Claims
- 1. A light emitting diode (LED) component comprising:an LED chip emitting light having a wavelength in a range of 200 to 570 nanometers; and an optic encapsulating the LED chip, the optic comprising: an outer optically transmissive shell of rigid material; and a quantity of resilient, optically transmissive material inside the shell.
- 2. The LED component of claim 1 wherein the rigid material is selected from a group consisting of silicone, cyclic-olefin copolymer, optical plastic, glass, ceramic, and aluminum oxide.
- 3. The LED component of claim 1 further comprising an optical dispersant mixed into the resilient, optically transmissive material.
- 4. The LED component of claim 1 further comprising an optical dispersant formed within the rigid material.
- 5. The LED component of claim 1 further comprising particles of light-emitting material embedded in the resilient, optically transmissive material.
- 6. The LED component of claim 5 wherein the light-emitting material is a phosphor.
- 7. The LED component of claim 1 further comprising particles of light-emitting material embedded in the rigid material.
- 8. The LED component of claim 7 wherein the light-emitting material is a phosphor.
- 9. The LED component of claim 1 wherein the resilient, optically transmissive material comprises a silicone material being transmissive to light in the wavelength range from ultraviolet through green, wherein the silicone material maintains its transmissiveness when exposed to a temperature of 100° C.
- 10. The LED component of claim 1 further comprising: a die placement area having a reflective surface.
- 11. The LED component of claim 1 wherein the optic is configured as a lens.
- 12. The LED component of claim 11 wherein the lens has a convex shape.
- 13. A light emitting diode (LED) component comprising:an LED chip emitting light having a wavelength in a range of 200 to 570 nanometers; and an optic, configured as a lens, encapsulating the LED chip, the optic comprising: an outer optically transmissive shell of rigid material; a quantity of resilient, optically transmissive material inside the shell, the resilient, optically transmissive material comprising a silicone material being transmissive to light in the wavelength range from ultraviolet through green, wherein the silicone material maintains its transmissiveness when exposed to a temperature of 100° C.; and a die placement area having a reflective surface.
- 14. The LED component of claim 13 further comprising particles of light-emitting phosphor embedded in the silicone material.
- 15. The LED component of claim 13 further comprising an optical dispersant mixed into the silicone material.
- 16. The LED component of claim 13 further comprising:particles of light-emitting phosphor embedded in the silicone material; and an optical dispersant mixed into the silicone material.
- 17. The LED component of claim 13 wherein the rigid material is selected from a group consisting of silicone, cyclic-olefin copolymer, optical plastic, glass, ceramic, and aluminum oxide.
Parent Case Info
This application is a continuation of U.S. application Ser. No. 09/187,357, filed Nov. 6, 1998, now U.S. Pat. No. 6,204,523.
US Referenced Citations (8)
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Jan 1998 |
DE |
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Entry |
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Continuations (1)
|
Number |
Date |
Country |
Parent |
09/187357 |
Nov 1998 |
US |
Child |
09/775765 |
|
US |