in some embodiments, physically coupled to a shield structure of a cable.
The coupler may be connected to the contact tips and conductors using, for example, soldering, welding, and/or crimping. The coupler may suitably connect the signal contact tips 932A which may be formed of a first material, such as a superelastic material like nickel titanium, to the cable conductors, which may be formed of a second material, such as a high conductivity material like copper.
The coupler may be fixed to the insert or mounted within the insert such that its motion in a direction parallel to the elongated axis of the cable conductor is limited. The inventors have recognized and appreciated that a cable conductor might slide within the insulator enclosing the cable conductor. In a configuration in which the end of the cable conductor is attached to a contact tip, such sliding of the conductor can change the position of the contact tip with respect to the surface of a substrate to which the contact tip is to mate, reducing the reliability of the connector. According to the embodiment of
Incorporating inserts into a connector housing may simplify manufacturing of the connector. An insert may be used to connect the conductors of a cable to contact tips outside of the connector housing, where tools and fixtures may be more readily used. For example, an end of a cable may be stripped of an exterior jacket and a shield surrounding a pair of signal conductors. Those signal conductors may be insulated within the cable, but that insulation may also be stripped off at the ends, leaving exposed conductors. Those exposed conductors might be inserted from one direction into openings passing through the insert. Contact tips may be inserted into those openings from the opposite direction, such that ends of the cable conductor and ends of the contact tip may face each other at an interior portion of the insert. That interior portion may include a window, exposing the joint between a cable conductor and a contact tip, such that the two may be connected, such as via welding or soldering. In embodiments in which a coupler is used, the window may open into a cavity in the insert where the coupler may be positioned. Ground contact tips may similarly be integrated into the insert, and coupled to the shield of the cable terminated by the insert. Once the cable is terminated with tips in this way, the insert may be inserted into or otherwise attached to the housing.
As shown in
Thus, each of the contact tips may be connected to a separate cable conductor and each of the ground contact tips may be connected to a ground shield. The bodies of the inserts shown in
In the depicted embodiment, to mate the connector to PCB 102, the contact tips and ground contact tips are elastically deformed against the contact pads 800. Elastic deformation may ensure good electrical communication between the PCB 102 and associated cable conductors. The inventors have recognized and appreciated that it may be desirable to form the signal contact tips 932 and/or ground contact tips of a superelastic material such as nickel titanium. Superelastic material, for example, may ensure a relatively constant contact force for a range of deflections of the contact tips, allowing for larger tolerances in the manufacturing of a connector assembly. As will be discussed further with reference to
As described above, the elastic limit of superelastic materials may be substantially larger than those of conventional materials. For example, some superelastic materials may be deformed to about 7% to 8% strain or more without yielding; in contrast, many conventional materials, such as metal alloys commonly used in electrical connectors, yield at 0.5% strain or less. Therefore, superelastic materials may enable designs for separable electrical connectors which utilize relatively large local deformations that are not possible with conventional materials without resulting in yielding and associated permanent damage to the connector. In particular, the inventors have recognized and appreciated that the large elastic limit of superelastic materials may be beneficial for providing reliable connections in the mating interface of an electrical connector. For example, the substantially flat stress-strain response of superelastic materials in the superelastic regime may allow for components made from superelastic materials to provide the same contact force over a large range of deformations. Therefore, superelastic components may allow for design tolerances that are larger compared to what is possible with conventional materials.
In some embodiments, the plateau 1218A in the stress-strain response of a superelastic material may enable connector designs which feature a substantially constant mating force over an extended range of deformations. Specifically, as described above, when a superelastic material is deformed in the superelastic regime, additional applied strain may be accommodated via a phase transition from an austenite phase to a martensite phase without a substantial increase in the applied stress. Such a response may allow for more facile and/or reliable connections between components of an interconnection system. For example, in some embodiments, an initial deformation applied to a connector element made from superelastic material during an initial stage of the mating process may be sufficient to deform the connector element into the superelastic regime. Therefore, the remainder of the mating process, including subsequent deformation of the superelastic connector element, may be carried out with little, if any, additional required force. In contrast, connector elements made from conventional materials may require an increasing force to achieve additional deformation.
Accordingly, in some embodiments, a connector may be designed with a nominal mating state in which beams or other members made of superelastic materials are deflected near the middle of the superelastic region. Because of manufacturing tolerances in the connector and the system in which the connector might be installed, members in a connector may be deflected more or less than designed for a nominal mating state. In a connector made with superelastic members, over a relatively wide working range, more or less deflection will still result in the members operating in their superelastic region. As a result, the contact force provided by those members will be approximately the same over the entire working range. Such a uniform force, despite variations attributable to manufacturing tolerances, may provide more reliable electrical connectors and electronic systems using those connectors.
As shown in
As shown in
In some embodiments, a PCB may include 256 contact pads with an increase in contact pad density or an equivalent pad density. Of course, any suitable number of contact pads may be employed on any suitable PCB surface, as the present disclosure is not so limited. A corresponding connector assembly may have a contact tip quantity and density corresponding to the quantity and density of the contact pads. In embodiments in which each cable is terminated in an insert, the inserts may similarly be held within a housing or other support structure in a similar pattern of primary and secondary rows with offsets, at least at the engagement surfaces of the inserts, conforming to the pattern of primary and secondary rows of contacts shown in
The inserts include ground contact tip holders 912 which include openings configured to receive and hold the ground contact tips 934. Ground contact tip holders 912 may be formed of insulative material, which may be the same material use to form other portions of insert 910. Alternatively or additionally, ground contact tip holders 912 may be formed of lossy material. The inserts also include an opening 914 configure to receive one or more couplers 920 which are used to electrically couple a cable conductor 930 to a signal contact tip 932. In this example, two such couplers fit within opening 914, and are electrically isolated from one another.
The assembly also includes a compliant conductive member which is configured to contact both the ground contact tips 934 and a conductive shield 1300 of a cable 114 to electrically couple the ground contact tips and shield. In this example, an end of the ground contact tips 934 fit between the shield 1300 and the compliant conductive member 918. Compression of the compliant conductive member 918 makes electrical connection to both ground contact tips 934 and shield 1300, thereby electrically connecting them.
In some embodiments, the arms may also be crimped around the cable conductor and signal contact to secure the signal contact and cable conductor before welding or instead of using welding to attach those conductors to the coupler. As a further alternative, those conductors may alternatively or additionally be soldered to coupler 920. The coupler also includes a cupped channel 1602 which also support the contact tip and cable conductors along a length of the portions of the contact tip and cable conductor inserted into the coupler.
Coupler 920 is illustrated with an opening between arms 1600. A cable conductor and a contact tip inserted into channel 1602 may butt against one another in that opening. In some embodiments, a laser or energy from another source may be applied to the butt joint between the cable conductor and a contact tip, forming a weld between the cable conductor and contact tip instead of or in addition to a weld between cable conductor and contact tip and respective ones of the arms 1600. As a further alternative, cable conductor and contact tip may be inserted into channel 1602 with a fusible mass, such as a solder ball or solder paste, between them. Heat may be applied to solder the cable conductor to the contact tip.
The coupler also includes flat ends 1604 which may be used for anti-pistoning in an insert or other housing, as will be discussed further with reference to
In some embodiments, surfaces of the insert 910 may be coated in a conductive material (e.g., metal), such as through a particle vapor deposition (PVD) process. The conductive surfaces may be connected to ground. As such, the coated surfaces may be the closest ground to the signal conductors, establishing the signal to ground spacing for those portions of the conductors within the insert, which in turn establishes the impedance of those portions of the conductors. Such an arrangement may allow the impedance of the portions of the conductors within the insert to match, such as within +/−5% or +/−10%, of the impedance within the cable, where the cable conductors are surrounded by a shield. The coating may be on an internal or external surface. Advantageously, the insert may be sized and shaped such that the surface coated with a conductor is at distance from the center of the conductors that varies based on other conductive structures attached to the conductors. For example, where there is solder or a coupler, increasing a mass of metal around the axis of the conductor, the plated surface may be spaced further from the center of the cable conductor to match an impedance of the cable conductor. A matched impedance may improve signal fidelity for high frequency signals.
While the embodiments of
The components may be sized and shaped to ensure that the amount of contact tip extending from the housing at the mating interface is not materially impacted by movement of the cable. Such a design may take advantage of the fact that the coupler does not fit through the holes formed in the first wall and second wall. Instead, the coupler ends 1604 contact the first wall 1900A and second wall 1900B to inhibit movement of the coupler relative to the insert 910. The insert may be disposed securely in a connector housing so that the insert does not move relative to the housing, the coupler may therefore not move relative to the housing. Correspondingly, the signal contact tip 932 and cable conductors 930 may also be inhibited from moving relative to both the insert 910 and an associated connector housing. Thus, each coupler and insert may cooperate to prevent movement of signal contact tips and cable conductors relative to a connector housing and/or insulators of an associated cable. Alternatively, the coupler may fit within the housing with such a small spacing on either end that any movement of the cable conductors and contact tips may be small, or the coupler may be positioned to block movement of the cable conductor in a direction away from the mating interface that a sufficient amount of the contact tip extends from the mating portion 916 to make a reliable and repeatable contact. It should be noted that in some embodiments the first wall and second wall may be formed directly in a connector housing and not an insert 910.
As shown in
The connector receptacle includes a mounting face 2250, which is designed to be mounted against a surface of a substrate, such as a PCB. An edge 2252 of the receptacle extends perpendicularly from the mounting face 2250 and may press against an edge of the substrate, positioning the receptacle with respect to the edge. The receptacle may be fastened to the substrate. In this embodiment, the receptacle includes holes, 2254, through which fasteners, such as screws, may be inserted to secure the receptacle to the substrate.
In the embodiment of
The connector receptacle includes features that generate a force on the connector assembly 2112 inserted into the receptacle. That force urges the connector assembly towards the substrate such that the contact tips extending through the mating surface are deflected, generating a contact force. In this embodiment, the connector receptacle includes a receptacle surface 2204 and a receptacle surface 2206 configured to engage the first engagement surface and second engagement surface of the connector housing. As the connector housing is slid into the connector receptacle, force on the connector housing in a direction parallel to the substrate is converted into a downward force to urge the connector housing toward the substrate.
The mechanisms that generate mating force may be positioned in multiple locations to provide consistent locations along the mating interface. In the embodiment illustrated in
Mating connector assembly 112 to contact pads on a surface of a board with a motion parallel to the surface of the printed circuit board enables the connector to be mated without open space above the mounting location. Such a configuration may enable a more compact electronic system. Additionally, it may enable more reliable mating. According to the embodiment of
In some embodiments, the first 2102 and second 2106 engagement surfaces may be angled relative to the PCB 102 at an angle greater than 0 degrees and less than 90 degrees relative to the mating surface of the connector. In one embodiment, the engagement surfaces may be angled between 2 and 10 degrees relative to the mating surface of the connector. The connector receptacle surfaces may have angles corresponding to those of the engagement surfaces of the connector housing. The angles of the receptacle surfaces may be measured with respect to the mounting face of the receptacle and/or the PCB to which the receptacle is mounted. Alternatively, in some embodiments, the connector receptacle may have connector receptacle surfaces which are angled at different angles than the engagement surfaces of the connector housing, or which are not angled at all. In other embodiments, the connector receptacle surfaces may be angled relative to the PCB while the connector engagement surfaces are not inclined or have a different inclination relative to the PCB. In some embodiments, a connector housing may include a single continuous engagement surface or any suitable number of distinct engagement surfaces. Likewise, in some embodiments, a connector receptacle may include any suitable number of distinct receptacle surfaces. In some embodiments, each distinct connector engagement surface and/or receptacle surface may be inclined at the same or a different angle with respect to the PCB 102.
To remove the connector assembly from the connector receptacle, the connector assembly may be slid out of the connector receptacle in a direction parallel to the plane formed by the PCB 102. Movement in any other directions is restricted by the various engagement surfaces. As will be discussed with reference to
While the embodiments of
In some embodiments, the connector assembly and/or mounting components, such as receptacle 2200, may include latching components that hold connector assembly 2112 in a position in which it is pressed against the substrate. For example, latching components may be used to hold the connector assembly in the a position in the receptacle in which the connector aligns with contact pads exposed in opening 2202 and the engagement surface so f the connector assembly and receptacle are engaged such that he mating face of the connector is pressed against the substrate.
A connector assembly as described herein may have different numbers and arrangements of contact tips than expressly pictured. The contact tips, for example, may be in multiple rows.
According to the embodiment of
Like the first housing module, the second housing module 3110 also includes an opening 3112, ground contact tip holders 3114, and a module surface 3116. However, the ground contact tip holders 3114 are offset from the ground contact tip holders 3104 of the first module, so that the housing modules may interlock while the housing module surfaces 3106, 3116 are aligned in the same plane.
The first housing modules 3100 are alternated with the second housing modules 3110 so that a row of housing modules is formed, with a total of eight signal contact tips in each row. As shown in
One or more structures may be used to couple the ground contact tips to shields of the cables. Those structures may also provide shielding and/or impedance control for the signal conductors within each of the modules. For example, conductive sheets, such as might be stamped from metal, may be used for this purpose. In other embodiments, compliant conductive material and/or lossy material, as elsewhere described herein, may be used to connect ground structures.
As shown in
In some embodiments, the metal sheet may also electrically couple the ground contact tips to a shield of each of the associated cables.
In the illustrated embodiment, the interlocking housing modules are secured to the metal sheet indirectly via the ground contact tips. In other embodiments the housing modules may be directly secured to the metal sheet or held in engagement with the metal sheet by an external housing of the connector assembly.
Each row may have a desired number of connector modules.
The modules, held together in a subassembly as shown in
Module 3800 is here shown configured to connect a signal conductor in a cable and a signal contact tip through an electronic component. The components may be surface mount components, such as 0205 surface mount capacitors. Such components may be sufficiently small that they may be integrated into a coupler.
In the example of
According to the embodiment of
Hole 3854 may be formed by bending arms, such as arms 1600, into a tube. The arms forming hole 3854 are here shown integral with tab 3853. One end of a capacitor or similar component may be attached to tab 3853, such as via a surface mount solder technique.
The capacitor coupler also includes a second side conductor receptacle 3858 which similarly includes a second hole 3860 and a weld channel 3862. The second side conductor receptacle may also receive and secure a conductor such as a cable conductor or signal contact tip. The arms forming hole 3858 are here shown integral with tab 3859. A second end of a capacitor or similar component may be attached to tab 3859.
As shown in
In some embodiments, when the capacitor coupler is placed in a housing opening, the housing opening may be sized and shaped so that portions of the housing abut the ends 3866 and prevent the capacitor coupler from moving relative to a longitudinal axis of a connected cable conductor inside of the connector housing. Correspondingly, an attached cable conductor which is physically secured to the capacitor coupler will also be inhibited from moving along its longitudinal axis (i.e., pistoning) relative to the connector housing or a cable jacket. In other embodiments, a cable conductor, contact tip, or other conductor secured to the capacitor coupler may include structures to inhibit pistoning such as a plastic bead attached to the conductor. In such an embodiment, the capacitor coupler may not provide any resistance to pistoning.
In some embodiments a contact tip and a cable conductor may be coupled through a component without a separate holder.
Such an arrangement may inhibit pistoning of the capacitor 4050, signal conductor 930, and/or signal contact tip 932. The capacitor coupling also includes an anti-pistoning projection 4006 which is shaped correspondingly to the capacitor so as to further inhibit motion of the capacitor 4050, and thereby inhibit pistoning of the conductors to which it is attached.
According to the embedment of
Ground contact tips 934 are disposed at least partially in the housing 4110 and are electrically connected to a shield 1300 of a cable. In this example, connection between the shield 1300 and the ground contact tips is via a compliant conductive member 4116, which may be formed as described above.
In the embodiment of
The lossy material is electrically connected to both the top shield 4012 and ground contact tips 934 and/or other grounded structures.
As can be seen in the exploded view of
The top shield is secured to the housing with posts 4114 and additionally may provide added structural rigidity and/or strength to the module.
As shown in the exploded view of
The first and second housing sections include receptacles 4306 sized and shaped to receive the module 4100. In some embodiments, the housing sections may include multiple receptacles for multiple modules, so that any desirable number of contacts and grounds may be employed in connector assembly. In such a configuration, the structure shown in
In some embodiments, a cable clamp 4308 may be used. The cable clamp 4308, for example, may be compressed around the cable 1304 and a portion of the housing. The clamp may be rigid, such as a crimped metal band or may be flexible, and may be formed by overmolding rubber or similarly flexible material on the cable and housing portion. The connector assembly is suitable for use with a substrate (e.g., a PCB) 102 having one or more contacts.
First signal contact pad 4406 and second signal contact pad 4408 are disposed in an opening in ground contact pad 4404. As will be discussed further with reference to
Such a configuration for example, may facilitate low tolerance in the relative positions of the signal contact tips and ground contact structures when a connector is pressure mounted to a substrate. As a result, the impedance of the signal path may be well controlled. Such impedance control may be particularly desirable for a connector carrying high speed signals, such as 56 Gbps (PAM4) or higher, including at 112 Gbps or higher. Such impedance control may be used, for example, with differential signals in which a contact region has a pair of signal pads surrounded by a ground pad. Reducing tolerance of the position of the signal contact tips may reduce changes in impedance within the connector to be less than 3 Ohms, and in some embodiments, less than 2 Ohms, less than 1 Ohm or less than 0.5 Ohms, in some embodiments.
It should be noted that the signal contact pads of
Various aspects of the present disclosure may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing and is therefore not limited in its application to the details and arrangement of components set forth in the foregoing description or illustrated in the drawings. For example, aspects described in one embodiment may be combined in any manner with aspects described in other embodiments.
For example, use of lossy material was described. Materials that conduct, but with some loss, or materials that by a non-conductive physical mechanism absorbs electromagnetic energy over the frequency range of interest may be referred to herein generally as “lossy” materials. Electrically lossy materials may be formed from lossy dielectric materials and/or poorly conductive materials and/or lossy magnetic materials.
Magnetically lossy materials may include, for example, materials traditionally regarded as ferromagnetic materials, such as those that have a magnetic loss tangent greater than approximately 0.05 in the frequency range of interest. The “magnetic loss tangent” is generally known to be the ratio of the imaginary part to the real part of the complex electrical permeability of the material. Practical lossy magnetic materials or mixtures containing lossy magnetic materials may also exhibit useful amounts of dielectric loss or conductive loss effects over portions of the frequency range of interest.
Electrically lossy materials may be formed from material traditionally regarded as dielectric materials, such as those that have an electric loss tangent greater than approximately 0.05 in the frequency range of interest. The “electric loss tangent” is generally known to be the ratio of the imaginary part to the real part of the complex electrical permittivity of the material. For example, an electrically lossy material may be formed of a dielectric material in which is embedded a conductive web that results in an electric loss tangent greater than approximately 0.05 in the frequency range of interest.
Electrically lossy materials may be formed from materials that are generally thought of as conductors, but are relatively poor conductors over the frequency range of interest, or contain conductive particles or regions that are sufficiently dispersed that they do not provide high conductivity, or are prepared with properties that lead to a relatively weak bulk conductivity compared to a good conductor (e.g., copper) over the frequency range of interest.
Electrically lossy materials typically have a bulk conductivity of about 1 siemen/meter to about 100,000 siemens/meter and preferably about 1 siemen/meter to about 10,000 siemens/meter. In some embodiments, material with a bulk conductivity of between about 10 siemens/meter and about 200 siemens/meter may be used. As a specific example, material with a conductivity of about 50 siemens/meter may be used. However, it should be appreciated that the conductivity of the material may be selected empirically or through electrical simulation using known simulation tools to determine a suitable conductivity that provides both a suitably low crosstalk with a suitably low signal path attenuation or insertion loss.
Electrically lossy materials may be partially conductive materials, such as those that have a surface resistivity between 1 Ω/square and 100,000 Ω/square. In some embodiments, the electrically lossy material may have a surface resistivity between 10 Ω/square and 1000 Ω/square. As a specific example, the electrically lossy material may have a surface resistivity of between about 20 Ω/square and 80 Ω/square.
In some embodiments, an electrically lossy material may be formed by adding to a binder a filler that contains conductive particles. In an embodiment, a lossy member may be formed by molding or otherwise shaping the binder with filler into a desired form. Examples of conductive particles that may be used as a filler to form an electrically lossy material include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles. Metal in the form of powder, flakes, fibers, or other particles may also be used to provide suitable electrically lossy properties. Alternatively, combinations of fillers may be used. For example, metal-plated carbon particles may be used. Silver and nickel may be suitable metals for metal-plating fibers. Coated particles may be used alone or in combination with other fillers, such as carbon flakes. The binder or matrix may be any material that will set, cure, or can otherwise be used to position the filler material. In some embodiments, the binder may be a thermoplastic material traditionally used in the manufacture of electrical connectors to facilitate the molding of the electrically lossy material into the desired shapes and locations as part of the manufacture of the electrical connector. Examples of such materials include liquid crystal polymer (LCP) and nylon. However, many alternative forms of binder materials may be used. Curable materials, such as epoxies, may serve as a binder. Alternatively, materials such as thermosetting resins or adhesives may be used.
Also, although the binder materials discussed above may be used to create an electrically lossy material by forming a matrix around conductive particle fillers, the present technology described herein is not so limited. For example, conductive particles may be impregnated into a formed matrix material or may be coated onto a formed matrix material, such as by applying a conductive coating to a plastic component or a metal component. As used herein, the term “binder” may encompass a material that encapsulates the filler, is impregnated with the filler or otherwise serves as a substrate to hold the filler.
In some embodiments, the fillers may be present in a sufficient volume percentage to allow conducting paths to be created from particle to particle. For example, when metal fiber is used, the fiber may be present at about 3% to 40% by volume. The amount of filler may impact the conducting properties of the material.
Filled materials may be purchased commercially, such as materials sold under the trade name Celestran® by Celanese Corporation, which can be filled with carbon fibers or stainless steel filaments.
A lossy member may be formed from a lossy conductive-carbon-filled adhesive preform, which may be obtained from Techfilm of Billerica, Massachusetts, US, may be used as a lossy material. This preform may include an epoxy binder filled with carbon fibers and/or other carbon particles. The binder may surround carbon particles, which act as a reinforcement for the preform. Such a preform may be inserted in a connector lead frame subassembly to form all or part of the housing. In some embodiments, the preform may adhere through an adhesive in the preform, which may be cured in a heat treating process. In some embodiments, the adhesive may take the form of a separate conductive or non-conductive adhesive layer. In some embodiments, the adhesive in the preform alternatively or additionally may be used to secure one or more conductive elements, such as foil strips, to the lossy material.
Various forms of reinforcing fiber, in woven or non-woven form, coated or non-coated, may be used. For example, non-woven carbon fiber may be a suitable reinforcing fiber. As will be appreciated, other suitable reinforcing fibers may be used instead or in combination.
Alternatively, lossy member may be formed in other ways. In some embodiments, a lossy member may be formed by interleaving layers of lossy and conductive material such as metal foil. These layers may be rigidly attached to one another, such as through the use of epoxy or another adhesive, or may be held together in any other suitable way. The layers may be of the desired shape before being secured to one another or may be stamped or otherwise shaped after they are held together. Alternatively or additionally, a lossy material may be formed by depositing or otherwise forming a diffuse layer of conductive material, such as metal, over an insulative substrate, such as plastic, to provide a composite part with lossy characteristics, as described above.
In various example embodiments described herein, lossy regions may be formed of an electrically lossy material. In some specific examples, that lossy material may have a plastic matrix, such that members may be readily molded into a desired shape. The plastic matrix may be made partially conductive by the incorporation of conductive fillers, as described above, such that the matrix becomes lossy.
Also, the embodiments described herein may be embodied as a method, of which an example has been provided. The acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.
Further, although various embodiments described herein include one or more components including superelastic materials, it should be understood that the current disclosure is not limited in this regard. For example, in some instances, the components may include materials that are not technically superelastic, but may include one or more compliant materials which are operated below their yield stress (and thus do not undergo plastic deformation). In other embodiments, non-superelastic materials may be included and may be operated above their yield stresses, and therefore these components may not be re-usable.
While the present teachings have been described in conjunction with various embodiments and examples, it is not intended that the present teachings be limited to such embodiments or examples. On the contrary, the present teachings encompass various alternatives, modifications, and equivalents, as will be appreciated by those of skill in the art. For example, connector assemblies of exemplary embodiments described herein may be employed in silicon to silicon application for data transmission rates greater than or equal to 28 Gbps and 56 Gbps. Additionally, connector assemblies may be employed where signal losses from trace signal transmissions are too great, such as in cases where signal frequencies exceed 10 GHz, 25 GHz, 56 GHz or 112 GHz.
As another example, embodiments were described in which metal sheets were positioned above and/or below multiple modules. The metal sheets may be solid metal or may, in some embodiments, be metal foils supported on a polymer film, such as an aluminum layer less than 5 mils thick on a mylar film.
Also, features described in connection with some embodiments may be applied in other embodiments. For example, coupling cable conductors and contact tips through capacitors may be used in embodiments other than those specifically described as including those options. As another example, various techniques to couple signal and/or ground conductors were described, and those techniques may similarly be applied in embodiments other than the ones for which they were expressly described. Likewise, lossy material and shields for a module that contact a substrate may be used in connection with embodiments other than the ones in which they were expressly described.
Accordingly, the foregoing description and drawings are by way of example only.
In some embodiments, interior surfaces of an opening are separated from a conductive coupler by a distance that provides an impedance through the conductive coupler that matches an impedance of a cable conductor within a cable. In some embodiments, the interior surfaces are at least partially coated with metal.
In some embodiments, a connector assembly according to exemplary embodiments described herein includes a compliant conductive member which at least partially surrounds the circumference of a shield, first ground conductor, second ground conductor, and electrically connects the first ground conductor and the second ground conductor to the shield.
In some embodiments, a metal stiffener plate is disposed on a surface of a housing which is perpendicular to a surface of the housing configured to be mounted adjacent a circuit board.
In some embodiments, a connector assembly includes a plurality of cables, each of the plurality of cables including at least one cable conductor having an end, a plurality of contact tips, where each of the plurality of contact tips includes an end abutting the end of a respective cable conductor and is made from a different material than the respective cable conductor, and a plurality of conductive couplers, where each of the plurality of conductive couplers including a first end with tines at least partially surrounding a contact tip of the plurality of contact tips and a second end with tines at least partially surrounding the end of the respective cable conductor. In some embodiments, each of the plurality of conductive couplers is welded to a respective contact tip of the plurality of contact tips and an end of a respective cable conductor of the plurality of cables. In some embodiments, each of the plurality of conductive couplers is soldered a respective contact tip of the plurality of contact tips and an end of a respective cable conductor of the plurality of cables. In some embodiments, each of the plurality of conductive couplers is crimped around a respective contact tip of the plurality of contact tips and an end of a respective cable conductor of the plurality of cables. In some embodiments, each of the plurality of contact tips includes a nickel titanium. In some embodiments, the plurality of cables are arranged in a first row and a second row separated from the first row. In some embodiments, the plurality of cables are arranged in a plurality of columns, where each of the plurality of columns includes a cable in the first row and a cable in the second row. In some embodiments, each of the plurality of cables includes a first cable conductor and a second cable conductor surrounded by a shield. In some embodiments, the plurality of cables includes 64 cables. In some embodiments, the plurality of cables includes 128 cables. In some embodiments, the connector assembly further includes a plurality of ground contact tips, where each of the plurality of cables includes a shield surrounding each of the at least one conductors, where each of the plurality of ground contact tips is electrically coupled to a shield of a cable of the plurality of cables within the connector assembly. In some embodiments, the connector assembly further includes a plurality of housing modules, where at least one of each of the cable conductors, plurality of contact tips, and plurality of ground contact tips is disposed in each of the plurality of housing modules. In some embodiments, each of the plurality of housing modules is interlocked with an adjacent housing module. In some embodiments, the ground contact tips of the plurality of housing modules pass through an opening formed in each of the respective adjacent housing modules.
In some embodiments, a connector assembly includes a housing including an opening, where the opening includes a first end defined by a first wall including a first hole there through and a second end defined by a second wall including a second hole there through, an elongated member passing through the first hole and the second hole, where the elongated member includes a first contact tip, a first cable conductor electrically and mechanically coupled to the contact tip, and a second member mechanically coupled to the elongated member, where the second member has a size larger than the first hole and of the second hole, and the second member is disposed in the opening. In some embodiments, the first contact tip includes a superelastic conductive material. In some embodiments, the second member is configured to contact the first wall and the second wall such that movement of the elongated member in the direction of the first wall or second wall is inhibited. In some embodiments, the connector assembly further includes a third elongated member including a second contact tip, a second cable conductor in electrical communication with the second contact tip, and a fourth member mechanically coupled to the third elongated member, where the fourth member is disposed in the housing, and where the fourth member is configured to contact the first wall and the second wall such that movement of the second third elongated member in the direction of the first wall or second wall is inhibited. In some embodiments, the second member and the fourth member are disposed in the opening, and where the second contact tip passes through the first wall, and the first cable conductor passes through the second wall. In some embodiments, the fourth member is disposed in a second opening having a first end defined by a first wall and second end defined by a second wall, where the second contact tip passes through the first wall of the second opening, and the first cable conductor passes through the second wall of the second opening. In some embodiments, the first opening is disposed in a first row and the second opening is disposed a second row offset from the first row. In some embodiments, the first row is separated from a second row in a direction perpendicular to the first row by a distance between 4 mm and 5 mm. In some embodiments, the first cable conductor and first contact tip are formed of metals of different types. In some embodiments, the opening is bounded by interior surfaces of the housing, and a portion of the interior surfaces are coated with a conductor. In some embodiments, the portion of the interior surfaces coated with a conductor are separated from the second member by a distance that provides an impedance through the second member that matches the impedance within the cable conductor. In some embodiments, the interior surfaces are at least partially coated with metal. In some embodiments, the cable conductor has a diameter of 30 AWG or smaller.
In some embodiments, an electrical connector includes a housing including a first surface, and a first side transverse to the first surface, an electrical contact tip projecting from the housing and exposed at the first surface, and at least one member configured as a receptacle sized to receive the housing therein, where the receptacle is bounded by a second side, where the first side includes a first portion with a second surface making an angle of greater than 0 degrees and less than 90 degrees with respect to the first surface, and where the second side includes a second portion with a third surface, parallel to the second surface and positioned to engage the second surface when the housing is received in the receptacle. In some embodiments, the receptacle is disposed on a circuit board, the first portion includes a wedge-shaped projection from the first surface, and the second portion includes a projection receptacle configured to receive the wedge-shaped projection when the housing is received in the receptacle. In some embodiments, the circuit board includes a signal contact disposed on the circuit board, and when the housing is received in the receptacle, the electrical contact tip is brought into electrical communication with the signal contact. In some embodiments, as the second surface is engaged by the third surface, the cable connector housing is moved closer to the circuit board. In some embodiments, as the housing is received in the receptacle, the electrical contact tip wipes the signal contact. In some embodiments, the receptacle includes a spring latch configured to releasably secure the housing in the receptacle. In some embodiments, the spring latch applies a force to the cable connector housing urging the housing into the receptacle. In some embodiments, the cable connector housing includes a first section and a second section, where the first section is angle relative to the second section by an angle between 15 and 60 degrees. In some embodiments, a thickness of the first section of the housing is between 3.5 and 4.5 mm. In some embodiments, a thickness of the housing is between 3.5 and 4.5 mm. In some embodiments, the electrical connector further includes a metal stabilization plate disposed on a front face of the cable connector housing, where the metal stabilization plate increases the stiffness of the cable connector housing. In some embodiments, the metal stabilization plate is perpendicular to the first surface. In some embodiments, the receptacle includes a fourth surface including features engaging the metal stabilization plate. In some embodiments, the electrical connector further includes a ground contact tip projecting from the cable connector housing, and a ground contact disposed on the circuit board, where, as the housing is moved into the receptacle and the second surface is in contact with the third surface, the ground contact tip is brought into electrical communication with the ground contact. In some embodiments, the housing and the receptacle are configured such that, as the housing moves into the receptacle and the second surface is in contact with the third surface, the ground contact tip is brought into electrical communication with the ground contact before the electrical contact tip is brought into electrical communication with a signal contact. In some embodiments, the electrical connector further includes a cable having a cable conductor in electrical communication with the electrical contact tip and shield in electrical communication with the ground contact tip. In some embodiments, the shield surrounds the cable conductor. In some embodiments, an electrical connector further includes a second electrical contact tip, where the cable includes a second cable conductor in electrical communication with the second electrical contact tip, and where the shield surrounds the cable conductor and second cable conductor. In some embodiments, the electrical connector further includes a compliant conductive member at which at least partially surrounds the shield and the ground contact tip, where the conductive gasket electrically couples the ground contact tip to the shield.
In some embodiments, a method of connecting a cable to a substrate includes positioning the housing with a first surface of the housing facing a surface of the substrate, applying a first force to the housing in a first direction, where the first direction is parallel to the surface of the substrate, engaging a second surface on the housing with a third surface attached to the substrate, such that a second force in a second direction, perpendicular to the first direction, is generated on the housing, urging, with the second force, at least one contact tip extending through the first surface against at least one contact disposed on the surface of the substrate. In some embodiments, the method further includes inhibiting bowing of the housing about a transverse axis of the housing with a metal stabilization plate. In some embodiments, the method further includes rotating a spring latch into engagement with a tab formed on the housing to secure the housing in the receptacle. In some embodiments, the method further includes applying a force to the housing in the first direction with the spring latch. In some embodiments, the method further includes wiping the contact with the at least one contact tip as the housing is moved in the first direction. In some embodiments, the at least one contact tip includes a plurality of signal contact tips and a plurality of ground contact tips, the at least one contact disposed on the surface of the substrate includes a plurality of signal contacts and a plurality of ground contacts, and the method further includes wiping the signal contacts with the signal contact tips as the housing is moved in the first direction, and wiping the ground contacts with the ground contact tips as the housing is moved in the first direction. In some embodiments, the second surface and/or the third surface are angled relative to the surface of the substrate by an angle of greater than 0 degrees and less than 90 degrees such that the second force is generated by camming the second surface against the third surface. In some embodiments, the method further includes urging the at least one contact tip against the at least one contact includes deflecting the first electrical contact tip from a resting position by at least 0.1 mm with a force that varies by less than 10% over the range of deflections from 0.05 mm to 0.1 mm. In some embodiments, elastically deflecting the first electrical contact tip includes transitioning the first electrical contact tip from an austenite to a martensite phase. In some embodiments, the method further includes electrically connecting a second electrical contact tip to a second signal contact disposed in the receptacle. In some embodiments, an electrical connector includes a first contact tip formed of a first material, a first cable conductor formed of a second material different from the first material and electrically connected to the first contact tip at a joint, and a housing including an opening therethrough, where the joint is disposed in the opening, where the opening is bounded by interior surfaces of the housing, and at least a portion of the interior surfaces is coated with a conductor. In some embodiments, the interior surfaces are separated from the joint by a distance that provides an impedance through the joint that matches the impedance within the cable conductor. In some embodiments, the at least a portion of the interior surfaces are coated with metal. In some embodiments, a cable conductor has a diameter of 30 AWG or smaller. In some embodiments, the first material is copper and the second material is nickel titanium.
In some embodiments, an electrical connector kit includes a contact tip, a conductive coupler including a first end configured to be mechanically coupled to the first contact tip and a second end configured to be mechanically coupled to a cable conductor, and a housing including an opening therethrough, where the opening includes a first end defined by a first wall and a second end defined by a second wall, where the housing is configured to receive the first contact tip through the first wall, where the housing is configured to receive the cable conductor through the second wall, and where the opening is configured to receive the conductive coupler. In some embodiments, the contact tip is formed of nickel titanium. In some embodiments, the kit includes a ground contact tip, where the housing is configured to receive the ground contact tip through the first wall.
In some embodiments, an electrical connector includes a housing, a first contact tip formed of a first material extending from the housing, a first cable conductor formed of a second material different from the first material extending from the housing, and a capacitor electrically connecting the first contact tip to the first cable conductor. In some embodiments, the first material is nickel titanium. In some embodiments, the capacitor is disposed within the housing and the electrical connector further includes a shield plate disposed on the housing and covering the capacitor. In some embodiments, at least a portion of the housing includes a semi-conductive lossy material electrically connected to the shield plate. In some embodiments, the electrical connector further includes a ground contact tip disposed at least partially in the housing, where the ground contact tip is electrically connected to the shield plate. In some embodiments, at least a portion of the housing includes a lossy material electrically connected to the ground contact tip.
In some embodiments a connector assembly includes a plurality of cables, each of the plurality of cables including at least one conductor and shield, a plurality of cartridges, each cartridge including a housing, at least one tip coupled to the at least on one conductor of a respective cable of the plurality of cables and extending from the housing, and a conductive plate mounted to the housing and electrically coupled to the shield of the respective cable, where the conductive plate includes at least one compliant portion extending beyond the housing. In some embodiments, the connector assembly further includes a conductive gasket pressing against the shield of the respective cable and electrically connected to the conductive plate. In some embodiments, the housing includes an insulative portion and a lossy portion. In some embodiments, the cartridge further includes a ground tip extending from the housing and a portion of the ground tip is in contact with the lossy portion. In some embodiments, the at least one tip extends from the housing at a mating interface, and the connector assembly further includes a conductive elastomer with a portion pressing against the shield of the respective cable and portion at the mating interface. In some embodiments, the connector assembly further includes a support member, where the plurality of cartridges are attached to the support member in a row. In some embodiments, the connector assembly may be used in combination with a substrate including at least one signal pad and a ground plane, where the compliant portion of the conductive plate contacts the ground plane; the at least one tip contacts the at one signal pad.
In some embodiments, a connector assembly includes a circuit board including a first contact pad, where the first contact pad includes a recess, and a first contact tip including a superelastic conductive material configured to mate with the first contact pad, where the first contact pad is configured to align the first contact tip with respect to the recess when the first contact tip mates with the first contact pad. In some embodiments, the recess is a semi-circular depression. In some embodiments, the recess is a V-shaped groove. In some embodiments, the recess includes a longitudinal centerline and the first contact pad is configured to align the first contact tip with the longitudinal centerline when the contact tip mates with a pressure contact with the first contact pad.
In some embodiments, an electronic assembly includes a substrate including a first surface and a second, opposing surface, a semiconductor device on the first surface, and a first connector assembly configured to couple signals to the semiconductor device, where the first connector assembly includes a first plurality of cables with conductors configured to carry the signals and a first connector including a first plurality of superelastic contact tips electrically connected to the conductors of the first plurality of cables and pressure mounted to the first surface. In some embodiments, the first plurality of cables include pairs of conductors, the first plurality of superelastic contact tips are arranged in pairs coupled to pairs of conductors of respective cables of the first plurality of cables, and the pairs of superelastic contact tips are pressure mounted to the first surface in a linear array including more than 15 pairs per inch. In some embodiments, the first plurality of cables and the second plurality of cables include pairs of conductors, the first plurality of superelastic contact tips are arranged in first pairs coupled to pairs of conductors of respective cables of the first plurality of cables, the second plurality of superelastic contact tips are arranged in second pairs coupled to pairs of conductors of respective cables of the second plurality of cables, the first pairs of superelastic contact tips are pressure mounted to the first surface in a first linear array parallel to an edge of the substrate, the second pairs of superelastic contact tips are pressure mounted to the second surface in a second linear array parallel to the edge of the substrate, and the first pairs and second pairs include more than 30 pairs per inch adjacent the edge of the substrate. In some embodiments, the first pairs and second pairs include at least 40 pairs per inch adjacent the edge of the substrate. In some embodiments, the first plurality of superelastic contact tips have a diameter of 36 AWG or less. In some embodiments, the electronic assembly further includes a motherboard and the substrate includes a daughter card parallel to the mother board.
This application is a continuation of U.S. patent application Ser. No. 17/024,337, filed on Sep. 17, 2020, entitled “HIGH SPEED ELECTRONIC SYSTEM WITH MIDBOARD CABLE CONNECTOR,” which claims priority to and the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Application No. 62/902,820, filed Sep. 19, 2019, entitled “HIGH SPEED ELECTRONIC SYSTEM WITH MIDBOARD CABLE CONNECTOR.” The contents of these applications are incorporated herein by reference in their entirety.
| Number | Name | Date | Kind |
|---|---|---|---|
| 7331816 | Krohn et al. | Feb 2008 | B2 |
| 7331830 | Minich | Feb 2008 | B2 |
| 7335063 | Cohen et al. | Feb 2008 | B2 |
| 7354274 | Minich | Apr 2008 | B2 |
| 7354300 | Shindo | Apr 2008 | B2 |
| 7361042 | Hashimoto et al. | Apr 2008 | B2 |
| 7371117 | Gailus | May 2008 | B2 |
| 7384275 | Ngo | Jun 2008 | B2 |
| 7402048 | Meier et al. | Jul 2008 | B2 |
| 7422483 | Avery et al. | Sep 2008 | B2 |
| 7431608 | Sakaguchi et al. | Oct 2008 | B2 |
| 7445471 | Scherer et al. | Nov 2008 | B1 |
| 7462942 | Tan et al. | Dec 2008 | B2 |
| 7485012 | Daugherty et al. | Feb 2009 | B2 |
| 7494383 | Cohen et al. | Feb 2009 | B2 |
| 7497693 | Wu | Mar 2009 | B1 |
| 7534142 | Avery et al. | May 2009 | B2 |
| 7540747 | Ice et al. | Jun 2009 | B2 |
| 7540781 | Kenny et al. | Jun 2009 | B2 |
| 7549897 | Fedder et al. | Jun 2009 | B2 |
| 7553190 | Laurx et al. | Jun 2009 | B2 |
| 7581990 | Kirk et al. | Sep 2009 | B2 |
| 7588464 | Kim | Sep 2009 | B2 |
| 7613011 | Grundy et al. | Nov 2009 | B2 |
| 7621779 | Laurx et al. | Nov 2009 | B2 |
| 7652381 | Grundy et al. | Jan 2010 | B2 |
| 7654831 | Wu | Feb 2010 | B1 |
| 7658654 | Ohyama et al. | Feb 2010 | B2 |
| 7686659 | Peng | Mar 2010 | B2 |
| 7690930 | Chen et al. | Apr 2010 | B2 |
| 7713077 | McGowan et al. | May 2010 | B1 |
| 7719843 | Dunham | May 2010 | B2 |
| 7722401 | Kirk et al. | May 2010 | B2 |
| 7722404 | Neumetzler | May 2010 | B2 |
| 7731537 | Amleshi et al. | Jun 2010 | B2 |
| 7744414 | Scherer et al. | Jun 2010 | B2 |
| 7753731 | Cohen et al. | Jul 2010 | B2 |
| 7771233 | Gailus | Aug 2010 | B2 |
| 7775802 | Defibaugh et al. | Aug 2010 | B2 |
| 7789676 | Morgan et al. | Sep 2010 | B2 |
| 7794240 | Cohen et al. | Sep 2010 | B2 |
| 7794278 | Cohen et al. | Sep 2010 | B2 |
| 7811129 | Glover et al. | Oct 2010 | B2 |
| 7819675 | Ko et al. | Oct 2010 | B2 |
| 7824197 | Westman et al. | Nov 2010 | B1 |
| 7828560 | Wu et al. | Nov 2010 | B2 |
| 7857630 | Hermant et al. | Dec 2010 | B2 |
| 7862344 | Morgan et al. | Jan 2011 | B2 |
| 7871296 | Fowler et al. | Jan 2011 | B2 |
| 7874873 | Do et al. | Jan 2011 | B2 |
| 7887371 | Kenny et al. | Feb 2011 | B2 |
| 7906730 | Atkinson et al. | Mar 2011 | B2 |
| 7914302 | Zhu | Mar 2011 | B1 |
| 7914304 | Cartier et al. | Mar 2011 | B2 |
| 7976318 | Fedder et al. | Jul 2011 | B2 |
| 7985097 | Gulla | Jul 2011 | B2 |
| 7993147 | Cole et al. | Aug 2011 | B2 |
| 8002581 | Whiteman, Jr. et al. | Aug 2011 | B1 |
| 8016616 | Glover et al. | Sep 2011 | B2 |
| 8018733 | Jia | Sep 2011 | B2 |
| 8036500 | McColloch | Oct 2011 | B2 |
| 8057266 | Roitberg | Nov 2011 | B1 |
| 8057267 | Johnescu | Nov 2011 | B2 |
| 8083553 | Manter et al. | Dec 2011 | B2 |
| 8092235 | Frantum, Jr. et al. | Jan 2012 | B2 |
| 8092254 | Miyazaki et al. | Jan 2012 | B2 |
| 8100699 | Costello | Jan 2012 | B1 |
| 8157573 | Tanaka | Apr 2012 | B2 |
| 8162675 | Regnier et al. | Apr 2012 | B2 |
| 8167651 | Glover et al. | May 2012 | B2 |
| 8182289 | Stokoe et al. | May 2012 | B2 |
| 8192222 | Kameyama | Jun 2012 | B2 |
| 8197285 | Farmer | Jun 2012 | B2 |
| 8210877 | Droesbeke | Jul 2012 | B2 |
| 8215968 | Cartier et al. | Jul 2012 | B2 |
| 8226441 | Regnier et al. | Jul 2012 | B2 |
| 8251745 | Johnescu et al. | Aug 2012 | B2 |
| 8272877 | Stokoe et al. | Sep 2012 | B2 |
| 8282402 | Ngo | Oct 2012 | B2 |
| 8308491 | Nichols et al. | Nov 2012 | B2 |
| 8308512 | Ritter et al. | Nov 2012 | B2 |
| 8337243 | Elkhatib et al. | Dec 2012 | B2 |
| 8338713 | Fjelstad et al. | Dec 2012 | B2 |
| 8371875 | Gailus | Feb 2013 | B2 |
| 8371876 | Davis | Feb 2013 | B2 |
| 8382524 | Khilchenko et al. | Feb 2013 | B2 |
| 8398433 | Yang | Mar 2013 | B1 |
| 8419472 | Swanger et al. | Apr 2013 | B1 |
| 8439704 | Reed | May 2013 | B2 |
| 8449312 | Lang et al. | May 2013 | B2 |
| 8449330 | Schroll et al. | May 2013 | B1 |
| 8465302 | Regnier et al. | Jun 2013 | B2 |
| 8469745 | Davis et al. | Jun 2013 | B2 |
| 8535065 | Costello et al. | Sep 2013 | B2 |
| 8540525 | Regnier et al. | Sep 2013 | B2 |
| 8550861 | Cohen et al. | Oct 2013 | B2 |
| 8553102 | Yamada | Oct 2013 | B2 |
| 8556657 | Nichols | Oct 2013 | B1 |
| 8588561 | Zbinden et al. | Nov 2013 | B2 |
| 8588562 | Zbinden et al. | Nov 2013 | B2 |
| 8597055 | Regnier et al. | Dec 2013 | B2 |
| 8632365 | Ngo | Jan 2014 | B2 |
| 8651880 | Wu et al. | Feb 2014 | B2 |
| 8657627 | McNamara et al. | Feb 2014 | B2 |
| 8662923 | Wu | Mar 2014 | B2 |
| 8672707 | Nichols et al. | Mar 2014 | B2 |
| 8678860 | Minich et al. | Mar 2014 | B2 |
| 8690589 | Ngo | Apr 2014 | B2 |
| 8690604 | Davis | Apr 2014 | B2 |
| 8715003 | Buck et al. | May 2014 | B2 |
| 8740644 | Long | Jun 2014 | B2 |
| 8753145 | Lang et al. | Jun 2014 | B2 |
| 8758051 | Nonen et al. | Jun 2014 | B2 |
| 8771016 | Atkinson et al. | Jul 2014 | B2 |
| 8787711 | Zbinden et al. | Jul 2014 | B2 |
| 8804342 | Behziz et al. | Aug 2014 | B2 |
| 8814595 | Cohen et al. | Aug 2014 | B2 |
| 8845364 | Wanha et al. | Sep 2014 | B2 |
| 8858243 | Luo et al. | Oct 2014 | B2 |
| 8864521 | Atkinson et al. | Oct 2014 | B2 |
| 8870471 | Ito et al. | Oct 2014 | B2 |
| 8888531 | Jeon | Nov 2014 | B2 |
| 8888533 | Westman et al. | Nov 2014 | B2 |
| 8911255 | Scherer et al. | Dec 2014 | B2 |
| 8926377 | Kirk et al. | Jan 2015 | B2 |
| 8944831 | Stoner et al. | Feb 2015 | B2 |
| 8992236 | Wittig et al. | Mar 2015 | B2 |
| 8992237 | Regnier et al. | Mar 2015 | B2 |
| 8998642 | Manter et al. | Apr 2015 | B2 |
| 9004942 | Paniauqa | Apr 2015 | B2 |
| 9011177 | Lloyd et al. | Apr 2015 | B2 |
| 9022806 | Girard, Jr. et al. | May 2015 | B2 |
| 9028201 | Kirk et al. | May 2015 | B2 |
| 9028281 | Kirk et al. | May 2015 | B2 |
| 9035183 | Kodama et al. | May 2015 | B2 |
| 9040824 | Guetig et al. | May 2015 | B2 |
| 9071001 | Scherer et al. | Jun 2015 | B2 |
| 9077118 | Szu et al. | Jul 2015 | B2 |
| 9118151 | Tran et al. | Aug 2015 | B2 |
| 9119292 | Gundel | Aug 2015 | B2 |
| 9124009 | Atkinson et al. | Sep 2015 | B2 |
| 9142921 | Wanha et al. | Sep 2015 | B2 |
| 9203171 | Yu et al. | Dec 2015 | B2 |
| 9214768 | Pao et al. | Dec 2015 | B2 |
| 9219335 | Atkinson et al. | Dec 2015 | B2 |
| 9225085 | Girard, Jr. et al. | Dec 2015 | B2 |
| 9232676 | Sechrist et al. | Jan 2016 | B2 |
| 9246251 | Regnier et al. | Jan 2016 | B2 |
| 9257778 | Buck et al. | Feb 2016 | B2 |
| 9257794 | Wanha et al. | Feb 2016 | B2 |
| 9281636 | Schmitt | Mar 2016 | B1 |
| 9300067 | Yokoo | Mar 2016 | B2 |
| 9312618 | Regnier et al. | Apr 2016 | B2 |
| 9350108 | Long | May 2016 | B2 |
| 9356401 | Homing et al. | May 2016 | B1 |
| 9362678 | Wanha et al. | Jun 2016 | B2 |
| 9368916 | Heyvaert et al. | Jun 2016 | B2 |
| 9373917 | Sypolt et al. | Jun 2016 | B2 |
| 9374165 | Zbinden et al. | Jun 2016 | B2 |
| 9385455 | Regnier et al. | Jul 2016 | B2 |
| 9391407 | Bucher et al. | Jul 2016 | B1 |
| 9413112 | Helster et al. | Aug 2016 | B2 |
| 9450344 | Cartier, Jr. et al. | Sep 2016 | B2 |
| 9472900 | Phillips et al. | Oct 2016 | B1 |
| 9490558 | Wanha et al. | Nov 2016 | B2 |
| 9509101 | Cartier, Jr. et al. | Nov 2016 | B2 |
| 9520680 | Hsu et al. | Dec 2016 | B2 |
| 9520689 | Cartier, Jr. et al. | Dec 2016 | B2 |
| 9531133 | Horning et al. | Dec 2016 | B1 |
| 9553381 | Regnier | Jan 2017 | B2 |
| 9559446 | Wetzel et al. | Jan 2017 | B1 |
| 9564696 | Gulla | Feb 2017 | B2 |
| 9608348 | Wanha et al. | Mar 2017 | B2 |
| 9651752 | Zbinden et al. | May 2017 | B2 |
| 9660364 | Wig et al. | May 2017 | B2 |
| 9666961 | Horning et al. | May 2017 | B2 |
| 9685724 | Tojo | Jun 2017 | B2 |
| 9685736 | Gailus et al. | Jun 2017 | B2 |
| 9735495 | Gross | Aug 2017 | B2 |
| 9774144 | Cartier, Jr. et al. | Sep 2017 | B2 |
| 9801301 | Costello | Oct 2017 | B1 |
| 9841572 | Zbinden et al. | Dec 2017 | B2 |
| 9843135 | Guetig et al. | Dec 2017 | B2 |
| 9929512 | Trout et al. | Mar 2018 | B1 |
| 9985367 | Wanha et al. | May 2018 | B2 |
| 9985389 | Morgan et al. | May 2018 | B1 |
| 10056706 | Wanha et al. | Aug 2018 | B2 |
| 10062984 | Regnier | Aug 2018 | B2 |
| 10062988 | Vinther et al. | Aug 2018 | B1 |
| 10069225 | Wanha et al. | Sep 2018 | B2 |
| 10096945 | Cartier, Jr. et al. | Oct 2018 | B2 |
| 10114182 | Zbinden et al. | Oct 2018 | B2 |
| 10136517 | Shirasaki | Nov 2018 | B2 |
| 10170869 | Gailus et al. | Jan 2019 | B2 |
| 10181663 | Regnier | Jan 2019 | B2 |
| 10205286 | Provencher et al. | Feb 2019 | B2 |
| 10243305 | Pan et al. | Mar 2019 | B1 |
| 10305224 | Girard | May 2019 | B2 |
| RE47459 | Vinther et al. | Jun 2019 | E |
| 10348007 | Kataoka et al. | Jul 2019 | B2 |
| 10367280 | Lloyd et al. | Jul 2019 | B2 |
| 10367308 | Little et al. | Jul 2019 | B2 |
| 10381767 | Milbrand, Jr. | Aug 2019 | B1 |
| 10462904 | Shirasaki | Oct 2019 | B2 |
| 10651606 | Little | May 2020 | B2 |
| 10680364 | Champion et al. | Jun 2020 | B2 |
| 10840622 | Sasame et al. | Nov 2020 | B2 |
| 10847937 | Cartier, Jr. et al. | Nov 2020 | B2 |
| 10879643 | Astbury et al. | Dec 2020 | B2 |
| 10944215 | Chua et al. | Mar 2021 | B2 |
| 10958005 | Dube | Mar 2021 | B1 |
| 11050176 | Yang et al. | Jun 2021 | B2 |
| 11070006 | Gailus et al. | Jul 2021 | B2 |
| 11101611 | Winey et al. | Aug 2021 | B2 |
| 11189943 | Zerebilov et al. | Nov 2021 | B2 |
| 11205877 | Diaz et al. | Dec 2021 | B2 |
| 11309655 | Avery et al. | Apr 2022 | B2 |
| 11437762 | Manter et al. | Sep 2022 | B2 |
| 11509100 | Chen et al. | Nov 2022 | B2 |
| 11637390 | Zerebilov et al. | Apr 2023 | B2 |
| 11670879 | Zerebilov | Jun 2023 | B2 |
| 11677188 | Diaz et al. | Jun 2023 | B2 |
| 11715922 | Winey et al. | Aug 2023 | B2 |
| 11735852 | Cartier et al. | Aug 2023 | B2 |
| 11757228 | Lai et al. | Sep 2023 | B2 |
| 11824311 | Gailus et al. | Nov 2023 | B2 |
| 20060234538 | Khemakhem et al. | Oct 2006 | A1 |
| 20080026638 | Cohen et al. | Jan 2008 | A1 |
| 20080194146 | Gailus | Aug 2008 | A1 |
| 20080200955 | Tepic | Aug 2008 | A1 |
| 20080207023 | Tuin et al. | Aug 2008 | A1 |
| 20080246555 | Kirk et al. | Oct 2008 | A1 |
| 20080248658 | Cohen et al. | Oct 2008 | A1 |
| 20080248659 | Cohen et al. | Oct 2008 | A1 |
| 20080248660 | Kirk et al. | Oct 2008 | A1 |
| 20080264673 | Chi et al. | Oct 2008 | A1 |
| 20080267620 | Cole et al. | Oct 2008 | A1 |
| 20080297988 | Chau | Dec 2008 | A1 |
| 20080305689 | Zhang et al. | Dec 2008 | A1 |
| 20090011641 | Cohen et al. | Jan 2009 | A1 |
| 20090011645 | Laurx et al. | Jan 2009 | A1 |
| 20090011664 | Laurx et al. | Jan 2009 | A1 |
| 20090017682 | Amleshi et al. | Jan 2009 | A1 |
| 20090023330 | Stoner et al. | Jan 2009 | A1 |
| 20090051558 | Dorval | Feb 2009 | A1 |
| 20090098767 | Long | Apr 2009 | A1 |
| 20090117386 | Vacanti et al. | May 2009 | A1 |
| 20090130913 | Yi et al. | May 2009 | A1 |
| 20090130918 | Nguyen et al. | May 2009 | A1 |
| 20090166082 | Liu et al. | Jul 2009 | A1 |
| 20090176400 | Davis et al. | Jul 2009 | A1 |
| 20090205194 | Semba et al. | Aug 2009 | A1 |
| 20090215309 | Mongold et al. | Aug 2009 | A1 |
| 20090227141 | Pan | Sep 2009 | A1 |
| 20090239395 | Cohen et al. | Sep 2009 | A1 |
| 20090247012 | Pan | Oct 2009 | A1 |
| 20090269971 | Tamura et al. | Oct 2009 | A1 |
| 20090291593 | Atkinson et al. | Nov 2009 | A1 |
| 20090291596 | Miyazoe | Nov 2009 | A1 |
| 20090305533 | Feldman et al. | Dec 2009 | A1 |
| 20090311908 | Fogg et al. | Dec 2009 | A1 |
| 20100009571 | Scherer et al. | Jan 2010 | A1 |
| 20100081302 | Atkinson et al. | Apr 2010 | A1 |
| 20100087084 | George | Apr 2010 | A1 |
| 20100099299 | Moriyama et al. | Apr 2010 | A1 |
| 20100112850 | Rao et al. | May 2010 | A1 |
| 20100144167 | Fedder et al. | Jun 2010 | A1 |
| 20100144168 | Glover et al. | Jun 2010 | A1 |
| 20100144175 | Helster et al. | Jun 2010 | A1 |
| 20100144201 | Defibaugh et al. | Jun 2010 | A1 |
| 20100144203 | Glover et al. | Jun 2010 | A1 |
| 20100177489 | Yagisawa | Jul 2010 | A1 |
| 20100183141 | Arai et al. | Jul 2010 | A1 |
| 20100203768 | Kondo et al. | Aug 2010 | A1 |
| 20100221951 | Pepe et al. | Sep 2010 | A1 |
| 20100248544 | Xu et al. | Sep 2010 | A1 |
| 20100291806 | Minich et al. | Nov 2010 | A1 |
| 20100294530 | Atkinson et al. | Nov 2010 | A1 |
| 20110003509 | Gailus | Jan 2011 | A1 |
| 20110034075 | Feldman et al. | Feb 2011 | A1 |
| 20110067237 | Cohen et al. | Mar 2011 | A1 |
| 20110074213 | Schaffer et al. | Mar 2011 | A1 |
| 20110104948 | Girard, Jr. et al. | May 2011 | A1 |
| 20110130038 | Cohen et al. | Jun 2011 | A1 |
| 20110136387 | Matsuura et al. | Jun 2011 | A1 |
| 20110177699 | Crofoot et al. | Jul 2011 | A1 |
| 20110212632 | Stoke et al. | Sep 2011 | A1 |
| 20110212633 | Regnier et al. | Sep 2011 | A1 |
| 20110212649 | Stokoe et al. | Sep 2011 | A1 |
| 20110212650 | Amleshi et al. | Sep 2011 | A1 |
| 20110223807 | Jeon et al. | Sep 2011 | A1 |
| 20110230095 | Atkinson et al. | Sep 2011 | A1 |
| 20110230096 | Atkinson et al. | Sep 2011 | A1 |
| 20110230104 | Lang et al. | Sep 2011 | A1 |
| 20110263156 | Ko | Oct 2011 | A1 |
| 20110287663 | Gailus et al. | Nov 2011 | A1 |
| 20110300757 | Regnier et al. | Dec 2011 | A1 |
| 20110300760 | Ngo | Dec 2011 | A1 |
| 20120003848 | Casher et al. | Jan 2012 | A1 |
| 20120034798 | Khemakhem et al. | Feb 2012 | A1 |
| 20120034820 | Lang et al. | Feb 2012 | A1 |
| 20120077369 | Andersen | Mar 2012 | A1 |
| 20120077380 | Minich et al. | Mar 2012 | A1 |
| 20120094536 | Khilchenko et al. | Apr 2012 | A1 |
| 20120135643 | Lange et al. | May 2012 | A1 |
| 20120156929 | Manter et al. | Jun 2012 | A1 |
| 20120184136 | Ritter | Jul 2012 | A1 |
| 20120202363 | McNamara et al. | Aug 2012 | A1 |
| 20120202386 | McNamara et al. | Aug 2012 | A1 |
| 20120214344 | Cohen et al. | Aug 2012 | A1 |
| 20120252232 | Buck et al. | Oct 2012 | A1 |
| 20120329294 | Raybold et al. | Dec 2012 | A1 |
| 20130012038 | Kirk et al. | Jan 2013 | A1 |
| 20130017715 | Laarhoven et al. | Jan 2013 | A1 |
| 20130017733 | Kirk et al. | Jan 2013 | A1 |
| 20130034999 | Szczesny et al. | Feb 2013 | A1 |
| 20130040482 | Ngo et al. | Feb 2013 | A1 |
| 20130065454 | Milbrand, Jr. | Mar 2013 | A1 |
| 20130078870 | Milbrand, Jr. | Mar 2013 | A1 |
| 20130084744 | Zerebilov et al. | Apr 2013 | A1 |
| 20130092429 | Ellison | Apr 2013 | A1 |
| 20130109232 | Paniaqua | May 2013 | A1 |
| 20130143442 | Cohen et al. | Jun 2013 | A1 |
| 20130196553 | Gailus | Aug 2013 | A1 |
| 20130210246 | Davis et al. | Aug 2013 | A1 |
| 20130223036 | Herring et al. | Aug 2013 | A1 |
| 20130225006 | Khilchenko et al. | Aug 2013 | A1 |
| 20130270000 | Buck et al. | Oct 2013 | A1 |
| 20130273781 | Buck et al. | Oct 2013 | A1 |
| 20130288521 | McClellan et al. | Oct 2013 | A1 |
| 20130288525 | McClellan et al. | Oct 2013 | A1 |
| 20130288539 | McClellan et al. | Oct 2013 | A1 |
| 20130340251 | Regnier et al. | Dec 2013 | A1 |
| 20140004724 | Cartier, Jr. et al. | Jan 2014 | A1 |
| 20140004726 | Cartier, Jr. et al. | Jan 2014 | A1 |
| 20140004746 | Cartier, Jr. et al. | Jan 2014 | A1 |
| 20140041937 | Lloyd et al. | Feb 2014 | A1 |
| 20140057475 | Tohjo | Feb 2014 | A1 |
| 20140057493 | De Geest et al. | Feb 2014 | A1 |
| 20140057494 | Cohen | Feb 2014 | A1 |
| 20140057498 | Cohen | Feb 2014 | A1 |
| 20140065883 | Cohen et al. | Mar 2014 | A1 |
| 20140073174 | Yang | Mar 2014 | A1 |
| 20140073181 | Yang | Mar 2014 | A1 |
| 20140099844 | Dunham | Apr 2014 | A1 |
| 20140199885 | Vinther et al. | Jul 2014 | A1 |
| 20140242844 | Wanha et al. | Aug 2014 | A1 |
| 20140273551 | Resendez et al. | Sep 2014 | A1 |
| 20140273557 | Cartier, Jr. et al. | Sep 2014 | A1 |
| 20140273627 | Cartier, Jr. et al. | Sep 2014 | A1 |
| 20140286613 | Ito et al. | Sep 2014 | A1 |
| 20140287627 | Cohen | Sep 2014 | A1 |
| 20140295680 | YuQiang et al. | Oct 2014 | A1 |
| 20140302706 | YuQiang et al. | Oct 2014 | A1 |
| 20140308852 | Gulla | Oct 2014 | A1 |
| 20140335707 | Johnescu et al. | Nov 2014 | A1 |
| 20140335736 | Regnier et al. | Nov 2014 | A1 |
| 20150056856 | Atkinson et al. | Feb 2015 | A1 |
| 20150072561 | Schmitt et al. | Mar 2015 | A1 |
| 20150079829 | Brodsgaard | Mar 2015 | A1 |
| 20150079845 | Wanha et al. | Mar 2015 | A1 |
| 20150180578 | Leigh et al. | Jun 2015 | A1 |
| 20150194751 | Herring | Jul 2015 | A1 |
| 20150200483 | Martin et al. | Jul 2015 | A1 |
| 20150200496 | Simpson et al. | Jul 2015 | A1 |
| 20150207247 | Regnier et al. | Jul 2015 | A1 |
| 20150236450 | Davis | Aug 2015 | A1 |
| 20150236451 | Cartier, Jr. et al. | Aug 2015 | A1 |
| 20150236452 | Cartier, Jr. et al. | Aug 2015 | A1 |
| 20150255926 | Paniagua | Sep 2015 | A1 |
| 20150280351 | Bertsch | Oct 2015 | A1 |
| 20150288110 | Tanguchi et al. | Oct 2015 | A1 |
| 20150303608 | Zerebilov et al. | Oct 2015 | A1 |
| 20150357736 | Tran et al. | Dec 2015 | A1 |
| 20150357747 | Filipon et al. | Dec 2015 | A1 |
| 20150357761 | Wanha et al. | Dec 2015 | A1 |
| 20160013594 | Costello et al. | Jan 2016 | A1 |
| 20160013596 | Regnier | Jan 2016 | A1 |
| 20160028189 | Resendez et al. | Jan 2016 | A1 |
| 20160049746 | Gross | Feb 2016 | A1 |
| 20160104956 | Santos et al. | Apr 2016 | A1 |
| 20160111825 | Wanha et al. | Apr 2016 | A1 |
| 20160141807 | Gailus et al. | May 2016 | A1 |
| 20160149343 | Atkinson et al. | May 2016 | A1 |
| 20160149362 | Ritter et al. | May 2016 | A1 |
| 20160150633 | Cartier, Jr. | May 2016 | A1 |
| 20160150639 | Gailus et al. | May 2016 | A1 |
| 20160150645 | Gailus et al. | May 2016 | A1 |
| 20160181713 | Peloza et al. | Jun 2016 | A1 |
| 20160181732 | Laurx et al. | Jun 2016 | A1 |
| 20160190747 | Regnier et al. | Jun 2016 | A1 |
| 20160197423 | Regnier | Jul 2016 | A1 |
| 20160211598 | Costello et al. | Jul 2016 | A1 |
| 20160218455 | Sayre et al. | Jul 2016 | A1 |
| 20160233598 | Wittig | Aug 2016 | A1 |
| 20160268714 | Wanha et al. | Sep 2016 | A1 |
| 20160268739 | Zerebilov et al. | Sep 2016 | A1 |
| 20160274316 | Verdiell | Sep 2016 | A1 |
| 20160308296 | Pitten et al. | Oct 2016 | A1 |
| 20160322770 | Zerebilov | Nov 2016 | A1 |
| 20160344141 | Cartier et al. | Nov 2016 | A1 |
| 20170025783 | Astbury et al. | Jan 2017 | A1 |
| 20170033478 | Wanha et al. | Feb 2017 | A1 |
| 20170042070 | Baumler et al. | Feb 2017 | A1 |
| 20170047692 | Cartier, Jr. et al. | Feb 2017 | A1 |
| 20170054250 | Kim et al. | Feb 2017 | A1 |
| 20170077643 | Zbinden et al. | Mar 2017 | A1 |
| 20170093093 | Cartier, Jr. et al. | Mar 2017 | A1 |
| 20170098901 | Regnier | Apr 2017 | A1 |
| 20170162960 | Wanha et al. | Jun 2017 | A1 |
| 20170294743 | Gailus et al. | Oct 2017 | A1 |
| 20170302011 | Wanha et al. | Oct 2017 | A1 |
| 20170338595 | Girard, Jr. | Nov 2017 | A1 |
| 20170365942 | Regnier | Dec 2017 | A1 |
| 20170365943 | Wanha et al. | Dec 2017 | A1 |
| 20180006416 | Lloyd et al. | Jan 2018 | A1 |
| 20180034175 | Lloyd et al. | Feb 2018 | A1 |
| 20180034190 | Ngo | Feb 2018 | A1 |
| 20180040989 | Chen | Feb 2018 | A1 |
| 20180062323 | Kirk et al. | Mar 2018 | A1 |
| 20180109043 | Provencher et al. | Apr 2018 | A1 |
| 20180145438 | Cohen | May 2018 | A1 |
| 20180219331 | Cartier, Jr. et al. | Aug 2018 | A1 |
| 20180219332 | Brungard et al. | Aug 2018 | A1 |
| 20180269612 | Pitten et al. | Sep 2018 | A1 |
| 20180309214 | Lloyd et al. | Oct 2018 | A1 |
| 20180366880 | Zerebilov et al. | Dec 2018 | A1 |
| 20190013625 | Gailus et al. | Jan 2019 | A1 |
| 20190020155 | Trout et al. | Jan 2019 | A1 |
| 20190044284 | Dunham | Feb 2019 | A1 |
| 20190157812 | Gailus et al. | May 2019 | A1 |
| 20190173236 | Provencher et al. | Jun 2019 | A1 |
| 20190260147 | Pitten et al. | Aug 2019 | A1 |
| 20190267732 | Buck et al. | Aug 2019 | A1 |
| 20200244025 | Winey et al. | Jul 2020 | A1 |
| 20200274267 | Zerebilov | Aug 2020 | A1 |
| 20200274301 | Manter et al. | Aug 2020 | A1 |
| 20210021085 | Diaz et al. | Jan 2021 | A1 |
| 20210091496 | Cartier, Jr. et al. | Mar 2021 | A1 |
| 20210234291 | Zerebilov | Jul 2021 | A1 |
| 20210305731 | Klein et al. | Sep 2021 | A1 |
| 20210384691 | Winey et al. | Dec 2021 | A1 |
| 20210399455 | Wang et al. | Dec 2021 | A1 |
| 20220013962 | Gailus et al. | Jan 2022 | A1 |
| 20220158371 | Zerebilov et al. | May 2022 | A1 |
| 20220173550 | Liu et al. | Jun 2022 | A1 |
| 20220224057 | Diaz et al. | Jul 2022 | A1 |
| 20230253722 | Zerebilov | Aug 2023 | A1 |
| 20230299518 | Zerebilov et al. | Sep 2023 | A1 |
| 20230307854 | Pritchard et al. | Sep 2023 | A1 |
| 20230352895 | Winey et al. | Nov 2023 | A1 |
| 20240030655 | Diaz et al. | Jan 2024 | A1 |
| Number | Date | Country |
|---|---|---|
| 2800738 | Dec 2011 | CA |
| 101164204 | Apr 2008 | CN |
| 101312275 | Nov 2008 | CN |
| 101330172 | Dec 2008 | CN |
| 101364692 | Feb 2009 | CN |
| 101752700 | Jun 2010 | CN |
| 201562814 | Aug 2010 | CN |
| 201956529 | Aug 2011 | CN |
| 102598430 | Jul 2012 | CN |
| 202678544 | Jan 2013 | CN |
| 102986091 | Mar 2013 | CN |
| 103140994 | Jun 2013 | CN |
| 103682705 | Mar 2014 | CN |
| 104025393 | Sep 2014 | CN |
| 104518363 | Apr 2015 | CN |
| 104779467 | Jul 2015 | CN |
| 105051978 | Nov 2015 | CN |
| 105612671 | May 2016 | CN |
| 106030925 | Oct 2016 | CN |
| 106104933 | Nov 2016 | CN |
| 107408769 | Nov 2017 | CN |
| 107645072 | Jan 2018 | CN |
| 108028481 | May 2018 | CN |
| 108475891 | Aug 2018 | CN |
| 108713355 | Oct 2018 | CN |
| 109273932 | Jan 2019 | CN |
| 212571566 | Feb 2021 | CN |
| 113078510 | Jul 2021 | CN |
| 214100162 | Aug 2021 | CN |
| 115347395 | Nov 2022 | CN |
| 102823073 | Dec 2022 | CN |
| 2 169 770 | Mar 2010 | EP |
| 2010-266729 | Nov 2010 | JP |
| 2011-018651 | Jan 2011 | JP |
| 2012-516021 | Jul 2012 | JP |
| 2014-195061 | Oct 2014 | JP |
| 2016-528688 | Sep 2016 | JP |
| 6193595 | Sep 2017 | JP |
| 6599548 | Oct 2019 | JP |
| 10-2015-0067010 | Jun 2015 | KR |
| 10-2015-0101020 | Sep 2015 | KR |
| 10-2016-0038192 | Apr 2016 | KR |
| 10-2016-0076334 | Jun 2016 | KR |
| 200910710 | Mar 2009 | TW |
| M357771 | May 2009 | TW |
| 201320504 | May 2013 | TW |
| I446657 | Jul 2014 | TW |
| I465333 | Dec 2014 | TW |
| 201521295 | Jun 2015 | TW |
| I489002 | Jun 2015 | TW |
| WO 2004098251 | Nov 2004 | WO |
| WO 2008072322 | Jun 2008 | WO |
| WO 2008124057 | Oct 2008 | WO |
| WO 2010039188 | Apr 2010 | WO |
| WO 2012078434 | Jun 2012 | WO |
| WO 2013006592 | Jan 2013 | WO |
| WO 2015013430 | Jan 2015 | WO |
| WO 2015112717 | Jul 2015 | WO |
| WO 2017015470 | Jan 2017 | WO |
| WO 2017123574 | Jul 2017 | WO |
| WO 2017164418 | Sep 2017 | WO |
| WO 2018226805 | Dec 2018 | WO |
| WO 2019195319 | Oct 2019 | WO |
| Entry |
|---|
| International Search Report and Written Opinion for International Application No. PCT/US2020/051242, mailed Feb. 1, 2021. |
| International Preliminary Report on Patentability mailed Mar. 31, 2022 in connection with International Application No. PCT/US2020/051242. |
| [No Author Listed], Amphenol TCS expands the Xcede Platform with 85 Ohm Connectors and High-Speed Cable Solutions. Press Release. Published Feb. 25, 2009. http://www.amphenol.com/about/news_archive/2009/58 [Retrieved on Mar. 26, 2019 from Wayback Machine]. 4 pages. |
| [No Author Listed], Agilent. Designing Scalable 10G Backplane Interconnect Systems Utilizing Advanced Verification Methodologies. White Paper, Published May 5, 2012. 24 pages. |
| [No Author Listed], Difference Between Weld Metal and Heat Affected Zone (HAZ). Minaprem.com. 2021. 7 pages. URL:http://www.difference.minaprem.com/joining/difference-between-weld-metal-and-heat-affected-zone-haz [date retrieved Dec. 20, 2021]. |
| [No Author Listed], Hitachi Cable America Inc. Direct Attach Cables. 8 pages. Retrieved Aug. 10, 2017 from http://www.hca.hitachi-cable.com/products/hca/catalog/pdfs/direct-attach-cable-assemblies.pdf [last accessed Mar. 6, 2019]. |
| [No Author Listed], What is the Heat Affected Zone (HAZ)? TWI Ltd. 2021. 8 pages. URL:https://www.twi-global.com/technical-knowledge/faqs/what-is-the-heat-affected-zone [date retrieved Dec. 20, 2021]. |
| Diaz et al., Controlled-Impedance Compliant Cable Termination, U.S. Appl. No. 18/321,754, filed May 22, 2023. |
| Lehto et al., Characterisation of local grain size variation of welded structural steel. Weld World. 2016;60:673-688. 16 pages. URL:https://link.springer.com/content/pdf/10.1007/s40194-016-0318-8.pdf. |
| Lloyd et al., High Speed Bypass Cable Assembly, U.S. Appl. No. 15/271,903, filed Sep. 21, 2016. |
| Lloyd et al., High Speed Bypass Cable Assembly, U.S. Appl. No. 15/715,939, filed Sep. 26, 2017. |
| Winey et al., I/O Connector Configured for Cabled Connection to The Midboard, U.S. Appl. No. 18/346,172, filed Jun. 30, 2023. |
| Zerebilov et al., I/O Connector Configured for Cable Connection to a Midboard, U.S. Appl. No. 18/136,827, filed Apr. 19, 2023. |
| Zerebilov, High Frequency Midboard Connector, U.S. Appl. No. 17/160,229, filed Jan. 27, 2021. |
| Extended European Search Report dated Jan. 23, 2024 in connection with European Application No. 20866832.7. |
| Fan et al., Compact High-Speed Electrical Connector, U.S. Appl. No. 18/494,129, filed Oct. 25, 2023. |
| U.S. Appl. No. 18/494,129, filed Oct. 25, 2023, Fan et al. |
| EP 20866832.7, Jan. 23, 2024, Extended European Search Report. |
| Chinese Office Action dated Jan. 10, 2024 in connection with Chinese Application No. 202080072500.X. |
| Number | Date | Country | |
|---|---|---|---|
| 20230352866 A1 | Nov 2023 | US |
| Number | Date | Country | |
|---|---|---|---|
| 62902820 | Sep 2019 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 17024337 | Sep 2020 | US |
| Child | 18347820 | US |
