1. Field of the Invention
The present invention relates to a high speed high density connector assembly, and more particularly, to a high speed high density connector assembly having stacked contact wafers that are completely shielded.
2. Description of the Prior Art
Many prior art references disclose high speed high density connector assemblies with shielding structures. U.S. Pat. No. 6,709,294 B1, issued to Cohen et al. on Mar. 23, 2004, discloses an electrical connector having electrical conductors in a plurality of rows. Each of the plurality of rows includes a housing and a plurality of electrical conductors. Each electrical conductor has a first contact end connectable to a printed circuit board, a second contact end, and an intermediate portion therebetween that is disposed within the housing. The housing includes a first region surrounding each of the plurality of electrical conductors, the first region made of insulative material and extending substantially along the length of the intermediate portion of the electrical conductors. The housing also includes a second region adjacent the first region and extending substantially along the length of the intermediate portion of the electrical conductors. The second region is made of a material with a binder containing conductive fillers providing shielding between signal conductors. Furthermore, in discussing background art in U.S. Pat. No. 6,709,294, it is mentioned that a solution is introduced to provide shields through plastics coated with metals, but there are no combination of readily available and inexpensive metals and plastics that can be used, such as the plastic lacks desired thermal or mechanical properties, available plating techniques are not selective, etc.
U.S. Pat. No. 6,471,549 B1, issued to Lappohn on Oct. 29, 2002, discloses a shielded plug-in connector. The plug-in connector has a jack-in-blade strip having at least one first contact element and an edge connector having at least one second contact element corresponding to the first contact element. The edge connector, on or in its outer body areas, has at least partially shielding sheets. Shielding of the plug-in connector is achieved by, in addition to the shielding sheets provided on the edge connector, a shielding group with at least one first element arranged in the jack-in-blade strip. The first element of the shielding group is a base part in the form of a U-shaped rail. The shielding sheets on the edge connector have a planar body and angled stays. Two of the angled stays and a portion of the planar body between the two angled stays form a counterpart to the base part, wherein the counterpart and the base part together substantially encapsulate the first and second contact elements.
U.S. Pat. No. 7,581,990 B2, issued to Kirk et al. on Sep. 1, 2009, discloses a waferized electrical connector incorporating electrically lossy material selectively positioned to reduce crosstalk without undesirably attenuating signals. Wafer may be formed in whole or in part by injection molding of material to form its housing around a wafer strip assembly. A two shot molding operation may be adopted, allowing the housing to be formed of two types of material having different material properties, namely an insulative portion being formed in a first shot and lossy portion being formed in a second shot. The housing may include slots that position air, or create regions of air, adjacent signal conductors in order to provide a mechanism to de-skew a differential pair of signal conductors.
A main object of the present invention is to provide a high speed high density electrical connector assembly with a cable assembly extension rather than the contact tails used for mounting to a printed circuit board.
The present invention first provides an electrical connector comprising a plurality of wafers and a plurality of shielding plates alternative arranged and stacked with each other in a transverse direction. Each of the wafers further comprises a conductive housing and a plurality of terminal modules. The conductive housing having opposite first and second faces both spanning perpendicular to the transverse direction, the first face defining a plurality of slots therein. Each of the terminal modules is received in one of the slots, each terminal module comprising an insulating holder and a pair of contacts extending along a signal path, each of said contacts having a contacting portion, a tail portion, and an intermediate portion connecting the contacting portion and the tail portion, the intermediate portions of the contacts in each pair being parallel fixed in the insulating holder and kept isolated from each other. A plurality of cables are connected to the corresponding terminal modules, respectively. Each of the cables includes a pair of differential wires and a drain wire wherein the differential wires are mechanically and electrically connected to the pair of contacts while the drain wire is mechanically and electrically connected to the shielding plate.
The present invention secondly provides a contact wafer adapted for an electrical connector. The contact wafer comprises a conductive housing, plural insulating holders, and plural pairs of contacts. The conductive housing defining plural slots in a side face, the plural slots extending along parallel paths from a first edge to a second edge in the side face. The plural insulating holders are received in the slots, respectively. The plural pairs of contacts are adapted to transfer the differential signal, each pair of the contacts extending along the path of a corresponding slot and kept isolated from the conductive board by a corresponding insulating holder. The conductive housing is formed by a molded plastic coated with metal plating or by die-casting.
The features of this invention which are believed to be novel are set fourth with particularity in the appended claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements in the figures and in which:
Reference will now be made to the drawing figures to describe the present invention in detail.
Referring to
The shielding plate 30 is assembled to the housing 12 via pegs 28 of the housing 12 and apertures 32 of the shielding plate 30. The shielding plate 30 forms a plurality of grooves 34 to receive the corresponding retention blocks 26 and a plurality of notch 36 to receive the corresponding drain wires 64 (illustrated later).
A plurality of cable assemblies (only one shown) 50 each corresponds to the paired wafer 10 and shielding plate 30. Each cable assembly 50 includes a spacer 52 and a plurality of cables 60 mounted thereon. The spacer 52 forms a plurality of passages 54, a plurality of recesses 56 communicating with the corresponding passages 54 respectively, a plurality of alignment slots 58 communication with the corresponding passages 54 for the rear tail section 24 alignment, and a plurality of inspection holes 59 communication with corresponding passages 54. The inspection holes 59 also can be used as pockets for glue which is applied to the passages 54. The spacer 52 forms a post 53 to be received in a hole 19 of the housing 12. Each cable 60 includes a pair of differential wires 62 and a drain wire 64 wherein the differential wires 62 extending through the corresponding passage 54, are mechanically and electrically connected to the tail sections 24 of the corresponding differential contacts 18 while the drain wire 64 extending through the corresponding recess 56 is mechanically and electrically received within the corresponding notch 36 and connected to the shielding plate 30. The shielding blades 40 are disposed between adjacent two pair of differential wires 62, respectively.
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It is to be understood, however, that even though numerous, characteristics and advantages of the present invention have been set fourth in the foregoing description, together with details of the structure and function of the invention, the disclosed is illustrative only, and changes may be made in detail, especially in matters of number, shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
This patent application is related to a U.S. patent application Ser. No. 13/772,232 filed Feb. 20, 2013 and entitled “HIGH SPEED HIGH DENSITY CONNECTOR ASSEMBLY”.
Number | Date | Country | |
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62056634 | Sep 2014 | US |