Patent Application
20120009398
1. Technical Field
The exemplary disclosure generally relates to housings and method for manufacturing the housings.
2. Description of Related Art
With the development of wireless communication and information processing technology, portable electronic devices, such as mobile telephones and electronic notebooks are now in widespread use. Magnesium and magnesium alloys have good heat dissipation and can effectively shield electromagnetic interference. Therefore. magnesium and magnesium alloys are widely used to manufacture housings of portable electronic devices. However, magnesium and magnesium alloys have a lower corrosion resistance.
Therefore, there is room for improvement within the art.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the exemplary housing and method for manufacturing the housing. Moreover, in the drawings like reference numerals designate corresponding parts throughout the several views. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment.
Referring to
The bonding layer 13 improves the binding force between the corrosion resistance layer 12 and the abrasion resistance layer 15. In this embodiment, the bonding layer 13 is made of aluminum. The abrasion resistance layer 15 may be titanium carbonitride (TiCN) layer. A total thickness of the corrosion resistance layer 12 and the bonding layer 13 is about 2 micrometer to about 6 micrometer. In another exemplary embodiment, the bonding layer 13 is made of Titanium. The abrasion resistance layer 15 may be titanium carbonitride (TiCN) layer, aluminum nitride (AlN) layer, titanium nitride (TiN) layer, chromium nitride (CrN) layer.
Referring to
A substrate 11 is provided. The substrate 11 may be made of magnesium or magnesium alloy.
The substrate 11 is pretreated. First, the substrate 11 is polished and electrolyzed to make the surface of the substrate 11 shine. The substrate 11 is then dipped into an oil removing solution having a temperature of from 60 centigrade to 80 centigrade for about 30 seconds to 60 seconds to remove grease. The oil removing solution is a water solution containing 25˜30 g/L Na2CO3, 20˜25 g/L Na3PO4 12H2O and 1˜3 g/L neopelex. After the oil removing step, the substrate 11 is taken out and then washed with a pure water. Second, the substrate 11 is dipped into an acid solution comprised of 0.5˜3 wt % HNO for a time of about 20 to about 50 seconds at room temperature to remove oxides and/or impurities. The substrate 11 is then washed with pure water. Third, the substrate 11 is dipped into an alkaline solution to neutralize acid solution on the magnesium or magnesium alloy at a temperature of 40 to 50 for a time of 3 seconds to 5 seconds to further remove oxides, thus improving adhesion between the substrate and the corrosion resistance layer 12. The alkaline solution comprises 40-70 g/L NaOH, 10-20 g/L Na3PO4 12H2O, 25-30 g/L Na2CO3, and 40-50 g/L AEO-9 (Fatty alcohol ethoxylates) After Alkaline washing, the substrate 11 is then washed with pure water. Last, the substrate 11 is dried.
The corrosion resistance layer 12 is deposited on the substrate 11 by a spraying process, spread coating process or dipping coating process. The corrosion resistance layer 12 is comprised of silicane. In this exemplary embodiment, a spraying process deposits the corrosion resistance layer 12. First, the substrate 11 is dipped into a primer coating solution containing 25-30 g/L prime coat(e.g., sold under the Dow Corning® 1205), at a room temperature for about 30 seconds to about 60 seconds. After that, the substrate 11 is taken out and then is dried, to deposit a corrosion resistance layer 12 on the substrate 11. The corrosion resistance layer 12 is comprised of silane, and the silane has a good waterproof, corrosion resistance and a strong binding force to the substrate 11. Thus, the corrosion resistance layer 12 enhances the corrosion resistance of the housing 10. The primer coating solution in the spraying process may be Dow Corning® 9801 prime coat or Dow Corning® 1200 prime coat.
The bonding layer 13 is deposited on the corrosion resistance layer 12. The substrate 11 is retained on a rotatable bracket 50 in a vacuum chamber 60 of a magnetron sputtering coating machine 100. The temperature of the vacuum chamber 60 is adjusted to 50˜150. The vacuum level of the vacuum chamber 60 is adjusted to 8.0×10-3˜5.0×10-2 Pa. Pure argon is floated into the vacuum chamber 60 at a flux of about 150 sccm (Standard Cubic Centimeters per Minute) from a gas inlet 90. A bias voltage applied to the substrate 11 in a range from −50 to −300 volts; an aluminum target 70 is evaporated for a time of about 100 seconds to about 1800 seconds, to deposit the bonding layer 13 on the erosion layer 12.
The abrasion resistance layer 15 is deposited on the bonding layer 13. Pure argon is floated into the vacuum chamber 60 at a flux of about 60 sccm to 80 sccm and acetylene is floated into the vacuum chamber at a flux of about 70 sccm to 90 sccm from the gas inlet 90. A bias voltage applied to the substrate 11 in a range from −50 to −300 volts; a titanium target 80 is evaporated for a time of about 120 seconds to about 3000 seconds, to deposit the abrasion resistance layer 15 on the bonding layer 13.
It is to be understood, however, that even through numerous characteristics and advantages of the exemplary disclosure have been set forth in the foregoing description, together with details of the system and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201010223943.2 | Jul 2010 | CN | national |
The present application is related to co-pending U.S. patent applications (Attorney Docket No.US34387, US34392), entitled “HOUSING AND METHOD FOR MANUFACTURING HOUSING”, by Zhang et al. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
