Claims
- 1. A housing and connection device for electronic modules comprising:
- a fixed panel member having an electrical interface area on one side thereof, and
- a movable housing member detachably mounted on the fixed panel member and having openings for heat dissipation,
- the movable housing member having a plurality of grooves extending from the interior front to the interior rear thereof for holding a plurality of electronic modules,
- the movable housing member also having a first motherboard at the rear disposed perpendicularly to said electronic modules for forming electrical connection therewith, and
- the movable housing member also having a second motherboard located above and substantially perpendicular to the first motherboard and electrically connected therewith so as to provide a housing and connection device for a plurality of electronic modules.
- 2. The device of claim 1 in which the movable housing member includes a L-shaped grilled removable protective cover containing a captive locking system.
- 3. The device of claim 2 in which the cover is made of plastic.
- 4. The device of claim 2 in which the fixed panel member has a pivot means and the movable housing member has a hook means on the external rear thereof and separate screw means for permitting the easy attachment and detachment of the movable housing member to and from the fixed panel member.
- 5. The device of claim 4 in which the movable housing member contains an external interface connector mounted thereon for providing electrical connection to other movable housing members to facilitate forming an expanded horizontal and/or vertical network of electronic modules.
- 6. The device of claim 1 wherein the electronic modules are in European DIN-41494 format.
Priority Claims (1)
Number |
Date |
Country |
Kind |
35502/85[U] |
Jan 1985 |
ITX |
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Parent Case Info
This is a continuation, of U.S. Application Ser. No. 07/211,105, filed June 17, 1988, which is a continuation of U.S. application Ser. No. 06/876,882, filed filed as PCT IT85/00021 on Jul. 24, 1985, now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0652710 |
Mar 1965 |
BEX |
2919394 |
Nov 1979 |
DEX |
3148902 |
Jun 1983 |
DEX |
2566221 |
Dec 1985 |
FRX |
Non-Patent Literature Citations (1)
Entry |
D. L. Smith, "Flexible Multilayer Interconnection Board Fabrication", IBM Technical Disclosure Bulletin, vol. 17, No. 4, Sep. 1974, at p. 990. |
Continuations (2)
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Number |
Date |
Country |
Parent |
211105 |
Jun 1988 |
|
Parent |
876882 |
May 1986 |
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