Products that include stainless-steel housing assemblies are often perceived by consumers as having a higher quality than those manufactured of other materials. This perception is due to stainless steel's cosmetic finishing, heft, and density. However, a fully stainless-steel housing assembly is unduly heavy and frequently cost-prohibitive due to the increased manufacturing difficulties associated with working with and processing stainless-steel components. Additionally, a computing device product will typically have multiple component modules that need to be aligned, assembled, and attached within the housing assembly during the manufacturing process. The utilization of a fully stainless-steel housing assembly can greatly add to the complexity of manufacturing processes.
This document describes techniques and apparatuses directed to housing assemblies for computing devices. In aspects, the techniques and apparatuses include housing assemblies having a forged stainless-steel band and an integral die-cast aluminum internal frame.
In general, a first aspect of the present disclosure relates to a housing assembly that includes an elongated side-frame element and a cast internal-frame element. The elongated side-frame element includes at least one elongated slot disposed on an inner surface of the elongated side-frame element. The elongated slot is oriented parallel to the elongated side-frame element and includes at least one undercut. The elongated side-frame element formed from a first metal. The cast internal-frame element includes an elongated interlock flange that extends from an internal frame body. The elongated interlock flange is received into the elongated slot of the elongated side-frame element. The elongated interlock flange includes a seat that engages the undercut. The internal-frame element is formed of a second metal. The second metal is a different metal than the first, and the melting point of the first metal is higher than the melting point of the second.
In aspects, the first metal is stainless steel and the elongated side frame element is formed through machining. In aspects, the second metal is at least one of aluminum, an aluminum alloy, magnesium, or a magnesium alloy. In aspects, the elongated side frame element is forged stainless steel. In aspects, the elongated side frame element is forged stainless steel and the second metal is at least one of aluminum, an aluminum alloy, magnesium, or a magnesium alloy. In aspects, the elongated slot comprises an open first channel, the open first channel defining an aperture in a sidewall face of the elongated side frame element, and the undercut further comprises at least one second channel connected to the open first channel. In aspects, the aperture has a width smaller than a width of the second channel. In aspects, the elongated interlock flange extends orthogonally from the internal frame body. In aspects, the elongated slot has the form in cross section of at least one of a T shape, a lobed shape, or a hook shape. In aspects, the elongated side frame element is formed of a first metal that has a first melting point and the internal frame element is formed of a second metal that has a second melting point. In aspects, the first melting point is higher than the second melting point. In aspects, the first metal is a different metal than the second metal.
Another aspect of the present disclosure relates to a method of making a housing assembly that comprises at least one of: forming the elongated side-frame element through a machining process; or forming the elongated side-frame element through a forging process. In aspects, a method of making the housing assembly further comprises forming an elongated slot that includes at least one undercut in the side-frame element. In aspects, a method of making the housing assembly further comprises forming an internal-frame element through a diecasting process by molding the internal frame element into the side-frame element to form a housing sub-assembly.
This Summary is provided to introduce simplified concepts for housing assemblies for computing devices, which are further described below in the Detailed Description and are illustrated in the Drawings. This Summary is intended neither to identify essential features of the claimed subject matter nor for use in determining the scope of the claimed subject matter.
The details of one or more aspects of housing assemblies for computing devices are described in this document with reference to the following drawings, where the use of same numbers in different instances may indicate similar features or components:
This document describes techniques and apparatuses directed to housing assemblies for computing devices. In aspects, the housing assemblies include a forged stainless-steel band (side-frame element) and an integral die-cast aluminum internal-frame element.
The following discussion describes an operating environment, techniques that may be employed in the operating environment, and various devices or systems in which components of the operating environment can be embodied. In the context of the present disclosure, reference is made to the operating environment by way of example only.
A computing device (e.g., a smartphone) may include a housing assembly (e.g., enclosure) that defines a cavity configured to enclose one or more internal component modules (e.g., a main logic board, a display panel, a speaker assembly, a battery, sensors modules, and the like) of the computing device. The housing assembly may include one or more of a housing, frame, internal frame, midframe, mount, mounting structure, case, plate, front-panel element, display panel, sidewall, side frame, cosmetic band, back-panel element, cover, or portion thereof. In an example, a computing device housing assembly includes an internal-frame element, a front-panel element, a back-panel element, and a side frame that extends between the front-panel element and the back-panel element to enclose the internal component modules of the computing device. The internal frame may include the front-panel element and/or the back-panel element. The internal-frame element may attach to one or more of the side frame, front-panel element, or back-panel element and may support one or more of the internal component modules. The internal-frame element may be sandwiched between the front-panel element and the back-panel element.
The computing device 100 includes a housing assembly 102 and internal component modules 120 (e.g., a battery 122, a main logic board 124). The housing assembly 102 has a front-panel element 110 (e.g., a cover glass, a display panel), a side-frame element 140 (side frame 140), an internal-frame element 170 (internal frame 170), and a back-panel element 130 (e.g., back panel 130). The front-panel element 110 is not illustrated in
The side-frame element 140 may be made from a first metal that has a first melting point (melting temperature). Example first metal materials include, but are not limited to, stainless steel and stainless-steel alloy. The side-frame element 140 may be forged or computer numerical control (CNC) machined. In an example, the first metal is stainless steel and the side-frame element 140 is a forged stainless-steel band. In another example, the first metal is stainless steel and the side-frame element 140 is a CNC machined stainless-steel band. Before die casting, the side-frame element 140 can be further machined and/or processed to enable a better interlock between the side-frame element 140 and the internal-frame element 170.
The side-frame element 140 includes at least one elongated slot 406 that includes at least one undercut 408, as described below in detail with respect to
The internal-frame element 170 may be made from a second metal that has a second melting point (melting temperature). In aspects, the first melting point is higher than the second melting point. Example second metal materials include, but are not limited to, aluminum, aluminum alloys, magnesium, magnesium alloys, and the like. The internal-frame element 170 may be die-cast into the side-frame element 140. In an example, the second metal is aluminum and the internal-frame element 170 is a die-cast aluminum internal-frame element. In aspects, the second metal is a different metal than the first.
The housing sub-assembly 310, the front panel 110, internal component modules 120, and the back panel 130 are configured for assembly together to form the computing device 100. The housing sub-assembly 310 may be formed through a molding process whereby the internal-frame element 170 is formed in situ as well as molded into and secured to the side-frame element 140. An example of a molding process is illustrated in
In
The side-frame element 510 illustrated in
The internal-facing surface 514 of the side-frame element 510 may define one or more supports (e.g., support 522) configured to support one or more of a front panel, an internal component module, or a back panel. For example, the support 522 includes a threaded aperture configured to receive a fastener (e.g., screw), enabling an internal component (e.g., internal component module 120) to be fastened to the side-frame element 510.
A further machining process is performed on the elongated side-frame element 510 to form at least one elongated slot in the internal-facing surface 514 of at least a portion of the side-frame element 510. The elongated slot may be oriented generally parallel to a length of the elongated side-frame element. In the aspect illustrated in
An elongated slot may include at least one undercut portion. The undercut portion provides a recessed surface that prevents withdrawal of an internal-frame element from engagement with the side-frame element. The undercut portion may be orthogonal to the orientation of the internal frame body. In the aspect illustrated in
As mentioned above, the elongated slot can be formed through any acceptable means, including forging, turning, molding, and milling. In an example, illustrated in
The elongated slot 606 and the undercut 608 may be formed through separate processes through the use of one or more cutting tools. For example, a first milling cutter (e.g., end mill) may be used to cut the elongated slot 606 and then a second milling cutter (e.g., a T-slot end mill, side milling cutter) may be utilized to cut the undercut 608. In aspects, the machining process may include the use of a milling cutter to form linear ramping from the side-frame element into the elongated slot, for example by climb-milling, down-milling, up-milling, and the like. The machining process may include additional steps, including but not limited to drilling and tapping holes.
After the machining process described with respect to
The internal-frame element 540 includes at least one elongated interlock flange (e.g., elongated interlock flange 542) that extends from an internal frame body 546 of the internal-frame element 540 and into an elongated slot (e.g., elongated slot 528) of the elongated side-frame element 510 to lock the internal-frame element 540 and the side-frame element 510 together. The elongated interlock flange includes a seat (e.g., seat 544) configured to engage the undercut (e.g. undercut 536), thereby securing the internal-frame element to the side-frame element. In aspects, the elongated interlock flange 542 extends orthogonally from the internal frame body 546 and is orthogonal to the elongated slot 528.
The internal-frame element 540 may define one or more bosses (e.g., boss 545) configured to engage a fastener (e.g., screw, tab, clip) to affix one or more internal component modules to the internal-frame element. In aspects, the bosses and other support structures (e.g., raised strengthening surfaces, ribs, stiffeners) may be formed through the molding process and/or through a machining process.
One or more apertures (e.g., aperture 524, aperture 526) may be defined through the internal-frame element 540 for routing or other purposes. For example, aperture 524 is defined adjacent to support structure 522, which extends from the internal-facing surface 514 of the side-frame element 510. In another example, the aperture 526 is defined in the internal-frame element 540 spaced apart from the side-frame element 510. In aspects, the apertures may be formed through the molding process and/or through a machining process.
After the internal-frame element and the side-frame element are molded together to form the housing sub-assembly 560, a further machining process may be performed on the workpiece 500 to remove the support structure 550, as illustrated in
In another aspect, the housing sub-assembly 310 includes a forged stainless-steel side frame (e.g., side frame 140) molded with an integral die-cast aluminum internal frame (e.g., internal frame 170). A forged side frame may include features similar to a machined side frame, e.g., at least one elongated slot and undercut.
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Disclosed herein are also example methods for manufacturing a computing device housing assembly and a product-by-process. The methods are shown as a set of blocks that specify operations performed but are not necessarily limited to the order or combinations shown for performing the operations by the respective blocks. Further, any of one or more of the operations may be repeated, combined, reorganized, or linked to provide a wide array of additional and/or alternate methods. In portions of the following discussion, reference may be made to the example operating environment 100 of
In a first method, at a first operation, an elongated side-frame element of a first metal material is provided. At a second operation, at least one elongated slot disposed on an inner surface of the elongated side-frame element is formed therein. The elongated slot oriented parallel to the elongated side-frame element and the slot includes at least one undercut. At a third operation, the elongated side-frame element is placed in a mold cavity. At a fourth operation, a second metal is cast into the elongated slot and undercut to form an internal-frame element.
Through this operation, the internal-frame element is molded with the elongated side-frame element to form a housing sub-assembly. The first and second metal materials are different metal materials, with the first metal material having a higher melting point than the second metal material. At a fifth operation, the molded housing sub-assembly is ejected from the mold to form a molded part. The molded housing sub-assembly may be a product-by-process.
Some additional examples of techniques and apparatuses directed to housing assemblies for computing devices are as follows:
Example 1. A housing assembly comprising: an elongated side-frame element, the elongated side-frame element including at least one elongated slot disposed on an inner surface thereof, the elongated slot oriented parallel to the elongated side-frame element, the elongated slot including at least one undercut, the elongated side-frame element comprising a first metal; and a cast internal-frame element, the cast internal-frame element including an elongated interlock flange extending from an internal frame body, the elongated interlock flange received into the elongated slot of the elongated side-frame element, the elongated interlock flange including a seat, the seat engaging the undercut, the internal-frame element comprising a second metal, the second metal is a different metal than the first metal, and a melting point of the first metal is higher than a melting point of the second metal.
Example 2. The housing assembly of Example 1, wherein the first metal is stainless steel and the elongated side-frame element formed through machining.
Example 3. The housing assembly of any preceding Example, wherein the second metal is at least one of aluminum, an aluminum alloy, magnesium, or a magnesium alloy.
Example 4. The housing assembly of any preceding Example, wherein the elongated side-frame element is forged stainless-steel.
Example 5. The housing assembly of Example 4, wherein the second metal is at least one of aluminum, an aluminum alloy, magnesium, or a magnesium alloy.
Example 6. The housing assembly of any preceding Example, wherein the elongated slot comprises an open first channel, the open first channel defining an aperture in a sidewall face of the elongated side-frame element, and wherein the undercut further comprises at least one second channel connected to the open first channel.
Example 7. The housing assembly of any preceding Example, wherein the aperture has a width smaller than a width of the second channel.
Example 8. The housing assembly of any preceding Example, wherein the elongated interlock flange extends orthogonally from the internal frame body.
Example 9. The housing assembly of any preceding Example, wherein the elongated slot has the form in cross-section of at least one of a T-shape, a lobed shape, or a hook shape.
Example 10. The housing assembly of any preceding Example, where the elongated side-frame element is formed of a first metal that has a first melting point.
Example 11. The housing assembly of any preceding Example, where the internal-frame element is formed of a second metal that has a second melting point.
Example 12. The housing assembly of any preceding Example, wherein the first melting point is higher than the second melting point.
Example 13. The housing assembly of any preceding Example, wherein the first metal is a different metal than the second metal.
Example 14. The housing assembly of any preceding Example, wherein the housing assembly includes a machined stainless-steel side frame molded with an integral die-cast aluminum internal frame.
Example 15. A method of making the housing assembly of any preceding Example, comprising forming the elongated side-frame element through a machining process.
Example 16. The method of making the housing assembly of any preceding Example, wherein the machining process is a computer numerical control machining process.
Example 17. A method of making the housing assembly of any preceding Example, comprising forming the elongated side-frame element through a forging process.
Example 18. The method of making the housing assembly of any preceding Example, comprising further machining and/or processing the side-frame element to enable a better interlock between the side-frame element and the internal-frame element.
Example 19. The method of making the housing assembly of any preceding Example, further comprising forming an elongated slot that includes at least one undercut in the side-frame element.
Example 20. The method of making the housing assembly of any preceding Example, wherein forming the elongated slot is performed through at least one of forging, turning, molding, or milling.
Example 21. The method of making the housing assembly of any preceding Example, further comprising forming an internal-frame element through a diecasting process by molding the internal-frame element into the side-frame element to form a housing sub-assembly.
Example 22. The method of making the housing assembly of any preceding Example, wherein the housing sub-assembly includes a machined stainless-steel side frame molded with an integral die-cast aluminum internal frame.
Example 23. The method of making the housing assembly of any preceding Example, wherein forming an elongated side-frame element through a machining process comprises placing a stock piece of a first material in a fixture and CNC machining the stock piece (e.g., by a machine tool, such as a milling cutter) by removal of material to form a workpiece.
Example 24. The housing assembly of any preceding Example, wherein the workpiece includes an elongated side-frame element and a support structure for supporting the side-frame element during machining.
Example 25. The housing assembly of any preceding Example, wherein the support structure connects to and extends from an external-facing surface of the side-frame element.
Example 26. The housing assembly of any preceding Example wherein the side-frame element also includes an internal-facing surface.
Example 27. The housing assembly of any preceding Example, wherein the side-frame element includes a number of gaps defined through the side-frame element that result in the side-frame element including a plurality of elongated sidewall elements that allow for isolation between multiple antennas of a computing device.
Example 28. The housing assembly of any preceding Example, wherein the gaps receive antenna split lines configured to permit radio frequency (RF) signals to pass through the housing assembly.
Example 29. The housing assembly of any preceding Example, wherein an antenna split line is configured of a material (e.g., a plastic material) that permits RF signals to pass through.
Example 30. The housing assembly of any preceding Example, wherein the side-frame element is continuous, without interruption.
Example 31. The housing assembly of any preceding Example, wherein the elongated side-frame element is a single elongated side-frame element.
Example 32. The housing assembly of any preceding Example, wherein the elongated side-frame element is a plurality of elongated side-frame elements.
Example 33. The housing assembly of any preceding Example, wherein the antenna split lines are formed in the side-frame element after the molding of the internal-frame element.
Example 34. The housing assembly of any preceding Example, wherein the internal-facing surface of the side-frame element defines one or more supports configured to support one or more of a front panel, an internal component module, or a back panel.
Example 35. The housing assembly of any preceding Example, wherein the support includes a threaded aperture configured to receive a fastener (e.g., screw), enabling an internal component to be fastened to the side-frame element.
Example 36. The housing assembly of any preceding Example, wherein a further machining process is performed on the elongated side-frame element to form at least one elongated slot in the internal-facing surface of at least a portion of the side-frame element.
Example 37. The housing assembly of any preceding Example, wherein the elongated slot is oriented generally parallel to a length of the elongated side-frame element.
Example 38. The housing assembly of any preceding Example, wherein the elongated slot includes at least one undercut portion.
Example 29. The housing assembly of any preceding Example, wherein the undercut portion provides a recessed surface that prevents withdrawal of an internal-frame element from engagement with the side-frame element.
Example 30. The housing assembly of any preceding Example, wherein the undercut portion is orthogonal to the orientation of the internal frame body.
Although implementations of techniques and apparatuses directed to housing assemblies for computing devices have been described in language specific to certain features and/or methods, the subject of the appended claims is not necessarily limited to the specific features or methods described. Rather, the specific features and methods are disclosed as example implementations for techniques and apparatuses directed to housing assemblies for computing devices.
Unless context dictates otherwise, use herein of the word “or” may be considered use of an “inclusive or,” or a term that permits inclusion or application of one or more items that are linked by the word “or” (e.g., a phrase “A or B” may be interpreted as permitting just “A,” as permitting just “B,” or as permitting both “A” and “B”). Also, as used herein, a phrase referring to “at least one of” a list of items refers to any combination of those items, including single members. For instance, “at least one of a, b, or c” can cover a, b, c, a-b, a-c, b-c, and a-b-c, as well as any combination with multiples of the same element (e.g., a-a, a-a-a, a-a-b, a-a-c, a-b-b, a-c-c, b-b, b-b-b, b-b-c, c-c, c-c-c, or any other ordering of a, b, and c). Further, items represented in the accompanying figures and terms discussed herein may be indicative of one or more items or terms, and thus reference may be made interchangeably to single or plural forms of the items and terms in this document.
Filing Document | Filing Date | Country | Kind |
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PCT/US2022/081827 | 12/16/2022 | WO |
Number | Date | Country | |
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63380808 | Oct 2022 | US |