This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2016-142988, filed on Jul. 21, 2016, the entire contents of which are incorporated herein by reference.
The embodiments discussed herein are related to a housing and an electronic device for which measures for Electro Magnetic Compatibility (EMC) are taken.
With the development of electronic devices, problems have arisen, for example, in that electromagnetic noise emitted from an electronic device causes a failure in other electronic devices, or an electronic device malfunctions due to electromagnetic noise emitted from other electronic devices. Thus, there has been a demand for EMC measures in a process of designing and assembling an electronic device.
Since the electromagnetic noise is blocked by a metal, it may be conceived to hermetically seal an electronic circuit which is a source of generating the electromagnetic noise, for example, within a housing made of a metal. As an example, it may be conceived to install flanges on two metal members (a housing body and a lid) forming a housing, respectively, and overlap and fix the flanges by screws, caulking, rivets, welding or the like (hereinafter, referred to as “connecting elements”).
When the two metal members having the flanges are fixed by the connecting elements such as screws, an attenuation amount of the electromagnetic noise is relative to the widths of the flanges and the arrangement interval (pitch) of the connecting elements. For example, when a frequency is 1,000 MHz, and the arrangement interval of the connecting elements is 7.5 cm, the width of each flange which is required to reduce the electromagnetic noise by 15 dB is about 5 cm.
However, in an electronic device such as a computer, when the flanges each having the width of 5 cm are installed, the size of the electronic device increases, and furthermore, a problem is also caused in view of design.
The following is a reference document.
[Document 1] Japanese Laid-Open Patent Publication No. 2007-067195.
According to an aspect of the invention, a housing includes a first member that has a first conductor, a second member that has a second conductor and cooperates with the first member to accommodate a circuit board on which an electronic element is mounted, inside a space surrounded by the first conductor and the second conductor, and a plurality of connecting elements that are arranged at a predetermined arrangement interval y to fix the second member to the first member, wherein, when an overlapping width between the first conductor and the second conductor is x, a frequency of a clock signal flowing through the circuit board is f, a speed of light is c, and a wavelength of electromagnetic noise is λ=c/f, a value of the arrangement interval y is calculated by following equation (1) or (2),
when x≤2.2 mm, y≤(0.13x+0.0015)λ (1)
when x>2.2 mm, y=(10−5x3−0.0006x2+0.012x+0.25)λ (2).
The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
Hereinafter, embodiments will be described with reference to the accompanying drawings.
In the electronic device illustrated in
The surfaces (the inner surfaces, the outer surfaces, and the edge surfaces) of the housing body 11 and the lid 12 are conductive, and the circuit board 15 is sealed in the space surrounded by the conductors. Accordingly, leakage of the electromagnetic noise from the circuit board 15 to the outside of the housing body 11 or entry of the electromagnetic noise from the outside into the housing 10 is suppressed.
However, when the edge of the lid 12 and the hosing body 11 are thoroughly in close contact with each other as illustrated in
In order to avoid the leakage of the electromagnetic noise between the housing body 11 and the lid 12, a related technology has installed flanges each having a width determined depending on the arrangement interval of the screws 13 and the frequency of the electromagnetic noise, on the housing body 11 and the lid 12, respectively. In that case, when the frequency of electromagnetic waves is 1,000 MHz, and the arrangement interval of the screws (the connecting elements) is 7.5 cm, the width of each of the flanges becomes 5 cm.
The inventors of the present disclosure inspected the intensity of the electromagnetic noise generated from the circuit board on which electronic components such as the CPU are mounted.
As may be seen from
The inventors of the present disclosure variously changed the overlapping width x of the two members (the housing body and the lid) forming the housing and the arrangement interval y of the screws, and inspected the attenuation amount of the electromagnetic noise under each of the conditions. Here, the overlapping width x is the width of the portion where the conductors of the two respective members are in contact with each other.
In addition, while a method of a related technology inspects the attenuation amount of the electromagnetic noise by using a sinusoidal signal, the inventors of the present disclosure inspect the attenuation amount of the electromagnetic noise by using a clock signal (a pulse shaped rectangular wave signal) flowing through the circuit board 15. This is because the electromagnetic noise generated from an electronic device such as a computer is mainly caused by a clock signal flowing through the circuit board 15. For the analysis of the attenuation amount of the electromagnetic noise, the electromagnetic field analysis software (Poynting for Microwave™) of Fujitsu Limited was used.
As a result, the relationship between the overlapping width x of the two members (the housing body and the lid) forming the housing and the arrangement interval y of the screws when the attenuation amount is set to 30 dB became as illustrated in
The inventors of the present disclosure divided the curve illustrated in
y=(0.13x+0.0015)λ (1)
y=(10−5x3−0.0006x2+0.012x+0.25)λ (2)
According to
In addition, equations (1) and (2) are represented as the following equations (1)′ and (2)′ when the number of significant digits is expanded.
y=(0.1285x+0.0015)λ (1)′
y=(10−5x3−0.0006x2+0.0123x+0.2498)λ (2)′
Instead of equation (1) or (2) above, the equation (1)′ or (2)′ may be used.
The circuit board 15 is accommodated inside the housing 10. The CPU and other electronic components 16 are mounted on the circuit board 15, and a clock signal of 1,000 MHz flows through the circuit board 15.
The housing 10 includes the housing body 11 and the lid 12. Here, it is assumed that the housing body 11 and the lid 12 are made of a resin, and the surfaces (the inner surfaces, the outer surfaces, and the edge surfaces) thereof are covered with a conductor such as a metal. However, both the housing body 11 and the lid 12 may be formed of a metal.
The overlapping width x (see, e.g.,
In the electronic device according to the present embodiment, since the circuit board 15 which is a source of generating the electromagnetic noise is disposed inside the housing 10 as an EMC measure, the electromagnetic noise leaking to the outside of the housing 10 is reduced to 50 dBμV or less. Further, in the electronic device according to the present embodiment, since the overlapping width between the housing body 11 and the lid 12 is as small as 2 mm, and flanges protruding outwardly are unnecessary, the electronic device is small in size and excellent in design.
All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiment of the present invention has been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
Number | Date | Country | Kind |
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2016-142988 | Jul 2016 | JP | national |
Number | Name | Date | Kind |
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20180155184 | Gudeman | Jun 2018 | A1 |
Number | Date | Country |
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1-270399 | Oct 1989 | JP |
2007-67195 | Mar 2007 | JP |
Number | Date | Country | |
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20180027707 A1 | Jan 2018 | US |