Claims
- 1. A reactive hot melt adhesive composition comprising the reaction product of a thermally activatable latent curing agent with
- (a) about 0.5 to about 1 equivalent of an epoxy resin which is solid at room temperature prepared from bisphenol A or bisphenol F and epichlorohydrin having an epoxide equivalent weight of from about 400 to about 700,
- (b) about 0.5 to about 1 equivalent of an epoxy resin which is liquid at room temperature prepared from bispbenol A or bisphenol F and epichlorohydrin having an epoxide equivalent weight of from about 150 to about 220, and
- (c) about 0.125 to about 0.5 equivalent of an amino-terminated polyalkylene glycol selected from the group consisting of polyethylene and polypropylene glycols, wherein said epoxy resins (a) and (b) are present in an amount such that a stoichiometric excess of at least 1 equivalent of epoxy groups over the amino groups is provided, said amino-terminated polyalkylene glycol comprising
- i) a linear amino-terminated polyethylene glycol corresponding to formula I
- H.sub.2 N--(CH.sub.2).sub.2 --[O--(CH.sub.2).sub.2 --O--(CH.sub.2).sub.2 ].sub.n --NH.sub.2 (I)
- wherein n is a number from about 17 to about 27 or
- ii) a linear amino-terminated polypropylene glycol corresponding to formula II
- H.sub.2 NCH(CH.sub.3)CH.sub.2 [OCH.sub.2 CH(CH.sub.3)].sub.n NH.sub.2(II)
- wherein n is 40 to 200, with an average molecular weight of >2000, or,
- iii) a linear amino-terminated polyethylene glycol of the formula I in which n=17 to 27, or a linear amino-terminated polypropylene glycol of the formula II, in which n is 5 to 200, with an average molecular weight of >360, together with a trifunctional amino-terminated polypropylene glycol of the formula III ##STR4## in which A is a --CH.sub.3 CH.sub.2 C(CH.sub.2).sub.3 or a ##STR5## group and x, y and z independently of each other are 1 to 40, with an average molecular weight of >400, and wherein 4 to 40% of the epoxy equivalents of the total epoxy resin component are replaced by (a) an adduct of dimeric fatty acids on epoxy resins prepared from diglycidyl ethers of bisphenol A or F, or (b) an adduct of carboxyl-terminated butadiene-nitrile rubber on epoxy resins prepared from diglycidyl ethers of bisphenol A or F.
- 2. A composition as in claim 1 wherein said component (b) has an epoxide equivalent weight of from about 182 to about 192.
- 3. A composition as in claim 1 wherein said latent curing agent consists of dicyandiamide.
- 4. The process of preparing a reactive hot melt adhesive comprising reacting a thermally activatable curing agent with
- (a) about 0.5 to about 1 equivalent of an epoxy resin which is solid at room temperature prepared from bisphenol A or bisphenol F and epichlorochydrin having an epoxide equivalent weight of about 400 to about 700,
- (b) about 0.5 to about 1 equivalent of an epoxy resin which is liquid at room temperature, prepared from bisphenol A or bisphenol F and epichlorohydrin having an epoxide equivalent weight of from about 150 to about 200, and
- (c) about 0.125 to about 0.5 equivalent of amino-terminated polyethylene or polypropylene glycols, wherein said epoxy resins a) and b) are present in an amount such that a stoichiometric excess of at least 1 equivalent of epoxy groups over the amino groups is provided, said amino-terminated polyethylene or polypropylene glycol comprising
- (i) a linear amino-terminated polyethylene glycol corresponding to formula I
- H.sub.2 N--(CH.sub.2).sub.2 --[O--(CH.sub.2).sub.2 ].sub.n --NH.sub.2(I)
- in which n=17 to 27, or
- (ii) a linear amino-terminated polypropylene glycol corresponding to formula II
- H.sub.2 NCH(CH.sub.3)CH.sub.2 [OCH.sub.2 CH(CH.sub.3)].sub.n --NH.sub.2(II)
- in which n is 40 to 200, with an average molecular weight of >2,000, or
- (iii) a linear amino-terminated polyethylene glycol of the formula I in which n=17 to 27, or a linear amino-terminated polypropylene glycol of the formula II, in which n is 5 to 200, with an average molecular weight of >360, together with a trifunctional amino-terminated polypropylene glycol of the formula III ##STR6## in which A is a --CH.sub.3 CH.sub.2 C(CH.sub.2).sub.3 -- or a ##STR7## group and x, y and z independently of each other are 1 to 40, with an average molecular weight of >400 and wherein 4 to 40% of the epoxy equivalents of the total epoxy resin component are replaced by (a) an adduct of dimeric fatty acids on epoxy resins prepared from diglycidyl ethers of bisphenol A or F, or (b) an adduct of carboxyl-terminated butadiene-nitrile rubber on epoxy resins prepared from diglycidyl ethers of bisphenol A or F.
- 5. A process according to claim 4 wherein said curing agent is added as the last component.
- 6. A process according to claim 4 wherein said component (b) has an epoxide equivalent weight of from about 182 to about 192.
- 7. A process according to claim 4 wherein said curing agent consists of dicyandiamide.
- 8. A process according to claim 4 further including applying said reactive hot melt adhesive to steel parts.
Parent Case Info
This application is a continuation, of application Ser. No. 07/721,045 filed on Jun. 26, 1991, abandoned.
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Continuations (1)
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Number |
Date |
Country |
Parent |
721045 |
Jun 1991 |
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