Claims
- 1. A process for fabricating homogeneous ductile foil having a composition consisting essentially of 5 to 40 atom percent nickel, 15 to 20 atom percent phosphorus, the balance being copper and incidental impurities, which process comprises forming a melt of the composition and quenching the melt on a chill surface at a rate of at least about 10.sup.5 .degree. C./sec.
- 2. The process of claim 1 in which the foil has a composition consisting essentially of 9 to 11 atom percent nickel, 17 to 19 atom percent phosphorus, the balance being copper and incidental impurities.
- 3. The process of claim 1 in which said foil has a thickness ranging from 0.0010 to 0.0025 inch.
- 4. A process for joining together two or more metal parts which comprises:
- (a) interposing a filler metal between the metal parts to form an assembly, the filler metal having a melting point less than that of any of the parts;
- (b) heating the assembly to at least the melting temperature of the filler metal; and
- (c) cooling the assembly; wherein the improvement comprises employing, as the filler metal, a homogeneous copper based foil having a composition consisting essentially of 5 to 40 atom percent nickel, 15 to 20 atom percent phosphorus, the balance being copper and incidental impurities.
- 5. The process of claim 4 in which the filler metal foil is at least about 50% glassy.
- 6. The process of claim 4 in which the filler metal is 100% glassy.
- 7. The process of claim 4 in which the ductile filler metal foil has a composition consisting essentially of 9 to 11 atom percent nickel, 17 to 19 atom percent phosphorus, the balance being copper and incidental impurities.
- 8. The process of claim 4 in which the total thickness of the foil ranges from 0.0010 to 0.0025 inch.
Parent Case Info
This is a division, of application Ser. No. 88,431, filed Oct. 26, 1979 U.S. Pat. No. 4,253,870, which is a division of application Ser. No. 947,329, filed Oct. 2, 1978 U.S. Pat. No. 4,209,570.
US Referenced Citations (8)
Divisions (2)
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Number |
Date |
Country |
Parent |
88431 |
Oct 1979 |
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Parent |
947329 |
Oct 1978 |
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