The present invention relates to superconducting materials and methods of fabricating the same.
(Note: This application references a number of different publications as indicated throughout the specification by one or more reference numbers in brackets, e.g., [x]. A list of these different publications ordered according to these reference numbers can be found below in the section entitled “References.” Each of these publications is incorporated by reference herein.)
The cuprate superconductors were discovered experimentally by materials scientists in 1986. Since then, there have been over 200,000 refereed papers on cuprate superconductivity, yet the mechanism that leads to superconductivity is unknown. It has been 24 years since the last discovery of the highest temperature superconductor at ambient pressure with a superconducting transition temperature, Tc, of 139 Kelvin. In addition, the critical current density, Jc, is 100 times smaller than the theoretical limit. The lack of progress in increasing Tc and Jc is due to a lack of understanding of the basic physics of these materials.
The current invention shows how significantly higher Tc and Je can be achieved in the cuprate materials class and in other materials with metallic and insulating regions. Such materials are of immense practical value in electrical machinery and power transmission.
To overcome the limitations described above, and to overcome other limitations that will become apparent upon reading and understanding this specification, one or more embodiments of the present invention disclose a superconducting composition of matter comprising a first region and a second region. The first and second regions comprise unit cells of a solid (e.g., crystalline or amorphous lattice, periodic or aperiodic lattice), the first region comprises an electrical insulator or semiconductor, the second region comprises a metallic electrical conductor. The second region extends or percolates through the solid (e.g., crystalline or amorphous) lattice and a subset of the second region comprises surface metal unit cells that are adjacent to at least one unit cell from the first region. The ratio of the number of the surface metal unit cells to the total number of unit cells in the second region being; at least 20 percent.
Examples of materials for the first region include an antiferromagnetic insulator, a non-magnetic insulator, and a semiconductor.
In one or more examples, the first region is comprised of metal-monoxides, MgO, CaO, SrO, BaO. MnO, FecO, CoO, NiO, CdO, EuO, PrO, or UO, and the second region is comprised of TiO, VO, NbO, NdO, or SmO.
In one or more further examples, the first region is comprised of Al2O3, and the second region is formed by replacing the Al atoms in the first region with Ti, V, or Cr atoms.
In yet further examples, the first region is comprised of V2O3 with up to 20% of the V atoms replaced by Cr atoms, and the second region is comprised of (VxTi1-x)2O3 where x is greater than or equal to zero or less than or equal to one.
In yet further examples, in the composition of one or any combination of the previous examples, the second region is formed by replacing one type of atom in said first region by another type of atom of a different chemical valence.
In yet other examples, in the composition of one or any combination of the previous examples, the second region is formed by adding a type of atom to a subset of the unit cells of said first region, the type of atom of such chemical valence that the type of atom acts as an electrical donor or acceptor when added to said unit cells.
In further examples, in the composition of one or any combination of the previous examples, the second region is formed by adding interstitial atoms in said first region.
In yet other examples, in the composition of one or any combination of the previous examples, the first region is formed by replacing one type of atom in said second region by another type of atom of a different chemical valence.
In one or more examples, in the composition of one or any combination of the previous examples the first region is formed by adding a type of atom to a subset of the unit cells of said second region, the type of atom of such chemical valence that the type of atom acts as an electrical donor or acceptor when added to said unit cells.
In further examples, in the composition of one or any combination of the previous examples, said first region is formed by adding interstitial atoms in said second region.
In one or more examples, in the composition of one or any combination of the previous examples the second region is comprised of approximately linear subregions. For example, the approximately linear subregions of the second region can surround regions of the first kind (first region). In other examples, some of the surrounded regions of the first kind (first region) have atomic substitutions, grain boundaries, or interstitial atoms.
The present disclosure further describes a superconductor from the hole-doped cuprate class comprising two distinct atoms (first and second atoms) having such chemical valence that the first atom when added to the cuprate acts as an electrical acceptor, the second atom acts as an electrical donor, and 20% or at least 20% of said second atoms reside inside the unit cell between two of the first atoms that are a distance of two unit cells from each other. In one or more examples, the superconductor has the composition of one or any combination of the previous examples having the first and second regions (the second region including the distinct atoms).
The present disclosure further describes a superconducting composition of matter comprised of YBa2Cu3O6+x where at least 5% of the Y atoms are replaced by +2 oxidation state atoms, Mg, Ca, Sr, Zn, Cd, Cu, Ni, or Co, at least 2% of the Y atoms are replaced by +4 oxidation state atoms, Ti, Zr, Hf, C, Si, Ge, Sn, or Pb. In one or more examples, the superconducting composition of matter has the composition of one or any combination of the previous examples having the first and second regions.
The present disclosure further describes a superconductor from the electron-doped cuprate class comprising two distinct atoms (first and second atoms) having such chemical valence that the first atom when added to the cuprate acts as an electrical donor, the second atom acts as an electrical acceptor, and 20% of said second atoms reside inside the unit cell between two of the first atoms that are a distance of two unit cells from each other. In one or more examples, the superconductor has the composition of one or any combination of the previous examples having the first and second regions (the second region including the distinct atoms).
The materials characteristics that are relevant for fabricating room-temperature superconductors and high current densities are also described.
Referring now to the drawings in which like reference numbers represent corresponding parts throughout:
f,μ*(f,iωn)=μ*FlucF(iωn)(1−f)+μ*BCS,
where μ*Fluc=7 (the fluctuating dumbbell μ*), μ*BCS=0.1 (a typical BCS value), and the cutoff
F(iωn)=ωFluc2/(ωn2+ωFluc2)
uses ωFluc=60 meV. The Eliashberg imaginary frequency, iωn, is defined in Appendix G. In order to achieve 100% frozen dumbbells, “domino” doping as shown in
In the following description of the preferred embodiment, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration a specific embodiment in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention.
The present disclosure describes a new composition of matter useful as high temperature superconductors. The compositions are fabricated from a wide range of materials including, but not limited to, cuprate superconductors.
The highest superconducting transition temperature, Tc, at ambient pressure is 138 K in the Mercury cuprate HgBa2Ca2Cu3O8+δ(Hg1223 was discovered in 1993) with three CuO2 layers per unit cell [1,2]. The longest time period between record setting Tc discoveries is the 17 years between Pb (1913 with Tc=7.2 K) to Nb (1930 with Tc=9.2 K). With the enormous increase in focus on superconductivity after the discovery of cuprates 30 years ago, the current 24 years without a new record at ambient pressure indicates we may be reaching the maximum attainable Tc.
The present disclosure shows this conclusion to be wrong, demonstrating that Tc can be raised above room-temperature to ≈400K in cuprates by precise control of the spatial separation of dopants. Hence, there still remains substantial “latent” Tc in cuprates. However, the proposed doping strategy and superconducting mechanism is not restricted to cuprates and may be exploited in other materials.
The room-temperature Tc result described herein is based upon four observations:
Research and funding invested into finding the mechanism for cuprate superconductivity and higher Tc materials has led to more than 200,000 refereed papers [3]. After this mind-boggling quantity of literature, it would be unlikely that any unturned stones remain that could lead to the room temperature superconductivity properties described herein.
However, as illustrated herein, the majority of the cuprate community settled upon the incorrect orbital nature of the doped hole. This mistake led to Hamriltonians (Hubbard models) that overlook significant features.
A major reason for the early adoption of these Hubbard models for cuprates was due to computational results using the ab initio local density approximation (LDA) in density functional theory (DFT). While LDA is now deprecated, being replaced by the Perdew-Burke-Ernzerhof functional 141 (PBE), both functionals lead to exactly the same doped hole wavefunction in cuprates. These “physicist” functionals find the doped hole to be a de-localized wavefunction comprised of orbitals residing in the CuO2 planes common to all cuprates [5-7]. Unfortunately, LDA and PBE both contain unphysical Coulomb repulsion of an electron with itself [8]. The “chemist” hybrid density functionals, invented in 1993 (seven years after the discovery of cuprate superconductivity), corrected for this self-Coulomb error, and thereby found the doped hole residing in a localized wavefunction surrounding the dopant atom with orbital character pointing out of the CuO2 planes [9,10].
Only twelve dopings are shown here from the range x=0.00 to x=0.32. The Appendix in the provisional application 62/458,740 has similar figures for all dopings in this range in 0.01 increments (Figures S0-S32). Only one CuO2 plane is shown in each of these figures.
The above identified eight electronic structural concepts explain a diverse set of normal state cuprate phenomenology as a function of doping by simple counting arguments [11-14]. These include the following results.
The present disclosure uses exactly the same doped electronic structure described above to explain the superconducting Tc and its evolution with doping. The Oxygen atom phonon modes at and adjacent to the interface between the insulating and metallic regions lead to superconductivity. The magnitude of the electron-phonon coupling is estimated and the following results are obtained:
All the superconducting transition temperatures described herein are computed using the strong coupling Eliashberg equations [16] as detailed in Appendix G of the provisional application 62/458,740. These equations include the electron “lifetime” effects that substantially decrease Tc from the simple BCS Tc expression.
These results are shown in the following set of Tc Concepts.
Since
Mω2=K, where K is the spring constant, there is no pairing isotope effect. For anharmonic potentials, the phonon pairing strength becomes dependent on the isotope mass [22]. Anharmonic potentials can decrease or increase the Tc isotope effect depending on the details of the anharmonicity [23-25]. Near optimal doping, the metallic and insulating environments for each O atom phonon is random, leading to an average isotope effect of zero, as has been observed [26.27]. The O atom environment becomes less random at lower dopings, as seen in
From Table 1, a 10% increase in δε always decreases the D-wave Tc, by ≈2-3%. A ±10% change in δt leads to ≈±10-30% change in the D-wave Tc. In appendices G2a and G2b, the exact dependence of the electron-phonon pairing parameter, λ, is derived. The contribution of δε to λ is approximately isotropic around the Fermi surface leading to a weak dependence of the D-wave Tc on changes in δε. In contrast, an S-wave pairing symmetry Tc depends strongly on both δε and δt. The weak dependence of the D-wave Tc on δε implies the δε parameters for the Tc curves in
Atomic-scale inhomogeneity explains three important materials issues about cuprates. First, cuprates are known to “self-dope” to approximately optimal Tc. Since plaquette overlap occurs at x=0.187 doping, we believe it is energetically favorable for dopants to enter the crystal until their plaquettes begin to overlap. Adding further dopants is energetically unfavorable. The change in Tc between optimal doping (x≈0.16) and plaquette overlap (x=0.187) is ≈0.5%. Hence, cuprates “self-dope” to approximately optimal Tc as a consequence of the energetics of overlapping plaquettes.
Second, YBa2Cu3O7-δ cannot be doped past x≈0.23, as shown in
Third, it is known that a room-temperature thermopower measurement is one of the fastest ways to determine if a cuprate sample is near optimal doping for Tc because the room-temperature thermopower is very close to zero near optimal doping. This peculiar, but useful, observation can be understood because 2D percolation of the metallic region occurs at x≈0.15 doping. Since the AF region thermopower is large (˜+100 μV/K) and the metallic thermopower is ˜−10 μV/K at high overdoping, 2D metallic percolation “shorts out” the AF thermopower and drives the thermopower close to zero near optimal Tc.
Finally, the potential energy curve in the intermediate correlation regime is hard to study for molecules. For H2, the equilibrium bond distance is 0.74 Angstroms. The intermediate correlation regime is at ≈2.0 Angstrom bond separation. At this distance, the blue potential energy curve in
As illustrated herein, there is enormous “latent” Tc residing in the cuprate class of superconductors from converting the D-wave superconducting pairing wavefunction to an S-wave pairing wavefunction. The result is surprising and unexpected because it has been assumed by most of the high-Tc cuprate community that there was something special about the D-wave pairing symmetry that led to Tc˜100 K.
Plaquettes have been overlapped with regularity for 30 years. However, these materials are all overdoped with doping x:>0.187, as shown in
While almost everything that can be possibly be suggested for the mechanism for cuprate superconductivity has been suggested in over 200,000 papers (percolation, inhomogeneity, dynamic Jahn-Teller distortions, competing orders. quantum critical points at optimal doping or elsewhere, spin fluctuations, resonating valence bonds, gauge theories, blocked single electron interlayer hopping, stripes, mid-infrared scenarios, polarons, bipolarons, spin polarons, spin bipolarons, preformed Bose-Einstein pairs, spin bags, one-band Hubbard models, three-band Hubbard models, t-J models, t+U models, phonons, magnons, plasmons, anyons, Hidden Fermi liquids, Marginal Fermi liquids, Nearly Antiferromagnetic Fermi liquids, Gossamer Superconductivity, the Quantum Protectorate, etc.), the inventor believes these ideas have lacked the microscopic detail necessary to guide experimental materials design, and in some instances, may have even led materials scientists down the wrong path.
As shown above (see
In cuprates, Tc can be raised to room-temperature by freezing dumbbells while maintaining the random metallic footprint found at optimal doping. By fabricating wires (a wire is defined as a continuous 1D metallic pathway through the crystal), Tc remains large while Jc increases to at least ˜10−1Jc,max.
The results presented herein lead to the following approaches for achieving higher Tc and Jc. Unless explicitly stated, the points below apply to any type of material (cuprate or non-cuprate).
The material should have a metallic region and an insulating region. The insulating region does not have to be magnetic. However, the inventor believes the antiferromagnetic insulating region helps maintain the sharp metal-insulator boundary seen in cuprates. An ordinary insulator or a semiconductor with a small number of mobile carriers is sufficient to obtain a longer ranged electron-phonon coupling at the interface because there is less electron screening in the semiconducting (or insulating) region compared to the metallic region. Thus, atomic-scale metal-insulator inhomogeneity in a 3D material leads to a high-Tc 3D S-wave pairing wavefunction. Moreover, a 3D material is more stable against defects and grain boundaries.
The ratio of the number of metallic unit cells on the interface (adjacent to at least one insulating unit cell) to the total number of metallic unit cells must be larger than 20%. The terms interface and surface are used interchangeably below. The number of metallic unit cells on the interface (or surface) must be a large fraction of the total number of metallic unit cells in order for the enhanced electron-phonon pairing at the interface to have an appreciable effect on Tc. From the calculations in
Metallic clusters that are smaller than approximately the coherence length do not contribute to Tc due to thermal fluctuations. The surface metal unit cells to total metal unit cells ratio described above should only include surface metal unit cells in extended metallic clusters.
In cuprates, high Tc can be obtained at very low doping if all the dopants leading to isolated plaquettes and small plaquette clusters are arranged such that a single contiguous metallic cluster is formed. While the Tc may be high, Jc will be low if the size of the metallic region is a small fraction of the total volume of the crystal.
Inhomogeneous materials formed at eutectic points have a surface metal unit cells to total metal unit cells ratio of ˜10−3 or less if the sizes of the metallic and insulating regions are on the order of microns. Standard materials fabrication methods do not lead to sufficient surface atomic sites for high Tc. Inhomogeneity on the atomic-scale is necessary.
It would appear that parallel 1D metallic wires that are one lattice constant wide (equal to one plaquette width in cuprates) would lead to the maximum surface unit cells to total metal unit cells ratio of 100%, and thereby a large Tc increase. It was surprising and unexpected to discover that at optimal doping of x=0.16, the surface metal unit cells to total metal unit cells ratio is 91% in cuprates, Increasing the ratio to 100% increases Tc by only ≈5% because at higher Tc magnitudes, Tc no longer increases exponentially with the magnitude of the electron-phonon coupling, λ. (defined in Appendix G). Instead, Tc scales [49] as Tc˜√λ. A 10% increase in the surface to total metal unit cells ratio increases λ by 10%, leading to a 5% in-crease in Tc. Hence, there is negligible Tc to be gained by fabricating wires.
While metallic wires lead to a tiny increase in Tc, metallic wires increase Je dramatically (up to a factor of ˜100) by eliminating the tortured conduction pathways shown in
Current materials fabrication methods for cuprates have optimized the Tc at the ex-pense of Jc. This point evidences that despite all the proposals in over 200,000 refereed publications [3] there has been little guidance to the materials synthesis community on what is relevant at the atomic level for optimizing Tc and Jc.
Parallel wires that are a few lattice constants in width are bad superconductors because 1D superconductor-normal state thermal fluctuations lead to large resistances below the nominal Tc. However, by fabricating two (or more) sets of parallel wires that cross each other, the effect of resistive thermal fluctuations in a single wire are suppressed.
Generally, it is most favorable to fabricate the narrowest wires that are spaced closely together because both Tc and Jc will be large. In addition, interfacial phonon modes will couple to both the closest wire and the next-nearest neighboring wire, leading to further increase in Tc. For cuprates, the narrowest wire is one plaquette width (see
In one or more examples, dopants are added to an insulating parent compound that leads to metallic regions. However, a metallic parent compound can also be doped to create insulating regions. In cuprates, the parent compound is insulating and doping creates metallic regions.
Strong pinning of magnetic flux lines in superconductors is necessary to obtain large critical current densities, Jc. Insulating “pockets” surrounded by metallic region are energetically favorable for magnetic flux to penetrate. The flux can be strongly bound inside these insulating regions by adding further pinning centers to the insulating region. Examples of insulating pockets are shown in
In cuprates, it is desirable to freeze the fluctuating dumbbells in non-overlapping plaquettes while maintaining a metallic footprint with a large surface metallic unit cells to total metallic unit cells ratio. The ratio of the isotropic S-wave pairing wavefunction Tc to the corresponding D-wave Tc is ≈2.8-4 (see
There are three materials issues with crowding dopants:
There are two cuprates materials where the dopant crowding idea can be tested:
As illustrated herein, the Tc of optimally doped La2-xSrxCuQ4 increases from 40 K with no dopant crowding (f=0.0 in
The ionic charges of the La and Sr atoms in La2-xSrxCuO4 are +3 and +2 (or −1 relative to La+3), respectively. The most direct way to crowd dopants is to add atoms with a. +1 charge relative to La+3 (a +4 oxidation state) because they favor residing in-between the Sr+2 atoms due to charge attraction. At first glance, it appears this approach is counter-productive because a +4 atom adds an electron, and thereby lowers the net doping and Tc. However, the added electron fills a hole in the out-of-plane fluctuating dumbbells rather than doping the planar CuO2 metallic band. The net result is our desired crowding. Example crowding dopants include C+4, Sr+4, Ge+4, Sn+4, Ti+4, Zr+4, Hf+4, and Pt+4. These dopants are smaller than La+3, and hence will “fit” in-between the two Sr atoms.
The lack of any change in Tc for dopant crowding less than 20% and the counter-intuitive suggestion above of electron doping the material are the reasons the materials community did not “accidentally” find this room-temperature mechanism, despite intense effort over 31 years.
In one or more examples, the room-temperature Seebeck coefficient (thermopower) of new material samples can be tested because it is a direct measure of the size of the metallic regions (yellow overlay in
Block 2400 represents combining a first region 1002a or material and a second region 1002b or material to form a composition of matter 1000.
In one or more examples, the first region 1002a or material and the second region 1002b or material each comprise unit cells 1004a, 1004b, respectively, of a solid 1000c (e.g., crystalline or amorphous lattice). The second region 1002b extends through the solid (e.g., crystalline or amorphous lattice) and a subset of the second region 1002b are surface metal unit cells 1004b that are adjacent to at least one unit cell 1004a from the first region 1002a. The ratio of the number of the surface metal unit cells 1004b to the total number of unit cells 1004b, 906, 902 in the second region 1002b is at least 20 percent (e.g., in a range of 20%-100%).
The first region 1002a or material comprises an electrical insulator or semiconductor. Examples of insulator include an antiferromagnetic insulator or a non-magnetic insulator. The second region or material comprises a metallic electrical conductor.
Examples of the composition of matter 1000 include the first region or material 1002a comprising at least one compound selected from the metal-monoxides, MgO, CaO, SrO, BaO, MnO, FeO, CoO, NiO, CdO, EuO, PrO, and UO, combined with the second region or material 1002b comprising at least one compound selected from TiO, VO, NbO, NdO, and SmO.
Further examples of the composition of matter 1000 include the first region 1002a or material comprising at least one compound selected from V2O3 with up to 20% of the V atoms replaced by Cr atoms, combined with the second region 1002b comprised of (VxTi1-x)2O3 where x is greater than or equal to zero or less than or equal to one.
Yet further examples of the composition 1000 include the first region 1002a comprised of Al2O3 and the second region 1002b is formed by replacing the Al atoms in the first region with Ti, V, or Cr atoms.
In yet further examples, the second region 1002b is formed by replacing one type of atom in the first region 1002a by another type of atom of a different chemical valence.
In yet further examples, the second region 1002b is formed by adding a type of atom to a subset of the unit cells 1004a of the first region 1002a, the type of atom of such chemical valence that (when the type of atom is added to the unit cells 1004a) the type of atom acts as an electrical donor or acceptor.
In one or more examples, the second region 1002b is formed by adding interstitial atoms in said first region 1002a.
In yet further examples, the first region 1002a is formed by replacing one type of atom in the second region 1002b by another type of atom of a different chemical valence.
In yet further examples, the first region 1002a is formed by adding a type of atom to a subset of the unit cells 1004b of the second region 1002b, the type of atom of such chemical valence that (when the type of atoms is added to the unit cells) the type of atom acts as an electrical donor or acceptor.
In yet further examples, the first region 1002a is formed by adding interstitial atoms in the second region 1002b.
In yet further examples, the combining comprises combining two distinct atoms (first 1800 and second atoms 1802). The first atom 1800 (e.g., Sr) has a chemical valence such that when the first atom 1800 is added to the material (e.g., cuprate), the first atom 1800 acts as an electrical acceptor. The second atom 1802 (e.g., Ti) has a chemical valence such that, when the second atom is added to the material (e.g., cuprate), the second atom 1802 acts as an electrical donor, and 20% or at least 20% (e.g., 20%-100%) of said second atoms 1802 reside inside the unit cell 1804 between two of said first atoms 1800 that are a distance of two unit cells 1804, 1000d from each other. In on one or more examples, the second region 1002 includes the two distinct atoms (first 1800 and second atoms 1802) and the superconductor is from the hole-doped cuprate class.
In yet further examples, the combining comprises forming YBa2Cu3O6+x where at least 5% of the Y atoms are replaced by +2 oxidation state atoms, Mg, Ca, Sr, Zn, Cd, Cu, Ni, or Co, at least 2% of the Y atoms are replaced by +4 oxidation state atoms, Ti, Zr, Hf, C, Si, Ge, Sn, or Pb.
In yet further examples, the combining comprises combining two distinct atoms (first and second atoms) having such chemical valence that (when added to the cuprate) the first atom acts as an electrical donor, the second atom acts as an electrical acceptor, and 20% or at least 20% (e.g., 20%-100%) of said second atoms reside inside the unit cell between two of the first atoms that are a distance of two unit cells from each other. In on one or more examples, the second region includes the two distinct atoms (first and second atoms) and the superconductor is from the electron-doped cuprate class.
In yet further examples, the second region 1002a is comprised of approximately linear subregions 1010, as illustrated in
In one or more examples, the components are provided in powder form and ground together in a pestle and mortar.
Block 2402 represents the step of doping the composition formed in Block 2400. Examples of doping include first n-type doping the composition then p-type doping the composition. Exemplary ranges of n-type doping include a doping concentration in a range from 5% up to 80% (e.g., 5% up to 20%) n-type dopants per unit cell Exemplary ranges of p-type doping include a doping concentration in a range from 5% up to 80% (e.g., 5% up to 20%) p-type dopants per unit cell. In one or more examples where the composition comprises a cuprate, the n-type doping and p-type doping are such that the dopant concentration x is in a range of 0.13-0.19. Examples of dopants include, but are not limited to, Mg, Ca, Sr, Zn, Cd, Cu. Ni, Co. Ti, Zr, Hf, C, Si, Ge, Sn, Pb.
In one or more examples, the dopants are provided in powder form and mixed together (e.g., ground together in a pestle and mortar) with the components of Block 2400.
Block 2404 represents the optional step of annealing the doped composite formed in Block 2402.
Block 2406 represents the optional step of measuring the insulator/semiconductor and metal content in the composition. In one or more examples, the step comprises measuring a thermopower of the composite, wherein the thermopower quantifies the amount of metal and insulator/semiconductor in the composition. The measurement enables identification of the fraction of overlapped plaquettes as a function of the structure, doping, and composition of the first region and the second regions, so that compositions mapping onto the red curve 2302 in
Block 2408 represents repeating steps 2400-2404 with modified compositions if the measurement in Block 2406 indicates that the fraction of overlapped plaquettes, f, does not lie on the S-wave curve in
Block 2410 illustrates the end result, a superconducting composition of matter having a Tc in a range of 100-400 K, wherein a ratio of the number of the surface metal unit cells to the total number of unit cells in the second region is at least 20 percent (e.g., in a range of 20-100%). In one or more examples, both the metallic content of the superconductor and the surface area of the metallic regions overlapping with the insulator/semiconductor regions are maximized.
Superconducting compositions of matter according to embodiments of the present invention may also be designed by computationally solving equations G43-G45 in the computational methods section for any combination of material(s) using the appropriate parameters for those materials.
It is known to be qualitatively correct that ℏwD/EF≈√{square root over (m/M)} where ℏwD is the Debye energy, EF is the Fermi energy, m is the electron mass, and M is the nuclear mass. One can quickly see that the form of the above expression is correct using ωD˜√{square root over (K/M)} where K is the spring constant and K˜EFkF2˜mEF2/ℏ2 due to metallic electron screening.
The electron-phonon coupling, g, is of the form g˜√{square root over (ℏ/2MωD)}∇V, where V is the nuclear potential energy. Substituting ∇V˜kFEF, leads to g2˜(ℏ/2MωD)kF2EF2˜(m/M)EF3/(ℏwD)˜(ℏwD)EF. Hence, g≈√{square root over (ℏωDEF)}.
Another derivation is dimensional. The coupling, g, has dimensions of energy and there are only two relevant energy scales, ℏwD and EF. Thus there are three possibilities for g. the mean, the geometric mean, and the harmonic mean of ℏω and EF. Since ℏωD<<EF, the mean is ≈EF, and the harmonic mean is ≈ℏωD. Neither of these two means makes intuitive sense because we know metallic electrons strongly screen the nuclear-nuclear potential. The only sensible choice is the geometric mean, g˜√{square root over (ℏωDEF)}.
There are superconducting fluctuations above Tc at low dopings due to the fluctuating magenta plaquette clusters in
The attractive electron-electron pairing mediated by phonons is not instantaneous in time due to the non-zero frequency of the phonon modes (phonon retardation). In addition, electrons are scattered by phonons leading to electron wavefunction renormalization (“lifetime effects”) that decrease Tc. Any credible Tc prediction must incorporate both of these effects. All Tc calculations in this paper solve the Eliashberg equations for the superconducting pairing wavefunction (also called the gap function). It includes both the pairing retardation and the electron lifetime.16,20,59
The Eliashberg equations are non-linear equations for the superconducting gap function, Δ(k, ω, T), and the wave function renormalization, Z(k, ω, T), as a function of momentum k, frequency ω, and temperature T. Usually, the T dependence of Δ and Z is assumed, and they are written as Δ(k, ω) and Z(k, ω), respectively. We follow this convention here. Both Δ(k, ω) and Z(k,ω) are complex numbers. In this Appendix only, we will absorb Boltzmann's constant, kB into T. Thus T has units of energy.
Both Δ and Z are frequency dependent because of the non-instantaneous nature of the superconducting electron-electron pairing. If the pairing via phonons was instantaneous in time, then there would be no frequency dependence to Δ and Z. The simpler BCS29 gap equation assumes an instantaneous pairing interaction (Δ is independent of ω) and no wavefunction renormalization (Z=1).
The Eliashberg equations may be solved in momentum and frequency space (k, ω), or in momentum and discrete imaginary frequency space, (k, iωn), where n is an integer and ωn=(2n+1)πT. In the imaginary frequency space representation, the temperature dependence and the retardation of the phonon induced pairing are both absorbed into the imaginary frequency dependence, iωn. In theory, both Δ(k, ω) and Z(k, ω) can be obtained by analytic continuation of their (k iωn) counterparts. In practice, the analytic continuation is fraught with numerical difficulties.60-63 However, the symmetry of the gap can be extracted from either the real or imaginary frequency representations of Δ.
In the pioneering work of Schrieffer, Scalapino, and Wilkins, 29,34,35,59 the goal was to obtain the isotropic (in k-space) gap function at zero temperature, Δ(ω), as a function of ω in order to compute the superconducting tunneling of lead (Tc=7.2 K). Hence, they solved the full non-linear Eliashberg equations in frequency space.
Above Tc, Δ(k,ω) is zero. For T≈TC, Δ is small. Since our interest in this paper is on the magnitude of Tc and the symmetry of the superconducting gap, we can linearize the gap, Δ, in the Eliashberg: equation for temperatures, T, close to Tc. The result is a temperature dependent real symmetric matrix eigenvalue equation with Δ(k, ω) as the eigenvector. The eigenvalues are dimensionless and the largest eigenvalue mnonotonically increases as T decreases. For T>Tc, the largest eigenvalue of the real symmetric matrix is less than 1. At T=Tc, the largest eigenvalue equals 1, signifying the onset of superconductivity.
The non-linear Eliashberg equations (or the linearized version) are easier to solve in imaginary frequency space. ≠Hence, we solve the linearized Eliashberg equations in imaginary frequency space to obtain Tc.
We use the linearized Eliashberg equations as derived in the excellent chapter by Allen and Mitrovic. 16 Prior Eliashberg formulations assume translational symmetry (momentum k is a good quantum number for the metallic states). Our metallic wavefunctions are not k states because they are only non-zero in the percolating metallic region. We write the wavefunction and energy for the state with index l as Ψi and ∈i, respectively. Since Ψi is only delocalized over the metallic region and is normalized, Ψi˜1/√{square root over (NM)}, where NM is the total number of metallic Cu sites. Rather than Cooper pairing occurring between k⬆ and its time-reversed partner, −k⬇, a Cooper pair here is comprised of (Ψi⬆,
The linearized Eliashberg equations for Δ(I, iωn) and Z(I, iωn) are obtained from the k-vector equations 16 simply by replacing k writh the index l everywhere
where ∈F is the Fermi energy, N(0) is the total metallic density of states per spin per energy, sn=ωn/|ωn|=sgn(ωn) is the sign of ωn, ωc is the cutoff energy for the frequency sums, λ(I, I′, ωn) is the dimensionless phonon pairing strength (defined below), and μ*(ωc) is the dimensionless Morel-Anderson Coulomb pseudopotential at cutoff energy ωc. It is a real number. The wavefunction renormalization, Z(l, iωn), is dimensionless. In the non-linear Eliashberg equations, Δ(I,iωn) is has units of energy. In the linearized equations above, Δ(l,iωn) is an eigenvector and is arbitrary up to a constant factor.
The “electron-phonon spectral function” α2F(l, l′, Ω) is defined
and the phonon pairing strength λ(l, l′, ωn) is defined
where <l|Hepσ|l′>is the matrix element (units of energy) between initial and final states l′ and l, respectively of the electron-phonon coupling, and Hepσ is the electron-phonon coupling for the phonon mode σ with energy ωσ. Both α2F(l, l′, Ω) and λ(l, l′, ωn), are real positive numbers. Hence, Z(l, iωn) is a real positive number. From G2, the gap Δ(l, iωn) can always be chosen to be real. Since λ(l, l′, ωn)=λ(l, l′, −ωn) from equation G4,
Z(l,−iωn)=Z(l,iωn)=Real Number, (G6)
Δ(l,−iωn)=Δ(l,iωn)=Real Number. (G7)
α2F(l, l′, Ω) and λ(l, l′, ωn) are dimensionless because (eV)−1 (eV)2(eV)−1˜1. Physically, they should be independent of the number of metallic Cu sites NM, as NM becomes infinite. The independence with respect to NM is shown below.
The electron-phonon Hamiltonian for phonon mode σ, Hepσ, is
where M is the nuclear mass, aσ and aσ† destroy and create σ phonon modes, respectively. V is the potential energy of the electron. For localized phonon modes, ∇V is independent of the number of metallic sites, NM. The l and l′ metallic states each scale as 1/√{square root over (NM)}, leading to <l|Hepσ|I′>˜1/NM. Since the number of localized phonon modes scales as NM, the NM, scaling of the sum Σσ|<I|Hepσ|I′>|2 is ˜NM(1/NM)2˜1/NM. Hence, we have shown that α2F(l, l′, Ω) and λ(I, I′,ωn) are dimensionless and independent of NM because the density of states per spin, N(0), is proportional to NM. In fact, α2 F and λ are independent of NM even when the phonon modes σ are delocalized. In this case, ∇V˜1/√{square root over (NM)}. The electron-phonon matrix element <l|Hepσ|l′>is now summed over the crystal, and thereby picks up a factor of NM. Hence, <l|Hepσ|l′>˜NM×√{square root over (1/NM)}×√{square root over (1/NM)}ט√{square root over (1/NM)}. For delocalized phonons, the sum over phonon modes σ in Σσ|<I|Hepσ|l′>|2 does not add another factor of NM. The claim is obvious when I and l′ are momentum states k and k′ because the only phonon mode that connects these two states has momentum q=k−k′. Therefore, α2F(l, l′, Ω) and λ(l, l′, ωn) are always dimensionless and independent of NM.
The atomic-scale inhomogeneity of cnprates implies translation is not a perfect symmetry of the crystal. However, the dopants are distributed randomly, and therefore on average k becomes a good quantum number. Hence, we may work with Green's functions in k space and approximate the Cooper pairing to occur between (k ⬆, −k⬇) states. The approximation is identical to the very successful Virtual Crystal Approximation (VCA) and the Coherent Potential Approximation (CPA) for random alloys. 64
In the VCA and CPA, the Green's function between two distinct k states, k and k′ is zero
G(k,k′,iωn)≈0,if k≠k′. (G9)
The fact that k is not a good quantum number of the crystal is incorporated by including a self-energy correction, Σ(k, iωn) at zeroth order into the metallic Green's function
Here, ∈here(k) is the bare electron energy. Σ(k, iωn) can be written as the sum of two terms, Σ(k, iωn)=Σ0(k, iωn)+iωnΣ1(k, iωn). Both Σ0 and Σ1 are even powers of ωn Σi(k, −iωn)=Σi(k, iωn), for i=1, 2. Σ0 adds a shift to the bare electron energy, ∈here(k), and a lifetime broadening to the electronic state. Σ1 leads to wavefunction renormalization of the bare electron state.
The shift of ∈bare(k) due to K0(k, iωn) leads to the observed angle-resolved photoemission
(ARPES) band structure in cuprates, 17 ∈k, and its lifetime broadening. The lifetime broadening integrates out of the Eliashberg equations because the integral of a Lorentzian across the Fermi energy is independent of the width of the Lorentzian. 16 Hence, we may use the ARPES band structure, ∈k, in the Eliashberg equations and absorb Σ1(k, iωn) into Z(k, iωn) in the Eliashberg equations.
Hence, we are right back to the standard Eliashberg equations 16,29,34,35,59
The Eliashberg equations above are completely general for a single band crossing the Fermi level. The only inputs into the equations are the Fermi surface, Fermi velocity (in order to obtain the local density of states), the dimensionless electron-phonon pairing, (k, k′, ωn), and the dimensionless Morel-Anderson Coulomb pseudopotential at the cutoff energy (typically, chosen to be five times larger than the highest phonon mode, ωc=5ωph), μ*(ωc). We apply the standard methods 16 to map the above equations into a matrix equation for the highest eigenvalue as a function of T. The highest eigenvalue monotonically increases at T decreases. When the highest eigenvalue crosses 1, Tc is found.
Equations G11, G12, G13 need to be modified when more than one band crosses the Fermi level. Phonons can scatter electron pairs from one band to another in addition to scattering within a single band. The modification to the single Fermi surface Eliashberg equations above require changing the k and k′ labels to bk and b′k′ where b and b′ refer to the band index. k and k′ remain vectors in 2D so long as we assume the coupling of CuO2 layers in different unit cells is weak. The number of bands is equal to the number of CuO2 layers per unit cell, L. We derive the electron-phonon pairing λ for a single layer cuprate in sections G2 and G3. In section G4, we derive the multi-layer λ.
The total electron-phonon spectral function is the sum of four terms
α2F=+α2F1+α2F2+α2Fsurf+α2F⊥, (G221)
Sections G2 and G3 in this Appendix derive the four α2F terms above in order to obtain the total phonon pairing, λ=λ1+λ2+λsurf+λ⊥, that is used in the Eliashberg equations G11, G12, and G13 for Tc.
The Hamiltonian for
Hsurf (R)=δ∈LCL†CL+ϵRC†R−δt(C554 LCR+C†RCL) (G15)
The k state ϕ(k) is defined as
The modulus squared is
Define the two functions of k and k′. Jsurf(x)(k, k′) and Jsurf(y)(k, k′) as
where F(Rσ)>x is the average of the function F(Rσ) defined for each planar surface O on the x-axis with Position Rσ as shown in
Similarly, <F(Rσ)>y is the average of F(Rσ), over the y-axis surface O atoms. The expression in equation G20 for Jsurf(y) is identical to the expression for Jsurf(x) in equation G19 with x replaced by y.
From the k-space versions or equations G3 and G4
The Hamiltonian for
H⊥(R)=δ∈C†RCR−δt(−)(c†R−aCR+C†RCR−a)−δt(+)(C†R+aCR+C†RCR+a); (G23)
where cR† and cR create and destroy an electron at the R Cu site. c†R+a and cR+a are defined similarly. Since there is no electron spin coupling to the O atom phonon node, the electron spin index is dropped in equation G23.
The matrix element between k′ and k is
ϕ(k′)|H⊥(R)|ϕ(k)=NM−1e−i(k′−k)R[δ∈−δt(+)(e−ik′a+eika)−δt(−)(eik′a+e−ika)] (G24)
The modulus squared is
|(ϕ(k′)H⊥(R)|ϕ(k)|2=NM−2{{δ∈−[δt(+)+δt(−)][cos(k′a)+cos(ka)]}2+[δt(+)−δt(−)]2[sin(k′a)−sin(ka)]2} (G25)
Define the two functions of k and k′, J⊥(x) (k, k′) and J⊥(y) (k k′) as
J⊥(x)(k,k′)=δ∈2x−2 δ∈[δt(+)+δt(−)]x(cos k′xa+cos kxa)+[δt(+)+δt(−)]x(cos k′xa+cos kxa)2+[δt(+)−δt(−)]x(sin k′xa−sin kxa)2, (G26)
J⊥(y)(k,k′)=δ∈2y−2δ∈[δt(+)+δt(−)]y(cos k′ya+cos kya)+[δt(+)+δt(−)]y(cos k′ya+cos kya)2+[δt(+)−δt(−)]y(sin k′ya−sin kya)2, (G27)
where <F(Rσ)>x is the average, defined in equation G21, of the function F(Rσ) for each x-axis Qphonon node with position Rσ a shown in
From the k-space versions of equations G3 and G4
The low-temperature resistivity of La2-xSrxCuO4 is the sum of two terms. 65 One term is linear in T and the other is proportional to T2. At high temperatures, both terms become linear in T. Previously, we showed 13 that the doping evolution of these two terms can be explained by phonon scattering and simple counting of the number of metallic sites and the number of overlapped plaquettes, as a function of doping. The contribution of these phonons on Tc must be included in our Eliashberg calculation.
The power law dependence of the two terms in the resistivity restricts the form of their electron-phonon spectral functions, α2F1 and α2F2 for the linear and T2 contributions, respectively. From Fermni's Golden Rule, the electron scattering rate is
where nB (Ω) is the Bose-Einstein distribution nB(ω)=: 1/[exp(ω/T)−1]. The factor of two in front of the integral cones from the absorption and emission of phonons. α2F is zero for Ω greater than the highest phonon energy.
At high temperatures, nB(Ω)≈T/Ω leading to h/T(k)≈2πλkT, where
and α2F(k, Ω)=Σk, α2F(k, k′, Ω). λk is called the mass-enhancement factor. 16 The slope of the high-temperature scattering rate can be obtained from the resistivity. Hence, the mass-enhancement can be computed from experiment.
At low-temperatures, the Bose-Einstein distribution cuts the integral in the scattering rate off at Ω˜T. If α2F˜Ωn, then
The low-temperature T2 scattering rate is known to be isotropic in k-space, 66 and thereby it must scale as ˜Ω from equation G31. From the low-temperature resistivity experiments65, we showed the T2 resistivity term was proportional to (1−N4M/NTot), where NTot is the total number of Cu sites (metallic plus insulating AF sites) and N4M is the number of metallic Cu sites that are in non-overlapping plaquettes. Therefore, α2F2(k, k′, Ω) is of the form
where C2 is a constant to be determined. ωD is the Debye energy. α2F2=0, for Ω>ωD.
The low-temperature T scattering rate is zero along the diagonals, kT=±ky, and large at k=(0, ±π), (±π, 0). 66 a2F1 is independent of Ω from equation G31. The scattering rate in equation G31 logaritimically diverges for small Ω. Hence, it must be cutoff at some minimum, ωmin. For temperatures below ωmin, the scattering rate cannot be linear in T. Previously, we showed that ωmin≈1 K 13 In this paper, we fix ωmin=1 K. See Appendix F.
The spectral function, α2F1(k, k′, Ω) is of the form
where C1 is a constant and α2F1=0 outside of the range ωmin<Ω<ωD.
The anisotropy factor, D(k), is
where the denominator is the average over the Fermi surface of the numerator.
The average of a function, f(k), over the Fermi surface is defined as
Thus <D(k)>=1.
The constants C1 and C2 can be determined as follows. The average around the Fermi surface of the scattering rate at high-temperatures is 1/τ=2πλtrT. From resistivity measurements,67λtr≈0.5. A fraction (N4M/NTot)λtr of λtr comes from <α2F1>and the fraction (1−N4M/NTot)λtr comes from <α2F2>leading to
Substituting C1 and C2 in terms of λtr back into α2F1 and α2F2 yields
α2F1=0 outside of the range ωmin<Ω<ωD and α2F2=0 for Ω>ωD.
We solve for λ(k, k′, ωn)or i=1, 2 using the k-space version of equation G4
The Eliashberg equations G11, G12, and G13 for a single CuO2 layer per unit cell are generalized to multi-layer cuprates by changing k and k′ to bk and b′k′, respectively, in the single layer Eliashberg equations.
where b and b′ are band indicies. They vary from 1 to L, where L, is the number of CuO2 layers per unit cell. A unit cell contains L Cu atoms, one in each layer. The k vector is a 2D vector. N(0) is the total density of states per spin
There is a Bloch k state for each layer, l, given by ϕ(lk). The band eigenfunctions are
The coefficients, Abl(k), are real since the inter-layer hopping matrix elements are real. The matrix element for hopping between adjacent layers is
<ϕ(l±1k′)|Hinter|ϕ(k)>=−t(l±1,l,k)δ,k′k (G48)
where
t(l±1,l,k)=αtz(¼)[cos(kxa)−cos(kya)]2, (G49)
and α is the product of the fraction of metallic sites in layers l and l±1. See Appendix F Table II.
The eigenvectors Ψ(bk) of equations G47 and G48 are independent of the magnitude of t(l±1, l, k). Thus Abl(k) is independent of k,
Abl(k)=Abl, (G50)
The eigenstates, Ψ(bk), are normalized leading to
The electron-phonon spectral function α2F2(bk, b′k′, Ω) is
N4M(l) is the number of metallic Cu sites in layer l that are in non-overlapping plaquettes, L is the total number of CuO2 layers per unit cell, and Nxy is the total number of Cu sites (metallic plus insulating AF) in a single CuO2 layer. Hence, LNxy is the total number of Cu sites in the crystal and n4M is the total fraction of metallic Cu sites over all the CuO2 layers, α2F2=0 for Ω>ωD.
For the electron-phonon spectral function, α2F1, that leads to the low-temperature linear resistivity, define the anisotropy factor, D(bk) as
where the denominator is the average over all the L Fermi surfaces of the numerator.
The average of a function, f(bk), over all the Fermi surfaces is defined as
The phonon modes in α2F1 are 2D. Hence the form of the spectral function between layers l and l′ is of the form,
Expanding the eigenstates Ψ(bk) in terms of ϕ(k) from equation G47 leads to
where ωmin<Ω<ωD·α2F1=0, for Ω<ωminor Ω>ωD.
Hence,
The multi-layer expressions for λsurf(bk, b′k′, ωn) and λ⊥(bk, b′k′, ωn) are similar to their single-layer counterparts with a modified definition for the averaging in their respective J(x) and J(y) functions.
where <F(Rσ)>x is the multi-layer average of the function F(Rσ) defined for each planar surface O on the x-axis with position Rσ as shown in
and <F1(Rσ)>x is the average over layer l, as defined in equation G21. Similarly for <F(Rσ)>y. The expression in equation G63 for Jsurf(y) is identical to the expression for Jsurf(x) in equation G62 with x replaced by y.
Hence, λsurf(bk, b′k′, ωn) is
where NM is the total number of metallic Cu sites NM=Σ1N1M, and N1M is the total number of metallic Cu sites In layer l.
For λ⊥(bk, b′k′, ωn), the corresponding J⊥(x) and J⊥(y) functions are
J⊥(x)(bk,b′k′)=δ∈2x−2 δ∈[δt(+)+δf(−)]x(cos k′xa+cos kxa)
+[δt(+)+δt(−)]x(cos kxJa+cos kxa)2
+[δt(+)−δt(−)]x(sin kxJa−sin kxa)2 (G66)
J⊥(y)(bk,b′k′)=δ∈2y−2 δ∈[δt(+)+δt(−)]y(cos k′ya+cos kya)
+[δt(+)+δt(−)]y(cos k′ya+cos kya)2
+[δt(+)−δt(−)]y(sin k′ya−sin kya)2 (G67)
All averages in equations G66 and G67 are defined in equation G64.
Hence λ⊥(bk, b′k′, ωn) is
The band structure, ∈k, and all the parameters used the solve the Eliashberg equations for Tc are described in Appendix F. Here, we discuss the computational issues necessary to obtain an accurate Tc.
The two planar interface O atom phonon modes in
For each doping value, we generate a 2000×2000 lattice of doped plaquettes. All O atoms that contribute to λsurf and λ⊥ are identified along with the nature of the corresponding Cu sites (edge, convex, or concave, as shown in
All four electron-phonon pairing functions, λ1, λ2, λsurf, and λ⊥ can be written in the following product form λ(k, k′, ωn)=λ′(k k′)F(ωn). The product separation, λ=λ′F, leads to a large reduction in the storage requirements because λ′ and F can be computed once and saved, and the product computed on the fly.
We discretize the Fermi surface by choosing 10 uniformly spaced (in angle) k-points in the 45° wedge bounded by the vectors along the x-axis, (π, 0), and the diagonal, (π, π), leading to a total of 80 k-points over the full Fermi surface. Increasing the number of k-points further led to <0.1 K change in the calculated Tc.
Fermi surface weights, Wbk, are computed at each bk-point using the Fermi velocity evaluated from the band structure, ∈k. By rescaling the gap function, Δ(bk, ωn),
the Eliashberg equations can be turned into an eigenvalue equation with a real symmetric matrix. 16 Since Tc occurs when the largest eigenvalue reaches one, we can perform a Lanczos projection. We compute Tc by bracketing. All the Tc values found in this paper are accurate to ±0.3K. For approximate timings, a, full Tc-dome is computed on a small workstation in ≈5-10 minutes.
Presented herein is a method of fabricating high temperature superconductors. The validity of the method is illustrated using a microscopic theory of cuprate superconductivity based on the results of the chemist's ab initio hybrid density functional methods (DFT). Hybrid DFT finds a localized out-of-the-CuO2 hole is formed around a negatively charged dopant. The doped hole resides in a four-Cu-site plaquette. The out-of-plane hole destroys the antiferromagnetism inside the plaquette and creates a tiny piece of metal there. Hence, the crystal is inhomogeneous on the atomic-scale with metallic and insulating regions.
In contrast, the physicist's DFT methods (LDA and PBE) find a delocalized hole residing in the CuO2 planes as a consequence of doping. As discussed herein, the chemist's result is to be trusted over the physicist's result because it corrects the spurious self-Coulomb repulsion of the electrons found in the physicist's density functionals.
Due to dopant-dopant Coulomb repulsion, doped plaquettes do not overlap unless the doping is sufficiently high that overlap cannot be avoided. Non-overlapping plaquettes have a dynamic Jahn-Teller distortion of the out-of-the-plane hole (called a “fluctuating dumbbell”). The dumbbells inside an overlapped plaquette become static Jahn-Teller distor-tions, or “frozen”.
The above model explains a vast swath of normal state phenomenology using simple counting of the sizes of the metallic region, the insulating AF region, and the number of fluctuating and frozen dumbbells. As illustrated herein, superconducting pairing arises from planar Oxygen atoms near the interface between the metallic and insulating regions. These planar O atom phonon modes explain the large Tc˜100 K, the Tc-dome as a function of doping, the changes in Tc as a function of the number of CuO2 layers per unit cell, the lack of a Tc isotope effect at optimal doping, and the D-wave superconducting pairing wavefunction (or superconducting gap symmetry).
Generally, with phonon superconducting pairing, an isotropic S-wave pairing wavefunction is favored over a D-wave pairing wavefunction. However, the present disclosure shows that the fluctuating dumbbells drastically raise the Cooper pair Coulomb repulsion, leading to the observed D-wave pairing wavefunction. By overlapping the plaquettes and freezing the dumbbells, the S-wave pairing wavefunction becomes favored over the D-wave pairing wavefunction. The present disclosure shows that the S-wave Tc is in the range of ≈280-390 K when the D-wave Tc≈100 K.
The following references are incorporated by reference herein.
This concludes the description of the preferred embodiment of the present invention. The foregoing description of one or more embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. It is intended that the scope of the invention be limited not by this detailed description, but rather by the claims appended hereto.
This application is a continuation under 35 U.S.C § 120 of U.S. Utility patent application Ser. No. 15/896,697, filed on Feb. 14, 2018, entitled “HIGH TEMPERATURE SUPERCONDUCTING MATERIAL” by Jamil Tahir-Kheli, which application claims the benefit under 35 U.S.C. Section 119(e) of co-pending and commonly-assigned U.S. Provisional Patent Application Ser. No. 62/458,740, filed on Feb. 14, 2017, by Jamil Tahir-Kheli, entitled “HIGH TEMPERATURE SUPERCONDUCTING MATERIALS,” CIT-7708); both of which applications are incorporated by reference herein.
This invention was made with government support under Grant No, N00014-18-1-2679 awarded by the Office of Naval Research. The government has certain rights in the invention.
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Decision to refuse a European Application dated Apr. 16, 2024 for EP application No. 18754979.5. |
Number | Date | Country | |
---|---|---|---|
20230397508 A1 | Dec 2023 | US |
Number | Date | Country | |
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62458740 | Feb 2017 | US |
Number | Date | Country | |
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Parent | 15896697 | Feb 2018 | US |
Child | 18162817 | US |