High speed optical interface converter module having mounting halves

Information

  • Patent Grant
  • 6299362
  • Patent Number
    6,299,362
  • Date Filed
    Wednesday, June 16, 1999
    25 years ago
  • Date Issued
    Tuesday, October 9, 2001
    22 years ago
Abstract
A device which retains a polymer mounting block between a metallic cover and a metallic base. The mounting block includes two mounting halves. The mounting halves being hermaphroditic such that a pair of the mounting halves of the mounting block being substantially identical can be assembled in opposite transverse relation to form the mounting block. The mounting half of the mounting block includes a member and two latch arms attached to the member. The member includes a transmitter mounting provision and a receiver mounting provision. The transmitter mounting provision receives a transmitter sub-assembly, and the receiver mounting provision receives a receiver sub-assembly. The transmitter mounting provision and the receiver mounting provision straddle the second latch arm, and the first latch arm and the second latch arm straddle one of the transmitter mounting provision and the receiver mounting provision.
Description




BACKGROUND OF THE INVENTION




The present invention relates to an improved pluggable electronic module configured to connect and/or convert data signals from a first serial transmission medium to a second serial transmission medium. A preferred embodiment of the invention relates particularly to an improved Giga-bit Interface Converter (GBIC) as defined by the GBIC specification, the teaching of which is incorporated herein by reference. However, the improvements disclosed in this specification are applicable to high-speed data communication modules other than GBICs as well.




The GBIC specification was developed by a group of electronics manufactures in order to arrive at a standard small form factor transceiver module for use with a wide variety of serial transmission media and connectors. The specification defines the electronic, electrical, and physical interface of a removable serial transceiver module designed to operate at Giga-bit speeds. A GBIC provides a small form factor pluggable module which may be inserted and removed from a host or switch chassis without powering off the receiving socket. The GBIC standard allows a single standard interface to be changed from a first serial medium to an alternate serial medium by simply removing a first GBIC module and plugging in a second GBIC having the desired alternate media interface.




The GBIC form factor defines a module housing which includes a first electrical connector for connecting the module to a host device or chassis. This first electrical connector mates with a standard socket which provides the interface between the host device printed circuit board and the module. Every GBIC has an identical first connector such that any GBIC will be accepted by any mating GBIC socket. The opposite end of the GBIC module includes a media connector which can be configured to support any high performance serial technology. These high performance technologies include: 100 Mbyte multi-mode short wave laser without OFC; 100 Mbyte single-mode long-wave laser with 10 km range; Style 1 intracabinet differential ECL; and Style 2 intracabinet differential ECL.




The GBIC module itself is designed to slide into a mounting slot formed within the chassis of a host device. The mounting slot may include guide rails extending back from the opening in the chassis wall. At the rear of the slot the first electrical connector engages the mating socket which is mounted to a printed circuit board within the host device. The GBIC specification requires two guide tabs to be integrated with the electrical connector. As the connector is mated with the socket, the guide tabs of the connector engage similar structures integrally formed with the socket. The guide tabs are to be connected to circuit ground on both the host and the GBIC. The guide tabs engage before any of the contact pins within the connector and provide for static discharge prior to supplying voltage to the module. When the GBIC is fully inserted in this manner, and the connector fully mated with the socket only the media connector extends beyond the host device chassis.




Copper GBIC's allow the host devices to communicate over a typical copper serial transmission medium. Typically this will comprise a shielded cable comprising two or four twisted pairs of conductors. In such cables, the media connector will generally be a standard DB-9 electrical connector, or an HSSDC (High Speed Serial Data Connector) at each end. In the case of copper GBICs this DB-9 or HSSDC connector is a purely passive device and serves no other function than to connect electrical signals between the cable and the GBIC module. Thus, it may be desirable to eliminate the connector altogether, and directly attach two copper GBICs, one at each end of the copper cable, thereby eliminating two connectors and reducing the cost of the data link. It may be further desired to make such direct attach copper GBICs field installable such that the transmission cable may be routed and installed prior to attaching the GBIC modules. Such field installable GBICs would help reduce the risk of damage to the modules while the wiring is being installed.




In designing GBIC modules, a factor which must be considered is that GBICs are high frequency devices designed to operate at speeds above 1 Giga-bit per second. Thus, the modules carry the potential of emitting high frequency signals to the surrounding area, which may adversely affect sensitive equipment situated nearby. Therefore, a sophisticated shielding mechanism is required in order to prevent such unwanted emissions. In prior art modules, this has generally included a metallized or metal clad portion of the module located adjacent the media connector. The metal portion is configured to engage the chassis wall of the host device when the module is fully inserted into the mounting slot. The metallized portion of the module and the chassis wall form a continuous metal barrier surrounding the slot opening. The metal barrier blocks any high frequency emissions from escaping from the host chassis due to a gap between the module and the chassis-mounting slot. A disadvantage of prior art GBIC modules, however, is that spurious emissions are free to escape the module directly through the media connector. This leakage has the potential of disrupting the operation of nearby devices. The problem is most acute in so called “copper GBICs” where an electrical connector is provided as the media connector. Furthermore, most prior art GBIC modules are formed of a plastic outer housing which allows EMI signals generated by the GBIC to propagate, freely within the chassis of the host device. These emissions can interfere with other components mounted within the host chassis and can further add to the leakage problem at the media end of the module.




Therefore, what is needed is an improved high speed pluggable communication module having an improved media connector end which acts to block all spurious emissions from escaping beyond the module housing. Such an improved module should be adaptable to function as a Giga-Bit Interface Converter module and interface with any GBIC receptacle socket. In such a module, the host connector should conform to the GBIC specification and include the requisite guide tabs connected to the circuit ground. At the media end of the module, the improved module may include either an DB-9 style 1 copper connector, an HSSDC style 2 copper connector, or an SC duplex fiber optic connector as the second end media connector. Alternately, the module may provide for the direct attachment of the module to a copper transmission medium such that a single shielded copper cable may be interconnected between two host devices with an individual GBIC connected at each end. It is further desired that the module include latching tabs to affirmatively lock the module into a corresponding host socket. Internally, the module should contain whatever electronics are necessary to properly convert the data signals from the copper transmission medium of the host device to whichever medium is to be connected to the media end of the module. In the case of GBIC modules, all of the operating parameters as well as mechanical and electrical requirements of the GBIC specification should be met by the improved module. However, though it is most desired to provide an improved GBIC module, it must be noted that the novel aspects of a transceiver module solving the problems outlined above may be practiced with high-speed serial modules other than GBICs.




SUMMARY OF THE INVENTION




In light of the prior art as described above, one of the main objectives of the present invention is to provide an improved small form factor interface module for exchanging data signals between a first transmission medium and a second transmission medium.




A further object of the present invention is to provide an improved small form factor interface module configured to operate at speeds in excess of 1 Giga-Bit per second.




Another objective of the present invention is to provide an improved interface module to prevent spurious electromagnetic emissions from leaking from the module.




Another objective of the present invention is to provide an improved interface module having a die cast metal outer housing including a ribbon style connector housing integrally formed therewith.




Another objective of the present invention is to provide an improved interface module having a die cast metal outer housing including detachable insulated latch members for releasably engaging a host device socket.




Another objective of the present invention is to provide and improved interface module having a die cast metal outer housing with an integrally cast electrical connector, including guide tabs electrically connected to the circuit ground of the module and configured to engage similar ground structures within a host device socket.




Still another objective of the present invention is to provide an improved Giga-Bit Interface Converter (GBIC) having a media connector mounted remote from the GBIC housing.




An additional objective of the present invention is to provide an improved GBIC having a shielded cable extending from the module housing, with the cable shield being bonded to the housing in a manner which electromagnetically seals the end of the module housing.




A further objective of the present invention is to provide an improved GBIC having a remote mounted media connector comprising a DB-9 connector.




A still further objective of the present invention is to provide an improved GBIC having a remote mounted media connector comprising an HSSDC connector.




Another objective of the present invention is to provide an improved GBIC having a remote mounted media connector comprising a 1×9 transceiver module.




Another objective of the present invention is to provide an improved GBIC module having a flexible shielded cable extending therefrom, and a second GBIC module being connected at the remote end of the cable wherein the two GBIC modules are field installable.




A further objective of the present invention is to provide an improved GBIC having a media connector incorporated with the GBIC housing and integrally formed therewith in order to provide an inexpensive, easily assembled module.




It is another object of the present invention to provide an improved GBIC module having an HSSDC connector integrally formed with the module components.




It is still an additional object of the present invention to provide an improved GBIC module having a DB-9 connector incorporated as the media connector mounted within the module.




It is a further object of the present invention to provide an interface module having a SC duplex optical receptacle incorporated as the media connector formed with the module housing.




It is another object of the invention to provide a way for holding the transceiver device in the housing.




All of these objectives, as well as others that will become apparent upon reading the detailed description of the presently preferred embodiment of the invention, are met by the Latch Block Insert for a Improved High Speed Interface Converter Module herein disclosed.




The present invention provides a small form factor, high speed serial interface module, such as, for example, a Giga-Bit Interface Converter (GBIC). The module is configured to slide into a corresponding slot within the host device chassis where, at the rear of the mounting slot, a first connector engages the host socket. A latching mechanism may be provided to secure the module housing to the host chassis when properly inserted therein. It is desirable to have a large degree of interchangeability in such modules, therefore across any product grouping of such modules, it is preferred that the first connector be identical between all modules within the product group, thus allowing any particular module of the group to be inserted into any corresponding host socket. It is also preferred that the first connector include sequential mating contacts such that when the module is inserted into a corresponding host socket, certain signals are connected in a pre-defined sequence. By properly sequencing the power and grounding connections the module may be “Hot Pluggable” in that the module may be inserted into and removed from a host socket without removing power to the host device. Once connected, the first connector allows data signals to be transferred from the host device to the interface module.




The preferred embodiment of the invention is to implement a remote mounted media connector on a standard GBIC module according the GBIC specification. However, it should be clear that the novel aspects of the present invention may be applied to interface modules having different form factors, and the scope of the present invention should not be limited to GBIC modules only.




In a preferred embodiment, the module is formed of a two piece die cast metal housing including a base member and a cover. In this embodiment the host connector, typically a D-Shell ribbon style connector, is integrally cast with the base member. The cover is also cast metal, such that when the module is assembled, the host end of the module is entirely enclosed in metal by the metal base member, cover, and D-Shell connector, thereby effectively blocking all spurious emissions from the host end of the module.




A printed circuit board is mounted within the module housing. The various contact elements of the first electrical connector are connected to conductive traces on the printed circuit board, and thus serial data signals may be transferred between the host device and the module. The printed circuit board includes electronic components necessary to transfer data signals between the copper transmission medium of the host device to the transmission medium connected to the output side of the module. These electronic components may include passive components such as capacitors and resistors for those situations when the module is merely passing the signals from the host device to the output medium without materially changing the signals, or they may include more active components for those cases where the data signals must be materially altered before being broadcast on the output medium.




In a further preferred embodiment, a portion of the printed circuit board extends through the cast metal D-Shell connector. The portion of the printed circuit board extending into the D-Shell includes a plurality of contact fingers adhered thereto, thereby forming a contact support beam within the metal D-Shell. Additional guide tabs extend from the printed circuit board on each side of the contact beam. The guide tabs protrude through apertures on either side of the D-Shell. A metal coating is formed on the outer edges of the guide tabs and connected to the ground plane of the printed circuit board. The guide tabs and the metal coating formed thereon are configured to engage mating structures formed within the host receiving socket, and when the module is inserted into the host receiving socket, the guide tabs act to safely discharge any static charge which may have built up on the module. The module housing may also include a metal U-shaped channel extending from the front face of the D-Shell connector adjacent the apertures formed therein, the channel forming a rigid support for the relatively fragile guide tabs.




Again, in an embodiment, an interface converter module includes a die cast metal base member and cover. Both the base member and the cover include mutually opposing cable supports. Each cable support defines a semicircular groove having a plurality of inwardly directed teeth formed around the circumference thereof. The opposing cable supports of the cover align with the corresponding cable supports of the base member. Each pair of opposing cable supports thereby form a circular opening through which a flexible shielded cable may pass, and the inwardly directed teeth formed within each groove engage the cable and secure the cable within the module. Furthermore, the outer layer of insulation of the cable may be stripped away such that a portion of the metallic shield is exposed. When stripped in this manner, the cable may be placed within the module with the outer layer of cable insulation adjacent a first and second pair of cable supports and the exposed shield portion of the cable adjacent a third and fourth pair of cable supports. The teeth of the first and second pair of cable supports compress the outer layer of insulation and secure the cable within the module. Similarly, the teeth of the third and fourth cable supports engage the exposed metal shield, thereby forming a secure electrical connection between the cast metal module housing and the cable shield. In order to ensure a secure connection with the cable shield, the radii of the semicircular grooves and the third and fourth cable supports are reduced to match the corresponding reduction in the diameter of the cable where the insulation has been stripped away. Further, the insulation of the individual conductors may be stripped such that the bare conductors may be soldered to individual solder pads formed along the rear edge of the module's printed circuit board.




In a similar embodiment, the module is made field installable. Rather than being soldered to the printed circuit board, the individual conductors may be connected utilizing an insulation displacement connector (IDC) mounted to the printed circuit board. In this embodiment the housing cover includes an IDC cover mounted on an inner surface of the cover. When the module is assembled, the IDC cover forces the individual conductors of the flexible cable onto knife contacts within the IDC connector. The knife contacts cut through the conductor's insulation to form a solid electrical connection with the copper wire within.




A media connector is attached at the remote end of the flexible shielded cable. The media connector may be configured as any connector compatible with the high performance serial transmission medium to which the module is to provide an interface. In the preferred embodiments of the invention, these connectors include a standard DB-9 connector or an HSSDC connector for applications where the module is interfacing with a copper transmission medium, or may include an optoelectronic transceiver such as a 1×9 for those cases where the interface module is to interface with a fiber optic medium. Within the housing the various conductors comprising the flexible shielded cable are connected to the printed circuit board and carry the serial data signals between the remote media connector and the module. In an alternate configuration, the length of the flexible cable is extended and a second interface module substantially identical to the first module is connected to the remote end of the cable.




In another embodiment, the module includes a plastic housing having a metallized or metal encased end portion. The housing includes a first end containing a discrete host connector. The conductive portion of the housing is configured to engage the perimeter of the mounting slot in the metal chassis of the host device which receives the module. This metal to metal contact forms a continuous metal barrier against the leakage of spurious emissions. The conductive portion of the housing includes the end wall of the module housing opposite the end containing the connector. This end wall at the second end of the housing includes a small circular aperture through which a short section of a flexible shielded cable protrudes. The flexible cable includes a plurality of individual conductors, which may be connected to electrical circuits formed on the printed circuit board, and the cable shield bonded to the conductive portion of the housing. In a first preferred embodiment the cable comprises a four conductor shielded cable, and in an alternative embodiment an eight conductor shielded cable is provided.




Thus is provided an adapter module for transmitting serial data signals between a first transmission medium and a second transmission medium. The module is defined by an electromagnetically sealed housing having first and second ends. The housing may be formed of die cast metal. The first end of the housing has a first connector attached thereto, which may be integrally cast with a base member of the housing. A flexible cable extends from the second end of the housing. The flexible cable includes a metallic shield which is bonded to the housing in a manner to electromagnetically seal the second end of the housing, thereby preventing high frequency electromagnetic emissions from escaping the housing. Individual conductors within the cable are connected to circuits mounted on a printed circuit board contained within the housing. Finally, a media connector is mounted at the remote end of the flexible cable for connecting to an external serial transmission medium.




There is also provided an interface converter module including a die-cast metal base member and die-cast metal cover. At a first end a D-shell ribbon style connector is formed having an integrally cast shroud with the base member. A printed circuit board is mounted within the cover including portions of the printed circuit board that extend through the cast metal D-shell connector. The portion of the printed circuit board extending into the D-shell includes a plurality of contact fingers adhered thereto and thereby forming a contact support beam within the metal D-shell. Additional guide tabs extend from the printed circuit board on each side of the contact beam. The guide tabs protrude through apertures on either side of the D-shell. A metal coating is formed on the outer edges of the guide tabs and connects to the ground plane of the printed circuit board. The guide tabs and the metal coating formed thereon are configured to engage mating structures formed within a host receiving socket and when the module is inserted into the host receiving socket the guide tabs act to safely discharge any static charge which may have built up on the module. The module housing may also include a metal U-shaped channel extending from the front face of the D-shell connector adjacent the apertures formed thereon, the channel forming a rigid support for the fragile guide tabs.




At the second end of the interface converter module is an integrally formed media connector. The cover and the base member are formed at the second end to form an aperture specifically designed to receive a designated plug style. In an embodiment the cover and base are formed specifically to provide a receptacle opening to receive an HSSDC plug. The media receptacle includes ramped portions to receive the latching member of an HSSDC plug. In an embodiment, mounted within the receptacle opening is a printed circuit board having a protruding portion having a plurality of contact fingers adhered thereto forming a contact support beam within the HSSDC receptacle to connect to the metallic fingers of the HSSDC plug. In an embodiment, the printed circuit board that provides for the contact fingers of the HSSDC connector receptacle at the second end of the module is integrally formed as one piece with the printed circuit board that forms the contact fingers at the first end of the module for the D-shaped pluggable male ribbon style connector.




In a further embodiment the module housing includes a DB-9 connector mounted at the second end. In a still further embodiment the module housing includes a SC duplex optical receptacle formed with the base and cover of the module.




In yet another embodiment a mounting half is provided which holds the transceiver device in the module housing. The mounting half is hermaphroditic so that it can mount to itself.











BRIEF DESCRIPTION OF THE DRAWINGS




A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:





FIG. 1

is an exploded isometric view of an interface module according to the preferred embodiment of the invention;





FIG. 2

is an isometric view of a printed circuit board to be mounted within the module housing shown in

FIG. 1

;





FIG. 3

is an isometric view of the printed circuit board in

FIG. 2

, showing the reverse side thereof;





FIG. 4

is an isometric view of an alternate printed circuit board;





FIG. 5

is an isometric view of the module housing cover shown in

FIG. 1

, showing the interior surface thereof;





FIGS. 6



a,




6




b,




6




c


and


6




d


are isometric views of various interface converter modules according to the present invention, showing alternate media connectors including:





FIG. 6



a—


A DB-9 connector;





FIG. 6



b—


An HSSDC connector;





FIG. 6



c—


A second interface converter module;





FIG. 6



d—


An SC duplex fiber optic connector;





FIG. 7

is a schematic diagram of a passive copper GBIC according to the preferred embodiment of the invention;





FIG. 8

is an isometric exploded view of an additional embodiment of an interface module looking down into the base;





FIG. 9

is an isometric exploded view of the interface module of

FIG. 8

looking down into the cover;





FIG. 10

is an isometric exploded view of another embodiment of the present invention viewed from the second end of the interface module;





FIG. 11

is an isometric exploded view of the embodiment of the interface module of

FIG. 10

viewed from the first end; and





FIG. 12

is an isometric exploded view of another embodiment of the interface module.











DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS




Referring to

FIGS. 1

,


2


,


3


and


5


, an interface module is shown according to a first embodiment of the invention


100


. In this preferred embodiment, module


100


conforms to the GBIC specification, although the novel aspects of the invention may be practiced on other interface modules having alternate form factors. Module


100


includes a two piece die cast metal housing including a base member


102


and a cover


104


. A first end of the housing


106


is configured to mate with a receiving socket located on a host device printed circuit board (host printed circuit board and socket not shown). The first end


106


of the housing is enclosed by a D-Shell ribbon style connector


108


which mates with the host device receiving socket. In this embodiment the D-Shell is entirely formed of metal which is integrally cast with the base member


102


.




The D-Shell connector


108


includes a D-shaped shroud


110


, which extends from a front end face plate


109


, which extends across the front end of the module housing. The face plate


109


includes a pair of apertures


113


located on each side of the metal shroud


110


, the apertures communicating with the interior of the module housing. A pair of U-shaped support channels


114


extend from the face plate


109


immediately adjacent each of the apertures


113


. The support channels may be integrally cast with the remainder of base member


102


. The D-Shell connector


108


further includes a contact beam


111


formed of an insulating material such as FR-4. Both the upper and lower surfaces of the contact beam have a plurality of contact elements


112


adhered thereto. When the connector


108


engages the host device socket, the contact elements


112


are held in wiping engagement against similar contact members formed within the socket. The physical connection between the contact members within the socket and the contact elements


112


allows individual electrical signals to be transmitted between the host device and the module.




The second end of the module


122


, includes an end wall


124


contained partially on the base member


102


, and partially on the cover


104


. Mutually opposing semicircular grooves


126


,


128


are formed in the end wall portions of the base member and cover respectively, such that when the cover is mated with the base member, the grooves form a circular opening in the end wall of the housing. Additionally, a plurality of cable supports


120




a,




120




b,




120




c


are formed on the inner surfaces of both the base member


102


and the cover


104


in axially alignment with the semicircular grooves formed in the end walls


124


. Like the portions of the end wall


124


contained on the base member


102


and the cover


104


, each cable support


120




a,




120




b,




120




c


includes a semicircular groove


130


which, when the cover and base member are joined, form a circular opening through each pair of mutually opposing cable supports. Both the semicircular grooves


126


,


128


in the end wall and the semicircular grooves


130


in the cable supports include knob like radial projections or teeth


132


.




The grooves


126


,


128


in end wall


124


and the grooves


130


in the cable support members


120




a,




120




b,




120




c


act to support a flexible shielded cable


118


which protrudes from the second end of the module


100


. The flexible cable includes an outer layer of insulation


134


, and a metal shield


136


which surrounds a plurality of individually insulated conductors


140




a,




140




b,




140




c,


and


140




d.


In a first preferred embodiment, the flexible cable


118


includes four individual conductors, another embodiment requires eight conductors, and of course a cable employing any number of individual conductors may be used as required by a particular application. Installing the cable


118


in the module requires that the cable be stripped as shown in FIG.


1


. First, the outer insulation


134


is stripped at


142


, exposing an undisturbed section of the cable shield


136


. Further down the length of the cable, the shield is stripped at


144


exposing the individual conductors


140




a,




140




b,




140




c,


and


140




d.


A layer of copper tape


145


may be applied to the end of the exposed shield to prevent the shield from fraying. Finally, the insulation of the individual conductors is stripped at


146


exposing the bare copper conductors


148


of each individual conductor. These exposed conductors are then soldered to contact pads


150


formed along the rear edge of printed circuit board


116


.




In an alternate printed circuit board arrangement depicted in

FIG. 4

, the solderpads


150


of

FIG. 3

are replaced by a single insulation displacement connector


152


. Mounted on the surface of printed circuit boards


116


, the IDC connector includes a plurality of knife contacts configured to receive each of the individual conductors


140




a,




140




b,




140




c


and


140




d


of flexible cable


118


. In this embodiment, the housing cover


104


includes an IDC cover


156


adhered to the inner surface of the housing cover. When the individual conductors


140


are placed over the knife contacts


154


, and the cover


104


and base member


102


are assembled, the IDC cover


156


forces the conductors down onto the knife contacts


154


. The knife contacts pierce the outer layer of insulation surrounding the conducts and make electrical contact with the copper conductors


148


contained therein. In this way, the module


100


may be easily field installed to a prewired copper cable.




Regardless of the attachment method, when the cable


118


is placed within the module housing, the manner in which the cable is stripped is such that the portion of the cable adjacent the end wall


124


and cable support


120




a,


nearest the end wall, includes the outer layer of insulation


134


. When the module is enclosed by joining the cover


104


to the base member


102


, the radial teeth


132


surrounding the mutually opposing grooves


126


,


128


in the end wall and the mutually opposing grooves


130


in the first pair of cable supports


120




a,


dig into the compliant outer insulation to grip the cable and provide strain relief for the individual conductors soldered to the printed circuit board within. Further, the stripped portion of the cable wherein the metallic shield is exposed, lies adjacent the second and third cable supports


120




b,




120




c.


The diameter of the grooves


130


formed in these supports is slightly smaller than the diameter of the grooves formed in the first cable support


120




a


and the outer wall


124


. This allows the teeth


132


formed in the two inner cable supports


120




b,




120




c


to firmly compress the reduced diameter of the exposed shield


136


. The radial teeth and the cable supports themselves are formed of metal cast with the base member


104


. Therefore, when the module is assembled, the cable shield will be electrically bonded to the module housing. Thus, when the module is assembled and inserted into a host device chassis where the module housing will contact the host device chassis ground, the entire module, including the cable shield


136


shield will be held at the same electrical potential as the chassis ground.




Referring now to

FIGS. 6



a,




6




b,




6




c,


and


6




d,


the remote end of the flexible cable


118


includes a media connector


158


. The media connector may be of nearly any style which is compatible with the serial interface requirements of the communication system. Since the preferred embodiment of the invention is to comply with the GBIC specification, the preferred copper connectors are a DB-9 male connector,

FIG. 6



a


or an HSSDC connector,

FIG. 6



b.


It is also possible to mount an optoelectronic transceiver at the end of the flexible connector such as in

FIG. 6



d,


allowing the module to adapt to a fiber optic transmission medium. Another alternate configuration is to connect a second GBIC module directly to the remote end of the flexible cable,

FIG. 6



c.


In this arrangement, the first GBIC may be plugged into a first host system device, and the second module plugged into a second system host device, with the flexible cable interconnected therebetween. The flexible cable acts as a serial patch cord between the two host devices, with a standard form factor GBIC module plugged into the host devices at either end. In a purely copper transmission environment, this arrangement has the advantage of eliminating a DB-9 connector interface at each end of the transmission medium between the two host devices.




Returning to

FIGS. 1

,


2


and


3


, in the preferred embodiment of the invention, the contact beam


111


of connector


108


is formed directly on the front edge of printed circuit board


116


. In this arrangement, the contact beam protrudes through a rectangular slot formed in the face plate


109


within the D-shaped shroud


110


. The contact elements


112


can then be connected directly to the circuitry on the printed circuit board which is configured to adapt the data signals between the copper transmission medium of the host device to the particular output medium of the module


100


. Also extending from the front edge of the printed circuit board is a pair of guide tabs


115


located on each side of the contact beam


111


. The guide tabs are configured to protrude through the apertures


113


formed in the face plate


109


. Each guide tab is supported by the corresponding U-shaped channel


114


located adjacent each aperture. As can be best seen in

FIGS. 2 and 3

, each guide tab


115


includes an outer edge


123


, which is coated or plated with a conductive material. The conductive material on the outer edge


123


of the guide tabs


115


is further electrically connected to narrow circuit traces


117


, approximately 0.010″ wide, located on both the upper


125


and lower


127


surfaces of the printed circuit board. The conductive traces


117


extend along the surfaces of the printed circuit board to conductive vias


119


which convey any voltage present on the traces from one side of the board to the other. On the lower surface


127


of the printed circuit board


116


the conductive vias are connected to the circuit ground plane


121


of the module.




The arrangement of the printed circuit board


116


and D-Shell connector


108


just described provide for proper signal sequencing when the module


100


is inserted into the receiving receptacle of a host device. As the connector


108


slides into a mating receptacle, the guide tabs


115


are the first structure on the module to make contact with the mating receptacle. The metal coating


123


on the outer edge of the tabs makes contact with a similar structure within the socket prior to any of the contact elements


112


mating with their corresponding contacts within the receptacle. Thus, the guide tabs


115


provide for static discharge of the module


100


prior to power being coupled to the module from the host device. The traces


117


formed along the upper and lower surfaces of the guide tabs are maintained as a very narrow strip of conductive material along the very edge of the guide tabs in order to provide as much insulative material between the static discharge contacts


123


and the metal U-shaped support channels


114


. The U-shaped channels provide additional rigidity to the guide tabs


115


.




In the preferred embodiment of the invention, the module


100


further includes longitudinal sides


131


extending between the first end


106


and second end


122


of the module housing. Latching members


133


associated with the longitudinal sides are provided to releasably secure the module


100


within the host receiving receptacle when the module is inserted therein. The latching members are formed of flexible plastic beams having a mounting base


135


configured to engage a slotted opening


137


formed within the side of base member


104


. The mounting base


135


anchors the latching member within the slotted opening


137


and a brace


139


protruding from the inner surface of cover


104


acts to maintain the mounting base


135


within the slotted opening


137


. The latching members further include latch detents


141


and release handles


143


. As the module


100


is inserted into a receptacle, the latching members


133


are deflected inward toward the body of the housing. The angled shape of the latch detents allow the detents to slide past locking structures such as an aperture or stop formed on the inner walls of the receptacle. Once the detents slide past the locking structures, the latching members elastically spring outward, and the latch detents engage the locking structures, and the module is retained within the receptacle. To release the module, the release handles


143


must be manually squeezed inwardly until the latching detents clear the locking structures. At that point the module may be withdrawn from the socket with little difficulty.




Referring again to

FIGS. 1 and 5

, an alternate embodiment to that just described is to form the housing base member


102


and cover


104


of a plastic material. In such an embodiment, the latch members


133


may be integrally molded directly with the base member


104


. The D-Shell connector


108


, however, requires a metal D-shaped shroud


110


. Therefore, in this alternate embodiment the D-Shell connector must be provided separately from base member


104


. Also, a plastic module housing will not be effective in reducing spurious electromagnetic emissions from leaking from the module. Therefore, some type of shielding must be provided at the second end


122


of the module to prevent such emissions from escaping the host device chassis when the module housing is inserted therein. As with prior art interface converter modules, this shielding may be provided by metallizing the plastic comprising the second end of the module, or by enclosing the second end of the module in a metal sheath


150


as is shown in the module of

FIG. 6



a.


Regardless of the manner in which the shielding is supplied, all that is necessary is that the second end of the module be encased within a conductive material, and that the conductive material contact the host chassis when the module is inserted into the host device.




Returning to

FIGS. 1 and 5

, if the base member and cover are formed of plastic according to this alternate embodiment, the cable supports


120




a,




120




b


and


120




c


must be formed of a conductive material separate from the base member


102


and cover


104


. Furthermore, when the supports are joined to the base member


104


and the cover, provisions must be made for electrically connecting the conductive cable supports to the conductive material encasing the second end of the module. In this way, the cable shield


136


will be bonded to the outer conductive portion of the module, and the aperture in the end wall


124


through which the cable


118


exits the module will be electromagnetically sealed to block spurious emissions.




Turning to

FIG. 7

, a schematic diagram of a passive “copper GBIC” module


200


is shown according to a preferred embodiment of the invention. The module includes a host connector


202


. As shown, contacts


1


-


3


,


6


,


8


-


11


,


14


,


17


, and


20


of connector


202


are all connected ground, and contacts


4


and


5


are left unconnected. Contacts


12


and


13


represent the differential receive data inputs, contacts


15


and


16


are connected to the receive and transmit voltage supply V


CC


, and pins


18


and


19


represent the differential transmit data outputs. A 4.7 KΩ resistor R


1


connects to the transmit disable pin


7


, which disables the transmitter when V


CC


is not present.




The transmit portion of the module is shown within block


204


. The transmit circuit includes 0.01 μF AC coupling capacitors C


3


and C


4


, and 75Ω termination resistors R


6


and R


7


. Resistors R


6


and R


7


form a 150Ω series resistance between the +transmit and the −transmit differential signal lines. The junction between R


6


and R


7


is AC coupled to ground by 0.01 μF capacitor C


5


. The +transmit and −transmit signal lines are connected to the D and −D inputs of non-inverting PECL signal driver


210


. Signal driver


210


acts as a buffer between the host device output drivers and the serial output transmission medium. Outputs Q and −Q of signal driver


210


are connected to the +transmit and −transmit signal lines of the serial transmission medium respectively. 180Ω resistor R


8


and 68Ω resistor R


9


provide proper output biasing and termination of the +transmit signal, and capacitor C


10


AC couples the +transmit signal to the serial transmission medium. Similarly, 180Ω resistor R


10


and 68Ω resistor R


11


bias the output and series terminate the −transmit signal, which is AC coupled to the serial transmission medium through capacitor C


11


. The +transmit and −transmit signals are connected to the transmission medium via pins


1


and


6


of the DB-9 connector


212


respectively.




The receive portion of the module is shown within block


206


. The receive circuit includes 0.01 μF AC coupling capacitors C


8


and C


9


, and 75Ω termination resistors R


12


and R


3


. Resistors R


12


and R


13


form a 150Ω series resistance between the +receive and the −receive


214


differential signal lines. The junction between R


12


and R


13


is AC coupled to ground by 0.01 μF capacitor C


12


. The +receive and −receive signal lines are connected to the D and −D inputs of non-inverting PECL signal driver


216


. Signal driver


216


acts as a buffer between the remote device output drivers and the receiving circuit of the host device. Outputs Q and −Q of signal driver


216


are connected to the +receive and −receive signal pins of the host connector


202


. 180Ω resistor R


5


and 68Ω resistor R


2


provide proper output biasing and series termination of the +receive signal from the signal driver


216


, and capacitor C


1


AC couples the +receive signal to the host device. Similarly, 180Ω resistor R


4


and 68Ω resistor R


3


provide biasing and series terminate the −receive signal, which is AC coupled to the serial transmission through capacitor C


2


. The +receive and −receive signals are connected to the host device via contact elements


13


and


12


of connector


202


respectively.




The schematic diagram just described represents the preferred embodiment of a passive “copper GBIC” interface converter module. Alternate schematics are known in the art, and it is well within the ordinary level of skill in the art to substitute more sophisticated circuit embodiments for the passive design disclosed herein. Such substitution would not require any undue amount of experimentation.





FIGS. 8 and 9

disclose an additional embodiment of the present invention showing an interface module


300


in an isometric exploded view. This embodiment of the interface module


300


conforms to the GBIC specification as discussed previously. The module


300


includes a two-piece die-cast metal housing including a base member


302


and a cover


304


. A first end of the housing


306


is configured to mate with a receiving socket located on a host device printed circuit board (not shown). The first end


306


of the housing is enclosed by a D-shell ribbon style connector


308


which mates with the host device receiving socket. In this embodiment the D-shell is entirely formed of metal which is integrally cast with the base member


302


.




The D-shell connector


308


includes a D-shaped shroud


310


, which extends from a front end face plate


309


, which extends across the front end of the module housing. The faceplate


309


includes a pair apertures


313


located on each side of the metal shroud


310


. The apertures


313


communicated with the interior of the module housing. A pair of U-shaped support channels


314


extends from the faceplate


309


immediately adjacent the apertures


313


. The support channels may be integrally cast with the base member


302


. The D-shell ribbon style connector


308


is completed by the mounting of the printed circuit board


316


within the base


302


. The end of the printed circuit board


316


, forms a contact beam


311


that forms the mating male connector portion of the male ribbon style connector


308


. The contact beam


311


includes a plurality of contact elements


312


adhered to the upper and lower surface of the contact beam


311


. The assembly of the printed circuit board


316


within the base


302


will be discussed in more detail below.




Also extending from the front edge of the printed circuit board is a pair of guide tabs


315


located on each side of the contact beam


311


. The guide tabs are configured to protrude through the apertures


313


formed in the base plate


309


of the base


302


. Each guide tab is supported by a corresponding U-shaped channel


314


located adjacent each aperture


313


. Each guide tab


315


includes an outer edge


323


that is coated or plated with a conductive material. The conductive material on the outer edge


323


of the guide tab


315


is further electrically connected to narrow circuit traces in the printed circuit board


316


and extend along the surfaces of the printed circuit board to conductive vias which convey voltage present on the traces on one side of the board to the other. The conductive edges


323


are electrically connected to the circuit ground plane of the module.




The second end


305


of the module


300


includes an end wall


324




a


and


324




b.


The end wall


324




a


is contained on the base member


302


and the end wall


324




b


is included in the construction of the cover


304


. When the cover


304


is mounted to the base


302


, the end wall


324




a


and


324




b


are joined together and form a receptacle opening


326


for receiving a media plug or connector. The media receptacle opening


326


is generally rectangular shaped. In a preferred embodiment this media receptacle opening is formed to conform to the specified outer package dimensions for an HSSDC plug (as disclosed ANSI X3TI 1/DC-0. ANSI X3TII and ANSI X3T10.1 for High Speed Serial Data Connector). The end wall


324




b


includes in the opening a slot


328


for receiving the latch member of an HSSDC plug. The opening


326


in the base


302


includes a depression


332


formed therein for receiving the mating portion


334


of the printed circuit board


316


when the printed circuit board is mounted within the base


302


. The mating portion


334


of the printed circuit board


316


includes contact traces


335


adhered to the printed circuit board


316


and provide for the mating contacts with the HSSDC plug contacts to be inserted with the media receptacle opening


326


. Therefore, it can be understood that the printed circuit board


316


is formed in one piece that forms both the mating contacts


335


for the media receptacle opening


326


at the second end


305


and the mating contacts


312


for the ribbon style connector


308


at the first end


309


. The printed circuit board


316


is formed to connect the contract traces


335


with the appropriate contact fingers


312


so that the signals from a media plug, such as an HSSDC plug, can be transferred from the second end


305


of the interface module to the first end


309


of the interface module via a contact fingers


312


and the host device to which the male ribbon style connector


308


is connected. Also included in the printed circuit board


316


are circuitry and other components including resistors and capacitors and other desired active devices such as those discussed previously in order to make the interface module compliant with the GBIC specifications. The mating end


334


of the printed circuit board


316


also includes contact fingers


337


that are offset from contact fingers


335


in order to provide for the staged mating of the contacts to provide for power sequencing or “hot plugging.”




In a preferred embodiment, the module


300


is assembled according to the following steps. The printed circuit board


316


is lowered into the interior


350


of the base


302


and the guide tabs


315


are inserted into apertures


313


while the contact beam


311


is inserted within the D-shaped shroud


310


. The entire board


316


is then slid forward toward the first end


309


of the base


302


until the abutment surfaces


341


,


342


of the printed circuit board


316


abut against support member


343


,


344


respectively of the base


302


. Sliding of the board into its fully mated position will provide for the guide tabs


315


to be located in U-shaped channels


314


so that the front edge of the guide tab


315


is adjacent to the front edge of the U-shaped channel


314


. Simultaneously, the contact beam


311


is centered within the D-shaped shroud


310


of the connector


308


.




The rear end of the board including the mating portion


334


is dropped into the depression


332


and fastening aperture


348


is aligned with the base aperture


349


. Latch members


333


are then mounted in slotted openings


337


. The cover


304


is then mounted onto the base


305


. The cover


304


includes edges


351


and walls


352


,


353


that intermate with the walls of the base


305


in order to aid in the sealing of the module


300


and to provide a conductive seal around all of the edges of the module in order to prevent leakage of electromagnetic fields from the module. Fastening member


360


is then inserted through the cover


304


through the apertures


348


and the printed circuit board and into the aperture


349


of the base in order to secure the cover


304


to the base


305


and to secure the printed circuit board


316


therein. Simultaneously the latch members


333


are captured between the cover


304


and the base


305


.




The assembled module


300


provides for many of the same features required of a GBIC as discussed previously such as the proper signal sequencing when the module


300


is inserted into a receiving receptacle of a host device (note shown). In a preferred embodiment, the housing of module


300


is formed of a die-cast conductive housing formed by the base


305


and the cover


304


. At least a portion of the first end


309


is conductive. For example, a conductive surface portion


370


at the first end of the module will be the first portion of the module


300


to contact a host receptacle opening. The host receptacle opening will include conductive portions connected to chassis ground. Thus by forming the module


300


of a conductive material, conductive portion


370


will act to dissipate static electricity from the module to chassis ground of the host device upon the initial insertion step of the module


300


into the host receptacle and also provide for electromagnetic shielding and therefore an FCC complaint module. Additionally, as the connector


308


of the module


300


slides further into a mating host receptacle, the tabs


315


are the first structure on the module to make contact with a mating host receptacle connector. The metal coating


323


on the outer edge of the tabs makes contact with a similar structure within the host socket prior to any of the contact elements


312


mating with their corresponding contacts within the receptacle. Thus, the guide tabs


315


provide for static discharge of the module


300


prior to power being coupled to the module from the host devices. The traces


317


formed along the upper and lower surfaces of the guide tab are maintained as a very narrow strip of conductive material along the very edge of the guide tabs in order to provide as much insulated material of the guide tab


315


such as FR-4, between the static discharge contacts


323


and the metal U-shaped support channels


314


. The U-shaped channels provide additional rigidity to the guide tabs


315


.




Turning to

FIG. 9

the module


300


of

FIG. 8

is shown in an isometric exploded view but inverted from the view shown in FIG.


8


. In other words,

FIG. 9

shows the interior


351


of the base


304


; the base


304


now being at the bottom of the drawing. Like numerals described in

FIG. 8

are marked for FIG.


9


and will not be discussed again herein. The second end


305


of the base


304


includes receptacle opening


326


. The receptacle opening


326


is formed to include slot


328


for receiving the latch arm of an HSSDC plug (not shown). Adjacent the slot


328


are protrusions


361


,


362


. Upon insertion of the latch arm into the slot


328


the latch will ride up and over the protrusions


361


,


362


. Upon full insertion of the HSSDC plug into the receptacle opening


326


the latch arm will snap past the protrusions


361


,


362


. The receptacle opening


326


also includes ramped portions


365


for guiding the insertion of the HSSDC plug therein. It should be noted that the interior of the media receptacle opening


326


including ramps


365


, slot


328


and protrusions


361


,


362


are also conductive and upon insertion of the HSSDC plug therein, grounding of the plug to the module


300


will occur. Therefore, it may be understood that a GBIC module including an HSSDC receptacle can be formed quickly and inexpensively, in that the HSSDC receptacle is formed as part of the cover


304


and the base


302


and a separate connector need not be manufacture or purchased and mounted within the housing. Further, the use of the printed circuit board


316


as the contact member


312


,


335


also simplifies the assembly and construction of the module. Further, the design of the module housing of a conductive material provides for a well sealed and shielded module to provide for an FCC complaint module. Forming the end


324




a,




324




b


of the housing of a conductive material provides for the sealing of the opening in the host device when the module


300


is mounted therein. The all conductive housing provides for the least amount of electromagnetic interference and the maximum amount of shielding for such a device. As well, additional members such as an internal shield may be provided as part of the housing or mounted separately within the housing in order to provide more shielding in order to alleviate electromagnetic leakage both when the module has a media plug inserted in the opening


326


and when the opening is empty.




Turning to

FIGS. 10 and 11

another embodiment of the present invention is disclosed. Generally the improvement disclosed in the embodiment

FIGS. 10 and 11

is the use of a DB-9 connector


460


mounted to the housing of the module


400


. The other portions of the module, such as the pluggable male ribbon connector and the assembly of the cover to the base are similar as to what was discussed previously and will not be repeated. The module


400


includes base


402


and cover


404


. In a preferred embodiment the base and the cover are formed of a conductive material such as die-cast metal. At the second end


405


of the module


400


is a media receptacle


462


is formed including a slot


428


for receiving the edge of a face plate


450


of an assembled media connector


460


. In the preferred embodiment the media connector


460


is a DB-9 connector including a D-shaped metallic shroud


461


, 9-pin receptacles


462


formed in an insulator


464


and locking nuts


468


,


469


. Turning to

FIG. 11

it may be seen that the insulator


464


includes contact terminals


470


protruding from the back side of the media connector


460


. The contact terminals


470


are mounted to the printed circuit board


416


. By sliding the conductive face plate


450


within the slots


428


at the second end


405


of the base


402


while simultaneously mounting the printed circuit board


416


within the base


402


, the printed circuit board and the connector


460


are aligned within the base


402


. The cover


404


also includes corresponding slots


428


of the base


402


and slot


429


of the cover


404


. As the entire base


402


and cover


404


are formed of a conductive material and the face plate


450


is mounted within the slots


428


,


429


a seal is formed at the second end


405


of the module


400


. Therefore leakage of EMI is greatly reduced in the present invention. It is therefore apparent that a GBIC module having a DB-9 connector at the media connector end can be formed quickly and inexpensively by using the components as described herein. The module will also be FCC compliant due to the shielding as discussed above.





FIG. 12

discloses an exploded isometric view of an interface converter module


500


. Generally, the module


500


differs from the previous discussed embodiments in that it converts electrical signals to or from optoelectronic signals. The module


500


includes a cover


504


, a printed circuit board


516


and a base


502


. At the first end of the module


506


on the base is an integrally formed connector


510


for connecting with a host device. As previously discussed, this connector includes a D-shaped shroud


508


for receiving the contact beam


511


of the printed circuit board


516


. The contact beam


511


includes contact traces


512


that are inserted within the shroud


508


in order to form a pluggable male ribbon style connector


510


. As discussed above, the base


502


, in a preferred embodiment, is formed of a die-cast metal and the connector


510


is also formed of one-piece with the base


502


of the die-cast metal. As discussed above, the printed circuit board also includes guide tabs


515


which are inserted into apertures


513


of the base


502


. A contact beam


511


is located at the first end


545


of the printed circuit board.




At the second end


546


of the printed circuit board is located a first optical subassembly


534


and a second optical subassembly


535


. In a preferred embodiment, the first optical subassembly


534


is a transmitting optical subassembly (TOSA) including a VCSEL. However, any type of optical transmitting device may be used including an LED or other surface emitting laser. In a preferred embodiment, the second optical subassembly


535


is a receiving optical subassembly (ROSA) and includes a photo diode. However, any type of optical receiving material may be used. The optical subassemblies


534


,


535


are mounted at the second end


546


of the printed circuit board


516


and are electrically connected to the circuitry and components on the printed circuit board


516


and provide for the conversion of signals as discussed above for the Giga-Bit Converter specification. Protruding from the optical subassembly


534


,


535


, are ferrule receiving barrels


536


,


537


, respectively.




The second end


546


of the printed circuit board


516


is mounted within the second end


505


of the base


502


. The second end


505


of the base


502


includes a receptacle opening


526


that forms an SC duplex receptacle. The standardized SC duplex opening


526


includes a pair of rectangular shaped openings, polarizing slots


527


and a center wall


530




a


to separate the pair of receptacle openings. The cover


504


at the second end


507


includes center wall


530




b


which mounts on top of wall


530




a


of the base


502


in order to completely separate the pair of optical receptacles.




A first optical subassembly mounting half


550


is provided for orienting and securing the optical subassemblies


534


,


535


within the module


500


. The first optical subassembly mounting half


550


mates with a second optical subassembly mounting half


551


in order to capture therein the pair of optical subassemblies


534


,


535


. Each mounting half


550


,


551


includes a main body or member


590


,


591


. Each mounting half


550


,


551


includes a throughport half


560




a,




560




b,




561




a,


and


561




b


attached to its respective member. In a preferred embodiment the throughport


560




a


of the second mounting half


551


includes a pair of latch arms


570


,


571


protruding therefrom. The throughports are also known as transmitter and receiver mounting provisions. Alternatively, the first mounting half


550


includes a pair of latch arms,


572


,


573


protruding adjacent the throughport


561




b.


Each mounting half throughport


560




a,




560




b


and


561




a,




561




b


include hexagonal shaped locating walls


575


. The locating walls


575


mate with the groove


541


,


542


of the optical subassembly


534


,


535


. Therefore upon assembly of the mounting half


550


,


551


the hexagonal shaped walls


575


, which includes three linear segments or segmented ridges, will align with the grooves


541


,


542


of the optical subassembly


534


,


535


in order to position the optical subassemblies within the mounting halves


550


,


551


. The mounting halves


550


,


551


are substantially identical so as to be hermaphroditic. Mounted together, the two mounting halves


550


,


551


form a mounting block. The mounting halves mate together in order that the latch arms


570


,


571


are centered adjacent the throughport


560




a,




560




b


and also are laterally positioned adjacent the latch arms


572


,


573


which are axially centered to the throughports


561




a,




561




b.


The mounting halves


550


,


551


can be formed of an insulating material such as a polymer material, for example, LCP that will insulate the optical subassemblies from the conductive base


502


and cover


504


. However, portions of the mounting halves


550


,


551


can be metallized. In an embodiment the optical subassemblies


534


,


535


may be formed of conductive material or portions thereof may be conductive and the electrical isolation of the optical subassemblies from the conductive housing of the module is necessary in order to reduce electromagnetic interference and/or electromagnetic radiation. The hermaphroditic feature of the mounting half allows for the use of a single mold instead of two molds for forming the completed mounting block.




The mounting halves


550


,


551


also include side protrusions


576




a,




576




b


and


577




a


and


577




b.


When the mounting halves


550


,


551


are joined together a side protrusion


577




a,




577




b


is formed that runs along the majority of the height of the complete mounting member at a side adjacent the throughport


561




a,




561




b


and a side protrusion


576




a,




576




b


that runs along the majority of the height of the mounting member adjacent throughport


560




a,




560




b.


The side protrusion


576




a,




576




b


is received in slot


516


of the base


502


when the printed circuit board


516


and the mounting members


550


,


551


are mounted within the base


502


.




In a preferred embodiment the module


500


is assembled according to the following steps. The first optical assembly mounting half


550


is mounted within the second end


505


of the base


502


having side protrusion


576




b


aligned within slot


516


and side wall


577




b


aligned in a slot on the wall opposite slot


516


. The printed circuit board


516


is oriented above the base


502


and the first end


545


of the printed circuit board is mounted within the base by inserting guide tabs


515


within apertures


513


and simultaneously sliding contact beam


511


within the D-shaped shell


508


. The second end


546


of the printed circuit board is then lowered into the base


502


so that the optical subassemblies,


534


,


535


are mounted onto the first mounting half


550


so that the hexagonal walls


575


align with grooves


541


,


542


. The second optical subassembly mounting half


551


is then mounted within the base


502


and aligned with the first mounting half


550


in order to capture the optical subassemblies


534


,


535


within the throughports


560




a,




561




b


and


561




a,




561




b


by aligning the hexagonal walls of the second mounting half


551


to the grooves


541


,


542


of the optical subassemblies


534


,


535


. Release lever arms


533


are then mounted onto the base in a manner as previously discussed. The cover


540


is then placed onto the base


502


and a securing member is inserted in the aperture


580


, through the printed circuit board and into aperture


581


in the base


502


. By tightening the securement member the cover is secured to the base


502


and simultaneously secures the mounting halves


550


,


551


within the housing to secure the optical subassemblies within the module and also secure the release lever arms


533


to the module. Therefore, it can be understood that the interface converter module


500


is assembled quickly and inexpensively with very few components. It may be understood that the securement of the mounting halves


550


,


551


within the module housing via the side walls


576




a,




576




b


and


577




a,




577




b


within slots


516


of the base


502


provide for the optical subassemblies


534


,


535


to be centered axially within the openings


526


of the SC duplex receptacle formed at the second end


505


of the module


500


. The hexagonal walls


575


of the mounting halves


550


,


551


act to center the optical subassemblies in the throughports


560




a,




560




b,


and


561




a,




561




b


both in the x, y and z planes. Therefore, an interface converter is provided for converting optical signals to or from electrical signals by the insertion of an SC plug into the receptacle opening


526


of the module and such signals will be transferred through the circuitry of the printed circuit board


516


through the contact fingers


512


and to or from a host device to which the connector


510


of the module


500


is mounted.




Furthermore, it should be understood that various changes and modifications to the presently preferred embodiments described herein will be apparent to those skilled in the art. Such changes and modifications may be made without departing from the spirit and scope of the present invention and without diminishing its attendant advantages. It is, therefore, intended that such changes and modifications be covered by the appended claims.



Claims
  • 1. A device comprising:a base made of a metallic material; a cover made of a metallic material; and a mounting block retained between the base and the cover, the mounting block includes a first mounting half and a second mounting half, the first mounting half and the second mounting half being substantially hermaphroditic such that the first mounting half and the second mounting half can be assembled in opposite transverse relation to form the mounting block, the first mounting half and the second mounting half made of a polymer material, and wherein the first mounting half includes: a member having a transmitter mounting provision for receiving a transmitter sub-assembly and a receiver mounting provision for receiving a receiver sub-assembly, wherein the transmitter mounting provision is configured to overlap one half of a perimeter of the transmitter sub-assembly, and wherein the receiver mounting provision is configured to overlap one half of a perimeter of the receiver sub-assembly, a first latch arm connected to the member, and a second latch arm connected to the member, wherein the transmitter mounting provision and the receiver mounting provision straddle the second latch arm, and wherein the first latch arm and the second latch arm straddle one of the transmitter mounting provision and the receiver mounting provision so as to engage complementary features of a mating connector.
  • 2. The device according to claim 1 wherein the transmitter mounting provision includes a first set of three linear segments configured to engage a reduced diameter portion of the transmitter sub-assembly, and wherein the first set of three linear segments form one half of a first hexagonal opening, and wherein a first linear segment of the first set of three linear segments of the transmitter mounting provision contacts the transmitter sub-assembly at a first point, and wherein a second linear segment of the first set of three linear segments of the transmitter mounting provision contacts the transmitter sub-assembly at a second point, and wherein a third linear segment of the first set of three linear segments of the transmitter mounting provision contacts the transmitter sub-assembly at a third point so as to align the transmitter sub-assembly within the mounting half of the mounting block, and wherein the receiver mounting provision includes a second set of three linear segments configured to engage a reduced diameter portion of the receiver sub-assembly, and wherein the second set of three linear segments form one half of a second hexagonal opening, and wherein a first linear segment of the second set of three linear segments of the receiver mounting provision contacts the receiver sub-assembly at a first point, and wherein a second linear segment of the second set of three linear segments of the receiver mounting provision contacts the receiver sub-assembly at a second point, and wherein a third linear segment of the second set of three linear segments of the receiver mounting provision contacts the receiver sub-assembly at a third point so as to align the receiver sub-assembly within the mounting half of the mounting block.
  • 3. The device according to claim 2 wherein the first latch arm is positioned near an end of the member.
  • 4. The device according to claim 3 wherein the first latch arm is flexible.
  • 5. The device according to claim 4 wherein the second latch arm is flexible.
  • 6. The device according to claim 5 wherein the first mounting half of the mounting block is metallized.
Parent Case Info

This application is a continuation-in-part of U.S. Ser. No. 09/160,816, filed on Sep. 25, 1998, now U.S. Pat. No. 6,179,627, which is a continuation-in-part of U.S. Ser. No. 09/064,208, filed on Apr. 22, 1998, now U.S. Pat. No. 6,203,333, and this case is related to U.S. Ser. No. 08/863,767, filed on May 27, 1997, now U.S. Pat. No. 5,966,487, all of which are hereby incorporated herein by reference.

US Referenced Citations (9)
Number Name Date Kind
4245887 Johnson Jan 1981
4253730 Logan et al. Mar 1981
4445750 Grois et al. May 1984
4449784 Basov et al. May 1984
5069522 Block et al. Dec 1991
5157749 Briggs et al. Oct 1992
5546281 Poplawski et al. Aug 1996
5596663 Ishibashi et al. Jan 1997
5631990 Hashizume May 1997
Foreign Referenced Citations (1)
Number Date Country
57-185009 Nov 1982 JP
Continuation in Parts (2)
Number Date Country
Parent 09/160816 Sep 1998 US
Child 09/334200 US
Parent 09/064208 Apr 1998 US
Child 09/160816 US