Claims
- 1. A hot melt adhesive for the bonding of paper, wood, and other cellulosic articles comprising a melt-processed polymeric blend of:
- a) from about 90 parts to about 98 parts of at least one first polymer containing at least about 50 mol % units of the structure ##STR43## and optionally units selected from one or more of the following structures: ##STR44## wherein R is alkyl, R.sub.1 is H or CH.sub.3, and R.sub.2 is an alkyleneoxy or a C.sub.1 to C.sub.4 alkyl group; and
- b) from about 2 to about 10 parts of at least one second polymer containing from about 90 to about 98 weight percent of units of at least one structure ##STR45## where R.sub.3 is at least one lower alkyl of from 1-4 carbon atoms, and from about 2 to about 10 weight percent of one or more units derived from an unsaturated copolymerizable carboxylic acid or anhydride, the total of units derived from (i) and (ii) being 100 %.
- 2. The hot melt adhesive of claim 1 wherein the optional unit of the at least one first polymer is ##STR46## R.sub.1 and R.sub.3 are --CH.sub.3, and the at least one unsaturated copolymerizable unsaturated acid has at least one of the following structures: ##STR47## where R.sub.4 is --COOH.
- 3. The hot melt adhesive of claim 1 wherein the second polymer contains both a lower alkyl acrylate and methyl methacrylate.
- 4. The hot melt adhesive of claim 1 wherein the second polymer further contains up to 5 weight percent of units having an adhesion-promoting functionality other than a lactam, amide, or acid functionality.
- 5. The melt processable hot melt adhesive of claim 1 further containing up to about 20 parts of a plasticizer.
- 6. The hot melt adhesive of claim 5 wherein the plasticizer is at least one polyol.
- 7. The hot melt adhesive of claim 6 wherein the at least one polyol is polyethylene glycol, neopentyl glycol, 2,2,4-trimethyl-1,3-pentanediol or glycerol.
- 8. The hot melt adhesive of claims 1 or 5 wherein the first polymer has been washed or treated with phosphoric acid to lower the level of sodium acetate to below about 0.1 weight percent.
Parent Case Info
This is a continuation-in-part of application Ser. No. 08/98,585, filed Jul. 28, 1992, which is a continuation-in-part of application Ser. No. 07/988,548, filed Dec. 10, 1992 which is a continuation-in-part of application Ser. No. 07/872,478, filed Apr. 23, 1992 now abandoned.
US Referenced Citations (19)
Foreign Referenced Citations (2)
Number |
Date |
Country |
470486 |
Jul 1991 |
EPX |
3112652 |
Dec 1991 |
EPX |
Continuation in Parts (3)
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98585 |
Jul 1993 |
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Parent |
988548 |
Dec 1992 |
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872478 |
Apr 1992 |
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