Claims
- 1. A high-temperature, creep-resistant material comprising intermetallic compounds in a titanium/aluminum system, containing from 44 to 73 atom % titanium, from 19 to 35 atom % aluminum, from 2 to 6 atom % silicon, and from 5 to 15 atom % niobium.
- 2. The high-temperature, creep-resistant material according to claim 1, including from 1 to 5 atom % of a material selected from the group consisting of tungsten, molybdenum and vanadium.
- 3. The high-temperature, creep-resistant material according to claim 1, including from 0.05 to 2 atom % up to a maximum total of 3 atom % of an admixed material selected from the group consisting of yttrium, hafnium, erbium and lanthanum.
- 4. The high-temperature, creep-resistant material according to claim 1, including from 0.05 to 2 atom % up to a maximum total of 3 atom % of a material selected from the group consisting of yttrium, hafnium, erbium and lanthanum, being admixed by mechanical alloying.
- 5. The high-temperature, creep-resistant material according to claim 1, including from 0.05 to 5 atom % boron.
- 6. The high-temperature, creep-resistant material according to claim 1, including from 0.05 to 1 atom % of an admixed material selected from the group consisting of carbon and nitrogen.
- 7. The high-temperature, creep-resistant material according to claim 5, including from 0.05 to 1 atom % of an admixed material selected from the group consisting of carbon and nitrogen.
Priority Claims (1)
Number |
Date |
Country |
Kind |
42 15 194.5 |
May 1992 |
DEX |
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CROSS-REFERENCE TO RELATED APPLICATION
This is a continuation-in-part of application Ser. No. 08/059,491, filed May 10, 1993, now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1245136 |
Jul 1967 |
DEX |
3257130 |
Nov 1991 |
JPX |
Non-Patent Literature Citations (2)
Entry |
Japanese Patent Abstract 3 226 538 Mar. 1991. |
DE-Z "Metallkunde" vol. 65, No. 2, Dec. 1974, pp. 89-93. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
59491 |
May 1993 |
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