Claims
- 1. A high density fluid ejection device, comprising:a substrate defining at least one fluid feed slot; and at least 120 fluid firing resistors formed on a surface of the substrate about the ink feed slot, wherein each of the fluid firing resistors has a resistance of at least 70 ohms.
- 2. The high density fluid ejection device of claim 1 wherein turn-on energy of each fluid firing resistor is approximately 1 μjoule.
- 3. The high density fluid ejection device of claim 2 wherein the at least one fluid feed slot includes a first side and an opposite second side and wherein each of the first and second sides includes at least 70 fluid firing resistors.
- 4. The high density fluid ejection device of claim 3 wherein the fluid firing resistors at the first side of the at least one fluid feed slot are staggered with respect to the fluid firing resistors at the second side of the at least one fluid feed slot.
- 5. The high density fluid ejection device of claim 1 wherein the at least one fluid feed slot is three fluid feed slots with each slot having at least 120 fluid firing resistors formed on a surface of the substrate thereabout.
- 6. The high density fluid ejection device of claim 1 wherein a passivation layer overlies each fluid firing resistor.
- 7. A high density fluid ejection device, comprising:a substrate having a plurality of fluid firing resistors formed thereon; a thermal barrier layer underlying each resistor; and a passivation layer overlying each resistor, wherein the thermal resistance of the passivation layer relative to the thermal barrier layer is tuned to allow an electrical impulse equal to or less than 1.4 μjoules to eject a drop of fluid from the resistor.
- 8. The high density fluid ejection device of claim 7 wherein a plurality of firing resistors includes:at least 400 fluid firing resistors formed on a surface of the substrate at a density of at least 6 fluid firing resistors per square millimeter.
- 9. A high density fluid ejection device, comprising:a substrate defining at least two fluid feed slots; and at least 400 fluid firing resistors formed on a surface of the substrate about the at least two fluid feed slots at a density of at least 6 fluid firing resistors per square millimeter.
- 10. The high density fluid ejection device of claim 9, and further including:a passivation layer overlying each resistor, wherein the thermal resistance of the passivation layer relative to the thermal barrier layer is tuned to allow an electrical impulse equal to or less than 1.4 μjoules to eject a drop of fluid from the resistor.
- 11. An ink ejection device, comprising:a substrate defining a plurality of firing chambers and a fluid delivery channel for delivering a fluid to the firing chambers; a plurality of fluid heating elements positioned within the plurality of firing chambers; and barrier features on the substrate positioned between the firing chambers and the fluid delivery channel, the barrier features defining a first series of pinch points at entrances to the firing chambers and defining a second series of pinch points between the first series of pinch points and the fluid delivery channel, the second series of pinch points in conjunction with the first series of pinch points mitigating oscillation of the fluid upon refilling of the firing chambers subsequent to firing of the fluid heating elements to produce ejected fluid drops of consistent volume.
- 12. The ink ejection device of claim 11 wherein the barrier features are defined by the substrate.
- 13. The ink ejection device of claim 11 wherein each pinch point of the first series of pinch points has a linear dimension of less than thirty microns.
- 14. The ink ejection device of claim 11 wherein each pinch point of the second series of pinch points has a linear dimension of less than thirty microns.
- 15. The ink ejection device of claim 11 wherein the barrier features define a third series of pinch points between the first and second series of pinch points, the third series of pinch points in conjunction with the first and second series of pinch points mitigating.
- 16. The ink ejection of claim 15 wherein the third series of pinch points includes:a first multiplicity of pinch points adjacent to the first series of pinch points; and a second multiplicity of pinch points adjacent to the second series of pinch points.
- 17. The ink ejection device of claim 15 wherein each pinch point of the third series of pinch points has a linear dimension of less than thirty microns.
- 18. The ink ejection device of claim 11 wherein the plurality of fluid heating elements is at least 400 fluid heating elements having a density of at least six fluid heating elements per square millimeter.
- 19. The ink ejection device of claim 11 wherein the consistent volume of each drop is less than 6.5 ng.
- 20. An ink ejection substrate, comprising:a fluid delivery channel; a plurality of fluid heating elements; a firing chamber surrounding each fluid heating element and receiving a fluid from the fluid delivery channel, each firing chamber including: an inner pinch point at an entrance to the firing chamber; an outer pinch point adjacent to the fluid delivery channel; and an intermediate pinch point between the inner and outer pinch points, the inner, outer and intermediate pinch points acting together to overdamp the firing chamber to produce a fluid drop having a volume of less than 6.5 ng.
- 21. The ink ejection substrate of claim 20 wherein with the inner pinch point is a single pinch point.
- 22. The ink ejection substrate of claim 21 wherein with the intermediate pinch point is a pair of pinch points.
- 23. The ink ejection substrate of claim 22 wherein with the outer pinch point is at least three pinch points.
- 24. The ink ejection substrate of claim 20 wherein a linear dimension of the outer pinch point is substantially equal to a linear dimension of the intermediate pinch point.
- 25. The ink ejection substrate of claim 24 wherein a linear dimension of the inner pinch point is greater than the linear dimensions of each of the outer and intermediate pinch points.
CROSS REFERENCE TO RELATED APPLICATIONS
This is a continuation of application Ser. No. 09/385,297 filed on Aug. 30, 1999 now U.S. Pat. No. 6,309,052, which is hereby incorporated by reference herein.
This application is a continuation-in-part of U.S. patent application Ser. No. 09/303,250 now U.S. Pat. No. 6,231,168, filed on Apr. 30, 1999 by Maze et al. and entitled “INK JET PRINTHEAD WITH FLOW CONTROL MANIFOLD SHAPE”.
US Referenced Citations (18)
Continuations (1)
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09/385297 |
Aug 1999 |
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09/938189 |
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Continuation in Parts (1)
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09/303250 |
Apr 1999 |
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09/385297 |
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