Claims
- 1. A moisture-reactive hot-melt adhesive composition formed by admixing components comprising a polyether polyol, a polyester polyol, a styrene/allyl alcohol copolymer, and a polyisocyanate; wherein the ratio of NCO/OH groups of said components on an equivalents basis is from 1.8/1 to 3.0/1; wherein said components contain less than 1%, by weight based on the total weight of said components, water; and wherein the free NCO content of said components is at least 4%, based on the total weight of said components.
- 2. The composition of claim 1, wherein the ratio of the weight of said polyether polyol to the weight of said polyester polyol is at least 0.42.
- 3. The composition of claim 1, wherein said polyether polyol comprises polypropylene glycol with molecular weight of between 1,000 and 3,000.
- 4. The composition of claim 1, wherein said polyisocyanate comprises 4,4′ diphenylmethane diisocyanate.
- 5. The composition of claim 4 wherein the ratio of the weight of said polyether polyol to the weight of said polyester polyols is at least 0.42; and wherein said polyether polyol comprises polypropylene glycol with molecular weight of between 1,000 and 3,000.
- 6. A method for forming a moisture-reactive hot-melt adhesive comprising admixing components comprising a polyether polyol, a polyester polyol, a styrene/allyl alcohol copolymer, and a polyisocyanate; wherein the ratio of NCO/OH groups of said components on an equivalents basis is from 1.8/1 to 3.0/1; wherein said components contain less than 1%, by weight based on the total weight of said components, water; and wherein the free NCO content of said components is at least 4%, based on the total weight of said components.
- 7. The method of claim 6 wherein the ratio of the weight of said polyether polyol to the weight of said polyester polyols is at least 0.42; wherein said polyether polyol comprises polypropylene glycol with molecular weight of between 1,000 and 3,000; and wherein said polyisocyanate comprises 4,4′ diphenylmethane diisocyanate.
- 8. A method for bonding substrates comprising(a) forming a moisture-reactive hot-melt adhesive by admixing components comprising a polyether polyol, a polyester polyol, a styrene/allyl alcohol copolymer, and a polyisocyanate; wherein the ratio of NCO/OH groups of said components on an equivalents basis is from 1.8/1 to 3.0/1; wherein said components contain less than 1%, by weight based on the total weight of said components, water; and wherein the free NCO content of said components is at least 4%, based on the total weight of said components; (b) heating said hot-melt adhesive; (c) applying said heated hot-melt adhesive to a first substrate in the presence of moisture; (d) contacting said applied heated hot-melt adhesive with a second substrate; and (e) cooling, or allowing to cool, said hot-melt adhesive.
- 9. The method of claim 8 wherein the ratio of the weight of said polyether polyol to the weight of said polyester polyols is at least 0.42; wherein said polyether polyol comprises polypropylene glycol with molecular weight of between 1,000 and 3,000; and wherein said polyisocyanate comprises 4,4′ diphenylmethane diisocyanate.
CROSS REFERENCE TO RELATED PATENT APPLICATIONS
This is a non-provisional application of prior pending U.S. provisional application Ser. No. 60/337,065 filed Dec. 6, 2001.
US Referenced Citations (7)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1153997 |
Nov 2001 |
EP |
9932569 |
Jul 1991 |
WO |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/337065 |
Dec 2001 |
US |