Claims
- 1. A holding structure of an electronic component comprising:
a first resin mold formed by resin insert molding with a terminal, the first resin mold possessing a positioning portion for positioning the electronic component to be electrically connected to the terminal; and a second resin mold formed by resin insert molding with the terminal and covering the first resin mold and the electronic component, the electronic component being positioned by the first resin mold and being electrically connected to the terminal.
- 2. A holding structure of an electronic component according to claim 1, wherein the electronic component is disposed in the positioning portion.
- 3. A holding structure of an electronic component according to claim 2, wherein the positioning portion possesses an approximately cup shape for disposing the electronic component therein.
- 4. A holding structure of an electronic component according to claim 2, wherein the positioning portion is an approximately cup shaped portion possessing an inner wall surface having at least the same width and depth as the width and depth of a body of the electronic component so as to dispose the electronic component therein.
- 5. A holding structure of an electronic component according to claim 1, wherein the electronic component is a magnetic detecting element arranged at a predetermined position relative to a rotor for changing a generated magnetic flux in response to a rotation angle thereof.
- 6. A holding structure of an electronic component according to claim 2 wherein the electronic component is a magnetic detecting element arranged at a predetermined position relative to a rotor for changing a generated magnetic flux in response to a rotation angle thereof.
- 7. A holding structure of an electronic component according to claim 3 wherein the electronic component is a magnetic detecting element arranged at a predetermined position relative to a rotor for changing a generated magnetic flux in response to a rotation angle thereof.
- 8. A holding structure of an electronic component according to claim 4 wherein the electronic component is a magnetic detecting element arranged at a predetermined position relative to a rotor for changing a generated magnetic flux in response to a rotation angle thereof.
- 9. A method for holding an electronic component comp rising the steps of:
forming a first resin mold by resin insert molding with a terminal, the first resin mold possessing a positioning portion for positioning the electronic component to be electrically connected to a terminal; and forming a second resin mold by resin insert molding with the terminal, the second resin mold covering the first resin mold and the electronic component being positioned by the first resin mold and being electrically connected to the terminal.
- 10. A holding structure of an electronic element comprising:
a first resin mold formed by resin insert molding with a terminal, the first resin mold possessing a positioning portion with a concave shape for positioning the electronic element; and a second resin mold formed by resin insert molding with the terminal covering the electronic component, the electronic component being disposed in the positioning portion and being electrically connected to the terminal.
- 11. A holding structure of an electronic element according to claim 10, further comprising:
a rotation shaft rotatably inserted and supported to the second resin mold via a housing; a yoke coaxially fixed to the rotation shaft and rotated integrally therewith; and plural permanent magnets fixed to an inner periphery of the yoke and surrounding the rotation shaft, wherein the electronic component is arranged coaxially with the rotation shaft.
- 12. A holding structure of an electronic element according to claim 10, further comprising:
a resin member arranged in the yoke for holding the permanent magnet.
- 13. A holding structure of an electronic element according to claim 11, wherein the second resin mold and the permanent magnets are positioned with a predetermined o separately positioned spaced each other.
- 14. A holding structure of an electronic element according to claim 12, wherein the second resin mold and the permanent magnets are separately positioned spaced each other.
- 15. A method for manufacturing a holding structure of an electronic element comprising the steps of:
forming a first resin mold by inserting a terminal, the first resin mold possessing a positioning portion with a concave shape for positioning an electronic component; and forming a second resin mold to be integrated with the electronic component by disposing the electronic component in the positioning portion and by electrically connecting the electronic component to the terminal.
- 16. A method for manufacturing a holding structure of an element according to claim 15,
wherein the positioning portion is defined based upon the terminal.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2001-371774 |
Dec 2001 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is based on and claims priority under 35 U.S.C. §119 with respect to a Japanese Patent Application 2001-371774, filed on Dec. 5, 2001, the entire content of which is incorporated herein by reference.