Claims
- 1. An epoxy composition comprising:
(a) an effective amount of a chain extender; (b) an effective amount of a catalyst; (c) an effective amount of a reactive epoxy resin; and (d) an effective amount of a polymeric toughener, wherein the chain extender, the reactive epoxy resin, the catalyst and the toughener are each in an amount and of a type that are effective, when mixed together, to form a thermally curable adhesive and, when the adhesive is cured, at least about 50% by weight of the epoxy resin is chain extended.
- 2. The composition of claim 1, wherein the composition is substantially free of a polyfunctional curing agent.
- 3. The composition of claim 1, wherein the chain extender comprises at least one of an amine and a phenolic compound in monomeric form.
- 4. The composition of claim 1, wherein the chain extender comprises at least one of an amine and a phenolic compound, the amine is at least one of a primary mono-amine, a secondary di-amine and compounds based thereon, and the phenolic compound is a dihydric phenolic compound.
- 5. The composition of claim 1, wherein the chain extender comprises at least one of a catechol, resorcinol and amine compound, and the chain extender is dissolvable into at least one of the epoxy resin and the catalyst.
- 6. The composition of claim 1, wherein the chain extender comprises at least one of an amine and a dihydroxy phenolic, the composition is an adhesive composition comprising a part A and a part B, the part A comprises the catalyst, the part B comprises the reactive epoxy resin, and if the chain extender includes an amine, the amine is only in the part A.
- 7. The composition of claim 1, wherein the composition is an adhesive composition comprising a part A and a part B, the part A comprises the catalyst, the part B comprises the reactive epoxy resin, and at least one of part A and part B further comprises the chain extender.
- 8. The composition of claim 1, wherein the chain extender is at least one of an amine, catechol and resorcinol compound, the composition is an adhesive composition comprising a part A and a part B, the part A comprises the catalyst, the part B comprises the reactive epoxy resin, and at least one of part A and part B further comprises the chain extender.
- 9. The composition of claim 1, wherein the chain extender comprises a catechol, the composition is an adhesive composition comprising a part A and a part B, the part A comprises the catalyst, the part B comprises the reactive epoxy resin, and at least the part B further comprises a catechol.
- 10. The composition of claim 1, wherein the chain extender comprises catechol and resorcinol, the composition is an adhesive composition comprising a part A and a part B, the part A comprises the catalyst, the part B comprises the reactive epoxy resin, at least the part A further comprises the resorcinol, and at least the part B further comprises the catechol.
- 11. The composition of claim 1, wherein at least about 50 wt % of the chain extender is catechol.
- 12. The composition of claim 11, wherein the chain extender comprises catechol and resorcinol, and up to about 50 wt % of the chain extender is resorcinol.
- 13. The composition of claim 12, wherein the amount of chain extender in the composition is in the range of from about 8 wt % to about 30 wt %, based on the amount of chain extender and reactive epoxy.
- 14. The composition of claim 1, wherein the catalyst is a base and comprises at least one catalyst selected from the group consisting of a cyclic amidine, a tertiary amine, substituted analogues thereof, and a substituted anologue of pyridine, of pyrrolidine and of piperidine which do not exhibit enough of an electron withdrawing or stereo chemical effect to prevent the composition, when mixed together, from forming a thermally curable adhesive suitable for structural bonding.
- 15. The composition of claim 1, wherein the catalyst comprises a first catalyst and a second catalyst different than the first.
- 16. The composition of claim 15, wherein the first catalyst comprises an imidazoline catalyst and the second catalyst comprises an imidazole catalyst.
- 17. The composition of claim 1, wherein the catalyst comprises at least one of imidazole, imidazoline, a substituted imidazole compound, a substituted imidazoline compound, 1,4,5,6-tetrahydropyrimidine and a substituted 1,4,5,6-tetrahydropyrimidine compound.
- 18. The composition of claim 1, wherein the composition is an adhesive composition, the catalyst comprises an imidazoline compound, and the chain extender comprises catechol.
- 19. The composition of claim 1, wherein the reactive epoxy resin comprises a glycidyl ether epoxy compound having more than one reactive epoxy group.
- 20. The composition of claim 1, wherein the reactive epoxy resin comprises at least one of an aromatic glycidyl ether epoxy compound and an aliphatic glycidyl ether epoxy compound, with at least one compound having more than one reactive epoxy group.
- 21. The composition of claim 1 containing an amount of the catalyst in the range of from about 0.5 wt % to about 10.0 wt %, based on the reactive species in the composition, an amount of the reactive epoxy resin in the range of from about 50 wt-% to about 90 wt-% of the adhesive, based on the reactive species in the composition, and an amount of the polymeric toughener in the range of from about 5 parts to about 35 parts by weight, based on 100 parts by weight of the reactive epoxy resin.
- 22. The composition of claim 1, wherein the components of the composition are present in amounts such that the stoichiometric equivalents ratio of reactive hydrogen sites to reactive epoxy sites is less than about 1.0.
- 23. The composition of claim 1, the components of the composition are present in amounts such that the stoichiometric equivalents ratio of reactive hydrogen sites to reactive epoxy sites is in the range of about 0.5 to less than about 1.0.
- 24. The composition of claim 1, wherein the components of the composition are present in amounts such that the stoichiometric equivalents ratio of reactive hydrogen sites to reactive epoxy sites is in the range of about 0.7 to less than about 1.0.
- 25. The composition of claim 1, wherein the composition is an adhesive that can form an adhesive bond having an impact peel strength of at least 3 J at a temperature in the range of from about −40° C. to about +90° C.
- 26. The composition of claim 1, wherein the composition is an adhesive capable of forming an adhesive bond having a T-peel strength of greater than about 85 N/cm at 23° C.
- 27. A structure comprising a first surface and a second surface joined by an adhesive bond, the adhesive bond comprising a cured mass of the composition of claim 1.
- 28. The structure of claim 27, wherein the first surface and the second surface each comprises at least one material selected from the group of materials consisting of thermoplastic polymers, thermoset polymers, reinforced thermoplastic composites, reinforced thermoset composites, metals, metal alloys and combinations thereof.
- 29. The structure of claim 27, wherein the structure comprises at least a portion of a vehicle.
- 30. The structure of claim 27, wherein the structure comprises a joint having a welded bond in addition to the adhesive bond.
- 31. The structure of claim 30, wherein the welded bond is formed through the adhesive bond.
- 32. A method of assembling the structure of claim 27 comprising the steps of:
(a) applying an uncured mass of the composition of claim 1 to at least one of a first member and a second member; (b) sandwiching the uncured mass between the first member and the second member; and (c) curing the composition to form an adhesive bond so as to adhere the first member and the second member together.
- 33. The method of claim 32, wherein the first member is a frame member and the second member is a sheet-like member.
- 34. The method of claim 33 further comprising the step of welding the sheet-like member to the frame member through the uncured mass before the curing step.
- 35. The method of claim 32, wherein the first member is a frame member and the second member is another frame member.
Parent Case Info
[0001] The present application is a divisional of U.S. patent application Ser. No. 09/170,597, filed on Oct. 13, 1998.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09170597 |
Oct 1998 |
US |
Child |
10244326 |
Sep 2002 |
US |