Claims
- 1. A method for hot dip plating of a metallic material comprising, prior to plating, dipping a metallic material to be plated in a bath of a fused salt flux, and then dipping the metallic material in a molten metal plating bath to perform hot dip plating thereon, wherein the fused salt flux has a melting temperature at least 5.degree. C. higher than the temperature of the molten metal plating bath.
- 2. The hot dip plating method according to claim 1 wherein the molten metal plating bath is an aluminum-zinc alloy containing at least 40% by weight of Al.
- 3. The hot dip plating method according to claim 2 wherein the molten metal plating bath is an aluminum-zinc alloy containing 45%-60% by weight of Al and 0.5%-2% by weight of Si and wherein the fused salt flux comprises of two or more salts selected from chlorides and fluorides of alkali metals, alkaline earth metals, aluminum, and zinc.
- 4. The hot dip plating method according to claim 3 wherein the fused salt flux is selected from a mixture of cryolite and at least one alkali metal chloride, and a mixture of cryolite, at least one alkali metal chloride, and aluminum fluoride.
- 5. The hot dip plating method according to claim 1 wherein the melting temperature of the fused salt flux is 15.degree. C.-80.degree. C. higher than the temperature of the molten metal plating bath.
- 6. The hot dip plating method according to claim 5 wherein the melting temperature of the fused salt flux is 30.degree. C.-60.degree. C. higher than the temperature of the molten metal plating bath.
- 7. The hot dip plating method according to claim 1 wherein the duration of dipping in the fused salt flux bath is at most 10 seconds.
- 8. The hot dip plating method according to claim 1 wherein the duration of dipping in the molten metal plating bath is at most 10 seconds.
- 9. The hot dip plating method according to claim 1, wherein the metallic material has a coating of the flux after the metallic material is withdrawn from the bath of the fused salt flux and the flux coating is removed from the metallic material when the metallic material is dipped in the molten plating bath, flux floating on the molten plating bath consisting essentially of solid pieces of flux.
- 10. The hot dip plating method according to claim 1, wherein the molten plating bath includes pieces of solid flux floating thereon.
- 11. The hot dip plating method according to claim 1, wherein the metallic material is withdrawn from the bath of the fused salt flux with a flux coating thereon, the flux coating protecting the metallic material from oxidation during transfer to the molten plating bath.
- 12. The hot dip plating method according to claim 1, wherein the bath of the fused salt flux is at a higher temperature than the molten plating bath.
- 13. The hot dip plating method according to claim 1, wherein the metallic material is heated by the bath of the fused salt flux.
- 14. The hot dip plating method according to claim 1, wherein the bath of the fused salt flux is at a temperature above but less than 100.degree. C. above the temperature of the molten plating bath.
- 15. The hot dip plating method according to claim 1, wherein the molten plating bath is at a temperature of 570 to 610.degree. C.
- 16. The hot dip plating method according to claim 1, wherein the metallic material comprises steel sheet, steel wire, shaped steel, steel pipe, a steel fixture, a bolt, a nut or a screw.
- 17. The hot dip plating method according to claim 1, wherein the method further comprises subjecting the metallic material to degreasing prior to the step of dipping the metallic material in the bath of the fused salt flux.
- 18. The hot dip plating method according to claim 1, wherein after the step of dipping in the bath of the fused salt flux the metallic material is transported in an air environment to the molten plating bath.
- 19. The hot dip plating method according to claim 1, wherein the method further comprises skimming floating solid pieces of flux from an upper surface of the molten plating bath.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8-298986 |
Nov 1996 |
JPX |
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Parent Case Info
This application is a continuation, of Application No. PCT/JP97/04080, filed Nov. 10, 1997, and which designated the United States of America.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
3027268 |
Linden |
Mar 1962 |
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Entry |
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Continuations (1)
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Number |
Date |
Country |
Parent |
PCTJP9704080 |
Nov 1997 |
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