1. Field of the Invention
The present invention relates to a modular jack suitable for high-speed communication, and more particularly to a RJ45 receptacle connector having two stacked printed circuit boards (PCBs).
2. Description of Related Art
U.S. Patent Application Publication No. 2012/0196479, published on Aug. 2, 2012, discloses a modular jack used for 10 Gbps Ethernet. The modular jack includes an insulative housing with a mounting port and a row of insert modules inserted into the mounting port along a back-to-front direction. Each insert module has a left vertical PCB, a right vertical PCB, and a central shielding ground plate sandwiched between the vertical PCBs for shielding EMI (electromagnetic interference). The central shielding ground plate has a left arm and a right arm for soldering to vertical PCBs. The central shielding ground plate needs to be soldered separately with the two vertical PCBs.
Hence, a modular jack having a simple structure for soldering two PCBs is desired.
Accordingly, an object of the present invention is to provide a modular jack having a simple structure for soldering two PCBs.
In order to achieve the object set forth, the invention provides a modular jack comprising an insulative housing, a lower PCB, an upper PCB stacked on the lower PCB, a set of lower contacts, a set of upper contacts and a terminal module located below the lower PCB. The insulative housing defines a lower port, an upper port stacked on the lower port, and a mounting port located behind the lower and upper ports. The lower PCB is disposed horizontally in the mounting port and has a bottom face facing downwardly. The upper PCB is stacked on the lower PCB and has a top face facing upwardly. Each lower contact has a lower contacting portion extending backwardly and downwardly in the lower port and a connecting portion mounted on the bottom face. Each upper contact has an upper contacting portion extending backwardly and upwardly in the upper port and an upper connecting portion mounted on the top face of the upper PCB. The terminal module has a set first terminals electrically connected to the upper contacts through the upper PCB, a set of second terminals electrically connected to the lower contacts through the lower PCB, and a metal shielding plate disposed between the first terminals and the second terminals. The lower PCB has a first edge with a lower cutout recessed therefrom and the upper PCB also has a second edge with an upper cutout recessed therefrom. The metal shielding plate has a top inserting section inserted in the lower and upper cutouts and simultaneously soldered to the upper PCB and lower PCB.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Reference will now be made in detail to the preferred embodiment of the present invention.
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The PCBA 20 includes an upper plastic body 207, a set of upper contacts 205 insert molded with the upper plastic body 207, a lower plastic body 208, and a set of lower contacts 206 insert molded with the lower plastic body 208. The upper plastic body 207 is mounted on the top face 2011 and each upper contact 205 is soldered on the top face 2011. The lower plastic body 208 is mounted on the bottom face 2021 and each lower contact 206 is soldered on the bottom face 2021. Each upper contact 205 has an upper contacting portion 2052 extending backwardly and upwardly in the upper port 11 and a connecting portion 2051 surface mounted on a front portion of the top face 2011. Each lower contact 206 has a lower contacting portion 2062 extending backwardly and downwardly in the lower port 12 and a connecting portion (not labeled) surface mounted on a front portion of the bottom face 2021.
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The terminal module 21 includes a set of first terminals 211 connected with the upper PCB 201, a set of second terminals 212 connected with the lower PCB 202, and a metal shielding plate 213 disposed between the first and second terminals 211, 212. The upper contacts 205 electrically connect with corresponding first terminals 211 through the upper PCB 201 and the upper transformers 203. The lower contacts 206 electrically connect with corresponding second terminals 212 through the lower PCB 202 and the lower transformers 204. The metal shielding plate 213 is used for shielding electromagnetic interference (EMI) between the first and second terminals when they transmitting signals. The terminal module 21 has a first insulative carrier 214 for retention of the first terminals 211 and a second insulative carrier 215 for retention of the second terminals 212. The metal shielding plate 213 is sandwiched between the first and second insulative carriers 214, 215. There is a receiving chamber 216 defined by the first insulative carrier 214 and the second insulative carrier 215. The lower transformers 204 mounted on the lower PCB 202 are received in the receiving chamber 216. The first insulative carrier 214 has a first receiving chamber 2141 and the second insulative carrier 215 has a second receiving chamber 2151. The first receiving chamber 2141 and the second receiving chamber 2151 assembled to form the receiving chamber 216. The first insulative carrier 214 has a first post 2142 mounting into a through hole 209 of the upper PCB 201. The second insulative carrier 215 has a second post 2152 mounting a through hole (not labeled) of the lower PCB 202. The first insulative carrier 214 has a positioning post 2143 and the second insulative carrier 215 has a positioning hole 2153 for the positioning post 2143 inserting therein. Each first terminal 211 includes a first connecting portion 2111 connecting with the upper PCB 201, a first holding portion 2112 held by the first insulative carrier 214, and a first mounting portion 2113 located below the bottom PCB 4. The second terminal 212 includes a second connecting portion 2121 connecting with the lower PCB 201, a second holding portion 2122 held by the second insulative carrier 215, and a second mounting portion 2123 located below the bottom PCB 4. The first mounting portion 2113 and the second mounting portion 2123 are used for electrically and mechanically engagement with the horizontal mother PCB 200. The first insulative carrier 214 has a first supporting face 2146 and a second supporting face 2147 located below the first supporting face 2146. The second carrier 215 having a third supporting face 2157 disposed at a same level with the second supporting face 2147. The upper PCB 201 is supported by the first supporting face 2146 and the lower PCB 202. The lower PCB 202 is supported by the second face 2147 and the third supporting face 2157.
The metal shielding plate 213 has a main body portion 2130, a top inserting section 2131 extending upwardly from the main body portion 2130, and a mounting portion 2134 extending downwardly from the main body portion 2130. The main body portion 2130 defines two holes 20133 for the positioning post 2143 passing over. The mounting portions 2134 are used for electrically and mechanically engagement with the horizontal mother board 200. The top inserting section 2131 is inserted into the first cutout 2013 and the second cutout 2023. The top inserting section 2131 is simultaneously soldered to the upper PCB 201 and the lower PCB 202.
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It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the members in which the appended claims are expressed.
Number | Date | Country | Kind |
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2013205160116 | Aug 2013 | CN | national |