Claims
- 1. Solvent free hot-melt compositions adapted to be extruded as sealants, adhesives, caulking compounds, expansion joints and the like consisting essentially of an unreacted mechanical mixture of 100 parts by weight of polymerized elastomeric butyl rubber composed essentially of a copolymer of isobutylene and isoprene having a molecular weight above about 15,000; with from 1 to 400 parts by weight of tackifying resin selected from the group consisting of terpene resins, polyterpene resins, phenolic resins, hydrogenated rosin, hydrocarbon resins and mixtures thereof; from 15 to 600 parts by weight of plasticizer selected from the group consisting of polybutenes, low molecular weight polyisobutylenes, phosphate esters, dibutyl phthalate, straight chain aliphatic acid esters, parafine oils, coal tars, asphalts, chlorinated polyphenyl, chlorinated biphenyl and mixtures thereof; from about 0.5 to 60 parts by weight of adhesion promoter comprising an epoxy resin having an epoxide equivalent of from about 150 to 300; and from about 5 to 1,000 parts by weight of inert filler material, said composition being readily extrudable at temperatures above about 150.degree.F. while hardening upon cooling without undergoing chemical change, and having a hardness of about 5 to 95 on a Shore A Durometer at room temperature.
- 2. A hot melt composition as defined in claim 1 wherein the adhesion promoter includes an organic silane.
- 3. A hot melt composition as defined in claim 1 having approximately the following composition in parts by weight:
- Copolymer of Isobutyleneand Isoprene 10Polyterpene resin 90Polybutene 45Epoxy resin 20Filler 40.
- 4. A hot melt composition as defined in claim 1 having approximately the following composition in parts by weight:
- Copolymer of isobutyleneand isoprene 100Phenolic resin 25Epoxy resin 30Stearic acid 2Filler 187Polybutene 150.
- 5. A hot melt composition as defined in claim 1 having approximately the following composition in parts by weight:
- Copolymer of isobutyleneand isoprene 50Polyterpene resin 50Filler 40Epoxy resin 10Organic silane 1Stearic Acid 1Polybutene 25.
Parent Case Info
This application is a continuation of copending application Ser. No. 256,928 filed May 25, 1972 now abandoned.
US Referenced Citations (9)
Continuations (1)
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Number |
Date |
Country |
Parent |
256928 |
May 1972 |
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