Claims
- 1. An amorphous 1-butene/propylene copolymer comprising:
- from 25 to 50 wt % propylene and from 75 to 50 wt % 1-butene, the copolymer containing no heptane insolubles and having a glass transition temperature between -35.degree. C. and -39.degree. C., no determinable heat of fusion, a tensile strength of between 300 psig and 900 psig, and an elongation at break between 300% and 669%.
- 2. The copolymer of claim 1 wherein the copolymer has a storage modulus between 10 and 14.
- 3. The copolymer of claim 1 wherein the copolymer contains between 28% and 40% BB dyads.
- 4. An amorphous 1-butene/propylene copolymer comprising:
- from 25 to 50 wt % propylene and from 75 to 50 wt % 1-butene, the copolymer containing no heptane insolubles and having a glass transition temperature between -35.degree. C. and -39.degree. C., a melt viscosity at 375.degree. F. between 5900 and 12050 cps, no determinable heat of fusion, a tensile strength of between 300 psig and 900 psig, and an elongation at break between 300% and 669%.
- 5. The copolymer of claim 4 wherein the copolymer has a ring and ball softening point between 193.degree. F. and 240.degree. F.
- 6. The copolymer of claim 4 wherein the copolymer has a storage modulus between 10 and 14.
- 7. The copolymer of claim 4 wherein the copolymer contains between 28% and 40% BB dyads.
- 8. An amorphous 1-butene/propylene copolymer comprising:
- from 25 to 50 wt % propylene and from 75 to 50 wt % 1-butene, the copolymer containing no heptane insolubles and having a glass transition temperature between -35.degree. C. and -39.degree. C., a ring and ball softening point between 193.degree. F. and 240.degree. F., no determinable heat of fusion, a tensile strength of between 300 psig and 900 psig, and an elongation, at break between 300% and 669%.
- 9. The copolymer of claim 8 wherein the copolymer has a storage modulus between 10 and 14.
- 10. The copolymer of claim 8 wherein the copolymer contains between 28% and 40% BB dyads.
RELATED APPLICATION
This is a divisional application of U.S. application Ser. No. 08/226,280, filed Apr. 11, 1994, now abandoned which is a Continuation-In-Part of prior application Ser. No. 07/941,916, filed Sep. 8, 1992 and issued as U.S. Pat. No. 5,302,675 on Apr. 12, 1994.
US Referenced Citations (6)
Foreign Referenced Citations (1)
Number |
Date |
Country |
335484 |
Oct 1989 |
EPX |
Divisions (1)
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Number |
Date |
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Parent |
226280 |
Apr 1994 |
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Continuation in Parts (1)
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Number |
Date |
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Parent |
941916 |
Sep 1992 |
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