Claims
- 1. A hot repair mix, comprising bisphenol as an auxiliary fluidizing agent in an amount of 1 to 20 weight parts and a material to form carbon bond in hot working process in an amount of 5 to 40 weight parts to 100 weight parts of a refractory material.
- 2. A hot repair mix according to claim 1, wherein the material to form carbon bond in hot working process is a pitch having softening point of not higher than 300° C.
Priority Claims (2)
Number |
Date |
Country |
Kind |
9-116714 |
May 1997 |
JP |
|
9-156630 |
Jun 1997 |
JP |
|
Parent Case Info
This application is a division of prior application Ser. No. 09/214,011 filed Dec. 17, 1998, now U.S. Pat. No. 6,120,593 which is a national stage application under §371 of international application PCT/JP98/01899 filed Apr. 4, 1998.
Foreign Referenced Citations (1)
Number |
Date |
Country |
8-169772 |
Jul 1996 |
JP |