Claims
- 1. A polymer derived by heating, in the presence of an acid catalyst at between about 140.degree. and 165.degree. C., a mixture consisting essentially of one monomeric compound selected from each of two or all four of the following groups
- A. methoxy methyl diphenyl oxide or sulfide or their alkyl or halogenated derivatives;
- B. methoxy poly(methoxy)methyl diphenyl oxide or sulfide or their alkyl or halogenated derivatives;
- C. di[methoxy poly(methoxy)methyl] diphenyl oxide or sulfide or their alkyl or halogenated derivatives;
- D. methoxy methyl poly(phenoxyphenyl methylene) phenoxybenzene, any one of which A to D may contain unreacted diphenyl oxide or sulfide and bis(phenoxy phenyl) methane,
- said compounds falling within the following generic formula ##STR5## wherein each A represents a chalcogen independently selected from the group oxygen and sulfur; R.sub.1 represents a member selected from the group hydrogen, --CH.sub.2 (OCH.sub.2).sub.y OCH.sub.2 -R.sub.3 ; each R.sub.2 represents a member independently selected from the group consisting of R.sub.1, halogen and an alkyl group of 1 to 10 carbon atoms; R.sub.3 represents a member selected from the group consisting of H, methyl, ethyl and propyl; each m represents an independently selected integer from 1 to 2; n represents an integer from 0 to 60 and y represents an integer from 0 to 3.
- 2. A polymer prepared as in claim 1 wherein the acid catalyst is a sulfonic acid.
- 3. A polymer prepared as in claim 1 wherein the acid catalyst is p-toluene sulfonic acid.
- 4. A polymer prepared as in claim 1 wherein the acid catalyst is dodecyl diphenyl oxide disulfonic acid.
- 5. A polymer prepared as in claim 1 wherein the monomeric compounds have an average equivalent weight of about 214.
- 6. A polymer prepared as in claim 1 wherein the monomeric compounds have an average equivalent weight of about 262.
- 7. A polymer prepared as in claim 1 wherein the monomeric compounds have an average molecular weight of about 700.
- 8. A thermoset resin prepared by heating the polymer of claim 1 at 170.degree. to 260.degree. C. for from several minutes to several hours.
- 9. A thermoset resin prepared by heating the polymer of claim 5 at 170.degree. to 260.degree. C. for from several minutes to several hours.
- 10. A thermoset resin prepared by heating the polymer of claim 6 at 170.degree. to 260.degree. C. for from several minutes to several hours.
- 11. A thermoset resin prepared by heating the polymer of claim 7 at 170.degree. to 260.degree. C. for from several minutes to several hours.
- 12. A polymer derived by heating, in the presence of a catalytic amount of dodecyl diphenyl oxide disulfonic acid at between about 140.degree. and 165.degree. C., a mixture consisting essentially of at least one monomeric compound selected from each of the following groups
- A. methoxy methyl diphenyl oxide or sulfide or their alkyl or halogenated derivatives;
- B. methoxy poly(methoxy)methyl diphenyl oxide or sulfide or their alkyl or halogenated derivatives;
- C. di[methoxy poly(methoxy)methyl] diphenyl oxide or sulfide or their alkyl or halogenated derivatives;
- D. methoxy methyl poly(phenoxyphenyl methylene) phenoxybenzene, any one of which A to D may contain unreacted diphenyl oxide or sulfide
- said compounds falling within the following generic formula: ##STR6## wherein each A represents a chalcogen independently selected from the group oxygen and sulfur; R.sub.1 represents a member selected from the group hydrogen, --CH.sub.2 (OCH.sub.2).sub.y OCH.sub.2 --R.sub.3 ; each R.sub.2 represents a member independently selected from the group consisting of R.sub.1 ; halogen and an alkyl group of 1 to 10 carbon atoms; R.sub.3 represents a member selected from the group consisting of H, methyl, ethyl and propyl; each m represents an independently selected integer from 1 to 2; n represents an integer from 0 to 60 and y represents an integer from 0 to 3.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of our prior filed application Serial No. 394,011, filed by us Sept. 4, 1973, now abandoned, entitled HIGH TEMPERATURE POLYMERS.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
3274157 |
Doedens |
Sep 1966 |
|
3323962 |
Sprengling et al. |
Jun 1967 |
|
3405091 |
Sprengling et al. |
Oct 1968 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
1021935 |
Mar 1966 |
GBX |
377318 |
May 1973 |
SUX |
Non-Patent Literature Citations (3)
Entry |
Nishizaki et al., "Thermosetting Resin Compositions," Chemical Abstracts 74, 13748c (1971). |
Aulova et al., "Thermosetting Polymers," Chemical Abstracts 79, 54430q (1973). |
Khadzhistoyanova et al., "Oligomeric Products from Diphenyl Ether," Chemical Abstracts 81, 136824b (1974). |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
394011 |
Sep 1973 |
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