The present application claims the benefit of the filing date under 35 U.S.C. § 119(e) of provisional U.S. patent application Ser. No. 60/146,446, filed Jul. 29, 1999, which is hereby incorporated by reference.
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Entry |
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Product Information from Dupont Engineering Polymers entitled “Electrical/Electronic Thermoplastic Encapsulation,” (no date), Publ: Reorder No.: H-58633 (R, 96.7), 20 pages. |
The Epoxylite Corporation, article from the Internet entitled “Vacuum Pressure Impregnation (VPI) Systems”, Nov. 19, 1999, <http://www.epoxylite.com/EpoxyliteEquipment.htm>, 3 pages. |
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LNP Engineering Plastics, Advertisement entitled “Konduit™ Thermally Conductive Composites,” undated (2 pages). |
U.S. patent application Ser. No. 09/470,432, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/470,434, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/470,430, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/470,429, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/470,427, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/470,431, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/470,433, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/470,425, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/470,426, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/470,424, filed Dec. 22, 1999, copy of claims enclosed. |
U.S. patent application Ser. No. 09/738,268, filed Dec. 15, 2000, copy of application as originally filed enclosed. |
Number | Date | Country | |
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60/146446 | Jul 1999 | US |