Cooling design for electronics, particularly portable electronics such as notebook computers, is increasingly difficult as chipset power dissipation continues to rise. Conventional methods of forced air cooling and liquid cooling have proven inadequate and/or difficult to implement.
The following detailed description can be read in connection with the accompanying drawings in which like numerals designate like elements and in which:
There is shown in
Turning again to
The display unit 6 is supported at and attached to the main unit 4 at respective edge regions 16, 16′ via one or more hinges. Thus, the display unit 6 is movable M about the one or more hinges between a closed position laid on the main unit 4 so as to cover the keyboard 8 from above and an open position at which the display unit 6 is erected so as to expose the keyboard 8 and the LCD panel 14.
The one or more hinges can provide mechanical and/or electrical connection between the display unit 6 and the main unit 4. For example, a first hinge can be a friction hinge 20. The friction hinge 20 holds the display unit 6 in a set position upon moving of the display unit 6 by a user. In the embodiment shown in
To cool the example electronic apparatus, a liquid coolant path 30 exists between the display unit 12 and the main unit 4. In the embodiment shown in
The liquid coolant path 30 traverses the separation between the display unit 6 and the main unit 4 via one or more hinges that includes a portion of the liquid coolant path 30. The hinge(s) incorporating the coolant path 30 between the display unit 6 and the main unit 4 can be the same hinge as that providing mechanical and/or electrical connection between the display unit 6 and the main unit 4 or can be a separate hinge(s). In the embodiments shown in
An embodiment of a hinge 50 that includes the liquid coolant path is shown in
In a closed loop system, the two coolant flow paths 60,60′ are the portion of the liquid coolant path 30 from the primary heat exchanger 32 to the secondary heat exchanger 34 and the portion from the secondary heat exchanger 34 to the primary heat exchanger 32 that are associated with or pass through the hinge 50 or its associated structure, such as a protruding inlet and/or outlet. The inlets and outlets of the hinge 50 are suitably associated with, and connected to or continuous with, the coolant paths to and from the primary heat exchanger 32 housed, for example, in the main unit 4 and the coolant paths to and from the secondary heat exchanger 34 housed, for example, in the display unit 6.
A conduit 66,66′ runs between the respective inlets and outlets. In one embodiment, the conduit 66,66′ is a length of flexible tube but can alternatively be constructed of any suitable material that can move with operation of the hinge. In one embodiment, the conduit 66, 66′ is jointless and runs continuously from the primary heat exchanger 36 in the main unit 4, through the hinge 50, to the secondary heat exchanger 34, through the hinge 50 and back to the primary heat exchanger 36. In another embodiment, the conduit 66, 66′ is flexible tubing in the hinge 50 and is connected within the hinge 50 to rigid connection, such as first connecting joint 62, 62′ and second connecting joint 64, 64′. Here, the conduit 66, 66′ is flexible and avoids tight radius turns or other wear causing paths and arrangements. However, because the connectors are stationary relative to the respective portion of the shroud in which it is located and in this region do not need to flex during operation, they can be rigid, e.g., metal or plastic tubing or piping, and can have tight radius bends. In this embodiment or in other embodiments needing a connection, the conduit can be connected to the connecting joints by any suitable means. For example, a clamp, a compression fitting, or a direct bonding such as soldering can be used, depending on the respective materials of the conduit and the connecting joints.
An alternative embodiment without connectors is shown in
The conduits 66,66′ run between the respective inlet and outlet of each coolant flow path 60,60′ and are positioned within a tube guide 68 in each of the guide plates 54. An exemplary radial cross-section of the hinge 50 showing the conduits 66,66′ positioned within a tube guide 68 of the guide plate 54 is illustrated in
Turning again to the longitudinal cross-section of the hinge 50 shown in
The hinge 50 allows relative movement of the two parts of an electronic apparatus to which it is attached. For example, the portion of the hinge 50 with the inlet and outlet of the coolant paths that lead to the primary heat exchanger can be connected to a main unit 4 of a portable computer and the portion of the hinge 50 with the inlet and outlet of the coolant paths that lead to the secondary heat exchanger can be connected to a display unit 6 of a portable computer. Such a connection is shown in different embodiments in
In the embodiment in
In the embodiment in
In some embodiments and as shown in
For example,
In another embodiment and as shown in
Views of other positions of the embodiment of the hinge 50 in
In general, the rotation and twisting of the conduits 66,66′ in different embodiments of the hinges 50 are minimized by passing the inlet and outlets through the ends 100 of the shroud 58 or by selecting the internal connecting geometry of the first connecting joint 62,62′ and second connecting joint 64,64′ to minimize the stretching and twisting in a particular position, e.g., the position of the display unit and the main unit during the expected greatest usage time of the portable computer, relative to other less used positions of the display unit and the main unit. The position of minimized stretching and twisting is considered the neutral position of the hinge. From the neutral position, the hinge (or the shroud of the hinge) is rotatable within a range of 0° to fully opened, e.g., approximately (±10%) 135°. Of course, other neutral positions can be selected. To minimize the twisting and stretching of the conduits, the neutral position can be varied. Depending on the deviation form the closed position of the selected neutral position, the hinge will rotate more or less in each of the positive and negative rotational directions.
To facilitate minimizing the stretching and twisting of the conduits 66,66′, at least some of the guide plates are independently rotatable about the spindle. For example, a first guide plate and a second guide plate can independently rotate about the spindle (with other guide plates either fixed or themselves independently rotatable, alternatively all guide plates independently rotatable) to helically position the flexible tubes when the first portion of the shroud is rotated about the spindle relative to the second portion of the shroud. While not all guide plates need to be independently rotatable, independent rotation of the guide plates allows for the conduits to find their own position of minimum stretching and twisting.
In another embodiment, the angular rotation of each spacer is limited to a certain range. This feature could be used to limit the number of degrees each guide plate can rotate. In addition, this feature can facilitate distributing the rotation of the helical conduit evenly across the entire axial length of the hinge. As an example, this feature could be accomplished by adding a rectangular post on one end of each rotating element, and coaxial to the spindle. This post would mate with a “bowtie” shaped socket on each rotating element in such a way to allow free rotation within a limited number of degrees. After the “stop” is reached the rotation would be transferred to the next rotating element.
The spacers 52 and guide plates 54 are shown as alternating along the longitudinal length of the spindle 56. Alternatively, the spacers 52 and guide plates 54 can be in non-alternating sequence, or in other sequences as desired to obtain suitable movement of the coolant path within the hinge. Also, the guide plates 54 and spacers 52 are illustrated as separate structures. However, the spacers can alternatively be formed as part of the guide plates or the guide plates or spindle can be modified to incorporated a structure that can function to axially space successive guide plates.
The pump 36 can be any suitable pump. In an exemplary embodiment, the pump is a type that does not have any rotating parts. To maintain the same or smaller form factor for the electronic device, the pump can occupy a space that is the same or less than that of the fan or other cooling system that it replaces. An example of a suitable pump is a piezoelectric pump, such as is available from Alps Electric Co., Ltd. of Tokyo Japan. The Alps pump is a piezoelectric diaphragm type pump with two chambers and 4 reed valves and has dimensions of 34 mm×37 mm×8 mm, making it smaller than most notebook fans. This pump weighs less than 25 g, and runs on 5 VDC with a power consumption of less than 1.5 W. It can move 250 ml/min at free delivery and 11-ml/min against 10 kPa of back pressure, and has a 44000 hour rated life. The pump is rated for use between 0° C. and 60° C. operating temperature and is very quiet at ≦25 dBA.
The pump is just one element of a complete cooling system. A practical liquid cooled notebook requires a number of other components. For example, a secondary heat exchanger can be mounted behind the LCD screen as shown in
Liquid cooling can also be adapted to liquid cooling within blade server products. Here, a pump can be mounted within a blade and power a “slave’ cooling loop. Heat could be exchanged with a central cooling solution in the multi-blade housing a dry plate heat exchanger. This would allow blades to be used in dusty environments such as remote server closets and mobile platforms.
| Number | Name | Date | Kind |
|---|---|---|---|
| 4040478 | Pogson et al. | Aug 1977 | A |
| 4864523 | Sasaki | Sep 1989 | A |
| 5383340 | Larson et al. | Jan 1995 | A |
| 5394936 | Budelman | Mar 1995 | A |
| 5566048 | Esterberg et al. | Oct 1996 | A |
| 5588483 | Ishida | Dec 1996 | A |
| 5606341 | Aguilera | Feb 1997 | A |
| 5621613 | Haley et al. | Apr 1997 | A |
| 5757615 | Donahoe et al. | May 1998 | A |
| 5781409 | Mecredy, III | Jul 1998 | A |
| 5832987 | Lowry et al. | Nov 1998 | A |
| 5847925 | Progl et al. | Dec 1998 | A |
| 5880929 | Bhatia | Mar 1999 | A |
| 5910883 | Cipolla et al. | Jun 1999 | A |
| 5975195 | Lowry et al. | Nov 1999 | A |
| 6026888 | Moore | Feb 2000 | A |
| 6069791 | Goto et al. | May 2000 | A |
| 6070654 | Ito | Jun 2000 | A |
| 6078499 | Mok | Jun 2000 | A |
| 6097596 | Cipolla et al. | Aug 2000 | A |
| 6134106 | Tao et al. | Oct 2000 | A |
| 6175493 | Gold | Jan 2001 | B1 |
| 6189602 | Tanahashi et al. | Feb 2001 | B1 |
| 6226177 | Rude et al. | May 2001 | B1 |
| 6250378 | Kobayashi | Jun 2001 | B1 |
| 6253836 | Mitchell | Jul 2001 | B1 |
| 6288896 | Hsu | Sep 2001 | B1 |
| 6341062 | Patel | Jan 2002 | B1 |
| 6377452 | Sasaki et al. | Apr 2002 | B1 |
| 6377454 | Inoue et al. | Apr 2002 | B1 |
| 6449149 | Ohashi et al. | Sep 2002 | B1 |
| 6493226 | Noguchi et al. | Dec 2002 | B1 |
| 6507488 | Cipolla et al. | Jan 2003 | B1 |
| 6507490 | Sasaki et al. | Jan 2003 | B2 |
| 6510052 | Ishikawa et al. | Jan 2003 | B2 |
| 6519147 | Nakagawa et al. | Feb 2003 | B2 |
| 6519148 | Nakagawa et al. | Feb 2003 | B2 |
| 6556439 | Shibasaki | Apr 2003 | B2 |
| 6587336 | Chu et al. | Jul 2003 | B2 |
| 6728102 | Ishikawa et al. | Apr 2004 | B2 |
| 6751095 | Ishikawa et al. | Jun 2004 | B2 |
| 6771498 | Wang et al. | Aug 2004 | B2 |
| 6791834 | Nakagawa et al. | Sep 2004 | B2 |
| 6809927 | Ohashi et al. | Oct 2004 | B2 |
| 6833992 | Kusaka et al. | Dec 2004 | B2 |
| 6845011 | Tomioka et al. | Jan 2005 | B2 |
| 6900990 | Tomioka | May 2005 | B2 |
| 6920043 | Ishikawa et al. | Jul 2005 | B1 |
| 6950303 | Neho et al. | Sep 2005 | B2 |
| 6989990 | Malone et al. | Jan 2006 | B2 |
| 7116552 | Wu | Oct 2006 | B2 |
| 7232313 | Shinoda | Jun 2007 | B1 |
| 7707691 | Jeong | May 2010 | B2 |
| 20010022720 | Mitchell | Sep 2001 | A1 |
| 20020001176 | Shibasaki | Jan 2002 | A1 |
| 20020008960 | Mitchell | Jan 2002 | A1 |
| 20020051339 | Ohashi et al. | May 2002 | A1 |
| 20040070940 | Tomioka et al. | Apr 2004 | A1 |
| 20040070942 | Tomioka et al. | Apr 2004 | A1 |
| 20040080908 | Wang et al. | Apr 2004 | A1 |
| 20050180107 | Naganawa et al. | Aug 2005 | A1 |
| 20050225952 | Takagi | Oct 2005 | A1 |
| 20060005549 | Ishinabe et al. | Jan 2006 | A1 |
| 20070019370 | Noh | Jan 2007 | A1 |
| 20070070599 | Chang | Mar 2007 | A1 |
| 20070221360 | Hayashi et al. | Sep 2007 | A1 |
| 20080266798 | Eckberg et al. | Oct 2008 | A1 |
| Number | Date | Country |
|---|---|---|
| 2002-014747 | Jan 2002 | JP |
| 2004-040123 | Feb 2004 | JP |
| 2005-190091 | Jul 2005 | JP |
| Number | Date | Country | |
|---|---|---|---|
| 20090279258 A1 | Nov 2009 | US |