Claims
- 1. A room temperature curing adhesive composition having improved thermal properties comprising:
- (a) at least one polymerizable cyanoacrylate monomer of the general formula ##STR8## wherein R is C.sub.1-16 alkyl, cycloalkyl, alkenyl, cycloalkenyl, phenyl or heterocyclic radical; (b) about 0.1 to about 20% by weight of the total composition of at least one polymerizable acrylate ester monomer of the general formula: ##STR9## wherein R.sup.1 is H, CH.sub.3 or lower alkyl and R.sup.2 is alkenyl, or ##STR10## wherein R.sup.3 is H, C.sub.1-4 alkyl or hydroxyalkyl or R.sup.5 OCH.sub.2 --; R.sup.4 is H, OH or R.sup.5 O--; R.sup.5 is CH.sub.2 .dbd.CR.sup.6 C.dbd.O; R.sup.6 is H, halogen of C.sub.1-4 alkyl; m is an integer from 1 to 8, k is an integer from 1 to 20; and p is 0 or 1;
- (c) about 0.1 to about 20% by weight of the total composition of an additive selected from the group consisting of ##STR11## wherein R.sup.7 and R.sup.8 are selected from the group consisting of alkyl, cycloalkyl, aryalkyl, alkaryl, aryl, aryloxy and alkoxy; and
- (d) an anionic polymerization inhibitor present in the amounts of about 0.1% to about 10% by weight of the total composition.
- 2. The adhesive composition of claim 1, wherein the polymerizable cyanoacrylate monomer is ethyl cyanoacrylate.
- 3. The adhesive composition of claim 1, wherein the polymerizable acrylate ester monomer is allyl methacrylate, present in the amount of about 1% to about 5% by weight of the total composition.
- 4. The adhesive composition of claim 1, wherein the additive (c) is represented by the formula: ##STR12## wherein R.sup.8 is phenyl.
- 5. The composition of claim 4, wherein the additive (c) is present in the amount of about 2% by weight of the total composition.
- 6. A composition as in claim 1 further comprising a free-radical polymerization inhibitor present in amounts of between about 0.1% to about 10% by weight of the total composition.
- 7. The adhesive composition of claim 6, wherein the free-radical polymerization inhibitor is selected from the group consisting of hydroquinones, benzoquinones, naphthoquinones, phenanthraquinones, anthraquinones, and a substituted compound of any of the foregoing.
- 8. The adhesive of claim 1, wherein the ionic polymerization inhibitor is a combination of sulfur dioxide and an acid having a pKa of between -12 and 7.
- 9. The adhesive composition of claim 8, wherein the acid is methane sulfonic acid in the range of 0.005% to 10% by weight of the composition.
- 10. The adhesive composition of claim 9, wherein the sulfur dioxide and methane sulfonic acid are present in the ratio of 20:50.
- 11. The adhesive composition of claim 1, wherein the polymerizable acrylate ester monomer component (b) is selected from the group consisting of allyl methacrylate, tetraethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate and mixtures thereof.
- 12. The adhesive composition of claim 1, wherein the composition contains a sulfimide or a tertiary amine, present in the amount of about 0.1 to about 10% by weight of the composition, as an accelerator of free-radical polymerization.
- 13. An adhesive composition as in claim 1, wherein component (a) is ethyl cyanoacrylate, component (b) is allyl methacrylate, and component (c) is ##STR13## wherein R.sup.8 is phenyl.
Parent Case Info
This is a continuation of application Ser. No. 246,560 filed June 1, 1981 and now abandoned.
US Referenced Citations (8)
Foreign Referenced Citations (1)
Number |
Date |
Country |
1546815 |
Mar 1976 |
GBX |
Continuations (1)
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Number |
Date |
Country |
Parent |
246560 |
Jun 1981 |
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