Unless otherwise indicated, the foregoing is not admitted to be prior art to the claims recited herein and should not be construed as such.
Radio frequency (RF) circuits typically require high power switching of passive devices for power control, multi-band tuning, and so on. RF applications (e.g., mobile communication devices and the like) often have space constraints that limit the amount of silicon area that is available to the designer.
Operating a switch at high power exposes the switch to high voltage swings across its source, gate, drain, and bulk terminals. High voltage swings present a challenge in maintaining the switch in the OFF state, thus affecting high voltage switching reliability.
With respect to the discussion to follow and in particular to the drawings, it is stressed that the particulars shown represent examples for purposes of illustrative discussion, and are presented in the cause of providing a description of principles and conceptual aspects of the present disclosure. In this regard, no attempt is made to show implementation details beyond what is needed for a fundamental understanding of the present disclosure. The discussion to follow, in conjunction with the drawings, make apparent to those of skill in the art how embodiments in accordance with the present disclosure may be practiced. In the accompanying drawings:
In the following description, for purposes of explanation, numerous examples and specific details are set forth in order to provide a thorough understanding of the present disclosure. It will be evident, however, to one skilled in the art that the present disclosure as expressed in the claims may include some or all of the features in these examples, alone or in combination with other features described below, and may further include modifications and equivalents of the features and concepts described herein.
In some embodiments, the circuit 100 may an output circuit comprising first and second transistor devices M1, M2 connected in series. In a particular embodiment, M1 and M2 are field effect transistors (FETs), and in particular PMOS type FET devices. However, it will be appreciated that in other embodiments M1 and M2 may be NMOS devices. Transistors M1 and M2 may be enhancement type transistors or depletion type transistors.
In the embodiment shown in
The circuit 100 may include first and second inductive elements L to couple the input terminals INP, INM to the output terminals OUT1, OUT2. In the embodiment shown in
In accordance with the present disclosure, the circuit 100 may include a sampling circuit 102. Inputs to the sampling circuit 102 may be connected to sense the input signals (e.g., 12a, 12b). Inputs to the sampling circuit 102 may be connected to sense points 104, 106, for example. In accordance with the present disclosure, the sense points 104, 106 may be any connection that allow the sampling circuit 102 to sense the input signals. Referring, for example, to
Returning to
In accordance with the present disclosure, the sampling 102 can generate voltages VG1, VG2, VB1, VB2 that are proportional to the voltage swing Vsig at the input terminals INP, INM. In some embodiments, the levels of the voltages VG1, VG2, VB1, VB2 may be produced in accordance with the following relationship:
bias voltage=α×Vsig+k,
where α is a real constant,
k is a real constant,
Vsig is the voltage swing (e.g., peak-to-peak value) at the input terminals,
VDD is a power rail voltage.
In some embodiments, the voltages VG1 and VG2 may be connected to the gate terminals of M1 and M2, respectively. Further in accordance with some embodiments, the voltages VB1 and VB2 may be connected to the bulk terminals of M1 and M2, respectively. The term “bulk terminal” can be variously referred to as the body terminal, base terminal, substrate terminal, the “fourth” terminal, and so on.
Refer now to
Returning to
In the embodiment shown in
In accordance with the present disclosure, the output 212 may be provided to the gate terminals G and bulk terminals B of transistors M1, M2 to bias the gate and bulk terminals, for example, using resistors RG and RB. Accordingly, the gate terminals G and bulk terminals B of transistors M1 and M2 can be biased at a voltage level (VDD+0.64VDD). Consequently, for transistor M1, the potential at gate terminal G and the potential at bulk terminal B will always be 0.64VDD above the potential at the drain terminal D of M1. This ensures proper reverse biasing of the bulk diode and turn OFF of M1. Similarly, the potential at gate terminal G and the potential at bulk terminal B of transistor M2 will always be 0.64VDD above the potential at the source terminal S of M2 to ensure proper reverse biasing of the bulk diode and turn OFF of M2.
Circuits in accordance with the present disclosure ensure reliability as the voltage across any two terminals in the OFF mode is less than VDD. Circuits in accordance with the present disclosure require fewer switches than conventional solutions to achieve the same, or better, turn OFF performance. Since the gate and bulk are consistently maintained at a higher voltage level than the source/drain, switches used in circuits according to the present disclosure exhibit better distortion performance in the OFF state than when used in conventional solutions.
As shown in
The above description illustrates various embodiments of the present disclosure along with examples of how aspects of the particular embodiments may be implemented. The above examples should not be deemed to be the only embodiments, and are presented to illustrate the flexibility and advantages of the particular embodiments as defined by the following claims. Based on the above disclosure and the following claims, other arrangements, embodiments, implementations and equivalents may be employed without departing from the scope of the present disclosure as defined by the claims.