Claims
- 1. A hologram device comprising hologram elements made from photo-sensitive members subjected to independent exposures and connecting structure to connect the hologram elements with each other so that the hologram elements are integrated so as to obtain a single hologram of an increased size in two dimensions, said connecting structure being arranged on at least one surface of the hologram, said connecting structure comprising a single, seamless structure.
- 2. A hologram device according to claim 1 wherein said connecting structure is a layer formed by laminating an adhesive seamless layer and a base seamless layer.
- 3. A hologram device according to claim 1, wherein said connecting structure is a layer formed by laminating an adhesive layer with a seamed portion and a base seamless layer, the position of said seamed portion of said adhesive layer being nearly the same as the position of the seamed portion of said hologram.
- 4. A hologram device according to claim 1, wherein said connecting structure is a layer formed by laminating an adhesive layer with a seamed portion and a base seamless layer, the position of said seamed portion of said adhesive layer being different from the position of the seamed portion of said hologram.
- 5. A hologram device according to claim 1, wherein said connecting structure is provided on front and back surfaces of said hologram.
- 6. A hologram device according to claim 1, wherein an adhesive layer is provided on a surface on which said integrated hologram is provided.
- 7. A hologram device according to claim 1, wherein said base layer is made from a resin film.
- 8. A hologram device according to claim 1, wherein the thickness of the film of said hologram device after the integration is 500 μm or less.
- 9. A hologram device according to claim 1, wherein a light diffusing body is recorded in the hologram elements.
- 10. A hologram device according to claim 9, wherein the light diffusing body recorded in the hologram element has an area larger than that of the hologram.
- 11. A hologram device according to claim 1, wherein an adhesive is provided for connecting said connecting structure and the hologram.
- 12. A hologram device according to claim 11, wherein said adhesive is made from at least one of an adhesive material or a hot melt material.
Priority Claims (2)
Number |
Date |
Country |
Kind |
8-341661 |
Dec 1996 |
JP |
|
9-203043 |
Jul 1997 |
JP |
|
Parent Case Info
This is a division of application Ser. No. 08/994,361, filed Dec. 19, 1997, now U.S. Pat. No. 6,111,670.
US Referenced Citations (4)
Foreign Referenced Citations (15)
Number |
Date |
Country |
582 229 |
Feb 1994 |
EP |
717 389 |
Jun 1996 |
EP |
828 202 |
Mar 1998 |
EP |
2 640 772 |
Jun 1990 |
FR |
2 104 678 |
Mar 1983 |
GB |
B-52-12568 |
Apr 1977 |
JP |
A-57-6878 |
Jan 1982 |
JP |
A-3-157684 |
Jul 1991 |
JP |
A-5-127022 |
May 1993 |
JP |
6-51239 |
Feb 1994 |
JP |
A-6-56484 |
Mar 1994 |
JP |
A-7-84504 |
Mar 1995 |
JP |
A-7-315893 |
Dec 1995 |
JP |
8-202248 |
Aug 1996 |
JP |
WO 9634322 |
Oct 1996 |
WO |
Non-Patent Literature Citations (1)
Entry |
Patent Abstract of Japan, vol. 096, No. 012, Dec. 26, 1996 & JP 08 202248 A (Nippondenso Co. Ltd.), Aug. 9, 1996. |